23results about How to "Lower interface thermal resistance" patented technology

This invention relates to the field of special ceramics preparation technology, and discloses a process for preparing high thermal conductivity ceramic materials for high-nickel ternary cathode sintering, including: preparing magnesium aluminum spinel green blanks containing magnesium oxide, yttrium oxide and titanium oxide composite additives; performing cyclic variable oxygen pressure sintering at 1420℃ to 1480℃, controlling the furnace atmosphere to periodically switch between the first and second oxygen partial pressure states. This invention utilizes the oxygen potential difference to drive the grain boundary liquid phase to alternate between low viscosity wetting and high viscosity pinning characteristics, eliminating the rheological quiescent zone at the end of sintering, effectively suppressing abnormal grain growth while ensuring high material density, and improving the thermal conductivity and lithium erosion resistance of the ceramic sagger.

The application provides a high-thermal-conductivity diamond / copper composite material and an SPS sintering process thereof, raw material pretreatment: selecting three kinds of monocrystalline diamond particles with different particle sizes, mixing the titanium-plated diamond obtained after vacuum titanium plating treatment; solid dry powder mixing: uniformly mixing a solid additive and graphene modified copper powder to prepare a copper-based composite dry powder; nitrogen intermittent airflow suspension dispersion: adding the titanium-plated diamond into a sealed covering tank to make the titanium-plated diamond suspended and dispersed in the sealed covering tank; atomization covering makes the copper-based composite dry powder uniformly covered on the surface of the titanium-plated diamond to obtain composite particles; vacuum low-temperature degreasing to obtain the composite particles after degreasing, and SPS sintering demolding to obtain the high-thermal-conductivity diamond / copper composite material. The coating is uniform and dense, has no exposure and no agglomeration, and significantly reduces porosity and interface thermal resistance; the proportioning is accurate, the degreasing is thorough, and there is no residue; the generation of brittle phases is inhibited, and the interface combination is excellent; the thermal conductivity is stable and greater than 700 W / (m*K), and the density is greater than or equal to 99%.

The utility model discloses a kind of heat exchange equipment and pulping system. Heat exchange equipment includes heat exchange cylinder and cold pipe. Heat exchange cylinder is provided with heat exchange cavity, feed inlet and discharge port, heat exchange cavity is communicated with feed inlet and discharge port, cold pipe is set in heat exchange cavity, and it is used for being contacted with slurry, cold pipe includes at least one coil pipe, each coil pipe is spirally arranged along the central axis of heat exchange cylinder, each coil pipe includes multiple radiating sections, multiple radiating sections are sequentially connected along the axial direction of heat exchange cylinder, in the axial section of the central axis of heat exchange cylinder, two adjacent radiating sections are spaced apart. Using the heat exchange equipment provided by the utility model, the resistance in the flow process of slurry is reduced, the pressure drop of heat exchange equipment is reduced, the energy consumption of heat exchange equipment is reduced, the pipeline wear and tear and leakage risk caused by high pressure of heat exchange equipment are reduced, the service life of heat exchange equipment is prolonged, the maintenance cost is reduced, and the heat exchange area between slurry and cold pipe is increased, the heat dissipation effect of slurry is improved.

The utility model discloses high -power load heat radiation structure, including extension assembly, be provided with cable assembly and load on the extension assembly, the extension assembly includes the box body and lid body that constitute by heat conduction plate, the lid body covers and is set up in the open end of box body, the bottom end interval distribution of box body has a plurality of mounting holes, a plurality of load one -to -one corresponding installation in mounting hole, the contact surface of load with box body still is provided with heat conduction coating layer. The utility model discloses through setting extension assembly, will connector, load and so on key components integration in the structure that the box body and lid body of heat conduction constitute, and the load is embedded through bottom mounting hole and is coated with the heat -conducting silicone grease between the contact surface of box body, effectively reduced the interface thermal resistance, has built the efficient heat conduction path from the load heat source to external environment, has improved the heat dissipation capacity of system significantly, prevents the performance decline or device damage because of local overheating.

The application discloses a method for improving the metalization connection strength of n-type Bi2Te3-based thermoelectric elements based on anchoring effect, and comprises the following steps: configuring a n-type Bi2Te3-based wafer surface treatment agent, the composition of which comprises 40-50% sulfuric acid (volume), 1-2% nitric acid (volume), and the rest is water; immersing a clean n-type Bi2Te3-based wafer into the surface treatment agent to perform surface etching; then immersing the etched n-type Bi2Te3-based wafer into ultrapure water to perform ultrasonic treatment; performing metalization connection on the ultrasonically treated n-type Bi2Te3-based wafer through electroplating or chemical plating, the plated metal is easy to form anchoring effect with the n-type Bi2Te3, the metalization connection strength is improved; and finally performing scribing and cutting to obtain the Bi2Te3-based thermoelectric elements with high metalization connection strength. The application makes the n-type Bi2Te3-based wafer have high surface roughness before electroplating, which is beneficial to forming anchoring effect with the plated metal such as nickel, so that the Bi2Te3-based thermoelectric elements with high metalization connection strength are obtained, and the thermoelectric elements are not physically damaged, and the product qualification rate can be improved.

This invention discloses a high thermal conductivity semiconductor packaging substrate and its preparation method, relating to the field of electronic materials technology. The method includes the following steps: mixing composite aluminum nitride powder with a sintering aid, ball milling, drying, and pressing into shape; sintering under high temperature and high pressure in a nitrogen atmosphere to obtain an aluminum nitride ceramic substrate; washing and drying the aluminum nitride ceramic substrate; covering both sides of the aluminum nitride ceramic substrate with copper foil, laying active solder between the aluminum nitride ceramic substrate and the copper foil, and then connecting them by vacuum brazing to obtain the semiconductor packaging substrate; the composite aluminum nitride powder is composed of aluminum nitride powder and modified aluminum nitride powder in a mass ratio of (6~8):(2~4). The semiconductor packaging substrate prepared by this method has excellent interfacial compatibility, effectively reduces interfacial thermal stress, and has good thermal conductivity.

This invention belongs to the field of automotive interior material testing technology and discloses a VOC release detection device for automotive interior materials. The device includes: a rotating support frame; a detection chamber assembly rotatably mounted on the rotating support frame, the detection chamber assembly including a main housing and a sealing cover mechanism, which cooperate to form a sealed detection chamber; and a suspension clamping assembly disposed within the detection chamber for clamping the sheet-like test material and physically dividing the detection chamber into a first chamber and a second chamber. This invention constructs a breathing circulation system through an oil-free pump suction mechanism combined with a bellows buffer mechanism, driving gas to reciprocate through the test material. Combined with a rotating inverted structure, gravity is used to accumulate the excitation medium on the material surface. Under the action of alternating airflow, cyclic excitation of fluidized suspension and compaction contact is generated, thereby effectively destroying the gas boundary layer under microscopic hammering and friction, significantly improving the deep VOC desorption rate and detection accuracy.

The utility model belongs to generator technical field, concretely is a kind of efficient integrated semiconductor thermoelectric generator. The integrated semiconductor thermoelectric generator includes thermoelectric conversion module, is equipped with heat absorption component on thermoelectric conversion module, and the bottom of thermoelectric conversion module is equipped with heat dissipation component. Thermoelectric conversion module includes upper ceramic substrate, first metal connecting piece, thermoelectric generation unit, second metal connecting piece and lower ceramic substrate connected in turn by magnesium-based material layer;The two sides of second metal connecting piece are respectively connected with positive guide line and negative guide line. The utility model innovatively integrates magnesium-based thermoelectric material system, graphene composite heat absorption coating and cubic boron nitride heat dissipation framework, and combines the nanowire / quantum dot superlattice structure on the surface of ceramic substrate, cooperates the optimized doping of P-type / N-type thermocouple arm, realizes thermoelectric merit figure≥1.8 in low temperature area, reduces material cost and improves system reliability simultaneously.

This application relates to a method for fabricating a high-temperature co-fired thermal conductivity measurement sensor and the sensor itself, belonging to the field of sensor technology. This application utilizes an integrated co-fired structure of a metal thick-film pattern and a ceramic green body, enabling the metal thick-film pattern to form a continuous transition interface with the ceramic substrate during sintering. This results in high interfacial bonding strength, effectively mitigating failure problems such as interface delamination, warping, or cracking that easily occur under high-temperature or thermal cycling conditions, thereby improving the structural stability and service life of the sensor. Simultaneously, the co-fired structure effectively blocks the influence of external oxidizing or corrosive samples on the metal layer, making it suitable for complex or extreme testing environments. Since the co-firing process eliminates the bonding layer, this invention reduces the interfacial thermal resistance of Joule heat transfer to the sample during measurement, making the transient temperature rise response more closely match the theoretical heat transfer model, thereby improving the accuracy of thermal conductivity measurement.

The application discloses a wafer surface activation bonding device and a bonding method, and relates to the technical field of wafer processing. The device comprises a clamp, a movable support rod and a bombardment particle emission device. The clamp comprises oppositely arranged first and second sample holders, and the first and second sample holders are each provided with a hard nonmetal back plate. Two wafers to be bonded are fixed on the hard nonmetal back plate, and the surface area of the two wafers to be bonded that is in contact with each other is a bonding area, which is surrounded by the surface of the hard nonmetal back plate. The movable support rod is arranged at least on the outer side of any one of the first and second sample holders, so that relative extrusion between the first and second sample holders is realized, and the bonding area of the surfaces of the two wafers to be bonded is fully contacted under the action of pressure. The bombardment particle beam spot emitted by the bombardment particle emission device uniformly covers the bonding area of the two wafers to be bonded. The application can effectively avoid the introduction of metal contamination at the bonding interface, and has the advantages of simple process, good compatibility and the like.

The invention relates to a graphene heat-conducting gasket as well as a preparation method and application thereof. The graphene heat-conducting gasket comprises a graphene heat-conducting matrix oriented in the thickness direction, the metal interface enhancement layer covers at least one surface of the graphene heat-conducting substrate; the metal interface enhancement layer comprises a transition layer and a functional layer which are sequentially arranged from the surface of the graphene heat conduction substrate to the outside. According to the graphene heat-conducting gasket provided by the invention, the interface thermal resistance can be remarkably reduced through the metal interface enhancement layer, and the metal interface enhancement layer is compact and continuous, so that graphene chippings are prevented from falling off, and the residual risk of assembly is eliminated.

This invention discloses a castor oil-based toughened high thermal conductivity material, its preparation method, and its applications. The preparation method includes: grafting isocyanate groups onto the bio-based chemical castor oil using silane coupling agent-amined graphene. The flexible long carbon chains and urethane groups of castor oil can toughen thermosetting polymers, while graphene can provide thermal conductivity. The material prepared by this invention can provide both toughening and thermal conductivity to thermosetting polymers.

The utility model relates to the technical field of showcase lighting, specifically relates to a light guide plate mounting assembly suitable for showcase, including aluminium frame, limiting component, limiting component installs in one side of aluminium frame, and limiting component is used for fixed position of light guide plate, heat dissipation component, heat dissipation component installs in one side of aluminium frame, and heat dissipation component is used for heat dissipation. Compared with prior art, the application realizes automatic position limiting and firm fixing of light guide plate through the combination of limiting component and elastic compression structure, realizes the high -efficient heat dissipation of LED light source through the setting of heat dissipation component and air convection channel, prolongs light source life and guarantees the temperature stability inside showcase, and simultaneously, the installation and maintenance are simple and convenient, improve the uniformity and reliability of the overall lighting effect of showcase.

This invention relates to the field of silicone technology, specifically to a silicone composite thermally conductive material and its preparation process. The preparation process of a silicone composite thermally conductive material includes: pretreatment of graphene filler, preparation of modified graphene filler, preparation and modification of heterogeneous filler, and preparation of the silicone composite thermally conductive material. This invention utilizes modified graphene and the construction of a boron nitride-silica heterogeneous filler to form a multi-level thermally conductive network. Combined with electric field-induced ordered arrangement of fillers and pretreatment of graphene with chemically reduced gel and directional ice template, multiple methods are used synergistically to reduce interfacial thermal resistance and phonon scattering, constructing continuous thermally conductive channels. Simultaneously, it improves the structural uniformity, thermal conductivity stability, and mechanical properties of the composite material, effectively solving problems such as filler agglomeration and migration, and significantly improving the thermal conductivity of the silicone composite material.

This invention discloses a high thermal conductivity and electromagnetic shielding polyimide coating and its preparation method, belonging to the field of polyimide coating technology. The coating comprises the following raw materials in parts by weight: 32 parts of diamine monomer, 33 parts of dianhydride monomer, 582 parts of organic solvent, and 3.4-11.5 parts of nitrogen-doped helical carbon nanotube-supported carbon nanofibers. The preparation method includes the following steps: ultrasonically dispersing nitrogen-doped helical carbon nanotube-supported carbon nanofibers in an organic solvent; then, under nitrogen protection and an ice-water bath condition, dissolving the diamine monomer in the dispersion; and then adding the dianhydride monomer to carry out a polycondensation reaction to obtain a high thermal conductivity and electromagnetic shielding polyimide coating. This invention, through an integrated design of "composition-structure-interface," constructs an efficient and stable three-dimensional multifunctional network within the polyimide matrix, achieving a synergistic improvement in the coating's electromagnetic shielding and thermal conductivity performance, providing an ideal material solution for the field of high-end electronic packaging and protection.

This invention belongs to the field of lithium-ion battery thermal management technology, and relates to a cylindrical battery thermal management system combining phase change materials and liquid-cooled heat pipes. The system includes a cylindrical battery module, a phase change material layer, a thermally conductive component, a cooling component, a heating component, and a control component. This invention features a thermally conductive structure circumferentially arranged on the outside of the heat pipe between adjacent cells, effectively increasing the contact area between the thermally conductive structure and the battery casing, reducing interfacial thermal resistance, and improving the heat transfer efficiency and response speed for both high-temperature heat dissipation and low-temperature preheating. Simultaneously, a composite flow channel liquid-cooled plate, serving as both an outer distribution zone and a central heat exchange zone, improves the uniformity of the working medium distribution, balances the cooling capacity of each area, reduces the difference in cooling rate of the phase change material and the internal temperature gradient of the battery. Combined with the control component, the cooling and heating components are linked and controlled, achieving bidirectional thermal management and coordinated control of the cylindrical battery module. This effectively improves the overall temperature uniformity of the battery and ensures consistent battery operation.

The application relates to the technical field of non-silicon heat-conducting paste processing, in particular to a non-silicon heat-conducting paste with ultra-low thermal resistance and high-temperature resistance and a preparation method thereof, which is prepared from the following raw materials in parts by weight: alkyl naphthalene 30-50 parts, alkyl benzene 5-15 parts, hydrogenated terphenyl 10-20 parts, polyether base oil 5-10 parts, superfine heat-conducting filler 60-80 parts, structure directing agent 4-8 parts, perfluoropolyether phosphate 0.5-1 part and antioxidant 1-3 parts. By adopting the above formula, a non-silicon compound oil phase system is constructed, the superfine heat-conducting filler, the structure directing agent and the perfluoropolyether phosphate are combined, high thermal conductivity, ultra-low thermal resistance and excellent interface adhesion are realized, the risk of silicon volatilization pollution is completely eliminated, high-temperature oxidation resistance and long-term reliability are improved, and the urgent needs of 5G, AI and other high-heat-density electronic equipment for non-silicon high-performance thermal interface materials are effectively met.

The application provides a high-frequency transformer functional insulating material of plasmonic orientation boron nitride and a preparation method and application thereof, and relates to the technical field of insulating materials. The functional insulating material is obtained by sequentially covering, from an inner layer to an outer layer, a thermosetting resin matrix layer, a silicon-rich transition layer, an oriented boron nitride sheet layer, a boron nitride gradient insulating layer and a densified surface layer on the surface of a metal conductor. The insulating material can realize heat diffusion enhancement, electric field distribution homogenization and space charge inhibition, and exhibits high breakdown strength, high local discharge starting voltage and good long-term insulating stability under high-frequency non-sinusoidal voltage, and is suitable for insulating reinforcement of the winding end, the outgoing line end and the core clamping piece area of a high-frequency transformer of a super-speed train, and has a good application prospect.

This invention provides a multi-component hydrogel thermally conductive composite material, its preparation method, and its applications. The multi-component hydrogel thermally conductive composite material comprises a multi-component hydrogel framework and a filling hydrogel layer; the filling hydrogel layer forms a secondary cross-linked network structure with the multi-component hydrogel framework; the multi-component hydrogel framework is an electrospun layer comprising components including sodium alginate and photomodified biomaterials; the filling hydrogel layer is obtained by casting a solution containing components including acrylamide and a photoinitiator onto the multi-component hydrogel framework and performing two cross-linking operations. The multi-component hydrogel thermally conductive composite material prepared by this invention has adjustable thermal conductivity, diverse thermal conduction pathways, low interfacial thermal resistance, and good mechanical properties, making it suitable for a wide range of applications. Due to its good biocompatibility, it is particularly suitable as a thermally conductive material for flexible wearable electronic products, mobile phone heat dissipation shells, and other applications.

The application relates to the technical field of high polymer materials, and discloses a heat-conducting PP material and a preparation method thereof. The PP material prepared by the application is prepared by extruding and granulating after blending of polypropylene as a main base material, addition of a heat-conducting reinforcing agent, maleic anhydride grafted polyethylene, ethylene-octene copolymer, an antioxidant and lubricant and other auxiliaries; the heat-conducting reinforcing agent added in the PP material improves the heat-conducting performance and impact resistance of the material while maintaining the mechanical performance. Therefore, the comprehensive performance of the material is improved, so that the material can be widely applied in the fields of electronic device shells, LED lighting heat-dissipation shells, relay shells and the like.

The application discloses a kind of conformal heat-conducting insulating composite material and its preparation method and application method, it is related to semiconductor packaging and thermal management technical field.The composite material includes: organic polysilazane resin 40-60 parts, toughening agent 4-10 parts, crosslinking agent 0.1-3 parts, low dielectric heat-conducting filler 35-85 parts, heat-conducting filler dispersant 0.3-2 parts, low volume shrinkage modifier 5-10 parts, catalyst 0.1-1 part, polymerization inhibitor 0.01-0.06 parts, solvent 5-90 parts;Wherein low dielectric heat-conducting filler is hexagonal boron nitride nanosheet, spherical silicon powder and the complex of undefined aluminum nitride, low volume shrinkage modifier is cage-type silsesquioxane.The composite material of the application can perfectly fill micron chip gap, volume shrinkage rate is low after solidification, interface thermal resistance is small, has excellent temperature resistance and high insulation, can satisfy the requirement of high-end equipment manufacturing field such as aerospace, high-performance computing to thermal management material.

This invention discloses a heat-dissipating stator module for a direct-drive motor, comprising a stator core, several winding slots arranged radially outside the stator core, and coil windings wound within the winding slots. It also includes a heat-dissipating stator base in thermal contact with the stator core. Heat pipes are disposed within the winding slots, with the evaporation sections of the heat pipes in thermal contact with both the stator core and the coil windings, and the condensation sections of the heat pipes extending to and in thermal contact with the heat-dissipating stator base. Simultaneously, a jointed direct-drive motor is also disclosed, comprising a heat-dissipating stator module and a rotor module. The rotor module includes a rotor shaft and a rotor magnet assembly. The rotor magnet assembly is located radially outside the stator core and coaxially arranged with it. The rotor shaft is rotatably connected to the heat-dissipating stator base and coaxially arranged with the stator core. The rotor shaft and the rotor magnet assembly are connected by a connecting bracket. This invention possesses highly efficient heat dissipation performance and thermal reliability, enabling the motor to withstand longer and higher-intensity peak torque operation.

The invention discloses a gradient composite diamond cooling fin and a preparation method thereof, and relates to the technical field of thermal management, in particular to the gradient composite diamond cooling fin and the preparation method thereof. The problems of high thermal resistance and easy layering caused by thermal expansion mismatch of diamond and a metal matrix and poor interface wetting in heat dissipation of high-heat-flux devices such as power devices and lasers are solved. The invention provides a gradient composite diamond cooling fin and a preparation method thereof. The cooling fin sequentially comprises a polycrystalline CVD diamond functional layer, a Ti-W-Ni component gradient transition layer and a metal heat dissipation base layer with a micron-sized groove from a heat source side to a heat dissipation side, and a continuous gradient layer is formed by magnetron sputtering and is subjected to brazing composite in vacuum; and the diamond layer is deposited through microwave plasma CVD and is subjected to periodic secondary nucleation / etching and polishing. The structure integrates mechanical occlusion and metallurgical bonding, interface thermal resistance can be reduced, and bonding strength and thermal cycle reliability are improved.