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High-oriented graphene radiating film and preparation method thereof

A heat-dissipating film and graphene dispersion technology, applied in the field of high thermal conductivity materials, can solve problems such as low thermal conductivity, large interface thermal resistance, directional arrangement damage, etc., achieve simple process and equipment, improve crystallinity, and increase thermal conductivity. rate effect

Active Publication Date: 2017-08-04
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the number of layers is 4, the thermal conductivity of graphene will drop below 2000W / (m K); the graphene sheets prepared by the prior art have low orientation, large phonon scattering, and large interface thermal resistance. The thermal conductivity along the direction of the sheet is low; and after the graphene foam is reduced, the original directional arrangement will be destroyed, reducing the thermal conductivity and other problems. The invention provides a method for preparing a highly oriented graphene heat dissipation film. Specifically, follow the steps below:

Method used

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  • High-oriented graphene radiating film and preparation method thereof
  • High-oriented graphene radiating film and preparation method thereof
  • High-oriented graphene radiating film and preparation method thereof

Examples

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Embodiment 1

[0033] The preparation method of the highly oriented graphene heat dissipation film described in this embodiment is specifically carried out according to the following steps:

[0034] 1) Preparation of graphene oxide dispersion: disperse graphene oxide powder in deionized water, and perform ultrasonic treatment for 60 minutes at a frequency of 10KHz to form a uniform solution to obtain a graphene oxide dispersion with a concentration of 0.1mg / mL ;

[0035] 2) Highly oriented treatment of graphene oxide: put the graphene oxide dispersion into a metal mold (a cuboid mold of 100×100×50mm), cool the metal frame (outside wall) around the mold with liquid nitrogen, and pass the liquid The nitrogen rate is 0.5L / min;

[0036] 3) freeze-drying: put the mixture of graphene oxide and water prepared in step 2) into a freeze dryer and dry at -20°C for 24 hours to obtain a graphene oxide foam;

[0037] 4) Reduction of hydrazine hydrate: put the graphene oxide foam on the support with hole...

Embodiment 2

[0043] The preparation method of the highly oriented graphene heat dissipation film described in this embodiment is specifically carried out according to the following steps:

[0044] 1) Preparation of graphene oxide dispersion: disperse graphene oxide powder in deionized water, and perform ultrasonic treatment for 30 minutes at a frequency of 100KHz to form a uniform solution to obtain a graphene oxide dispersion with a concentration of 5mg / mL ;

[0045] 2) Highly oriented treatment of graphene oxide: put the graphene oxide dispersion into a metal mold (cuboid mold of 100×100×50mm), and then cool the surrounding metal frame with liquid nitrogen, and the rate of passing liquid nitrogen is 0.5L / min;

[0046] 3) freeze-drying: put the mixture of graphene oxide and water prepared in step 2) into a freeze dryer and dry at -20°C for 48 hours to obtain a graphene oxide foam;

[0047] 4) Reduction of hydrazine hydrate: put the graphene oxide foam on the support with holes at the bo...

Embodiment 3

[0052] The preparation method of the highly oriented graphene heat dissipation film described in this embodiment is specifically carried out according to the following steps:

[0053] 1) Preparation of graphene oxide dispersion: disperse graphene oxide powder in deionized water, and perform ultrasonic treatment for 45 minutes at a frequency of 50KHz to form a uniform solution to obtain a graphene oxide dispersion with a concentration of 3mg / mL ;

[0054] 2) Highly oriented treatment of graphene oxide: put the graphene oxide dispersion into a metal mold (100×100×50mm cuboid mold), and then cool the surrounding metal frame with liquid nitrogen;

[0055] 3) Freeze-drying: put the mixture of graphene oxide and water prepared in step 2) into a freeze dryer and dry at -20°C for 36 hours to obtain a graphene oxide foam;

[0056] 4) Reduction of hydrazine hydrate: put the graphene oxide foam on the support with holes at the bottom, put hydrazine hydrate in the heating reflux device, ...

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Abstract

The invention provides a high-oriented graphene radiating film and a preparation method thereof, solving the problem of high oriented distribution of graphene and realizing the internal ultra-high heat conductivity. The preparation method includes the steps of preparing oxidized graphene dispersion liquid; performing high orientation treatment of graphene; freezing and drying to obtain the oxidized graphene foam; performing hydrazine hydrate reduction and acquiring graphene foam; pressurizing the graphene foam to obtain a graphene film; performing a post thermal treatment. The sample with controllable thickness and highly orienting distributed graphene can be prepared. The internal heat conductivity of the radiating film can reach 2400 W / (m.K), and the radiating filmcan be widely applied to the field of radiation.

Description

technical field [0001] The invention relates to the field of high thermal conductivity materials, in particular to a method for preparing a highly oriented graphene heat dissipation film and the heat dissipation film. Background technique [0002] In recent years, the power of electronic products has become larger and larger, but the volume has become smaller and smaller. The miniaturization and high integration of integrated circuits have led to a continuous increase in the assembly density of electronic components. While providing powerful functions, it has also led to a sharp increase in its power consumption and heat generation. High temperatures will have a detrimental effect on the stability, reliability and life of electronic components. Mithal's research results show (Mithal et al. Design of experimental based evaluation of thermal performance of a flichip electronic assembly[C]. ASME EEPProceedings. New York: ASME, 1996, 18: 109–115.), the temperature of electronic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B32/184
Inventor 孙贤贤李宜彬赫晓东徐帆林在山
Owner HARBIN INST OF TECH
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