The application belongs to the technical field of
epoxy structural
adhesive and discloses a single-component organic
silicon modified temperature-resistant
epoxy structural
adhesive composition and a preparation method thereof, the single-component organic
silicon modified temperature-resistant
epoxy structural
adhesive composition comprises, in terms of weight percentage, 40-75 parts of epoxy resin, 26-47 parts of epoxy modified
silicon oil, 21-28 parts of methyl phenyl silicon resin containing an alkoxy functional group, 6-8 parts of a curing agent, 24-40 parts of amino phenyl silicon oil, 0-18 parts of a defoaming agent and 1-3 parts of a leveling agent, the
side chain or end chain of the epoxy modified silicon oil contains at least one epoxy group, the amino equivalent of the amino phenyl silicon oil is 670-3750 g / eq, and the phenyl content is 0.10-0.40 mol / 100g. The application provides a single-component organic silicon modified temperature-resistant epoxy structural adhesive composition, the epoxy modified silicon oil and the amino phenyl silicon
oil can produce a synergistic effect, the high-
temperature resistance of the composition is improved, and thus the problems such as the decrease of adhesion, the failure of insulation performance after 90-degree bending and the decrease of tensile strength of the epoxy structural adhesive composition in an environment exceeding 100 DEG C can be avoided.