329 results about "Silicone grease" patented technology

The invention relates to a preparation method of a polysiloxane defoaming composition. The polysiloxane defoaming composition is prepared from silicone grease, a polyether-polysiloxane copolymer, a surfactant and polyether. The silicone grease is prepared from the following raw materials: branched polysiloxane, hydrogen-containing polysiloxane, silicon dioxide, a TQ polymer, an addition catalyst and an inhibitor; the polyether-polysiloxane copolymer is prepared from hydrogen-containing silicon resin with a spatial structure, diallyl alcohol polyether and allyl polyether through a reaction. The polysiloxane defoaming agent composition obtained by the invention has the characteristics of excellent foam control and easiness in cleaning.

This utility model discloses a high-temperature resistant cooling circulation structure for a fluoroplastic magnetic pump, specifically relating to the field of magnetic pumps. It includes a base, pump body, pump cover, connecting frame, isolation sleeve, inner magnetic rotor, outer magnetic rotor, motor, and impeller. The isolation sleeve, inner magnetic rotor, and outer magnetic rotor are all housed inside the connecting frame. The high-temperature resistant cooling circulation structure of this fluoroplastic magnetic pump features a spiral cooling channel inside the isolation sleeve. The coolant flows directly through the core area of ​​the heat source, rapidly absorbing heat transferred by magnetic eddy currents and high-temperature media through forced convection, thus improving cooling efficiency and effectively blocking heat transfer to the outer magnetic rotor, preventing permanent magnets from demagnetizing and failing due to high temperatures. Copper-nickel alloy heat-conducting fins are welded to the inner wall of the isolation sleeve, combined with a layer of thermally conductive silicone grease, accelerating the conduction of heat from the inner magnetic rotor to the cooling channel. A vacuum cavity is provided between the spiral cooling channel and the outer wall of the isolation sleeve to suppress heat conduction to the outer magnetic rotor, achieving double thermal isolation.

This invention relates to the field of cable technology and discloses a safety early warning cable with temperature sensing. The cable includes a wrapping layer containing multiple insulated power wire cores, a protective layer outside the wrapping layer, a first vibration sensing element within the protective layer, and an isolation layer between the wrapping layer and the protective layer. By incorporating a spiral metal sheath within each conductor, with thermally conductive silicone grease filling the space between the sheath's inner wall and the temperature-sensing optical fiber, rapid and direct monitoring of the conductor's core temperature is achieved. Simultaneously, heat is transferred through the conductor's copper wires in the spiral microgrooves, the thermally conductive metal strip on the surface of the insulation layer, and the thermally conductive material in the filling layer to the multimode optical fiber core in the multi-core sensing cable, forming redundant temperature measurement channels. When the temperature of a conductor is abnormal, the corresponding temperature-sensing optical fiber and the multimode optical fiber core can be cross-verified, effectively avoiding false alarms caused by single-point faults or poor local contact, significantly improving temperature measurement reliability and response speed.

The utility model discloses a power device heat-conducting silicone grease smearing tool, which belongs to the technical field of power device production auxiliary equipment and comprises a mounting box body, a fixing plate fixedly mounted at the top of the mounting box body, a power device body arranged at the top of the fixing plate, and a turntable rotatably mounted at the bottom of the fixing plate. Four groups of moving plates are slidably mounted in the fixed plate, connecting plates are fixedly mounted at the tops of the four groups of moving plates, clamps are fixedly mounted on one sides of the four groups of connecting plates, and supporting rods II are fixedly mounted at the bottoms of the four groups of moving plates, so that self-centering clamping of four surfaces of the power device body is realized; the multi-direction clamping mode can stably fix the power device from all angles, no matter how the initial placement position of the power device is, the power device can be automatically adjusted to the center position of the tool and is firmly fixed, the conditions of deviation, shaking and the like of the power device in the heat-conducting silicone grease smearing process are effectively avoided, and the working efficiency is improved. And the smearing operation can be stably carried out.

The invention discloses a preparation method and application of a graphite flake diamond complex. The preparation method comprises the following steps: mixing diamond micro-powder, crystalline flake graphite, copper powder, sodium chloride, potassium chloride and titanium powder according to a certain proportion, co-firing at 880-1050 DEG C for 30-60 minutes, cooling, taking out a mixed co-fired sample, and fully cleaning with deionized water to obtain the graphite flake diamond complex (GD); mixing GD, a silane coupling agent and absolute ethyl alcohol according to a certain proportion, magnetically stirring for 60-120 minutes at the temperature of 60-80 DEG C, and preserving heat for 6-12 hours at the temperature of 100-200 DEG C to obtain a silane coupling agent surface modified graphite flake diamond complex (GDSM); and then, uniformly mixing the GDSM and dimethyl silicone oil according to a certain proportion, putting the mixture into a vacuum drying oven, carrying out vacuum-pumping heat preservation at 80-120 DEG C for 120-360 minutes, cooling to room temperature, and taking out to obtain the graphite flake diamond composite heat-conducting silicone grease which can be applied to the field of interface heat management of high-power devices.

The invention discloses a pulse tube refrigeration device based on a semiconductor refrigeration ring. The device comprises a compressor, a precooler, a heat regenerator, a cold-end heat exchanger, a pulse tube, a hot-end heat exchanger, a reducing cavity, an adjusting tube and an air reservoir which are communicated in sequence. The semiconductor refrigeration sleeve is arranged outside the heat regenerator, and the surfaces of the semiconductor refrigeration sleeve and the heat regenerator are tightly attached. The semiconductor refrigeration sleeve is formed by overlapping a plurality of annular semiconductor refrigeration sheets, the hot surface of each semiconductor refrigeration sheet faces upwards, the cold surface of each semiconductor refrigeration sheet faces downwards, and the cold and hot surfaces of every two adjacent semiconductor refrigeration sheets are connected through heat-conducting silicone grease. Temperature sensors are arranged at the top and the bottom of the semiconductor refrigeration sleeve to monitor the temperature difference in real time, and the control system adjusts the input current of the semiconductor refrigeration piece and adjusts the refrigeration power of the semiconductor refrigeration piece. Through the stacked structure of the semiconductor refrigeration rings, step-by-step reduction of the temperature is achieved, the cooling efficiency is remarkably improved, and accurate temperature control can be conducted. The device is compact in structure, high in reliability and suitable for the working environment with the high requirement for equipment stability.

The invention discloses a droplet nanometer friction / photo-thermoelectric hybrid power generation device and a preparation method thereof. The hybrid power generation device comprises a liquid drop power generator part and a photo-thermal power generator part, wherein the liquid drop power generator part is mainly formed by integrating a capacitor and liquid drop friction power generation, and the photo-thermal power generator part is mainly composed of a temperature difference semiconductor. The preparation method of the device mainly comprises the following steps: carrying out surface treatment on a zinc sheet, so that a layer of candle ash is uniformly attached to the surface of the zinc sheet to obtain the treated zinc sheet; uniformly coating a layer of polydimethylsiloxane (PDMS) on the surface of the candle ash, and heating in an oven for two hours for curing and forming; fixing a copper electrode on the surface of the PDMS, and welding a lead on the copper electrode and the zinc sheet; the temperature difference semiconductor and the zinc sheet are combined together through heat-conducting silicone grease; a radiation cooling plate is attached to the cold end of the temperature difference semiconductor; and wires are respectively welded at the hot end and the cold end of the temperature difference semiconductor. The droplet nanometer friction / photo-thermoelectric hybrid power generation device provided by the invention is simple in structure and convenient to manufacture, can continuously and stably output direct current voltage without depending on single weather, and has a wide application prospect.

The utility model relates to the field of LED substrate processing discloses LED substrate heat conducting silicone grease fixture, including fixed frame, the fixed frame is located the top surface of base, the inside fixed installation board of fixed frame, the top surface of installation board is equipped with two fixed holes, the inside fixed metal round plate of fixed hole, the top surface of metal round plate is equipped with a plurality of smearing holes, the top surface of base is detachably provided with the placing plate, the top surface of placing plate is equipped with two containing grooves. In the utility model, scrape the heat conducting silicone grease on the metal round plate, the heat conducting silicone grease will be filled into the inside of smearing hole, through the limitation of smearing hole inside space, can accurately control the amount of heat conducting silicone grease every time smearing, thereby ensuring the consistency of smearing thickness.

The invention provides heat-conducting silicone grease for spaceflight electronic equipment and a preparation method of the heat-conducting silicone grease. The heat-conducting silicone grease is prepared from the following components in parts by weight: 3-8 parts of ethyl silicone oil with the viscosity of 50-1000 mPa.s, 3-8 parts of phenyl silicone oil with the viscosity of 50-1000 mPa.s, 1-5 parts of modified silicone oil, 60-80 parts of zinc oxide with the particle size of 2-7 microns and 15-25 parts of zinc oxide with the particle size of 0.1-1 micron. The invention aims to provide the heat-conducting silicone grease which has high heat-conducting property, good low-temperature resistance and cosmic ray resistance and is stable and reliable, so that the heat dissipation requirement of spaceflight electronic equipment in an extreme space environment is met, and the effective thermal design of the prepared heat-conducting silicone grease can greatly prolong the service life of a spacecraft and improve the working reliability of the spacecraft.

The invention relates to the technical field of insulated cables, in particular to a high-temperature-resistant overhead insulated wire, which comprises a core body, an insulating layer and a high-temperature-resistant layer which are sequentially arranged from inside to outside, the core body is coated with the inner layer; the inner layer is sleeved with the annular framework, and a plurality of pipe grooves are annularly formed in the annular framework in the circumferential direction; the heat dissipation unit is accommodated in the pipe groove; the outer layer is coated outside the annular framework; the heat dissipation unit comprises a hollow cylinder and a spiral cooling pipe, a spiral groove is formed in the outer surface of the cylinder, and the spiral cooling pipe is embedded in the spiral groove; a plurality of through holes are formed in the wall part of the column body; and a guide piece is arranged in the pipe groove. According to the high-temperature-resistant overhead insulated wire, heat-conducting silicone grease is forced to overflow through rotary installation of the column body, and the column body is combined with the third filling layer to form a heat conduction function, so that the contact thermal resistance between the spiral cooling pipe and the external environment is greatly reduced, the heat dissipation efficiency is ensured to be maximized, and heat generated during operation of the conductor is actively taken away through a built-in liquid cooling system.

The utility model relates to the field of routers, and discloses a 5G router device for electric power communication, which comprises a device body, the outer wall of the device body is provided with a heat dissipation plate, the side wall of the heat dissipation plate is provided with a notch, the surface of the heat dissipation plate is provided with heat dissipation holes in a penetrating manner, the inner wall of the notch is slidably connected with a moving block, and the outer wall of the moving block is provided with a chute. A sliding block is slidably connected to the inner wall of the sliding groove, a connecting shaft is rotatably connected to the outer wall of the sliding block, a thin-wall scraper is fixedly connected to the outer wall of the connecting shaft, and a spring is fixedly connected to the side wall of the sliding block. According to the utility model, the heat dissipation plate, the notches, the heat dissipation holes and other structures are arranged, so that the heat dissipation plate can be conveniently smoothed or scraped off when being coated or replaced with heat-conducting silicone grease, and the covering uniformity of the heat-conducting silicone grease is ensured, thereby preventing the heat dissipation efficiency from being reduced due to a small gap between the heat dissipation plate and the internal heat dissipation block, and improving the use stability of equipment.

The utility model relates to the technical field of conference control equipment, in particular to multifunctional conference centralized control equipment which comprises a protection box, a protection cover is installed at the bottom end of the protection box through bolts, a rubber strip is fixedly installed on one side of the protection cover, a cavity is formed after the protection box and the protection cover are fixed, a control mainboard is fixed through bolts, and the protection box and the protection cover are fixed through bolts. A heating point of the control main board is attached to the vapor chamber through heat conduction silicone grease, the heat dissipation end of the vapor chamber is connected with the refrigeration end of the semiconductor board through heat conduction silicone grease, the heating end of the semiconductor board faces the heat dissipation window, and an exhaust fan is installed on the heat dissipation window through bolts. According to the utility model, the semiconductor chilling plate and the vapor chamber are used for cooperative heat dissipation, the diagonal air duct and the multilayer filter screen are combined, the temperature stability under high load is maintained, the dust retention is reduced, the problems of low efficiency and frequent maintenance in the traditional scheme are solved, the standby power supply can be seamlessly switched during power failure due to the dual-power-supply redundancy design, conference interruption is avoided, and the service life of the conference is prolonged. And the anti-voltage fluctuation reliability of equipment is improved.

The invention discloses an integrated efficient heat dissipation baseband structure for a spaceflight measurement and control transponder, and particularly relates to the technical field of spaceflight measurement and control transponders, the integrated efficient heat dissipation baseband structure comprises a circuit board, a chip and a main heat dissipation substrate, the surface of the circuit board is provided with a positioning mechanism connected with the main heat dissipation substrate, and the circuit board is connected with the main heat dissipation substrate through the positioning mechanism and the main heat dissipation substrate. The main heat dissipation substrate is bonded on the plurality of groups of chips through heat conduction epoxy resin, so that the installation of the main heat dissipation substrate is completed, the heat of the chips can be conducted through the main heat dissipation substrate, and the heat can be dissipated from a path from a chip tube core to a chip shell to the main heat dissipation substrate to an external environment; according to the invention, at least one contact interface (heat-conducting silicone grease layer) with high heat resistance is reduced, the total heat resistance is obviously reduced, the heat dissipation efficiency is greatly improved by shortening a heat-conducting path and eliminating the heat resistance of a key interface, the system can reach a heat balance state more quickly due to the reduction of the heat resistance, and the heat stability of a single machine under transient power change is improved.

The invention relates to the field of heat-conducting silicone grease, and discloses low-thermal-resistance heat-conducting silicone grease and a preparation method thereof. The heat-conducting silicone grease with low thermal resistance is prepared from the following raw materials in parts by weight: 100 to 120 parts of silicone oil polymer, 135 to 150 parts of heat-conducting filler, 4 to 6.5 parts of methylcyclosiloxane, 2 to 4 parts of alkyl alkoxy silane and 0.2 to 0.4 part of lubricating additive, the silicone oil polymer is prepared from trimethyl trivinyl cyclotrisiloxane, vinyl terminated polydiphenyl siloxane-polymethylvinyl siloxane block polydimethylsiloxane, trimethylolpropane diallyl ether, hydrogen-containing silicone oil and a platinum catalyst through a reaction. The heat-conducting silicone grease prepared by the invention has relatively good thixotropy, heat conductivity and low-heat-resistance stability, and silicone oil is not easy to separate out in a long-term cold and hot cycle use process.

The utility model relates to the technical field of outdoor tables, and provides an extensible function combination portable outdoor table which comprises a placing table, a table top, a table top and a table top, the placing table comprises a first folding plate and a second folding plate, and the first folding plate is hinged to the second folding plate; the bottom of the placing table is fixedly connected with a plurality of groups of hinging pieces, one side of each hinging piece is provided with a supporting piece, the surface of the placing table is provided with a mounting groove, the inner wall of the mounting groove is fixedly connected with a solar power generation panel, and the surface of the solar power generation panel is provided with an acrylic plate. The structure is reasonable, a user places food or beverage in the heat preservation cover, the temperature of the copper sheet is reduced through the refrigeration face of the semiconductor refrigerator via heat conduction silicone grease, meanwhile, the heat preservation cover is placed on the sealing ring on the surface of the placement table, a closed space is formed, and the food and beverage are refrigerated.

The utility model relates to the field of igniter discloses a heat dissipation structure and high energy igniter. It includes shell, circuit board and heat dissipation component, and circuit board installs in the inside of shell, and the voltage increasing voltage transformation module is electrically connected on the circuit board, and the heat dissipation component includes copper sheet and heat dissipation piece, and the heat dissipation piece is aluminium material, and one side of copper sheet is pasted with the outer wall of voltage increasing voltage transformation module, and the other side is pasted with heat dissipation piece, and the side of heat dissipation piece far from copper sheet passes through shell and exposes in the air, and both sides of copper sheet pasted with voltage increasing voltage transformation module and heat dissipation piece all have daubed with heat -conducting silicone grease. The utility model discloses through heat dissipation component can make the heat of voltage increasing voltage transformation module promptly get dissipation;The heat dissipation effect of heat dissipation component is higher;The cost of igniter is low.

A device for strengthening heat transfer between a pipeline and a heater is characterized in that the device is composed of an inner pipe (2), an outer pipe (6) and heat conduction silicone grease (4), the inner pipe (2) is tightly wrapped on the pipeline (1) needing to be heated, the heat conduction silicone grease (4) is clamped between the inner pipe (2) and the outer pipe (6), and the heater (7) is sleeved and wrapped on the outer pipe (6). The inner pipe and the outer pipe are made of metal materials with good flexibility, and the outer surface of the metal is subjected to oxidation resistance treatment, so that the corrosion resistance of the metal can be improved, and the service life of the metal can be prolonged; according to the utility model, the high-heat-conduction metal and the heat-conduction silicone grease are combined, so that the cost can be reduced, and the heat transfer can be enhanced.

The invention discloses composite heat-conducting silicone grease and a preparation method thereof, and relates to the technical field of heat dissipation materials. The composite heat-conducting silicone grease is prepared from the following components in parts by mass: 5 to 8 parts of base oil, 3 to 6 parts of three-dimensional gel, 85 to 95 parts of composite heat-conducting filler and 0.5 to 3 parts of powder treating agent, and the three-dimensional gel is prepared from micro-crosslinking organic silicon gel and nano hierarchical pore silicon dioxide microspheres according to the mass ratio of (2 to 4) to (1 to 2). According to the invention, a unique gel network is formed in the base oil through the three-dimensional gelling agent, and the three-dimensional gelling agent and the composite heat-conducting filler have a synergistic effect, so that the product has high heat conductivity coefficient, extremely low oil yield, excellent pump-out resistance and certain self-healing ability, and the long-term reliability and the service life of the heat-conducting silicone grease are remarkably improved.

The invention provides insulating heat-conducting silicone grease and a preparation method and application thereof.The preparation method comprises the steps that spherical aluminum oxide is modified through a silane coupling agent, and modified aluminum oxide is obtained; mixing the modified aluminum oxide and the hydroxylated hexagonal boron nitride nanosheet, adding deionized water and a pH value regulator, mechanically shearing, collecting supernate, and drying to obtain KA-coated BN powder; and stirring the KA-coated BN powder, simethicone, a catalyst and an auxiliary agent, reacting, grinding, and removing bubbles to obtain the insulating heat-conducting silicone grease. According to the preparation method, the insulating heat-conducting silicone grease which is extremely high in inertness and not easy to prepare on a large scale can be prepared on a large scale, and the insulating heat-conducting silicone grease has high heat conductivity, corrosion resistance and insulativity and can be applied to the field of electronics and electromagnetism.

This invention provides a liquid metal-based thermal grease, its preparation method, and its application. The liquid metal-based thermal grease comprises the following raw materials in parts by weight: 100 parts liquid metal, 2-5 parts silicone oil, 0.1-20 parts thermally conductive powder filler, and 0.1-3 parts other additives. The high-reliability liquid metal-based thermal grease provided by this invention possesses excellent high thermal conductivity, high processability, and high reliability. It can replace traditional thermal grease to solve the heat dissipation and cooling problem of high-power chips, thereby extending the lifespan of electronic products.

The present disclosure relates to thermally conductive silicone compositions selected from non-curing thermally conductive silicone greases and curable thermally conductive silicone rubber compositions which, in each case, contain high levels (e.g., greater than 65 wt. %) of thermally conductive fillers but which thermal conductivity is further increased without increasing the specific gravity (i.e., density) resulting from the introduction of a greater quantity of thermally conductive fillers. The present disclosure also extends to methods for achieving the above and to uses for such materials.

The utility model provides an anti-interference high-heat-dissipation seven-layer circuit board, which sequentially comprises a conductive layer, a first insulating layer, a power supply layer, a second insulating layer, a grounding layer, a third insulating layer and a metal base layer from top to bottom, and graphene composite films are uniformly distributed and embedded on the edges of the sides of the metal base layer in order; a snakelike heat dissipation channel is formed in one side surface, close to the third insulating layer, of the metal base layer, and the snakelike heat dissipation channel is filled with a heat-conducting silicone grease layer; a heat conduction block is arranged at the position, away from the snake-shaped heat dissipation channel and the circuit area, of the metal base layer, and the heat conduction block is arranged close to the high heat dissipation area of the circuit board; a heat conduction block penetrates through the third insulating layer and is in contact with the grounding layer in an attached manner; the first insulating layer is provided with a plurality of honeycomb-shaped hexagonal grooves, and the honeycomb-shaped hexagonal grooves are filled with ferrite filling layers. And an anodic oxide layer is arranged on one side surface, far away from the third insulating layer, of the metal base layer. And the anti-interference and anti-corrosion functions are good, and the heat dissipation function is high.

The invention discloses a gas-assisted molding plastic injection mold and a use method, and relates to the technical field of injection molds. The mold comprises a static mold, a movable mold, a cavity, an injection molding pipe and a nitrogen pipeline, the static mold is sequentially provided with a bottom mold frame, a flat cable plastic frame, a heat insulation positioning frame and a top mold frame from outside to inside, an electric flat cable is installed on the flat cable plastic frame, an electric heating module is installed on the outer side of the bottom mold frame, and a heating module is arranged in the heat insulation positioning frame. The heating surface of the heating module is coated with a heat-conducting silicone grease layer and directly faces the unit heat absorption area on the top mold frame, and a ceramic heat insulation plate is embedded in the top mold frame. During use, the mold is firstly closed, molten plastic raw materials are injected, then the unit heat absorption area is pertinently heated through the electric heating module and the heating module, heat preservation is conducted through the ceramic heat insulation plate, then high-pressure gas is injected to assist filling and pressure maintaining, and a product is taken out after cooling and mold opening are conducted after exhausting. Accurate heating and efficient heat insulation are achieved, and the problems that a traditional mold is unbalanced in gas distribution, poor in melt state and fluctuating in temperature are solved.

The invention discloses a power assembly, power conversion equipment and a manufacturing method, and belongs to the technical field of power electronic equipment, and the power assembly comprises a substrate which comprises a first surface and a second surface which are oppositely distributed, the first surface is provided with a solder, the substrate is provided with a containing cavity, and the containing cavity is used for being filled with a phase change medium; the power module is arranged on the solder; and the first reinforcing structure is at least partially pressed on the first surface, the yield strength of the first reinforcing structure is greater than that of the substrate, and the first reinforcing structure is used for enabling the substrate to reach a preset state. According to the application, the substrate is pressed to the predetermined state through the first reinforcing structure with high yield strength, and the substrate in the predetermined state can flatten the silicone grease to avoid generation of holes due to migration of the silicone grease, so that the substrate and the silicone grease are fully attached, the thermal resistance is reduced, and the heat dissipation effect of the module is further improved.

The invention belongs to the technical field of sensors, and particularly relates to a surface acoustic wave sensor working at constant temperature and a preparation method thereof. The sensor comprises a heat dissipation layer, a thermoelectric refrigeration layer and a sensing layer, the heat dissipation layer serves as a base of the whole surface acoustic wave sensor and has high heat conduction performance; the thermoelectric refrigeration layer adopts a semiconductor refrigerator, the upper surface of the thermoelectric refrigeration layer is connected with the heat dissipation layer through heat-conducting silicone grease or in a welding manner, and the lower surface of the thermoelectric refrigeration layer is connected with the sensing layer through heat-conducting silicone grease or in a welding manner; the sensing layer comprises a composite functional substrate, and an SAW sensing unit and a temperature sensing unit which are integrated on the composite functional substrate; the device is compact in structure, high in integration level, high in temperature control precision, fast in thermal response and uniform in temperature field, and has a good application prospect.

The utility model relates to a heat-conducting consumable, in particular to heat-conducting silicone grease which comprises a body, the body is provided with an upper high filler layer and a lower high filler layer, the upper high filler layer is in a square shape, the inner side of the upper high filler layer is filled with a low filler layer, a containing groove is formed in the bottom of the lower high filler layer, and the lower high filler layer is filled with a heat-conducting material. The containing groove is filled with a protective filler layer, a graphene sheet is arranged on the inner side of the protective filler layer, the graphene sheet is attached to the bottom of a low filler layer, and the low filler layer and the protective filler layer are the same in component. The heat-conducting silicone grease has the advantages of being reasonable in design and high in heat-conducting performance, heat in electronic components can be more efficiently conducted out through the graphene sheets inside the heat-conducting silicone grease, the temperature of the electronic components can be reduced, the heat-conducting silicone grease can be evenly spread on the surfaces of the electronic components, the probability that the heat-conducting silicone grease overflows unevenly is reduced, and the heat dissipation performance is guaranteed.

A capacitor with a protective housing, comprising a capacitor body, characterized in that symmetrically arranged connecting pins are fixedly attached to the upper end of the capacitor body on the left and right, a fixed outer housing is movably attached to the outside of the lower end of the capacitor body, a graphitic thermal interface material is fixedly attached to the inside of the fixed outer housing, a limiting seat is fixedly attached to the upper end of the inner base of the graphitic thermal interface material, in which step recesses are formed, a damping pad is fixedly attached to the lower end of the fixed outer housing, thermal grease is firmly applied to both front and rear ends of the fixed outer housing, cooling fins are fixedly attached outside the thermal grease, and an insertion recess is formed at the upper end of the fixed outer housing.A height-adjustable inner housing is movably arranged in the insertion recess, and adjustment grooves and cooling grooves are formed successively from top to bottom at both left and right ends of the fixed outer housing.

The thermally conductive silicone grease composition (10) comprises a first thermally conductive silicone grease (7a, 7b) which contains a curing reaction catalyst and does not contain a crosslinking agent, a second thermally conductive silicone grease (8a, 8b) which does not contain a curing reaction catalyst and contains a crosslinking agent, and a bonding portion between the first thermally conductive silicone grease and the second thermally conductive silicone grease. The first and second thermally conductive silicone greases are bonded on at least one of the opposing surfaces via the bonding portions, the bonding portions (9a, 9b, 9c) are cured, and the portions other than the bonding portions are in an uncured state.

The utility model relates to the technical field of glass distillation devices, in particular to an interface connecting assembly of a glass distillation device, which comprises a kettle cover and a reflux pipe, a connecting pipe for condensation and reflux is arranged at the upper end of the kettle cover, and a first ball convex opening connector is arranged at one end of the connecting pipe; compared with the prior art, the utility model has the advantages that the kettle cover adopts the spherical convex opening, the reflux elbow also adopts the spherical convex opening, and the polytetrafluoroethylene sealing gasket is additionally arranged between the two spherical convex openings, so that the reflux efficiency of the condensed liquid solvent is higher, and the problem that the reflux efficiency is low due to the fact that the kettle cover adopts the spherical concave opening in the traditional interface connection mode is solved. According to the present invention, the reflux elbow adopts the ball opening convex opening manner, such that the condensed liquid solvent flows into the kettle along the glass wall after passing through the spherical surface concave opening of the kettle cover during the reflux so as to cause the secondary reaction returning to the interior of the kettle body to have a certain hysteresis; therefore, the practicability of the interface connecting assembly can be greatly improved.

The utility model relates to the field of circuit boards, in particular to a mining machine heat conduction and heat dissipation integrated circuit board which comprises a heat conduction board. The lower end of the heat conduction plate is fixedly connected with uniformly distributed heat dissipation blocks, and the upper end of the heat conduction plate is fixedly connected with a first high heat conduction insulating layer. According to the utility model, an aluminum substrate and a heat-conducting silicone grease layer are removed, and the high-heat-conducting insulating layer is adopted to directly bridge the chip to be connected with the heat-conducting plate, so that the heat transfer level is greatly shortened, the interface thermal resistance is remarkably reduced, the heat is rapidly and directionally conducted, and the working temperature stability of the chip is improved; performance fluctuation caused by heat attenuation of multiple layers of media of a traditional structure is effectively avoided, through collaborative design of the T-shaped heat dissipation grooves and the columnar heat conduction columns, a three-dimensional heat dissipation channel is constructed, the air convection efficiency is enhanced, the heat conduction plates made of high-heat-conduction materials are combined, the overall heat dissipation capacity is remarkably improved, continuous and stable operation of the chip under the high-load working condition is ensured, and the service life of the chip is prolonged. The compact structure design breaks through the space limitation of a traditional heat dissipation system.