54results about How to "Lower interface thermal resistance" patented technology

The invention provides a back contact photovoltaic cell piece capable of preventing stacking scratch in a high-temperature passivation process. The back contact photovoltaic cell piece comprises a back contact photovoltaic cell piece body and a plurality of soft isolation protrusions located on the light receiving face of the back contact photovoltaic cell piece body. The soft isolation protrusions are used for supporting photovoltaic cells to be mutually isolated when the photovoltaic cells are stacked layer by layer, and the soft isolation protrusions are resistant to high temperature of 300 DEG C and do not become sticky or yellow within 3 hours. According to the invention, the soft isolation projections are arranged on the light receiving surface of the back contact photovoltaic cell sheet body to support mutual isolation of the photovoltaic cell sheets when the photovoltaic cell sheets are stacked layer by layer, so that the photovoltaic cell sheets can be protected from being scratched in the stacking and moving process; the flexible isolation protrusions are arranged on the back contact photovoltaic cell piece, the flexible isolation protrusions can be prevented from scratching the surface of the photovoltaic cell piece due to the specific flexibility of the flexible isolation protrusions, meanwhile, the flexible isolation protrusions can bear the passivation temperature of 300 DEG C or above and do not crack or yellow or adhere to the cell piece, and therefore it can be ensured that the back contact photovoltaic cell piece is subjected to high-temperature passivation in a multi-layer stacking mode, and the passivation efficiency is improved.

The invention discloses an aerosol generating product and an aerosol generating system.The aerosol generating product comprises an aerosol forming base material sheet and a magnetic heating body sheet, and the magnetic heating body sheet and the aerosol forming base material sheet are arranged in a stacked mode in the thickness direction and attached in the stacked area in a surface contact mode; the main heat conduction path directed from the magnetic heating element sheet to the aerosol-forming substrate sheet is a path passing through the thickness direction of the laminated region. Compared with the prior art, the magnetic heating body sheet and the aerosol forming base material sheet are laminated along the thickness direction, and the surface contact is realized in the lamination area, so that the main conduction path of heat from the magnetic heating body sheet to the base material is a short path passing through the lamination thickness direction; therefore, heat conduction distance is shortened, interface thermal resistance is reduced, and heating response speed and energy utilization rate are improved. And meanwhile, the base material is heated more uniformly, so that the aerosol generation efficiency and consistency are improved, and the risk caused by local overheating is reduced.

This invention relates to the field of special ceramics preparation technology, and discloses a process for preparing high thermal conductivity ceramic materials for high-nickel ternary cathode sintering, including: preparing magnesium aluminum spinel green blanks containing magnesium oxide, yttrium oxide and titanium oxide composite additives; performing cyclic variable oxygen pressure sintering at 1420℃ to 1480℃, controlling the furnace atmosphere to periodically switch between the first and second oxygen partial pressure states. This invention utilizes the oxygen potential difference to drive the grain boundary liquid phase to alternate between low viscosity wetting and high viscosity pinning characteristics, eliminating the rheological quiescent zone at the end of sintering, effectively suppressing abnormal grain growth while ensuring high material density, and improving the thermal conductivity and lithium erosion resistance of the ceramic sagger.

The application provides a high-thermal-conductivity diamond / copper composite material and an SPS sintering process thereof, raw material pretreatment: selecting three kinds of monocrystalline diamond particles with different particle sizes, mixing the titanium-plated diamond obtained after vacuum titanium plating treatment; solid dry powder mixing: uniformly mixing a solid additive and graphene modified copper powder to prepare a copper-based composite dry powder; nitrogen intermittent airflow suspension dispersion: adding the titanium-plated diamond into a sealed covering tank to make the titanium-plated diamond suspended and dispersed in the sealed covering tank; atomization covering makes the copper-based composite dry powder uniformly covered on the surface of the titanium-plated diamond to obtain composite particles; vacuum low-temperature degreasing to obtain the composite particles after degreasing, and SPS sintering demolding to obtain the high-thermal-conductivity diamond / copper composite material. The coating is uniform and dense, has no exposure and no agglomeration, and significantly reduces porosity and interface thermal resistance; the proportioning is accurate, the degreasing is thorough, and there is no residue; the generation of brittle phases is inhibited, and the interface combination is excellent; the thermal conductivity is stable and greater than 700 W / (m*K), and the density is greater than or equal to 99%.

The invention discloses a diamond filler for chip heat dissipation and a preparation method thereof, and belongs to the technical field of heat conduction fillers, the diamond filler comprises the following raw materials by weight: 90-100 parts of pretreated functional diamond, 4-8 parts of modified carbon nanotubes and 15-25 parts of modified hexagonal boron nitride nanoparticles; the diamond filler for chip heat dissipation is prepared by mixing pretreated functional diamond, modified carbon nanotubes and modified hexagonal boron nitride nanosheets, adding the mixture into N-methyl pyrrolidone, adding 1-ethyl-(3-dimethylaminopropyl) carbodiimide hydrochloride and N-hydroxysuccinimide, and carrying out a reaction. According to the mode, micro-grinding rounding and dopamine functionalization of the diamond, carbon nano tube modification and hexagonal boron nitride modification have a synergistic gain effect on the filler heat conductivity, composite material heat conductivity and composite material CTE of the prepared diamond filler.

This invention provides a low-density flame-retardant thermally conductive foam powder filler, composed of the following components in parts by weight: 200-300 parts of boron nitride (80-100 micrometers); 200-300 parts of hollow glass microspheres (50-70 micrometers); 200-300 parts of aluminum hydroxide (8-10 micrometers); 200-300 parts of aluminum hydroxide (1-2 micrometers); and 2-4 parts of coupling agent. Its advantages are: 1. Low density: By introducing low-density hollow glass microspheres, the overall density of the filler is effectively reduced, meeting lightweight design requirements. 2. High thermal conductivity: The compound boron nitride forms a highly efficient thermal conductivity network. 3. Excellent flame-retardant performance: The halogen-free flame retardant aluminum hydroxide works synergistically with the hollow glass microspheres. The hollow glass microspheres form a glassy barrier at high temperatures, isolating oxygen and heat, achieving excellent flame-retardant effects. 4. Good dispersibility and compatibility: By modifying the powder surface with silane coupling agent, a "molecular bridge" is formed between the inorganic powder and the organic polymer matrix, which significantly reduces agglomeration, lowers the interfacial thermal resistance, and significantly reduces the viscosity of the system.

The utility model relates to the technical field of LED display structures, in particular to an efficient heat dissipation LED display structure which comprises a base material layer, a chip layer, an optical adjustment layer and a packaging protection layer, the base material layer is arranged at the bottommost layer, the chip layer is arranged at the upper end of the base material layer, the optical adjustment layer is arranged at the upper end of the chip layer, and the packaging protection layer is arranged at the lower end of the optical adjustment layer. The packaging protection layer is arranged at the upper end of the optical adjustment layer; the chip layer and the base material layer are connected in a bonding mode, and a gap position between the chip layer and the base material layer is filled with a reflective glue filling layer; the optical adjustment layer is attached to the surface of the chip layer; and the packaging protection layer is cured on the surface of the optical adjustment layer.

The utility model discloses a kind of heat exchange equipment and pulping system. Heat exchange equipment includes heat exchange cylinder and cold pipe. Heat exchange cylinder is provided with heat exchange cavity, feed inlet and discharge port, heat exchange cavity is communicated with feed inlet and discharge port, cold pipe is set in heat exchange cavity, and it is used for being contacted with slurry, cold pipe includes at least one coil pipe, each coil pipe is spirally arranged along the central axis of heat exchange cylinder, each coil pipe includes multiple radiating sections, multiple radiating sections are sequentially connected along the axial direction of heat exchange cylinder, in the axial section of the central axis of heat exchange cylinder, two adjacent radiating sections are spaced apart. Using the heat exchange equipment provided by the utility model, the resistance in the flow process of slurry is reduced, the pressure drop of heat exchange equipment is reduced, the energy consumption of heat exchange equipment is reduced, the pipeline wear and tear and leakage risk caused by high pressure of heat exchange equipment are reduced, the service life of heat exchange equipment is prolonged, the maintenance cost is reduced, and the heat exchange area between slurry and cold pipe is increased, the heat dissipation effect of slurry is improved.

The utility model relates to the field of circuit boards, in particular to a mining machine heat conduction and heat dissipation integrated circuit board which comprises a heat conduction board. The lower end of the heat conduction plate is fixedly connected with uniformly distributed heat dissipation blocks, and the upper end of the heat conduction plate is fixedly connected with a first high heat conduction insulating layer. According to the utility model, an aluminum substrate and a heat-conducting silicone grease layer are removed, and the high-heat-conducting insulating layer is adopted to directly bridge the chip to be connected with the heat-conducting plate, so that the heat transfer level is greatly shortened, the interface thermal resistance is remarkably reduced, the heat is rapidly and directionally conducted, and the working temperature stability of the chip is improved; performance fluctuation caused by heat attenuation of multiple layers of media of a traditional structure is effectively avoided, through collaborative design of the T-shaped heat dissipation grooves and the columnar heat conduction columns, a three-dimensional heat dissipation channel is constructed, the air convection efficiency is enhanced, the heat conduction plates made of high-heat-conduction materials are combined, the overall heat dissipation capacity is remarkably improved, continuous and stable operation of the chip under the high-load working condition is ensured, and the service life of the chip is prolonged. The compact structure design breaks through the space limitation of a traditional heat dissipation system.

The invention discloses an ammonia-methanol coupling gas production device and a use method thereof, and belongs to the technical field of controllable atmosphere preparation, the ammonia-methanol coupling gas production device comprises a central combustion zone, a peripheral cracking zone and a tail mixing purification zone which are coaxially nested; the central combustion area comprises a hearth wall, and the hearth wall is of a honeycomb-shaped porous heat exchange structure; the peripheral cracking area is arranged on the outer side of the central combustion area, a catalyst bed layer of a spiral flow guide structure is arranged in the peripheral cracking area, and a high-temperature-resistant heat-conducting filling layer is arranged between the catalyst bed layer and the hearth wall of the central combustion area; the tail mixing and purifying area is connected to the downstream of the central combustion area and the peripheral cracking area and used for mixing and purifying combustion products from the central combustion area and cracking gas from the peripheral cracking area. By optimizing a heat exchange interface and a catalyst bed layer structure, the heat transfer uniformity and the response speed are enhanced, so that stable temperature control and preparation of high-purity mixed gas are realized.

The application discloses a low-volatility high-thermal-conductivity insulating silica gel composite material suitable for power batteries, characterized by comprising the following components in mass parts: 3-10 parts of vinyl silicone oil, 8-20 parts of liquid acrylic ester rubber, 95-105 parts of compounded thermal conductive powder, 0.3-0.5 parts of hydrogen-containing silicone oil, 0.02-0.04 parts of platinum catalyst, 0.02-0.05 parts of acetylenic alcohol inhibitor and 0.8-2.0 parts of silane modifier. The low-volatility high-thermal-conductivity insulating silica gel composite material adopts low-volatility vinyl silicone oil and liquid acrylic ester rubber as a composite matrix, can effectively coat the vinyl silicone oil at a very low content and the compounded thermal conductive powder at a high content, avoids problems such as sharp increase of dispersion resistance and particle agglomeration in the modification and subsequent mixing process of the thermal conductive powder, and can stabilize the thermal conductivity coefficient at more than 6.5 W / (m*K), the volatilization amount is less than 90 ppm, and can be used in the range of -40 DEG C to 200 DEG C.

The utility model discloses high -power load heat radiation structure, including extension assembly, be provided with cable assembly and load on the extension assembly, the extension assembly includes the box body and lid body that constitute by heat conduction plate, the lid body covers and is set up in the open end of box body, the bottom end interval distribution of box body has a plurality of mounting holes, a plurality of load one -to -one corresponding installation in mounting hole, the contact surface of load with box body still is provided with heat conduction coating layer. The utility model discloses through setting extension assembly, will connector, load and so on key components integration in the structure that the box body and lid body of heat conduction constitute, and the load is embedded through bottom mounting hole and is coated with the heat -conducting silicone grease between the contact surface of box body, effectively reduced the interface thermal resistance, has built the efficient heat conduction path from the load heat source to external environment, has improved the heat dissipation capacity of system significantly, prevents the performance decline or device damage because of local overheating.

This invention relates to the field of electronic packaging composite materials technology, and particularly to a thermally conductive epoxy encapsulation material, its preparation method, and its application. The invention uses Fe3O4 nanospheres and sodium polyacrylate solution as raw materials to prepare polyacrylic acid-modified Fe3O4 nanospheres; these are then blended with adipic acid and epoxy resin, and a thermally conductive epoxy encapsulation material is prepared through a curing reaction. The thermally conductive epoxy encapsulation material prepared by the method of this invention exhibits uniform dispersion of Fe3O4 nanospheres, good interfacial compatibility, and high thermal conductivity, demonstrating excellent thermal conductivity, interfacial reliability, and mechanical properties, making it well-suited for electronic chip packaging applications.

The application discloses a spherical aluminum nitride silicon grease high-thermal-conductivity interface material composition and belongs to the technical field of thermal-conductivity interface materials.The spherical aluminum nitride silicon grease high-thermal-conductivity interface material composition comprises, in terms of weight parts, 50-80 parts of spherical aluminum nitride and 50-100 parts of modified silicon oil, the modified silicon oil is silicon oil grafted with adamantane molecules and fluorine-containing alkyl groups on the side chain, and the spherical aluminum nitride is prepared by using aluminum powder with low, medium and high particle sizes, wherein the spherical structure guarantees the fluidity of the silicon grease, the introduction of the adamantane molecules and the perfluoroalkyl molecules improves the heat resistance of the silicon oil and reduces the migration rate of the silicon oil, different particle sizes of the spherical aluminum nitride are used in combination for compounding, the filler with a smaller particle size can fill the gaps between the fillers with a larger particle size, a more perfect thermal-conductivity channel is constructed, the gap rate between the filler particles is greatly reduced, and the thermal-conductivity performance of the material is improved.

The application discloses a method for improving the metalization connection strength of n-type Bi2Te3-based thermoelectric elements based on anchoring effect, and comprises the following steps: configuring a n-type Bi2Te3-based wafer surface treatment agent, the composition of which comprises 40-50% sulfuric acid (volume), 1-2% nitric acid (volume), and the rest is water; immersing a clean n-type Bi2Te3-based wafer into the surface treatment agent to perform surface etching; then immersing the etched n-type Bi2Te3-based wafer into ultrapure water to perform ultrasonic treatment; performing metalization connection on the ultrasonically treated n-type Bi2Te3-based wafer through electroplating or chemical plating, the plated metal is easy to form anchoring effect with the n-type Bi2Te3, the metalization connection strength is improved; and finally performing scribing and cutting to obtain the Bi2Te3-based thermoelectric elements with high metalization connection strength. The application makes the n-type Bi2Te3-based wafer have high surface roughness before electroplating, which is beneficial to forming anchoring effect with the plated metal such as nickel, so that the Bi2Te3-based thermoelectric elements with high metalization connection strength are obtained, and the thermoelectric elements are not physically damaged, and the product qualification rate can be improved.

This invention discloses a high thermal conductivity semiconductor packaging substrate and its preparation method, relating to the field of electronic materials technology. The method includes the following steps: mixing composite aluminum nitride powder with a sintering aid, ball milling, drying, and pressing into shape; sintering under high temperature and high pressure in a nitrogen atmosphere to obtain an aluminum nitride ceramic substrate; washing and drying the aluminum nitride ceramic substrate; covering both sides of the aluminum nitride ceramic substrate with copper foil, laying active solder between the aluminum nitride ceramic substrate and the copper foil, and then connecting them by vacuum brazing to obtain the semiconductor packaging substrate; the composite aluminum nitride powder is composed of aluminum nitride powder and modified aluminum nitride powder in a mass ratio of (6~8):(2~4). The semiconductor packaging substrate prepared by this method has excellent interfacial compatibility, effectively reduces interfacial thermal stress, and has good thermal conductivity.

This invention belongs to the field of automotive interior material testing technology and discloses a VOC release detection device for automotive interior materials. The device includes: a rotating support frame; a detection chamber assembly rotatably mounted on the rotating support frame, the detection chamber assembly including a main housing and a sealing cover mechanism, which cooperate to form a sealed detection chamber; and a suspension clamping assembly disposed within the detection chamber for clamping the sheet-like test material and physically dividing the detection chamber into a first chamber and a second chamber. This invention constructs a breathing circulation system through an oil-free pump suction mechanism combined with a bellows buffer mechanism, driving gas to reciprocate through the test material. Combined with a rotating inverted structure, gravity is used to accumulate the excitation medium on the material surface. Under the action of alternating airflow, cyclic excitation of fluidized suspension and compaction contact is generated, thereby effectively destroying the gas boundary layer under microscopic hammering and friction, significantly improving the deep VOC desorption rate and detection accuracy.

The invention relates to the technical field of phase change materials, in particular to a composite phase change material and a preparation method thereof. The composite phase change material provided by the invention comprises polyethylene glycol, metal organic gel and expanded graphite which are blended, the metal organic gel is a chelate of citric acid and metal ions; the polyethylene glycol is dispersed in the expanded graphite and the metal organic gel and on the surfaces of the expanded graphite and the metal organic gel. The capillary action of the porous structure of the metal organic gel and the interaction of hydrogen bonds are utilized to anchor the phase change material component (polyethylene glycol), so that the stability of the composite phase change material is improved, and the composite phase change material is not easy to leak; a three-dimensional heat conduction network is constructed by utilizing tight combination of the expanded graphite and the metal organic gel, a continuous heat transfer path is provided for phonon transmission, an average free path of phonon transmission is increased, the interface thermal resistance is effectively reduced, and the heat conductivity is improved.

The invention belongs to the field of heat-conducting polymer composite materials, and particularly relates to a high-heat-conductivity PEEK / PEI super-tough composite insulating material as well as a preparation method and application thereof. The high-thermal-conductivity PEEK / PEI super-tough composite insulating material contains polyether-ether-ketone, polyetherimide, a heat conduction agent, a compatilizer, an optional flexibilizer, an optional antioxidant and an optional lubricant. The heat conduction agent contains nano-scale aluminum oxide, micron-scale aluminum oxide and coated carbon fibers, and the coated carbon fibers comprise carbon fibers and hydroxyethyl methylacrylate-dimethylaminoethyl acrylate copolymers coating the surfaces of the carbon fibers. The high-thermal-conductivity PEEK / PEI super-tough composite insulating material provided by the invention has high toughness, thermal conductivity and insulativity at the same time.

The utility model relates to the technical field of light-emitting diode (LED) lighting, and discloses a surface-mounted LED lamp bead substrate heat dissipation mechanism which comprises a stepped metal substrate, heat dissipation fin sets are evenly and fixedly installed at the lower end of the side wall of the stepped metal substrate, and the stepped metal substrate comprises an aluminum alloy heat dissipation base body. The side wall of the aluminum alloy heat dissipation base body is fixedly connected with the outer wall of the heat dissipation fin set, the top of the aluminum alloy heat dissipation base body is evenly provided with step boss assemblies, the top of each step boss assembly is fixedly provided with an insulating layer, and the top of each insulating layer is fixedly provided with a copper circuit layer. The heat dissipation area is increased, the heat dissipation efficiency is effectively improved, the heat accumulation problem is avoided, stable operation of the high-power-density LED is ensured, meanwhile, due to the design of the stepped metal substrate, the heat dissipation fin sets can be attached more tightly, interface thermal resistance is reduced, and the heat dissipation performance is further improved.

The utility model belongs to generator technical field, concretely is a kind of efficient integrated semiconductor thermoelectric generator. The integrated semiconductor thermoelectric generator includes thermoelectric conversion module, is equipped with heat absorption component on thermoelectric conversion module, and the bottom of thermoelectric conversion module is equipped with heat dissipation component. Thermoelectric conversion module includes upper ceramic substrate, first metal connecting piece, thermoelectric generation unit, second metal connecting piece and lower ceramic substrate connected in turn by magnesium-based material layer;The two sides of second metal connecting piece are respectively connected with positive guide line and negative guide line. The utility model innovatively integrates magnesium-based thermoelectric material system, graphene composite heat absorption coating and cubic boron nitride heat dissipation framework, and combines the nanowire / quantum dot superlattice structure on the surface of ceramic substrate, cooperates the optimized doping of P-type / N-type thermocouple arm, realizes thermoelectric merit figure≥1.8 in low temperature area, reduces material cost and improves system reliability simultaneously.

The invention relates to the technical field of cables, and discloses a high-thermal-conductivity creep-resistant corrosion-resistant composite reinforced core aluminum stranded wire and a preparation method thereof.The high-thermal-conductivity creep-resistant corrosion-resistant composite reinforced core aluminum stranded wire comprises a composite reinforced core and at least one aluminum stranded layer or aluminum alloy stranded layer concentrically stranded outside the composite reinforced core; the composite reinforced core comprises a surface modified carbon fiber reinforced body and a metal matrix; the surface modified carbon fiber reinforcement comprises a carbon fiber reinforcement and a gradient metal transition layer deposited on the surface of the carbon fiber reinforcement; the gradient metal transition layer comprises a bonding layer deposited on the surface of the carbon fiber reinforcement and a main transition layer deposited on the bonding layer; according to the invention, the composite reinforced core is formed by taking the carbon fiber as the reinforcement and the metal as the matrix to replace the traditional steel core, and the gradient metal transition layer is constructed on the surface of the carbon fiber reinforcement, so that the interface reinforcement and function integration are realized, and the mechanical, heat-conducting, creep-resistant and corrosion-resistant performances of the wire are comprehensively improved.

This application relates to a method for fabricating a high-temperature co-fired thermal conductivity measurement sensor and the sensor itself, belonging to the field of sensor technology. This application utilizes an integrated co-fired structure of a metal thick-film pattern and a ceramic green body, enabling the metal thick-film pattern to form a continuous transition interface with the ceramic substrate during sintering. This results in high interfacial bonding strength, effectively mitigating failure problems such as interface delamination, warping, or cracking that easily occur under high-temperature or thermal cycling conditions, thereby improving the structural stability and service life of the sensor. Simultaneously, the co-fired structure effectively blocks the influence of external oxidizing or corrosive samples on the metal layer, making it suitable for complex or extreme testing environments. Since the co-firing process eliminates the bonding layer, this invention reduces the interfacial thermal resistance of Joule heat transfer to the sample during measurement, making the transient temperature rise response more closely match the theoretical heat transfer model, thereby improving the accuracy of thermal conductivity measurement.

The application discloses a wafer surface activation bonding device and a bonding method, and relates to the technical field of wafer processing. The device comprises a clamp, a movable support rod and a bombardment particle emission device. The clamp comprises oppositely arranged first and second sample holders, and the first and second sample holders are each provided with a hard nonmetal back plate. Two wafers to be bonded are fixed on the hard nonmetal back plate, and the surface area of the two wafers to be bonded that is in contact with each other is a bonding area, which is surrounded by the surface of the hard nonmetal back plate. The movable support rod is arranged at least on the outer side of any one of the first and second sample holders, so that relative extrusion between the first and second sample holders is realized, and the bonding area of the surfaces of the two wafers to be bonded is fully contacted under the action of pressure. The bombardment particle beam spot emitted by the bombardment particle emission device uniformly covers the bonding area of the two wafers to be bonded. The application can effectively avoid the introduction of metal contamination at the bonding interface, and has the advantages of simple process, good compatibility and the like.

The invention relates to the technical field of heat dissipation, in particular to a phase-change composite heat-conducting gasket with vertical corrugated channels and a preparation method of the phase-change composite heat-conducting gasket. The invention aims to solve the problems of high hardness, poor compression compliance and large interface contact thermal resistance of the existing vertical orientation carbon-based heat conduction material and improve the actual heat dissipation efficiency of the thermal interface material in a high-power electronic device. According to the main scheme, high-heat-conductivity graphene paper or graphite paper serves as a framework base material, a composite heat conduction core with vertically-arranged bent heat conduction channels inside is constructed, and a phase-change material skin layer is combined on the surface of the composite heat conduction core. Rigid compression of the material can be converted into geometric bending deformation by utilizing an internal vertically-oriented micro-ripple structure (the section can be sine waves, sawtooth waves, trapezoidal waves or asymmetric ripples and the like), so that the compression resilience and the stress buffering capacity of the material are effectively improved; and meanwhile, the interface contact thermal resistance is effectively reduced by virtue of the self-adaptive wetting characteristic of the phase change material layer on the surface at the working temperature.

The application discloses a heating assembly for a heating non-combustion atomizer, comprising a heating body and a support, the heating body is arranged on the periphery of the support, the support is used for supporting the heating body, and at least part of the outer surface of the heating body is used for contacting and heating aerosol substrate. The application sets the heating body on the outer side, does not need to additionally add a shell, can directly contact with tobacco, can reduce the interface thermal resistance, and the heating body itself also has a large heat exchange area, so that the heating efficiency of the heating body can be obviously improved, and thus the energy consumption required for heating the cartridge can be reduced.

The application belongs to the technical field of battery thermal management materials, and particularly relates to a full-weather battery thermal management material and a preparation method and application thereof. The full-weather battery thermal management material has the functions of high-temperature heat dissipation and low-temperature heating, and can realize bidirectional regulation of the battery temperature in a wide temperature range, which is conducive to prolonging the battery life and improving the safety and reliability in a full-weather environment.

The invention relates to a graphene heat-conducting gasket as well as a preparation method and application thereof. The graphene heat-conducting gasket comprises a graphene heat-conducting matrix oriented in the thickness direction, the metal interface enhancement layer covers at least one surface of the graphene heat-conducting substrate; the metal interface enhancement layer comprises a transition layer and a functional layer which are sequentially arranged from the surface of the graphene heat conduction substrate to the outside. According to the graphene heat-conducting gasket provided by the invention, the interface thermal resistance can be remarkably reduced through the metal interface enhancement layer, and the metal interface enhancement layer is compact and continuous, so that graphene chippings are prevented from falling off, and the residual risk of assembly is eliminated.

This invention discloses a castor oil-based toughened high thermal conductivity material, its preparation method, and its applications. The preparation method includes: grafting isocyanate groups onto the bio-based chemical castor oil using silane coupling agent-amined graphene. The flexible long carbon chains and urethane groups of castor oil can toughen thermosetting polymers, while graphene can provide thermal conductivity. The material prepared by this invention can provide both toughening and thermal conductivity to thermosetting polymers.

The utility model relates to the technical field of showcase lighting, specifically relates to a light guide plate mounting assembly suitable for showcase, including aluminium frame, limiting component, limiting component installs in one side of aluminium frame, and limiting component is used for fixed position of light guide plate, heat dissipation component, heat dissipation component installs in one side of aluminium frame, and heat dissipation component is used for heat dissipation. Compared with prior art, the application realizes automatic position limiting and firm fixing of light guide plate through the combination of limiting component and elastic compression structure, realizes the high -efficient heat dissipation of LED light source through the setting of heat dissipation component and air convection channel, prolongs light source life and guarantees the temperature stability inside showcase, and simultaneously, the installation and maintenance are simple and convenient, improve the uniformity and reliability of the overall lighting effect of showcase.