912 results about "Thermal transmittance" patented technology

An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.

It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity.

A thermally-conductive, electrically insulative interface for conductively cooling a heat-generating source, such as an electronic component, having an associated thermal dissipation member such as a heat sink. The interface is provided as a cured sheet of a curable material formulated as a blend of a curable silicone binder, and a particulate alumina, i.e., aluminum oxide (Al2O3), filler. The interface is observed to exhibit a thermal conductivity of at least about 0.8 W/m-K and a wet dielectric breakdown strength of at least about 475 Vac/mil.

It is to provide a filter for an exhaust gas having a high thermal conductivity irrespective of a relatively high porosity or showing characteristics that the whole of the filter containing a high refractive index substance or pigment is easily warmed but hardly cooled while making low the thermal conductivity of the filter as a whole. This filter is provided with a catalyst coat layer formed by carrying a catalyst active component on a surface of a porous ceramic carrier, in which a porosity of the porous ceramic carrier is 40-80% and a substance or a pigment indicating a thermal conductivity as the filter of 3-60 W/mk or having a large refractive index at a thermal conductivity of 0.3-3 W/mk.

A heat spreader for transferring heat from a heat source to a heat sink using a phase change coolant, includes an array of cells, each cell having at least one microporous wick for supporting flows of the coolant in the liquid phase, via capillary action, within the spreader from proximate the heat sink to proximate the source and at least one macroporous wick for supporting flows of the coolant, in the liquid and vapor phase, within the spreader from proximate the source to proximate the heat sink.

A light conversion device and high-intensity, solid-state light source utilize wavelength conversion elements with a thermal conductivity greater than 1 watt per meter per degree Kelvin (W/m-K). Exemplary materials that have high thermal conductivity include monocrystalline solids, polycrystalline solids, substantially densified ceramic solids, amorphous solids or composite solids. The light conversion device and high-intensity, solid-state light source have at least one heat sink that is in direct thermal contact with the wavelength conversion element. The heat sink quickly dissipates heat generated within the wavelength conversion element in order to prevent the wavelength conversion element from overheating and undergoing thermal quenching of the wavelength conversion and light emission.

A vertical, monolithic, thin-film thermoelectric device is described. Thermoelectric elements of opposing conductivity types may be coupled electrically in series and thermally in parallel by associated electrodes on a single substrate, reducing the need for mechanisms to attach multiple substrates or components. Phonon transport may be separated from electron transport in a thermoelectric element. A thermoelectric element may have a thickness less than an associated thermalization length. An insulating film between an electrode having a first temperature and an electrode having a second temperature may be a low-thermal conductivity material, a low-k, or ultra-low-k dielectric. Phonon thermal conductivity between a thermoelectric element and an electrode may be reduced without a significant reduction in electron thermal conductivity, as compared to other thermoelectric devices. A phonon conduction impeding material may be included in regions coupling an electrode to an associated thermoelectric element (e.g., a liquid metal).

A diamond composite heat spreader having a low thermal mismatch stress can improve reliability and cost of diamond-based heat spreaders. A diamond composite heat spreader can have a thermally conductive base and a diamond film in thermal contact with the thermally conductive base. The diamond film and the thermally conductive base can have a residual thermal mismatch stress which is less than about 75% of a residual thermal mismatch stress which would result from forming the diamond film on the thermally conductive base using a high temperature deposition process at 700° C. The diamond film can be formed on the thermally conductive base using a low temperature vapor deposition process performed at a temperature from about 10° C to less than 700° C, and typically lower than about 450° C. The diamond films further have high thermal diffusivity and thermal conductivity which allow for dramatic improvements in heat transfer away from a heat source without the need for growing a thick diamond film. By providing a low temperature deposition of the diamond film, residual thermal mismatch stress can be significantly reduced, while allowing for use of well known heat spreaders such as standard copper heat spreaders and associated technologies.

A Peltier or Seebeck element has first and second conductive members having different Seebeck coefficients. To decrease the heat conduction from one to the other end of each of the conductive members, the cross-section area at the intermediate part in the length direction is smaller than those at both ends parts. In place of the decrease of the cross-section, the shape of the cross-section of the intermediate part of each of the conductive members may be changed by dividing the intermediate part into pieces, or amorphous silicon or the like having a heat conductivity lower than those of the materials of both end parts may be used for the material of the intermediate part. In such a way, a high-performance Peltier/Seebeck element such that the difference between the temperature of the heated portion of the Peltier/Seebeck element and the opposite portion can be kept to a predetermined temperature difference for a long time and its manufacturing method are provided.

The invention discloses fluororesin radiating paint and a preparation method thereof. The paint mainly comprises an electron transfer type organic compound, graphene, a carbon nanotube, titanium white, other additives and fluororesin, wherein the fluororesin is a paint brand having the highest comprehensive property at present; the electron transfer type organic compound can greatly enhance the thermal radiation rate of the paint; the graphene and the carbon nanotube can further accelerate thermal conduction; and the electron transfer type organic compound, the carbon nanotube and the graphene finally form a full three-dimensional network distribution of granules (electron transfer type organic compound), wires (carbon nanotube) and planes (graphene) in a fluid. The fluororesin radiating paint disclosed by the invention has high thermal radiation rate, high thermal conductivity and low thermal resistance, can realize radiation cooling, and simultaneously has the effects of self cleaning, acid/alkali resistance and super high insulativity, thereby having high practical value.

A light emitting module with improved optical functionality and reduced thermal resistance is described, which comprises a light emitting device (LED), a wavelength converting (WC) element and an inorganic optically-transmissive thermally-conductive (OTTC) element. The WC element is capable of absorbing light generated from the LED at a specific wavelength and re-emitting light having a different wavelength. The re-emitted light and any unabsorbed light exits through at least one surface of the module. The OTTC is in physical contact with the WC element and at least partially located in the optical path of the light. The OTTC comprises one or more layers of inorganic material having a thermal conductivity greater than that of the WC element. As such, a compact unitary integrated module is provided with excellent thermal characteristics, which may be further enhanced when the OTTC provides a thermal barrier for vertical heat propagation through the module but not lateral propagation.

It is an object of the present invention to provide a high thermal conductive element that has improved thermal conductivity in the layer direction while retaining the high thermal conductivity characteristics in the planar direction possessed by graphite. The present invention is a high thermal conductive element in which carbon particles are dispersed in a graphite-based matrix, wherein (1) the c axis of the graphene layers constituting the graphite are substantially parallel, (2) the thermal conductivity κ∥ in a direction perpendicular to the c axis is at least 400 W/m·k and no more than 1000 W/m·k, and (3) the thermal conductivity κ⊥ in a direction parallel to the c axis is at least 10 W/m·k and no more than 100 W/m·k.

Phononic crystals that have the ability to modify and control the thermal black body phonon distribution and the phonon component of heat transport in a solid. In particular, the thermal conductivity and heat capacity can be modified by altering the phonon density of states in a phononic crystal. The present invention is directed to phononic crystal devices and materials such as radio frequency (RF) tags powered from ambient heat, dielectrics with extremely low thermal conductivity, thermoelectric materials with a higher ratio of electrical-to-thermal conductivity, materials with phononically engineered heat capacity, phononic crystal waveguides that enable accelerated cooling, and a variety of low temperature application devices.

In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 and a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the high thermal conductivity fillers are from 1-1000 nm in length and have an aspect ratio of between 3-100.

This invention relates to solar panels with improved encapsulants and backsheets for greater power output and/or increased efficiency by using materials with higher thermal conductivity than conventional solar panels. According to certain embodiments the improved materials include fillers while maintaining sufficient dielectric properties. According to certain other embodiments, the invention includes a solar panel with the improved encapsulant between solar cells and the improved backsheet. The invention also includes a method of making a solar panel including the improved materials.

A battery having at least one group of electric power-generating elements each comprising at least a positive electrode, a negative electrode and a separator; and a battery case containing the group of electric power-generating elements. The battery case is formed from a mixture which includes a matrix material selected from the group consisting of plastics, polymers, resins or combinations thereof. The mixture further includes a thermally conductive, electrically insulating material distributed throughout the matrix material. The thermally conductive material has a thermal conductivity at least one order of magnitude higher than the thermal conductivity of the matrix material. The present invention also includes battery cases (lids and containers) used in making the batteries and formed of the mixture.

The invention relates to a medium-high temperature (120-1000 DEG C or higher) composite structural heat storage material. The medium-high temperature composite structural heat storage material comprises an inorganic salt phase change latent heat material, a sensitive heat storage material and a heat conduction reinforcing material, wherein the mass ratio of the inorganic salt phase change latent heat material to the sensitive heat storage material is of 1: (0.1-10); and the heat conduction reinforcing material is of 0.0001-1kg/ (kg heat storage material) based on mass ratio. The preparation method comprises steps as follows: uniformly mixing the inorganic salt phase change latent heat material with the sensitive heat storage material and the heat conduction reinforcing material; pressurizing to form green blank; and then heating and sintering, so as to obtain the medium-high temperature composite structural heat storage material. The medium-high temperature composite structural heat storage material provided by the invention is capable of obviously reducing the corrosion resistance of the sensitive heat storage material; meanwhile, the thermal conductivity of the composite heat storage material is markedly improved by virtue of the micro-nano doping of the heat conduction reinforcing material; and moreover, high heat storage density is achieved, and wide application prospect is provided.

This invention relates to a heat spread sheet material comprised of hexagonal boron nitride with adhesives. Extraction process for adhesive coating greatly decreases the adhesive fraction and provides an evenly distributed thin adhesive film on the surface of hexagonal boron nitride powders. This sheet material shows a layer structure and anisotropic properties. With 10 vol % (5.5 wt %) of phenolic epoxy, thermal conductivity along the base plane of the sheet reaches 48 W/m·K, and CTE reaches 3.5 ppm/K.

A graphene-polymer layered composite and a method of manufacturing the same is provided. A graphene-polymer layered composite includes polymer layers surrounding a graphene sheet, and may include numerous polymer layers and graphene sheets in an alternating stacked configuration. The graphene-polymer layered composite has the characteristics of a polymer in that it provides flexibility, ease of manufacturing, low manufacturing costs, and low thermal conductivity. The graphene-polymer layered composite also has the characteristics of graphene in that it has a high electrical conductivity. Due to the low thermal conductivity and high electrical conductivity, the graphene-polymer layered composite may be useful for electrodes, electric devices, and thermoelectric materials.

An optical recording medium configured with a light reflection layer; a first protection layer; a recording layer containing a phase-change material which changes between crystalline and amorphous phases by a light irradiation; a second protection layer; and one of a cover layer and a protective coating layer disposed on a substrate in this order; and in which the light reflection layer is formed of one of an Al alloy and an Ag alloy; the first protection layer has a ZnS-SiO2 mixture layer which contains a mixture of ZnS and SiO2, and a intermediate layer having higher thermal conductivity than the ZnS-SiO2 mixture layer; the intermediate layer is formed on the side of the light reflection layer; the recording layer comprises Ge, Sb, and Te as main elements; and the second protection layer comprises a mixture of ZnS and SiO2.

An electronic clinical thermometer has a probe including a temperature sensor and a heat flux sensor which are controlled to make measurements at specified time intervals. The measured values are used in solving the equation of heat conduction to estimate the temperature of an internal body position. A heater may be included to preheat a body part in order to reduce the time required for measurement. The probe may use two temperature sensors to measure temperatures at two body surface positions through insulating members which are different in thermal conductivity.

A composite heat sink apparatus includes a metal base which has a thermal conductivity of at least about 150 W/m° K. The metal base is preferably constructed either of copper of aluminum. The heat sink apparatus further includes a plurality of fins attached to the base, the fins being constructed of anisotropic graphite material having a direction of relatively high thermal conductivity perpendicular to the base.

A heat pipe (20) includes a pipe (21), a wick (22), and an operating fluid. The wick is a capillary structure including a carbon nanotube layer, and is fixed to an inside wall of the pipe. The operating fluid is sealed in the pipe and soaks into the wick. The operating fluid includes a pure liquid, and a plurality of nanometer-scale particles uniformly suspended in the pure liquid. The nanometer-scale particles can be carbon nanocapsules (30) or particles of a metal (32) with high thermal conductivity. Each carbon nanocapsule can further have a metal with high thermal conductivity filled therein. The carbon nanotube layer contains carbon nanotubes of small size and high thermal conductivity, therefore the capillary performance of the wick is good. Further, because the operating fluid includes nanometer-scale particles with high thermal conductivity, this ensures that the operating fluid has high thermal conductivity.

The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.

An article includes a working portion including cemented carbide, and a heat sink portion in thermal communication with the working portion. The heat sink portion includes a heat sink material having a thermal conductivity greater than a thermal conductivity of the cemented carbide. Also disclosed are methods of making an article including a working portion comprising cemented carbide, and a heat sink portion in thermal communication with the working portion and including a heat sink material having a thermal conductivity that is greater than a thermal conductivity of the cemented carbide. The heat sink portion conducts heat from the working portion.

This invention relates to solar panels with improved encapsulants and back sheets for greater power output and/or increased efficiency by using materials with higher thermal conductivity than conventional solar panels. According to certain embodiments the improved materials include fillers while maintaining sufficient dielectric properties. According to certain other embodiments, the invention includes a solar panel with the improved encapsulant between solar cells and the improved back sheet. The invention also includes a method of making a solar panel including the improved materials. The invention also includes solar modules and methods related to encapsulants and the back sheets including filler materials with an enhanced particle size distribution, a brightening agent, or an infrared extinguisher.

The present invention has been completed in view of such situation, and an object of the present invention is to find a Ag based alloy which exhibits high cohesion resistance, high light resistance, high heat resistance, high reflectivity, high transmissivity, low absorptivity, and high thermal conductivity of the level which had not been realized by the pure Ag or by the conventional Ag alloys, and on the bases of such alloy, to provide a semi-reflective film and a reflective film for an optical information recording medium provided with excellent writing/reading properties and long term reliability; sputtering target for an optical information recording medium used in depositing such semi-reflective film and the reflective film; and an optical information recording medium provided with such semi-reflective film or the reflective film. A semi-reflective film or reflective film for an optical information recording medium comprising a Ag based alloy, wherein the Ag based alloy comprises 0.005 to 0.40% (at % unless otherwise noted) of Bi and 0.05 to 5% in total of at least one element selected from Zn, Al, Ga, In, Si, Ge, and Sn.

A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects.

The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.

A heat radiation member including a thermal diffusion sheet; and a thermally conductive polymer layer provided on at least a part of the thermal diffusion sheet. Thermal conductivity of the thermally conductive polymer layer in a thickness direction of the layer is higher than thermal conductivity of the thermally conductive polymer layer in a direction parallel to the surface of the layer. The heat radiation member is formed by joining an independently formed thermally conductive layer including a thermally conductive filler onto the thermal diffusion sheet. The thermally conductive filler are oriented in a specific direction. Alternatively, the heat radiation member is formed by placing a thermally conductive polymer composition containing a thermal conductive filler containing a thermally conductive filler onto the thermal diffusion sheet, orienting the thermally conductive filler in a specific direction, and curing the thermally conductive polymer composition while the orientation is maintained.