238 results about "Thermal transmittance" patented technology

The invention discloses a silica gel pad with high thermal conductivity and heat resistance and a preparation method thereof, and the method comprises the following steps: preparing a composite thermal conductive filler, mixing boron nitride nanosheets and graphene according to a certain mass ratio, adding a silane coupling agent, carrying out ball milling, adding spherical alumina, and mixing; preparing modified organic silicon resin, wherein methyl vinyl silicone rubber, hydrogen-containing silicone oil, a platinum catalyst and MQ silicon resin react to obtain the modified organic silicon resin; mixing and defoaming the modified organic silicon resin, the composite heat-conducting filler, the flame retardant and the antioxidant to obtain a heat-conducting silica gel mixture; preparing a reinforced base material, carrying out plasma treatment on glass fiber cloth, and then impregnating the glass fiber cloth with vinyl ester resin for pre-curing; and grinding the mixture by three rollers, coating the mixture on a reinforced base material, and heating and curing. The thermal conductivity of the obtained silica gel pad is 2.5-3.5 W / m.K, the volume resistivity is larger than 1012 omega.cm, the long-term heat-resistant temperature reaches 200 DEG C or above, the tensile strength is larger than 5 MPa, the peel strength is larger than 15 N / cm, and the silica gel pad has excellent thermal conductivity, insulativity, heat resistance and mechanical strength.

The invention discloses a multi-physical-field intelligent optimization system and method for low-thermal-resistance stacked electrode packaging, and relates to the technical field of packaging thermal management. According to the system, a thermal, mechanical and electric multi-physics field coupling model of the stacked electrode packaging structure is established in a unified computational domain through a modeling module; the measurement module collects thermal resistance, thermal conductivity and interface stress data in real time through an integrated sensor; the self-correction optimization module executes a self-adaptive residual iterative algorithm based on the deviation between the model simulation result and the actually measured data, corrects model parameters and generates process control variables; and the process regulation and control module dynamically adjusts the sintering temperature, the coating thickness and the pressing pressure according to the control variables and feeds back updated data to form closed-loop optimization. According to the method, collaborative operation of modeling, measurement, optimization and process regulation and control is realized, dynamic self-correction of multi-physical field parameters and process adaptive optimization can be realized in the packaging operation process, the interface thermal resistance is remarkably reduced, and the heat-conducting property and the structural stability are improved.

The invention discloses an insulating boron nitride heat-conducting gasket and application thereof, and belongs to the technical field of heat-conducting materials. The preparation method comprises the following steps: S1, preparing boron nitride powder, a volatile organic solvent and silica gel into a BN dispersion liquid; s2, coating a substrate with the dispersion liquid; s3, drying the wet film to obtain a BN film; s4, the BN film is torn down and cut into BN thin strips; s5, the BN thin strips are flatly laid in the polytetrafluoroethylene grooves to be fixed; s6, addition type silica gel is injected into the groove to be cured, a primary BN sheet is formed, and the primary BN sheet is repeatedly prepared; s7, coating addition type silica gel on the upper surface and the lower surface of each primary BN sheet, stacking the primary BN sheets into a mold, and pressing and curing the primary BN sheets to form a BN block; and S8, cutting the BN block along the direction perpendicular to the arrangement direction of the BN thin strips to obtain the insulating boron nitride heat-conducting gasket. The insulating boron nitride heat-conducting gasket has the excellent properties of high orientation degree, high heat conductivity, controllable structure, stable performance, excellent insulativity, flexibility and the like.

The application discloses a kind of production methods and application of mushroom-shaped array via hole mould which avoid blockage, easy to clean, including steps: round hole array mould processing, hot-press forming, conductive treatment, end insulation, electroforming;The mushroom-shaped array via hole mould obtained by the method is applied in the preparation of mushroom-shaped bionic array by rolling;The metal mould prepared by the method has high mechanical strength, high thermal conductivity and good durability, and converts the processing problem of mushroom-shaped blind hole into mushroom-shaped via hole, forms mushroom-shaped via hole by inducing non-uniform deposition of metal ions in 3D limited space, effectively eliminates the limitation that the morphology of plating layer is completely determined by the morphology of core mould in conventional electrodeposition process, simplifies the geometry of electroforming core mould, reduces the manufacturing difficulty of electroforming core mould, and improves the controllability of plating layer morphology.

The utility model relates to the field of chemical oxygen generation and heat insulation, in particular to an onboard chemical oxygen generator with a heat insulation structure, which comprises a starting mechanism, a starting base detachably connected with the lower end of the starting mechanism, an upper connecting piece, a lower connecting piece and a heat insulation structure, the inner circumferential surface of the top end of the inner tank body is fixed with the outer circumferential surface of the lower end of the upper connecting piece; the upper end of the outer circumferential surface of the lower connecting piece is fixed with the inner circumferential surface of the bottom end of the inner tank body; due to the fact that the outer tank body is adopted and the annular space is formed between the outer tank body and the inner tank body, the problem that the temperature of the outer surface of the inner tank body is too high due to the fact that heat is generated in the inner tank body is effectively solved, and the temperature of the outer tank body meets the standard due to the fact that the static air layer in the annular space between the inner tank body and the outer tank body is low in heat conductivity. Meanwhile, air heat insulation is adopted in the annulus, so that the overall weight is reduced, and the requirement of light-weight products is met.

A method of manufacturing a semiconductor device includes: preparing a superposed substrate in which a first substrate and a second substrate are bonded via a heat conduction control film, a peeling promotion film, and a laser absorbing film; irradiating the laser absorbing film with laser; and separating the first substrate from the second substrate, in which the thermal conductivity control film, the peeling promoting film, and the laser absorbing film are laminated in this order from the first substrate side, the thermal conductivity of the thermal conductivity control film is different from the thermal conductivity of the peeling promoting film, and the thermal conductivity of the laser absorbing film is different from the thermal conductivity of the peeling promoting film. The thermal expansion coefficient of the peeling promoting film is greater than the thermal expansion coefficient of the laser absorbing film.

The invention provides a high-power and high-density digital power supply embedded temperature equalization and insulation integrated material which comprises a three-dimensional porous BN substrate, a high-thermal-conductivity metal alloy filled in a three-dimensional network, and a graphene layer sprayed on the outer surface. The integrated material is extremely heat-conducting, excellent in insulation and matched in thermal expansion, the graphene spraying outer layer can avoid flowing metal leakage, and meanwhile the heat conductivity is guaranteed.

The application provides a high-thermal-conductivity heat dissipation integrated composite heat control film for satellites, which comprises a protective layer, a nano heat control film and a graphite film. The nano heat control film comprises a protective layer based on the surface of the film and a three-dimensional micro-nano structure, the graphite film is packaged by hot melt adhesive and is pasted together with the nano heat control film by the hot melt adhesive to form a new high-thermal-conductivity heat dissipation integrated composite heat control film. The application is pasted on the outer surface of a satellite cabin plate or an antenna and the like by silicone rubber, so that the outer surface of the satellite has the characteristics of high reflectivity to the solar spectrum, high emissivity to the infrared spectrum and high thermal conductivity, the uniformity of the temperature field of the whole satellite is improved, the reliability of the single machine in the cabin is improved, the production cycle of the product is short and the product is convenient to implement. The application solves the problems of high heat flux density, complex illumination components and rapid development of future low-orbit satellite constellations, the production cost is significantly reduced, and the commercial batch production of the satellite constellations is facilitated.

The application relates to a high-temperature-resistant and erosion-resistant heat insulation layer structure and a laying process method, and belongs to the field of solid rocket engine charge design. The application comprises a debonding layer, a first surface layer, a cylinder heat insulation layer, a ceramic-carbon cloth layer, a buffer layer, an aerogel filling layer, a bottom layer, a V-shaped sheet and a tail second surface layer. The application adds the ceramic-carbon cloth layer and the aerosol layer in the heat insulation layer, improves the strength of the heat insulation layer and reduces the thermal conductivity, so that the anti-erosion and high-temperature-resistant performance of the heat insulation structure is improved; the V-shaped sheet is pasted at the position close to the tail joint of the combustion shell of the debonding layer and the surface layer, so that the excessive materials in the charge process and the high-temperature and high-pressure gas and high-temperature condensed phase particles in the engine working process are effectively prevented from entering the debonding gap, and then the damage caused by the abnormal ablation of the debonding layer and the surface layer is avoided.

The invention discloses a heat dissipation coating suitable for a PTC (Positive Temperature Coefficient) electric heater and a preparation method of the heat dissipation coating. The heat dissipation coating is prepared by adding graphene, carbon nanotubes, boron nitride and other substances with high thermal conductivity into the coating, matching with a polyethersulfone material and a polytetrafluoroethylene material with excellent temperature resistance to prepare film substances and blending. According to the heat dissipation coating prepared by the invention, the heating power of the PTC electric heater and the infrared heat radiation intensity of the surface can be effectively improved, and the temperature rise time of the environment is shortened. And the heat dissipation coating has excellent high temperature resistance, and can be used at 260 DEG C for a long time without peculiar smell. In addition, the heat dissipation coating is environment-friendly in preparation process and excellent in corrosion resistance.

The utility model discloses a heating and heat preservation device of an aluminum alloy isothermal forging die, which comprises a lower die block and an upper die block arranged at the top of the lower die block, an upper die heat insulation base plate for insulating heat of the upper die block is arranged at the top of the upper die block, and a heat insulation plate for insulating heat of the lower die block is arranged at the bottom of the lower die block. In order to improve the heat balance speed and efficiency, high-thermal-conductivity die steel is selectively adopted to manufacture the upper die and the lower die of the cavity, in order to reduce the invalid heat energy consumption of an isothermal die and block or reduce the heat energy loss path, a heat insulation material is adopted to wrap a coil and the die on the outer layer of the die, and the contact and heat exchange between the outer surface of the die and air are reduced; under the condition that the necessary temperature of isothermal forging is guaranteed, the input energy of induction heating is reduced, the production cost is reduced, high-thermal-conductivity die steel is adopted between an induction heating coil and a module or a combined module of the die, and the heat balance speed and efficiency of the module are improved.

The invention provides a bus bar and a shielded electric wire, which can improve heat dissipation efficiency without increasing weight. The bus bar (10) comprises a conductor layer (11) and an insulating layer (13). The outer periphery of the conductor layer (11) is covered with the insulating layer (12); and a shield layer (15) that covers the outer periphery of the insulating layer (13). The thermal conductivity of the insulating layer (13) is greater than or equal to 0.2 W / m.K.

The invention discloses a preparation method of a co-fired integrated heat sink for an LTCC substrate, and belongs to the technical field of electronic components. According to the structure of the integrated heat sink, a through or non-through cavity with the size matched with that of a chip is prefabricated in the LTCC substrate according to the position of the high-power chip; before the raw ceramic tape is laminated and sintered, high-thermal-conductivity metal slurry is used for filling to form a solid metal heat sink block; the power chip is directly installed on the filled metal heat sink block, and heat generated by the chip is quickly conducted to the bottom plate through the solid metal block. The preparation method comprises a cavity forming process, a metal slurry filling process and a laminating and co-firing process. The problems that an existing LTCC substrate is low in intrinsic thermal conductivity, a heat sink cannot be welded, and the integration technology of a heat dissipation structure and a circuit substrate is poor in feasibility, high in cost and poor in practicability are solved. The method is widely applied to the substrate manufacturing technology of power electronic components, power assemblies, power modules and complete machine circuits.

To provide automotive window glass that can improve infrared absorption performance without the need for an interlayer. [Solution] The automotive window glass according to the present invention comprises an outer glass plate, an inner glass plate, and an interlayer that bonded the outer glass plate and the inner glass plate and substantially has no infrared absorption properties, and has a thermal transmittance (Ttf) of 44.0% or less.

The invention belongs to the field of heat-conducting materials, and particularly relates to a preparation method of a high-heat-conductivity graphene heat-conducting film. Through combination of various graphene materials (such as mechanically stripped graphene and reduced graphene oxide), a carbon-containing material is adopted as a dispersoid, so that the content of bound water and hydrogen bonds is reduced, and the production efficiency is improved; and meanwhile, the three-roller machine is used for dispersing to realize mutual lap joint of the graphene materials, so that the internal arrangement of the film materials is more uniform and compact, and the heat conductivity of the heat-conducting film is remarkably improved.

The utility model discloses a radiator, which relates to the radiator field, and comprises a support main body and a heat radiation assembly, the support main body comprises at least one support column, the support column extends along a first direction, and the first end of the support column is used for being connected with an external heat source; the heat dissipation assembly comprises a plurality of heat dissipation fins, the multiple heat dissipation fins are arranged outside the supporting body in a sleeving mode and distributed at intervals in the first direction, and at least one heat dissipation hole penetrates through each heat dissipation fin; wherein the support main body and the radiating fins are diamond aluminum alloy composite parts respectively; thus, the supporting body and the cooling fins have high thermal conductivity, the thermal conductivity can reach 400 W / (m.K) or above, the high-temperature resistance is improved to 600 DEG C, and the phenomenon of oxidation and falling is avoided, so that the reliability and durability of the radiator under complex working conditions are improved, and the lightweight design of the radiator is facilitated; at least one radiating hole penetrates through the radiating fin, so that the radiating area is increased, and the weight is further reduced; meanwhile, the multiple cooling fins are arranged at intervals, the heat exchange efficiency can be improved, and then the cooling efficiency is improved.

The high thermal conductive silicon nitride sintered body of the embodiment has silicon nitride grains and a grain boundary phase, and the thermal conductivity of the silicon nitride sintered body is 80 W / (m·K) or more. The average value of the solid solution oxygen content of the silicon nitride grains present in a unit area of 20 μm×20 μm in any cross section is 0.2 wt% or less. The average value of the length diameter of the silicon nitride grains present in a unit area of 50 μm×50 μm in any cross section is 1 μm or more and 10 μm or less. The average value of the length-width ratio of the silicon nitride grains present in the unit area of 50 μm×50 μm is 2 or more and 10 or less.

The utility model provides a converter steel slag waste heat recovery system, and particularly relates to the technical field of solid waste treatment, the converter steel slag waste heat recovery system uses a phase change ball tank and a slag tank to respectively add phase change balls and the slag tank into a mixing stock bin, and the phase change balls and steel slag are mixed in the mixing stock bin; conveying and heat exchange are synchronously achieved in the rotary conveying device, phase-change core metal in the phase-change balls is gradually converted into a liquid state from a solid state, the steel slag is gradually reduced to the target temperature, then the steel slag and the phase-change balls are conveyed into the solid-solid separation device to be separated, and finally the phase-change balls enter the waste heat recovery device to conduct heat exchange with a medium to release heat. Meanwhile, the internal phase change core metal is gradually converted into a solid state from a liquid state and is conveyed into the mixing bin again through the conveyor, and due to the fact that the phase change balls have good stability, high energy storage density and high heat conductivity, a large amount of heat energy can be efficiently and stably stored; the problem that high-grade waste heat of converter steel slag cannot be efficiently and stably recycled is solved.

The application relates to the technical field of high polymer composite materials, in particular to a modified polytetrafluoroethylene material and a preparation method thereof, the method comprises the following steps of S1, respectively preparing graphene-coated topological insulator powder, fluorine-containing surfactant modified liquid metal microdroplets and bifunctionalized fullerene, S2, mixing the three to prepare a pre-composite powder, S3, mixing with PTFE resin and then cold pressing to form, and S4, performing gradient sintering densification under a protective atmosphere, wherein the temperature rising rate is controlled to be less than or equal to 2 DEG C / min in a key temperature range of 250 DEG C to 340 DEG C, the application successfully solves the problems of multi-phase interface compatibility and high-temperature protection of functional components through unique component design and interface regulation and a gradient sintering process suitable for heat-sensitive components, and the application has the advantages of super-low friction coefficient, extremely high wear resistance, adjustable volume resistivity, significantly improved thermal conductivity and mechanical strength and excellent photo-thermal conversion efficiency.

This invention belongs to the field of thermal insulation materials technology and discloses a composite thermal insulation coating based on an ethanol evaporation-induced stable covalent crosslinked adhesive phase and its preparation method. The composite thermal insulation coating includes a crosslinked adhesive phase and hollow glass microspheres dispersed and fixed within the crosslinked adhesive phase. The crosslinked adhesive phase is obtained by ethanol evaporation-induced crosslinking of a reactive precursor formed by the reaction of thioctic acid and amino-functionalized polydimethylsiloxane. During the drying process of the precursor, ethanol evaporation gradually forms an adhesive network containing polydimethylsiloxane segments and a covalently crosslinked structure derived from thioctic acid. The preparation method includes reactive precursor preparation, slurry compounding, and drying and curing steps, requiring no additional crosslinking agent or high-temperature curing, and can complete crosslinking and film formation at room temperature or under moderate heating conditions. The thermal conductivity of the composite thermal insulation coating can be as low as 0.025–0.030 W / (m·K), and it possesses good adhesion, waterproof and moisture-proof properties, mechanical stability, and environmental durability.

The application relates to a preparation method of a high-thermal-conductivity FR4 copper-clad plate, and belongs to the technical field of copper-clad plate preparation. Raw materials include resin, curing agent, coupling agent, catalyst, filler and solvent; the resin includes naphthalene type epoxy resin and benzocyclobutene resin; the application uses naphthalene type epoxy resin as the main body resin, adds benzocyclobutene resin, increases the thermal conductivity of the copper-clad plate by increasing the proportion of the resin and reducing the proportion of the filler, the copper-clad plate prepared by the application has the properties of heat resistance of 288 DEG C for 10 min or more, thermal conductivity of 3 W / m*K or more, water absorption of 0.15% or less, peeling strength of 1.0 N / mm or more and flame-retardant level of FV-0 grade.

The utility model is suitable for the technical field of cleaning equipment, and provides a fan, cleaning equipment and a cleaning system.The fan is at least used for the cleaning equipment and comprises a shell and a heating part, the shell comprises a first area and a second area, and the heat conductivity of the first area is larger than that of the second area; the heating element is in heat conduction connection with the first area; the shell is provided with an air inlet and an air outlet, and airflow flowing from the air inlet to the air outlet flows through at least part of the first area. The fan has the advantage of being good in heat dissipation effect.

The application discloses a melt composite treatment method with the advantages of improving the mechanical properties and heat conduction performance of cast aluminum alloy, which comprises the following steps: carrying out boronization treatment on Al-Si series cast aluminum alloy melt to remove transition elements such as V, Ti and Cr, reduce the solid solubility of the above-mentioned elements in the aluminum matrix, reduce the degree of lattice distortion, and improve the heat conductivity of the alloy; further carrying out heat preservation and liquid transfer treatment on the melt to guarantee the removal effect of the above-mentioned elements; and adding Al-Sr-RE composite modifier with a specific content to modify the eutectic silicon in the alloy. Through the cooperation of the above-mentioned treatment methods, the obtained aluminum alloy has excellent mechanical properties and heat conduction performance, can greatly meet the performance requirements of the market and existing products, and has the significance of wide popularization and application.

The utility model relates to the technical field of heat insulation of new energy systems, and discloses a heat insulation aerogel structure applied to a new energy system, which comprises a battery cell, a battery module and a heat insulation buffer structure, the battery module consists of a plurality of battery cells, and the heat insulation buffer structure is arranged in the battery module; the plurality of battery modules are uniformly arranged in the shell along the left side and the right side, and are respectively fixed in the shell; and the longitudinal aerogel glass fiber heat insulation sheets are vertically arranged between the adjacent battery modules and are fixedly connected with the adjacent battery modules respectively. Compared with the prior art, the aerogel battery has the advantages that the battery cells are connected by adopting the aerogel, the aerogel has extremely low thermal conductivity and excellent heat resistance, high-efficiency thermal management is realized under a high-density battery cell packaging condition, the aerogel has flexibility and pressure resistance, the integrity of a physical structure can be kept, and meanwhile, the battery cells can be effectively packaged. The battery cell is effectively prevented from being damaged due to thermal expansion and is safer and more reliable to use.

The utility model discloses a constant-temperature air compressor room, which belongs to the field of air compressors and comprises an air compressor room with a plurality of interlayers, an air compressor positioned inside the air compressor room, a temperature controller for controlling the inside of the air compressor room, an electric controller for driving the air compressor and the temperature controller, and an air filter for purifying indoor air. Compared with the prior art, the device has the advantages that sound insulation and electromagnetic wave shielding can be effectively carried out through the interlayer formed by the large-aperture foam aluminum alloy blocks, heat can be transmitted in air holes more easily due to large air holes and high porosity of the large-aperture foam aluminum alloy blocks, and therefore high heat conductivity is achieved, and the service life of the device is prolonged. In order to solve the problem that the large-aperture foam aluminum alloy is fragile, ceramic radiating fins are adhered to the outer wall ends of the large-aperture foam aluminum alloy blocks, and the large-aperture foam aluminum alloy blocks can be prevented from being broken by external force while insulation protection is performed through the ceramic radiating fins.

A thermally conductive interface article for attenuating electromagnetic frequency radiation and transferring excess heat energy includes a multilayer structure having a first layer with a low refractive index and a second layer with a high refractive index. The article includes thermally conductive ceramic filler, metal filler, graphite filler, or a combination thereof dispersed in a polymer matrix. The interface article is adjustable to exhibit a reduction of at least 75% in the reflection of incident electromagnetic radiation at target frequencies of 0.3–100 GHz, while possessing a thermal conductivity of at least 2 W / m·K.

An aspect of the present application relates to a vehicle module (1) having a housing (2) and an electronic unit (4) arranged in the housing (1), and a liquid cooling device (5) through which heat generated by the electronic unit (4) during operation of the vehicle module (1) can be dissipated, wherein the liquid cooling device (5) comprises at least one cooling channel (6) in which a liquid can flow, wherein a volume region (10) of the cooling channel (6) is partially delimited by a wall (7, 8, 9) of a housing component (3a) of the housing (2), wherein the volume region (10) of the cooling channel (6) is partially directly delimited by an insert (14) separate from the housing component (3a), which insert (14) is formed from a thermally conductive material having a thermal conductivity greater than that of the material of the housing component (3a).

The present application relates to a kind of Cu95Zn4.8Sn0.2 copper alloy and its plate strip preparation method, copper alloy composition is according to mass percentage, including Cu:94.5~95.5%, Zn:4.34~5.34%, Ce:0.01~0.04%, Sr:0.01~0.04%, Sn:0.04~0.18%;Its copper alloy plate strip preparation method steps include batching, melting, ingot heating, hot rolling, pre-precision rolling, pre-precision rolling annealing, finished product rolling, finished product heat treatment, cleaning and passivation.The present application can greatly improve the elongation of material while ensuring the tensile strength, electrical conductivity, thermal conductivity of H95 copper alloy, improve the bending performance of material.

The application relates to the technical field of metal plate composite technology and discloses a preparation process of a Kovar alloy-copper composite plate, which comprises the following steps: a preparation process of an Invar alloy-copper composite plate, which comprises the following steps: s1, taking one Invar alloy plate and two copper plates; s2, immersing the Invar alloy plate into liquid copper after the Invar alloy plate is heated to 250-300 DEG C; s3, positioning the two copper plates and the Invar alloy plate to form a group of initial composite plate materials; s4, heating the whole in a heating furnace, the heating temperature is 700-850 DEG C, and the heating time is 20-40 min; s5, taking out and cooling to 500-650 DEG C, and then performing hot rolling; s6, performing stress relieving annealing on the composite blank; s7, naturally cooling to normal temperature after annealing, and cold rolling to form an Invar alloy-copper composite plate with a preset thickness. The Invar alloy-copper composite plate prepared through the process is more stable and not easy to separate between the plates, the composite plate has the physical properties of the Kovar alloy and good thermal conductivity.

The utility model provides an underframe of a container and the container. The underframe of the container comprises a transverse structural member, a floor, a connecting member and a supporting member. The floor is arranged above the transverse structural part in the height direction of the container. The connecting component is connected to the bottom face of the floor in the height direction, and an inserting groove is formed in the bottom of the connecting component. The bottom of the supporting component is connected to the transverse structural component, the top of the supporting component forms an inserting part, the inserting part is inserted into the inserting groove in a matched mode in the direction perpendicular to the height direction, so that the supporting component is connected to the connecting component, and the thermal conductivity of the material of the supporting component is lower than that of the PE material. According to the bottom frame of the container, the heat preservation performance is good, installation is convenient, and the production efficiency of the container is improved.