Thermosetting resin composition with high heat conductivity, prepreg manufactured by adopting same and copper-clad laminate

A technology of copper-clad laminates and resin compositions, applied in coatings, circuit substrate materials, paper coatings, etc., can solve problems such as low heat resistance, low thermal decomposition temperature, and large thermal expansion coefficient, and achieve cost Low, simple manufacturing process, good thermal conductivity effect
CN101735611AInactive Publication Date: 2010-06-16GUANGDONG SHENGYI SCI TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGDONG SHENGYI SCI TECH
Publication Date
2010-06-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a thermosetting resin composition with high heat conductivity, a prepreg manufactured by adopting the same and a copper-clad laminate. The thermosetting resin composition with high heat conductivity comprises the following components in parts by mass: 5 parts of allyl phenolic compound, 5-40 parts of bismaleimide compound, 0-30 parts of modified resin, 25-85 parts of filler and 1-8 parts of catalyst. The thermosetting resin composition with high heat conductivity, which is provided by the invention, has the superior properties of high heat conductivity, high glass transition temperature, low CTE, high heat decomposition temperature, favorable process deformability and the like; the prepreg is simple to manufacture and has better heat resisting effect and high heat conductivity; and the copper-clad laminate can be applied to the manufacture of a high multi-layer circuit with high-temperature resistance and has simple manufacture process and lower cost.
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Description

technical field

[0001] The invention relates to a thermosetting resin composition, in particular to a thermosetting resin composition with high thermal conductivity and high heat resistance used in the field of copper-clad laminates, and a prepreg and a copper-clad laminate made thereof. Background technique

[0002] With the mass production of electronic information products and the design trend towards light, thin, small and multi-functional, the printed circuit substrate (PCB), which is the main supporting substrate of electronic components, is also continuously improving its technical level to provide high-density wiring, High multilayer, thin profile, fine pore size, high dimensional stability, high heat dissipation and low price, especially the new high-density semiconductor structure multilayer (Build-Up) process technology and high heat dissipation multilayer (Build-Up) organic materials The development of semiconductor packaging is a very important link in current s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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