1348 results about "Silicone grease" patented technology

The invention discloses a heat-conducting silicone grease composition which mainly consists of organic silicone oil, a silicane coupling agent and heat-conducting powder, wherein the silicane coupling agent covers the surface of the heat-conducting powder; the heat-conducting powder is prepared from powders with larger, intermediate and small diameters; and the concerned metal powder is subjected to heat treatment to form an oxide film on the surface of the metal powder. The heat-conducting silicone grease composition has high heat conductivity and good fluidity; secondarily, the heat-conducting silicone grease composition has high temperature resistance and can keep good heat conductivity and fluidity at 250 DEG C; additionally, the heat-conducting silicone grease composition requires no refrigeration and has the advantages of simplified storage and operation flows and high reliability.

The invention discloses an organic silicon defoamer and preparing method in the hydraulic flexible ink and paint, which comprises the following parts: silicon polyether, silicone grease, emulsifier and thickener, wherein the active content is 10-50% corresponding to emulsion; the silicon polyether and silicone grease is 70-90% in the active content; the disperse dielectric adopts deionized water.

The invention discloses an efficient silicone defoaming agent, which mainly comprises a silicone grease mixture, a synergistic agent, a polyether silicone oil emulsifier, an assistant emulsifier, a thickening agent, preservative and water, wherein in an emulsifier emulsion, the silicone grease mixture and the polyether silicone oil emulsifier account for 70-90 percent of the amount of active matters; the active matters account for 5-30 percent of the amount of the emulsion; and water serves as another medium. In the efficient silicone defoaming agent, the foam inhibiting performance is enhanced by using the silicone grease mixture, the defoaming performance and dispersity are improved by using the polyether silicone oil emulsifier, and the silicone grease viscosity and compatibility are lowered and the emulsifying effect is improved by adding the synergistic agent. The efficient silicone defoaming agent has the characteristics of application to waterborne systems, high defoaming speed, good foam inhibiting effect, low using dosage, high chemical inertness, nontoxicity, capability of acting under severe conditions and low cost.

The invention discloses a measuring device and method for a trap parameter of solid dielectric. The solid dielectric material is charged by using a three-electrode corona discharge system; a material sample to be tested is placed below a single-needle electrode and a metal mesh electrode; the sample is adhered to a metal disc electrode through conductive silicone grease and is charged by the three-electrode system; after charging is ended, an external voltage is removed, and short circuit discharge is performed to remove surface free loads; surface potential of the measured sample is attenuated; and the trap energy level and the trap density parameter of the material can be calculated through a signal conditioning circuit and a data acquisition system. The measuring device comprises a constant temperature box, the three-electrode coronate charging system, a surface potential measuring system, a sample preheating system, a rotary electrode and a temperature and humidity control system. The invention provides an effective analysis means for research in representation of an aging condition of a polymer insulating material and an aging rule of polymer by the trap parameter and research in aspects such as a solid dielectric surface electrification phenomenon and surface flashover performance influence.

The invention discloses a phase change heat-conducting thermal silicone grease composition for central processing unit (CPU) radiating. The phase change heat-conducting thermal silicone grease composition is prepared from the following raw materials in parts by weight: 5-10 parts of base oil, 5-10 parts of paraffin, 1-3 parts of vinyl trimethoxy silane, 80-90 parts of heat-conducting filler. The method for preparing the phase change heat-conducting thermal silicone grease composition for CPU radiating comprises the following steps: 1) performing particle size distribution on the heat-conducting filler; 2) mixing the compounded heat-conducting filler and vinyl trimethoxy silane in ethanol, regulating the pH of the solution to be 3-4, heating to the temperature of 70-80 DEG C, stirring for 2-4 hours, removing ethanol, and obtaining a modified inorganic filler; and 3) heating 5-10 parts by weight of paraffin to be melted, adding 5-10 parts by weight of base oil and the modified inorganic filler prepared in the previous step, and fully mixing to prepare the phase change heat-conducting thermal silicone grease composition. The phase change heat-conducting thermal silicone grease is high in heat-conducting coefficient and high in heat transfer capacity, and the excessive heat of the CPU can be rapidly derived, so that the service life of the CPU is prolonged, and the preparation process is simple.

The invention discloses a moistureproof type low-smoke halogen-free flame-retarding wire and cable insulation material used for building. The insulation material comprises components, by weight, 100 parts of vinyl copolymer and/or ethylene propylene rubber, 100-250 parts of halogen-free flame retardants, 1-20 parts of compatilizer, 0.3-5 parts of antioxygen, 0.5-5 parts of lubricants, 0-3 parts of coupling reagents, 0-2 parts of dispersing agents, and 2-20 parts of one or more of vinyl silicone oil, silicone, silicone grease, silicone rubber, and mineral oil. Wires made of the material is low in smoke, free of halogen, incapable of releasing poisonous gas. Flames can be retarded due to the fact that a single stick of wire can vertically combust at combusting time. Moreover, some special addition agents are added in materials of insulation layers or protective sleeve layers, so that the surface hydrophobic property of products is increased and can be used in a high-temperature humid environment for a long time, and short circuit accidents caused by moisture absorption of the wire insulation layers are avoided.

The invention discloses a heat-conductive silicone grease composition being high in heat conductivity and low in viscosity and freeness degree, and a preparation method of the silicone grease composition. The heat-conductive silicone grease composition includes organo-polysiloxane, heat conductive filler and other additives. By selecting the heat conductive fillers in multiple dimensions (one-dimension, two-dimension and three-dimension) and multiple scales (micron, submicron and nanometer) and in special ranges, synergistic effect among the multi-dimension and multi-scale fillers is achieved,thus achieving compact stack of the fillers in a local network structure. The heat-conductive silicone grease not only is improved in heat-conductivity but also has good flowability, low viscosity and low freeness degree.

Using YAG single crystal body converts part of blue light sent from GaN based semiconductor LED crystal grain to another light in one or more ideal wave bands. Then, not converted remanent blue light sent from LED crystal grain is mixed with the converted light in ideal wave band to generate white light. Through controlling each parameter of fluorophor of single crystal chip, the method adjusts and controls proportion between yellow light converted by the fluorophor of single crystal and not converted blue light. At the same time, using evenness of single crystal chip obtains even white light in high quality. Comparing with traditional technique, the invention solves difficult issue of controlling dispersivity of powder of fluorophor in sealant in silicone greases or resins. After wafer is cut to chips in desired size, packaging operation is full automatic so as to raise degree of mechanization.

The invention discloses a packaging method for a sensitivity enhanced optical fiber grating temperature sensor, belongs to the technical field of sensors, and relates to a sensitivity enhanced packaging method of the optical fiber grating temperature sensor. The method is characterized in that the optical fiber grating is packaged into a metal capillary tube by applying prestress to the optical fiber grating and gluing two ends of the optical fiber grating, and the metal capillary tube packaged with the optical fiber grating is put into an outer stainless steel tube the internal diameter of which is greater than the external diameter of the metal capillary tube, then heat conducting silicone grease is filled between the metal capillary tube and the outer stainless steel tube, and finally the two ends of the outer stainless steel tube are connected with an optical fiber jacket or an optical fiber cable; and a fiber pigtail of the optical fiber grating must be ensured to be in a bent state during the packaging process. The beneficial effects of the packaging method is that the sensitivity enhanced optical fiber grating temperature manufactured by the packaging method has the advantages of high temperature sensitivity, rapid response speed, simple structure, reasonable design, high survival rate of the field installation and the like, and can be used for high-precision temperature measurement in such occasions as intense electromagnetic radiation, flammable and explosive occasions and the like.

The invention discloses measuring equipment for heat conductivity coefficients of solid materials. The measuring equipment comprises a thermal insulating layer (1), and a heating plate (2), a soaking plate (3), a temperature sensor group (4), a temperature sensor group (5), a heat dissipation plate (6) and a constant temperature plate (7) which are arranged inside the thermal insulating layer (1) from bottom up in sequence, wherein two wholes are formed by bonding the heating plate (2) with the soaking plate (3), the heat dissipation plate (6) and the constant temperature plate (7) through heat-conducting silicone grease; the temperature sensor group (4) is mounted on the upper surface of the soaking plate (3) and distributed uniformly on the upper surface of the soaking plate (3); the temperature sensor group (5) is mounted on the lower surface of the heat dissipation plate (6) and distributed uniformly on the lower surface of the heat dissipation plate (6); the measuring equipment further comprises fitting function, which relates to the temperature of the lower surface of the heat dissipation plate (6), of temperature gradient of the lower surface of the heat dissipation plate (6). The invention further discloses a measuring method of the measuring equipment. The measuring equipment and the measuring method can rapidly and accurately measure the heat conductivity coefficients of to-be-measured samples.

The invention discloses a low-filling-capacity and high-heat-conductivity graphene/silicone grease composite material and a preparation method thereof. Heat-conductive silicone grease is prepared by filling functional reduction-oxidation graphene sheet with silicone oil. The preparation method of the composite material comprises the following steps: preparing the functional reduction-oxidation graphene sheet as heat-conductive filler; sufficiently mixing the modified heat-conductive filler and dimethicone matrix in a double-roller open mill to uniformly disperse the functional reduction-oxidation graphene sheet in the silicone oil matrix. The heat-conductive silicone grease provided by the invention can be used for effectively avoiding the contacting gap between a high-power electronic component heating element and a heat radiation device, so that the interface contact thermal resistance can be reduced, a high-efficiency heat radiation passage is formed, and heat transfer is accelerated; the silicone grease is beneficial to encapsulation and radiation of the high-power electronic components, can be used for improving the reliability of the electronic component products and prolonging the service life of the products, and is simple in preparation process.

Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 μm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.

The invention discloses a thermal transfer ribbon which comprises an ink layer, a release agent layer, base material and a thermal resistant layer. The ink layer comprises water-dilutable resin, inorganic nanoscale pigment, organic pigment, dispersant, curing agent, deformer and deionized water. The release agent layer comprises organic silicone resin, water-based wax emulsion, talcum powder and deionized water. The base material includes polyester film and thermal-conductive silicone grease. The thermal resistant layer comprises perfluorocarbon, organic silicone resin and deionized water. The invention further discloses a preparation method for the thermal transfer ribbon. The preparation method includes steps of stirring, mixing, drying and the like. The thermal-conductive silicone grease is added to the base material polyester film, using temperature of the thermal transfer ribbon is increased, thermal resistance and adaptability of the thermal transfer ribbon are improved, and printing speed is increased. The thermal resistant layer is added to the thermal transfer ribbon, and accordingly performance of the thermal transfer ribbon is improved. The release layer is added, and accordingly the ink is easier to separate from the base, strippable level is high, printing effect is better, and writing is clearer. The deionized water is used as solvent, and accordingly production cost is reduced, and cost performance of the thermal transfer ribbon is better.

The invention discloses a large-scale true tri-axial test method and a large-scale true tri-axial test device, which can be used for carrying out the true tri-axial test on an original grading rockfill body. The device is arranged in a concrete cave chamber; six faces of a sample are loaded by rigid slabs; three directional main stress is applied by a hydraulic jack controlled by adopting a hydraulic system; two layers of rubber membranes are sleeved at the inner side of a steel plate so as to reduce friction; silicone grease is coated between the rubber membranes; and rigidity compression plates are respectively provided with a displacement sensor or a dialgage used for determining the deformation of the sample in all directions. The device can be used for testing a large-sized original grading sample of the rockfill body, therefore, the size effect can be completely avoided, larger axial strain can be achieved, and a complicated stress-strain path can be simulated.

Provided is a heat conductive silicone grease composition, including: an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm²/s, an alkoxysilane containing specific substituent groups, an organohydrogenpolysiloxane containing 2 or more SiH groups within each molecule, a heat conductive filler, a platinum-based catalyst, and an addition reaction retarder. The heat conductive silicone grease composition exhibits high thermal conductivity, has excellent fluidity prior to curing and therefore exhibits favorable workability, is capable of filling fine indentations and therefore reduces contact resistance, and is also able to prevent oil separation and bleeding of the heat conductive material following curing, meaning the composition exhibits excellent heat radiation performance and reliability. Also, the heat conductive silicone grease composition exhibits improved durability under conditions of high temperature and high humidity, and thereby exhibits further improved reliability during actual use.

Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane of a specific structure with a kinematic viscosity at 25° C. within a range from 10 to 100,000 mm²/s, (B) 0.1 to 50 parts by volume of an organopolysiloxane that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, displays excellent initial fluidity and is capable of retaining that fluidity over an extended period, and exhibits excellent heat radiation performance. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.

The invention discloses ultra-low thermal-resistance heat-conducing silicon grease. The silicon grease is prepared by the following raw materials according to parts by weight: 100 parts of polydimethylsiloxane, 10-40 parts of polyphenylmethylsiloxane, 1000-2600 parts of aluminum oxide, 20-60 parts of zinc oxide and 1-10 parts of a coupling agent. Furthermore, the invention discloses a preparation method of the ultra-low thermal resistant heat-conducing silicon grease. The heat-conducting silicon grease has the following advantages that the silicon grease has a high heat-conducting coefficient and ultra-low contact thermal resistance, and the contact thermal resistance is lower than 0.06K.cm<2>/W (pressure 40psi); and the silicon grease is stable to store at room temperature, free from oil seepage, good in high-temperature resistance, free from drying after long-time use at high temperature, and excellent in both electric insulating and dielectric performances.

The invention relates to a solid particle foam inhibitor and a preparation method thereof. The foam inhibitor component comprises an organic carrier, a main defoaming substance, an emulsifying agent, a structural agent and deionized water, wherein the organic carrier can be dextrin, starch, and the like; the main defoaming substance is a complex of high-viscosity silicone and low-viscosity silicone; and the structural agent can be acrylic acid and maleic acid copolymer, sodium citrate, and the like. The preparation method of the foam inhibitor comprises the following steps of: fully mixing the main defoaming substance with the emulsifying agent; then adsorbing the mixture on a carrier; adding the structural agent and granulating and drying to form a particle with favorable mobility. The prepared solid particle foam inhibitor is quite applicable to the industrial processes of cleaning, sewage treatment and textile printing and dyeing.

The invention discloses a heat-conducting silicone grease composition with low oil separation degree and a preparation method thereof. The heat-conducting silicone grease composition with low oil separation degree includes: by weight, 30-40 parts of vinyl silicone oil, 0.1-1.0 part of hydrogen-containing silicone oil, 0.05-0.1 part of an inhibitor, 0.01-0.05 part of platinum-vinyl siloxane complex, and 100-500 parts of heat-conducting filler. The silicone oil in the heat-conducting silicone grease composition with low oil separation degree is difficult to transfer, and the oil separation degree is less than 0.05% (200 DEG C, 24h, HG/T 2502). The composition has secular stable thermolysis when using in the electron component, and has no harmful effect on the electron component because of the transference of the silicone oil.

The invention relates to an evaporator for cooling a chip and a manufacture method thereof. The evaporator combines a micro-porous surface coat with a plurality of small-scale passageways. An evaporator main body consists of an upper cover plate and a lower base plate. The two ends of the upper cover plate of the evaporator are provided with a cooling liquid inlet and a cooling liquid outlet. The two ends of the lower base plate of the evaporator are respectively provided with an empty cavity; and the lower base plate is machined with a plurality of parallel ribs to form into the plurality of parallel small-scale passageways for flowing cooling liquid. The bottom surface of each small-scale passageway is coated with a layer of micro-porous surface coat for greatly intensifying the boiling phase-change heat transmission of the cooling liquid. The evaporator is glued with a heating electronic chip through a layer of heat-conductive silicone grease, heats up the cooling liquid which flows the passageways therein, absorbs the dissipated power of the electronic chip in the form of flowing boiling heat transmission, has the characteristics of small flow resistance, compact structure and low cost, has strong cooling performance, and is applied to cooling the electronic chip with high dissipated power.

The invention provides an adjustable device for atmospheric pressure low-temperature plasma jet arrays. Single plasma generators are fixed with stud sleeves through cementation; the stud sleeves and a box body are in threaded connection, and sealing silicone grease is used for lubricating and sealing at the joints of screws; working gas is introduced into the upper end of the box body, and uniformly flows into the plasma generators through filtering screen meshes; the stud sleeves can be adjusted up and down relative to the position of the box body by screwing the stud sleeves, and thus the plasma generators can be driven to be adjusted up and down; the adjusting distance can be calculated through a screwing number of turns and a screw pitch; various combined adjustments of the plasma jet arrays can be realized by adjusting the up-and-down positions of the single plasma generators, and the adjustable device is suitable for different array forms of existing linear arrays and annular arrays. According to the adjustable device, the up-and-down positions of the plasma generators can be adjusted according to practical requirements, and the application flexibility and processing accuracy of the plasma jet arrays are improved.