72results about How to "Lower interface thermal resistance" patented technology

The invention provides a back contact photovoltaic cell piece capable of preventing stacking scratch in a high-temperature passivation process. The back contact photovoltaic cell piece comprises a back contact photovoltaic cell piece body and a plurality of soft isolation protrusions located on the light receiving face of the back contact photovoltaic cell piece body. The soft isolation protrusions are used for supporting photovoltaic cells to be mutually isolated when the photovoltaic cells are stacked layer by layer, and the soft isolation protrusions are resistant to high temperature of 300 DEG C and do not become sticky or yellow within 3 hours. According to the invention, the soft isolation projections are arranged on the light receiving surface of the back contact photovoltaic cell sheet body to support mutual isolation of the photovoltaic cell sheets when the photovoltaic cell sheets are stacked layer by layer, so that the photovoltaic cell sheets can be protected from being scratched in the stacking and moving process; the flexible isolation protrusions are arranged on the back contact photovoltaic cell piece, the flexible isolation protrusions can be prevented from scratching the surface of the photovoltaic cell piece due to the specific flexibility of the flexible isolation protrusions, meanwhile, the flexible isolation protrusions can bear the passivation temperature of 300 DEG C or above and do not crack or yellow or adhere to the cell piece, and therefore it can be ensured that the back contact photovoltaic cell piece is subjected to high-temperature passivation in a multi-layer stacking mode, and the passivation efficiency is improved.

The invention discloses an aerosol generating product and an aerosol generating system.The aerosol generating product comprises an aerosol forming base material sheet and a magnetic heating body sheet, and the magnetic heating body sheet and the aerosol forming base material sheet are arranged in a stacked mode in the thickness direction and attached in the stacked area in a surface contact mode; the main heat conduction path directed from the magnetic heating element sheet to the aerosol-forming substrate sheet is a path passing through the thickness direction of the laminated region. Compared with the prior art, the magnetic heating body sheet and the aerosol forming base material sheet are laminated along the thickness direction, and the surface contact is realized in the lamination area, so that the main conduction path of heat from the magnetic heating body sheet to the base material is a short path passing through the lamination thickness direction; therefore, heat conduction distance is shortened, interface thermal resistance is reduced, and heating response speed and energy utilization rate are improved. And meanwhile, the base material is heated more uniformly, so that the aerosol generation efficiency and consistency are improved, and the risk caused by local overheating is reduced.

This invention discloses a high thermal conductivity PCB metal substrate and its preparation method, relating to the field of PCB manufacturing technology. The high thermal conductivity PCB metal substrate of this invention comprises at least a metal base layer and a thermally conductive dielectric layer; the thermally conductive dielectric layer comprises at least the following raw materials in parts by weight: 100 parts of 1,5-naphthol modified epoxy resin; 20-35 parts of bismaleimide; 10-25 parts of diallyl biphenyl ester; 20-50 parts of cyanate ester; 20-50 parts of bismaleimide-coated aluminophosphate passivated aluminum nitride@boron nitride composite thermally conductive filler; 5-15 parts of bismaleimide-octavinyl cage-type polysilsesquioxane composite porous microspheres; 20-35 parts of curing agent; and 0-10 parts of diluent. The PCB metal substrate prepared by this invention possesses high thermal conductivity, low dielectric constant, high interfacial peel strength, and excellent heat resistance.

This invention relates to the field of special ceramics preparation technology, and discloses a process for preparing high thermal conductivity ceramic materials for high-nickel ternary cathode sintering, including: preparing magnesium aluminum spinel green blanks containing magnesium oxide, yttrium oxide and titanium oxide composite additives; performing cyclic variable oxygen pressure sintering at 1420℃ to 1480℃, controlling the furnace atmosphere to periodically switch between the first and second oxygen partial pressure states. This invention utilizes the oxygen potential difference to drive the grain boundary liquid phase to alternate between low viscosity wetting and high viscosity pinning characteristics, eliminating the rheological quiescent zone at the end of sintering, effectively suppressing abnormal grain growth while ensuring high material density, and improving the thermal conductivity and lithium erosion resistance of the ceramic sagger.

The application provides a high-thermal-conductivity diamond / copper composite material and an SPS sintering process thereof, raw material pretreatment: selecting three kinds of monocrystalline diamond particles with different particle sizes, mixing the titanium-plated diamond obtained after vacuum titanium plating treatment; solid dry powder mixing: uniformly mixing a solid additive and graphene modified copper powder to prepare a copper-based composite dry powder; nitrogen intermittent airflow suspension dispersion: adding the titanium-plated diamond into a sealed covering tank to make the titanium-plated diamond suspended and dispersed in the sealed covering tank; atomization covering makes the copper-based composite dry powder uniformly covered on the surface of the titanium-plated diamond to obtain composite particles; vacuum low-temperature degreasing to obtain the composite particles after degreasing, and SPS sintering demolding to obtain the high-thermal-conductivity diamond / copper composite material. The coating is uniform and dense, has no exposure and no agglomeration, and significantly reduces porosity and interface thermal resistance; the proportioning is accurate, the degreasing is thorough, and there is no residue; the generation of brittle phases is inhibited, and the interface combination is excellent; the thermal conductivity is stable and greater than 700 W / (m*K), and the density is greater than or equal to 99%.

The invention discloses a diamond filler for chip heat dissipation and a preparation method thereof, and belongs to the technical field of heat conduction fillers, the diamond filler comprises the following raw materials by weight: 90-100 parts of pretreated functional diamond, 4-8 parts of modified carbon nanotubes and 15-25 parts of modified hexagonal boron nitride nanoparticles; the diamond filler for chip heat dissipation is prepared by mixing pretreated functional diamond, modified carbon nanotubes and modified hexagonal boron nitride nanosheets, adding the mixture into N-methyl pyrrolidone, adding 1-ethyl-(3-dimethylaminopropyl) carbodiimide hydrochloride and N-hydroxysuccinimide, and carrying out a reaction. According to the mode, micro-grinding rounding and dopamine functionalization of the diamond, carbon nano tube modification and hexagonal boron nitride modification have a synergistic gain effect on the filler heat conductivity, composite material heat conductivity and composite material CTE of the prepared diamond filler.

The application relates to the technical field of semiconductors, and particularly discloses a POI substrate, a preparation method thereof and an acoustic device. The preparation method of the POI substrate comprises the following steps: providing a substrate; growing an amorphous gallium oxide layer on the substrate; and growing a nanocrystalline gallium oxide layer on the amorphous gallium oxide layer; wherein the nanocrystalline gallium oxide layer is c-axis oriented perpendicular to a section; the nanocrystalline gallium oxide layer is subjected to activation treatment to obtain a first intermediate product; a piezoelectric substrate is subjected to ion implantation to form a peeling defect layer at a preset position of the piezoelectric substrate, thereby obtaining a second intermediate product A; the first intermediate product is bonded with the second intermediate product A to obtain a third intermediate product A; the third intermediate product A is treated by using a pulse laser to convert the nanocrystalline gallium oxide layer into an epsilon-phase gallium oxide layer; and the piezoelectric substrate is split and partially peeled along the peeling defect layer to form a piezoelectric layer. By implementing the application, the heat conduction performance and reliability of the POI substrate can be improved.

This invention provides a low-density flame-retardant thermally conductive foam powder filler, composed of the following components in parts by weight: 200-300 parts of boron nitride (80-100 micrometers); 200-300 parts of hollow glass microspheres (50-70 micrometers); 200-300 parts of aluminum hydroxide (8-10 micrometers); 200-300 parts of aluminum hydroxide (1-2 micrometers); and 2-4 parts of coupling agent. Its advantages are: 1. Low density: By introducing low-density hollow glass microspheres, the overall density of the filler is effectively reduced, meeting lightweight design requirements. 2. High thermal conductivity: The compound boron nitride forms a highly efficient thermal conductivity network. 3. Excellent flame-retardant performance: The halogen-free flame retardant aluminum hydroxide works synergistically with the hollow glass microspheres. The hollow glass microspheres form a glassy barrier at high temperatures, isolating oxygen and heat, achieving excellent flame-retardant effects. 4. Good dispersibility and compatibility: By modifying the powder surface with silane coupling agent, a "molecular bridge" is formed between the inorganic powder and the organic polymer matrix, which significantly reduces agglomeration, lowers the interfacial thermal resistance, and significantly reduces the viscosity of the system.

The utility model relates to the technical field of LED display structures, in particular to an efficient heat dissipation LED display structure which comprises a base material layer, a chip layer, an optical adjustment layer and a packaging protection layer, the base material layer is arranged at the bottommost layer, the chip layer is arranged at the upper end of the base material layer, the optical adjustment layer is arranged at the upper end of the chip layer, and the packaging protection layer is arranged at the lower end of the optical adjustment layer. The packaging protection layer is arranged at the upper end of the optical adjustment layer; the chip layer and the base material layer are connected in a bonding mode, and a gap position between the chip layer and the base material layer is filled with a reflective glue filling layer; the optical adjustment layer is attached to the surface of the chip layer; and the packaging protection layer is cured on the surface of the optical adjustment layer.

The utility model discloses a kind of heat exchange equipment and pulping system. Heat exchange equipment includes heat exchange cylinder and cold pipe. Heat exchange cylinder is provided with heat exchange cavity, feed inlet and discharge port, heat exchange cavity is communicated with feed inlet and discharge port, cold pipe is set in heat exchange cavity, and it is used for being contacted with slurry, cold pipe includes at least one coil pipe, each coil pipe is spirally arranged along the central axis of heat exchange cylinder, each coil pipe includes multiple radiating sections, multiple radiating sections are sequentially connected along the axial direction of heat exchange cylinder, in the axial section of the central axis of heat exchange cylinder, two adjacent radiating sections are spaced apart. Using the heat exchange equipment provided by the utility model, the resistance in the flow process of slurry is reduced, the pressure drop of heat exchange equipment is reduced, the energy consumption of heat exchange equipment is reduced, the pipeline wear and tear and leakage risk caused by high pressure of heat exchange equipment are reduced, the service life of heat exchange equipment is prolonged, the maintenance cost is reduced, and the heat exchange area between slurry and cold pipe is increased, the heat dissipation effect of slurry is improved.

The utility model relates to the field of circuit boards, in particular to a mining machine heat conduction and heat dissipation integrated circuit board which comprises a heat conduction board. The lower end of the heat conduction plate is fixedly connected with uniformly distributed heat dissipation blocks, and the upper end of the heat conduction plate is fixedly connected with a first high heat conduction insulating layer. According to the utility model, an aluminum substrate and a heat-conducting silicone grease layer are removed, and the high-heat-conducting insulating layer is adopted to directly bridge the chip to be connected with the heat-conducting plate, so that the heat transfer level is greatly shortened, the interface thermal resistance is remarkably reduced, the heat is rapidly and directionally conducted, and the working temperature stability of the chip is improved; performance fluctuation caused by heat attenuation of multiple layers of media of a traditional structure is effectively avoided, through collaborative design of the T-shaped heat dissipation grooves and the columnar heat conduction columns, a three-dimensional heat dissipation channel is constructed, the air convection efficiency is enhanced, the heat conduction plates made of high-heat-conduction materials are combined, the overall heat dissipation capacity is remarkably improved, continuous and stable operation of the chip under the high-load working condition is ensured, and the service life of the chip is prolonged. The compact structure design breaks through the space limitation of a traditional heat dissipation system.

The invention discloses an ammonia-methanol coupling gas production device and a use method thereof, and belongs to the technical field of controllable atmosphere preparation, the ammonia-methanol coupling gas production device comprises a central combustion zone, a peripheral cracking zone and a tail mixing purification zone which are coaxially nested; the central combustion area comprises a hearth wall, and the hearth wall is of a honeycomb-shaped porous heat exchange structure; the peripheral cracking area is arranged on the outer side of the central combustion area, a catalyst bed layer of a spiral flow guide structure is arranged in the peripheral cracking area, and a high-temperature-resistant heat-conducting filling layer is arranged between the catalyst bed layer and the hearth wall of the central combustion area; the tail mixing and purifying area is connected to the downstream of the central combustion area and the peripheral cracking area and used for mixing and purifying combustion products from the central combustion area and cracking gas from the peripheral cracking area. By optimizing a heat exchange interface and a catalyst bed layer structure, the heat transfer uniformity and the response speed are enhanced, so that stable temperature control and preparation of high-purity mixed gas are realized.

The application discloses a low-volatility high-thermal-conductivity insulating silica gel composite material suitable for power batteries, characterized by comprising the following components in mass parts: 3-10 parts of vinyl silicone oil, 8-20 parts of liquid acrylic ester rubber, 95-105 parts of compounded thermal conductive powder, 0.3-0.5 parts of hydrogen-containing silicone oil, 0.02-0.04 parts of platinum catalyst, 0.02-0.05 parts of acetylenic alcohol inhibitor and 0.8-2.0 parts of silane modifier. The low-volatility high-thermal-conductivity insulating silica gel composite material adopts low-volatility vinyl silicone oil and liquid acrylic ester rubber as a composite matrix, can effectively coat the vinyl silicone oil at a very low content and the compounded thermal conductive powder at a high content, avoids problems such as sharp increase of dispersion resistance and particle agglomeration in the modification and subsequent mixing process of the thermal conductive powder, and can stabilize the thermal conductivity coefficient at more than 6.5 W / (m*K), the volatilization amount is less than 90 ppm, and can be used in the range of -40 DEG C to 200 DEG C.

The utility model discloses high -power load heat radiation structure, including extension assembly, be provided with cable assembly and load on the extension assembly, the extension assembly includes the box body and lid body that constitute by heat conduction plate, the lid body covers and is set up in the open end of box body, the bottom end interval distribution of box body has a plurality of mounting holes, a plurality of load one -to -one corresponding installation in mounting hole, the contact surface of load with box body still is provided with heat conduction coating layer. The utility model discloses through setting extension assembly, will connector, load and so on key components integration in the structure that the box body and lid body of heat conduction constitute, and the load is embedded through bottom mounting hole and is coated with the heat -conducting silicone grease between the contact surface of box body, effectively reduced the interface thermal resistance, has built the efficient heat conduction path from the load heat source to external environment, has improved the heat dissipation capacity of system significantly, prevents the performance decline or device damage because of local overheating.

This invention relates to the field of electronic packaging composite materials technology, and particularly to a thermally conductive epoxy encapsulation material, its preparation method, and its application. The invention uses Fe3O4 nanospheres and sodium polyacrylate solution as raw materials to prepare polyacrylic acid-modified Fe3O4 nanospheres; these are then blended with adipic acid and epoxy resin, and a thermally conductive epoxy encapsulation material is prepared through a curing reaction. The thermally conductive epoxy encapsulation material prepared by the method of this invention exhibits uniform dispersion of Fe3O4 nanospheres, good interfacial compatibility, and high thermal conductivity, demonstrating excellent thermal conductivity, interfacial reliability, and mechanical properties, making it well-suited for electronic chip packaging applications.

The application discloses a spherical aluminum nitride silicon grease high-thermal-conductivity interface material composition and belongs to the technical field of thermal-conductivity interface materials.The spherical aluminum nitride silicon grease high-thermal-conductivity interface material composition comprises, in terms of weight parts, 50-80 parts of spherical aluminum nitride and 50-100 parts of modified silicon oil, the modified silicon oil is silicon oil grafted with adamantane molecules and fluorine-containing alkyl groups on the side chain, and the spherical aluminum nitride is prepared by using aluminum powder with low, medium and high particle sizes, wherein the spherical structure guarantees the fluidity of the silicon grease, the introduction of the adamantane molecules and the perfluoroalkyl molecules improves the heat resistance of the silicon oil and reduces the migration rate of the silicon oil, different particle sizes of the spherical aluminum nitride are used in combination for compounding, the filler with a smaller particle size can fill the gaps between the fillers with a larger particle size, a more perfect thermal-conductivity channel is constructed, the gap rate between the filler particles is greatly reduced, and the thermal-conductivity performance of the material is improved.

The application relates to a temperature-sensitive adjustable heat rectification porous material and a preparation method thereof, and belongs to the technical field of functional materials and thermal management materials. The temperature-sensitive adjustable heat rectification porous material comprises an asymmetric porous polymer skeleton and a temperature-sensitive polymer network embedded in the interior of the polymer skeleton, wherein the asymmetric porous polymer skeleton has a pore size difference in the thickness direction, one side of the asymmetric porous polymer skeleton is a small-pore structure, and the other side is a large-pore structure. The temperature-sensitive polymer network is introduced into the asymmetric porous polymer skeleton, so that the heat rectification is changed from a static behavior to a dynamic adjustable behavior. Under a low-temperature condition, the temperature-sensitive polymer absorbs water to expand, the pore size of the large-pore side is reduced, the pore size difference is reduced, and the heat rectification ratio is reduced; under a high-temperature condition, the temperature-sensitive polymer is dehydrated to shrink, the pore size of the large-pore side is increased, the pore size difference is increased, and the heat rectification ratio is increased. Through the mechanism, the heat rectification ratio can be adjusted and changed in the range of 25-40 DEG C, and the heat regulation capacity is remarkably improved.

The application discloses a method for improving the metalization connection strength of n-type Bi2Te3-based thermoelectric elements based on anchoring effect, and comprises the following steps: configuring a n-type Bi2Te3-based wafer surface treatment agent, the composition of which comprises 40-50% sulfuric acid (volume), 1-2% nitric acid (volume), and the rest is water; immersing a clean n-type Bi2Te3-based wafer into the surface treatment agent to perform surface etching; then immersing the etched n-type Bi2Te3-based wafer into ultrapure water to perform ultrasonic treatment; performing metalization connection on the ultrasonically treated n-type Bi2Te3-based wafer through electroplating or chemical plating, the plated metal is easy to form anchoring effect with the n-type Bi2Te3, the metalization connection strength is improved; and finally performing scribing and cutting to obtain the Bi2Te3-based thermoelectric elements with high metalization connection strength. The application makes the n-type Bi2Te3-based wafer have high surface roughness before electroplating, which is beneficial to forming anchoring effect with the plated metal such as nickel, so that the Bi2Te3-based thermoelectric elements with high metalization connection strength are obtained, and the thermoelectric elements are not physically damaged, and the product qualification rate can be improved.

This invention discloses a high thermal conductivity semiconductor packaging substrate and its preparation method, relating to the field of electronic materials technology. The method includes the following steps: mixing composite aluminum nitride powder with a sintering aid, ball milling, drying, and pressing into shape; sintering under high temperature and high pressure in a nitrogen atmosphere to obtain an aluminum nitride ceramic substrate; washing and drying the aluminum nitride ceramic substrate; covering both sides of the aluminum nitride ceramic substrate with copper foil, laying active solder between the aluminum nitride ceramic substrate and the copper foil, and then connecting them by vacuum brazing to obtain the semiconductor packaging substrate; the composite aluminum nitride powder is composed of aluminum nitride powder and modified aluminum nitride powder in a mass ratio of (6~8):(2~4). The semiconductor packaging substrate prepared by this method has excellent interfacial compatibility, effectively reduces interfacial thermal stress, and has good thermal conductivity.

The application discloses a high-temperature-resistant and heat-conducting diamond-like film and a preparation method thereof, and relates to the field of film coating technology. The high-temperature-resistant and heat-conducting diamond-like film is a same-element hetero-interface structure plated on the surface of a substrate; the sp 3 -C bond content in the diamond-like film continuously changes along the thickness direction of the diamond-like film; the average sp 3 -C bond content accounts for more than 40% of the total carbon-carbon bond content in the diamond-like film. The application improves the interface thermal resistance effect of the whole film, improves the high-temperature-resistant performance of the diamond-like film, guarantees the balanced state of the film-substrate bonding force, internal stress, heat conduction and surface lubricity of the film, makes the film have excellent comprehensive performance, and further improves the applicable environment of the diamond-like material.

The application discloses a kind of thermal interface materials and its preparation method and application, belong to microelectronic packaging and thermal management material field.The preparation method of the application is by the synergistic effect of laser ablation and chemical deposition, first by laser etching to form the micropore with high roughness and large specific surface area, then depositing nano-silver catalytic layer, and cooperate with chemical copper plating and copper paste dense filling technology, in polymer matrix, it is structured by copper column and is axially through metal channel, significantly improve the thermal conductivity of material;And the application directly directional etching micropore array in flexible polymer substrate, make vertical heat conduction passage height adjustable, provide sufficient macroscopic deformation margin for the thermal induced differential expansion caused by the mismatch of thermal expansion coefficient between chip and heat sink two ends.The thermal interface material of the application has high thermal conductivity, excellent compliance and resistance to harsh wet heat environment aging ability, can satisfy the extreme heat dissipation and high reliability integrated demand of high-power semiconductor device.

This invention belongs to the field of automotive interior material testing technology and discloses a VOC release detection device for automotive interior materials. The device includes: a rotating support frame; a detection chamber assembly rotatably mounted on the rotating support frame, the detection chamber assembly including a main housing and a sealing cover mechanism, which cooperate to form a sealed detection chamber; and a suspension clamping assembly disposed within the detection chamber for clamping the sheet-like test material and physically dividing the detection chamber into a first chamber and a second chamber. This invention constructs a breathing circulation system through an oil-free pump suction mechanism combined with a bellows buffer mechanism, driving gas to reciprocate through the test material. Combined with a rotating inverted structure, gravity is used to accumulate the excitation medium on the material surface. Under the action of alternating airflow, cyclic excitation of fluidized suspension and compaction contact is generated, thereby effectively destroying the gas boundary layer under microscopic hammering and friction, significantly improving the deep VOC desorption rate and detection accuracy.

The invention relates to the technical field of phase change materials, in particular to a composite phase change material and a preparation method thereof. The composite phase change material provided by the invention comprises polyethylene glycol, metal organic gel and expanded graphite which are blended, the metal organic gel is a chelate of citric acid and metal ions; the polyethylene glycol is dispersed in the expanded graphite and the metal organic gel and on the surfaces of the expanded graphite and the metal organic gel. The capillary action of the porous structure of the metal organic gel and the interaction of hydrogen bonds are utilized to anchor the phase change material component (polyethylene glycol), so that the stability of the composite phase change material is improved, and the composite phase change material is not easy to leak; a three-dimensional heat conduction network is constructed by utilizing tight combination of the expanded graphite and the metal organic gel, a continuous heat transfer path is provided for phonon transmission, an average free path of phonon transmission is increased, the interface thermal resistance is effectively reduced, and the heat conductivity is improved.

The invention belongs to the field of heat-conducting polymer composite materials, and particularly relates to a high-heat-conductivity PEEK / PEI super-tough composite insulating material as well as a preparation method and application thereof. The high-thermal-conductivity PEEK / PEI super-tough composite insulating material contains polyether-ether-ketone, polyetherimide, a heat conduction agent, a compatilizer, an optional flexibilizer, an optional antioxidant and an optional lubricant. The heat conduction agent contains nano-scale aluminum oxide, micron-scale aluminum oxide and coated carbon fibers, and the coated carbon fibers comprise carbon fibers and hydroxyethyl methylacrylate-dimethylaminoethyl acrylate copolymers coating the surfaces of the carbon fibers. The high-thermal-conductivity PEEK / PEI super-tough composite insulating material provided by the invention has high toughness, thermal conductivity and insulativity at the same time.

This invention relates to the field of spacecraft thermal control technology, specifically to a fiber-reinforced flexible composite substrate for deployable space radiators and its preparation method. The method first involves cryogenically treating polyimide fibers with liquid nitrogen, weaving them into a fabric, and then subjecting them to gradient heating and surface carbonization to obtain a carbonized fiber-woven reinforcement. Simultaneously, boron nitride nanosheets and carbon nanotubes are covalently linked via amide bonds and coated with polydopamine to obtain a composite thermally conductive filler, which is then dispersed in polyimide resin. Finally, the resin is impregnated onto the surface of the reinforcement and the interior of the fiber bundles, and then cured to obtain the final product. In this invention, the carbonized layer of the fiber-woven fabric forms thermally conductive channels in both the warp and weft directions, and the composite thermally conductive filler forms a thermally conductive network within the matrix. Together, they construct a dual-network thermally conductive structure, giving the substrate excellent thermal conductivity, flexibility, and lightweight properties, making it suitable for high-power deployable spacecraft radiators.

The utility model relates to the technical field of light-emitting diode (LED) lighting, and discloses a surface-mounted LED lamp bead substrate heat dissipation mechanism which comprises a stepped metal substrate, heat dissipation fin sets are evenly and fixedly installed at the lower end of the side wall of the stepped metal substrate, and the stepped metal substrate comprises an aluminum alloy heat dissipation base body. The side wall of the aluminum alloy heat dissipation base body is fixedly connected with the outer wall of the heat dissipation fin set, the top of the aluminum alloy heat dissipation base body is evenly provided with step boss assemblies, the top of each step boss assembly is fixedly provided with an insulating layer, and the top of each insulating layer is fixedly provided with a copper circuit layer. The heat dissipation area is increased, the heat dissipation efficiency is effectively improved, the heat accumulation problem is avoided, stable operation of the high-power-density LED is ensured, meanwhile, due to the design of the stepped metal substrate, the heat dissipation fin sets can be attached more tightly, interface thermal resistance is reduced, and the heat dissipation performance is further improved.

The utility model belongs to generator technical field, concretely is a kind of efficient integrated semiconductor thermoelectric generator. The integrated semiconductor thermoelectric generator includes thermoelectric conversion module, is equipped with heat absorption component on thermoelectric conversion module, and the bottom of thermoelectric conversion module is equipped with heat dissipation component. Thermoelectric conversion module includes upper ceramic substrate, first metal connecting piece, thermoelectric generation unit, second metal connecting piece and lower ceramic substrate connected in turn by magnesium-based material layer;The two sides of second metal connecting piece are respectively connected with positive guide line and negative guide line. The utility model innovatively integrates magnesium-based thermoelectric material system, graphene composite heat absorption coating and cubic boron nitride heat dissipation framework, and combines the nanowire / quantum dot superlattice structure on the surface of ceramic substrate, cooperates the optimized doping of P-type / N-type thermocouple arm, realizes thermoelectric merit figure≥1.8 in low temperature area, reduces material cost and improves system reliability simultaneously.

The invention relates to the technical field of cables, and discloses a high-thermal-conductivity creep-resistant corrosion-resistant composite reinforced core aluminum stranded wire and a preparation method thereof.The high-thermal-conductivity creep-resistant corrosion-resistant composite reinforced core aluminum stranded wire comprises a composite reinforced core and at least one aluminum stranded layer or aluminum alloy stranded layer concentrically stranded outside the composite reinforced core; the composite reinforced core comprises a surface modified carbon fiber reinforced body and a metal matrix; the surface modified carbon fiber reinforcement comprises a carbon fiber reinforcement and a gradient metal transition layer deposited on the surface of the carbon fiber reinforcement; the gradient metal transition layer comprises a bonding layer deposited on the surface of the carbon fiber reinforcement and a main transition layer deposited on the bonding layer; according to the invention, the composite reinforced core is formed by taking the carbon fiber as the reinforcement and the metal as the matrix to replace the traditional steel core, and the gradient metal transition layer is constructed on the surface of the carbon fiber reinforcement, so that the interface reinforcement and function integration are realized, and the mechanical, heat-conducting, creep-resistant and corrosion-resistant performances of the wire are comprehensively improved.

The application discloses an alumina-coated aramid core-shell fiber / epoxy resin composite medium and a preparation method and application thereof, and belongs to the technical field of polymer composite media and electrical insulation materials. The application solves the problems of insufficient heat conduction performance of existing epoxy resin, easy agglomeration of traditional inorganic fillers, weak interface bonding between aramid fibers and resin, and difficult balance between heat conduction performance improvement and breakdown performance maintenance. The application constructs an alumina coating layer on the surface of aramid fibers through a precursor deposition-thermal conversion method, and then is modified by a coupling agent, and is compounded with an epoxy resin, a curing agent and an accelerator, and is subjected to vacuum degassing and gradient curing to obtain a high-heat-conduction insulation epoxy resin composite medium. The application has the advantages of simple preparation process, easily available raw materials and controllable cost, and the obtained composite medium has heat conduction performance, electrical insulation performance and mechanical performance, and can be widely applied to the fields of electronic packaging, transformer pouring insulation, high-voltage insulation components and new energy motor insulation systems.

This application relates to a method for fabricating a high-temperature co-fired thermal conductivity measurement sensor and the sensor itself, belonging to the field of sensor technology. This application utilizes an integrated co-fired structure of a metal thick-film pattern and a ceramic green body, enabling the metal thick-film pattern to form a continuous transition interface with the ceramic substrate during sintering. This results in high interfacial bonding strength, effectively mitigating failure problems such as interface delamination, warping, or cracking that easily occur under high-temperature or thermal cycling conditions, thereby improving the structural stability and service life of the sensor. Simultaneously, the co-fired structure effectively blocks the influence of external oxidizing or corrosive samples on the metal layer, making it suitable for complex or extreme testing environments. Since the co-firing process eliminates the bonding layer, this invention reduces the interfacial thermal resistance of Joule heat transfer to the sample during measurement, making the transient temperature rise response more closely match the theoretical heat transfer model, thereby improving the accuracy of thermal conductivity measurement.