479 results about "Thermal transmittance" patented technology

The invention provides a temperature control system of an electrostatic adsorption disc and an improvement method of temperature control performance. According to the system, a temperature control layer is arranged in an electrostatic adsorption disc, and the temperature control layer comprises a graphite heat absorption layer and a graphene heat conduction layer; the system further comprises a laser generator and a controller. During working, the laser generator emits heating laser to the graphite heat absorption layer, so that the graphite heat absorption layer efficiently absorbs energy to generate heat, and then the heat is quickly and uniformly conducted to the surface of the electrostatic adsorption disc through the graphene heat conduction layer with ultrahigh heat conductivity. Laser heating is used for replacing traditional resistance heating, graphene heat conduction is used for replacing traditional metal heat conduction, the method has the advantages of being high in temperature switching speed, high in control precision, good in temperature uniformity and the like, and the temperature control performance of the electrostatic adsorption disc can be remarkably improved.

The invention discloses a silica gel pad with high thermal conductivity and heat resistance and a preparation method thereof, and the method comprises the following steps: preparing a composite thermal conductive filler, mixing boron nitride nanosheets and graphene according to a certain mass ratio, adding a silane coupling agent, carrying out ball milling, adding spherical alumina, and mixing; preparing modified organic silicon resin, wherein methyl vinyl silicone rubber, hydrogen-containing silicone oil, a platinum catalyst and MQ silicon resin react to obtain the modified organic silicon resin; mixing and defoaming the modified organic silicon resin, the composite heat-conducting filler, the flame retardant and the antioxidant to obtain a heat-conducting silica gel mixture; preparing a reinforced base material, carrying out plasma treatment on glass fiber cloth, and then impregnating the glass fiber cloth with vinyl ester resin for pre-curing; and grinding the mixture by three rollers, coating the mixture on a reinforced base material, and heating and curing. The thermal conductivity of the obtained silica gel pad is 2.5-3.5 W / m.K, the volume resistivity is larger than 1012 omega.cm, the long-term heat-resistant temperature reaches 200 DEG C or above, the tensile strength is larger than 5 MPa, the peel strength is larger than 15 N / cm, and the silica gel pad has excellent thermal conductivity, insulativity, heat resistance and mechanical strength.

An MIM preparation method for an ultrahigh heat-conducting composite material based on diamonds and red copper. The method comprises the preparation of a mixture, internal mixing granulation, injection molding, and degreasing sintering. By means of the MIM process, not only can uniform mixing and high-density molding of diamonds and a red copper powder be achieved, thereby effectively overcoming the technical problems of non-uniform dispersity, low density, etc. during the preparation of a high-heat-conductivity composite material by means of a traditional process, but the shape and size of a product can also be accurately controlled, particularly during the production of a sheet material having a thickness of less than 1 mm; moreover, the heat conductivity (the heat conductivity thereof being up to 500-800 W / (m·K)) thereof is significantly improved and is significantly higher than that of a traditional metal material. In addition, by optimizing MIM process parameters and selecting raw materials having higher cost effectiveness, the present invention effectively reduces the production cost, such that large-scale use of the high heat-conducting composite material based on diamonds and red copper becomes possible, thereby satisfying the high-standard requirements of high-performance electronic equipment for heat dissipation materials.

According to the high-thermal-conductivity flame-retardant copper-clad laminate and the preparation method thereof, the thermal conductivity and the limit oxygen index of a copper-clad plate can be effectively improved, so that the high-thermal-conductivity flame-retardant property of the copper-clad plate is effectively improved; modified aluminum nitride and phosphoric acid modified aluminum nitride powder in the heat-conducting filler can keep good hydrolysis resistance in the ball milling process; polyvinyl butyral and polyethylene glycol are compounded as a binder, so that the modified aluminum nitride has good sphericity and surface smoothness, and the spherical aluminum nitride prepared by water-based spray granulation is suitable for being used as a heat-conducting filler of a thermal interface material; modified silicon dioxide in the heat-conducting filler adopts cerium-doped hollow mesoporous silicon dioxide nanospheres coated with polydopamine, and a corrosion inhibitor MBT (2-mercaptobenzothiazole) is loaded by the cerium-doped hollow mesoporous silicon dioxide nanospheres; controllable release of the corrosion inhibitor MBT and rare earth cerium ions is achieved, the process of corroding the cathode and the anode can be inhibited at the same time, and the corrosion resistance and the corrosion self-repairing performance of the copper-clad plate can be effectively improved.

The invention discloses a flexible light heat-insulation streamline oxide nanofiber aerogel and a preparation method and application thereof.The fiber aerogel is prepared through preparation of a spinning precursor solution, an air flow spinning technology and a heat treatment process, the spinning solution is stretched into fibers through the air flow spinning technology, and under the influence of a flow field, the flexible light heat-insulation streamline oxide nanofiber aerogel is obtained. The fibers present streamlines with different curvatures, high-quality dry fibers are obtained through a heating field, and the high-quality dry fibers are stacked in a receiver to form a three-dimensional structure; and finally, the three-dimensional streamline oxide nanofiber aerogel with ultralow thermal conductivity and low density is obtained by combining thermal treatment with a folding process, has excellent thermal protection performance and can be widely applied as a light high-temperature-resistant thermal insulation material.

The invention discloses a lightweight alumina foamed ceramic refractory material and a preparation method thereof, and relates to the technical field of ceramic materials. When the light aluminum oxide foamed ceramic refractory material is prepared, zirconium acetylacetonate, yttrium nitrate hexahydrate and aluminum nitrate nonahydrate are mixed to prepare a spinning solution for electrostatic spinning, nano aluminum titanate is loaded by using a nano spraying technology during spinning, and doped modified zirconium oxide fibers are prepared after high-temperature heat treatment and defibering and dispersing; mixing aluminum oxide micro powder, hollow aluminum oxide, a high-temperature foaming agent, doped modified zirconium oxide fibers and a sintering aid, and then performing ball milling and sieving to prepare aluminum oxide-based mixed powder; and carrying out mold pressing on the alumina-based mixed powder to prepare a green body, sintering, and cooling to prepare the lightweight alumina foamed ceramic refractory material. The light aluminum oxide foamed ceramic refractory material prepared by the invention has the advantages of light weight, low thermal conductivity, high compressive strength, high bending strength and good thermal shock resistance.

The invention discloses high-temperature reaction equipment which comprises a reaction cavity; the base is arranged at the bottom of the reaction cavity and used for bearing a substrate, and the base comprises a central area, a base disc area and an edge area which are sequentially arranged close to the side wall of the reaction cavity in the radial direction; the top surface of the reaction cavity is provided with the first heat insulation plate and a baffle, the baffle is opposite to the base, the first heat insulation plate is arranged on the side, away from the base, of the baffle, an airflow gap is formed between the first heat insulation plate and the baffle, and the first heat insulation plate comprises a plurality of sub heat insulation plates; and the comprehensive thermal conductivity of the sub-thermal-insulation plate corresponding to the base plate area is greater than that of the sub-thermal-insulation plate corresponding to the central area and the edge area.

This land-based aquaculture tank comprises: an inner side wall that is formed from a material having a high thermal conductivity and stores aquaculture water on the inner side; an outer side wall that is formed from a material having a low thermal conductivity and is provided outside the inner side wall so as to surround the inner side wall at a distance, thereby providing a double structure; a warming space portion that is formed by a gap between the inner side wall and the outer side wall and is filled with air; and a heater disposed in the warming space portion. The present invention is configured such that the inner side wall is heated by heat radiation and heat conduction from the heater, and the aquaculture water stored on the inner side is heated.

The invention discloses an aerogel / spacer fabric composite material as well as a preparation method and application thereof, and belongs to the technical field of thermal insulation materials. A three-dimensional spacer fabric with the upper surface layer being a hexagonal mesh structure and the lower surface layer being a chaining and weft insertion structure is selected as a substrate, the lower surface layer of the fabric is firstly filled with an aerogel coating in a coating mode, and then the fabric is completely filled with the coating on the upper surface layer; and drying to obtain the aerogel / three-dimensional spacer fabric composite material with better heat preservation effect and flexibility. The two-phase composite structure thermal insulation material obtained by the method has the characteristics of light weight, high strength and low thermal conductivity. Meanwhile, by adding the three-dimensional spacer fabric, the mechanical property of the material is effectively improved. The thermal insulation material can be used as a thermal insulation material for buildings, engineering, vehicles and the like, and is wide in application range and good in market prospect. The preparation process is simple, short in flow, mild in reaction condition and suitable for industrial production.

The invention discloses a multi-physical-field intelligent optimization system and method for low-thermal-resistance stacked electrode packaging, and relates to the technical field of packaging thermal management. According to the system, a thermal, mechanical and electric multi-physics field coupling model of the stacked electrode packaging structure is established in a unified computational domain through a modeling module; the measurement module collects thermal resistance, thermal conductivity and interface stress data in real time through an integrated sensor; the self-correction optimization module executes a self-adaptive residual iterative algorithm based on the deviation between the model simulation result and the actually measured data, corrects model parameters and generates process control variables; and the process regulation and control module dynamically adjusts the sintering temperature, the coating thickness and the pressing pressure according to the control variables and feeds back updated data to form closed-loop optimization. According to the method, collaborative operation of modeling, measurement, optimization and process regulation and control is realized, dynamic self-correction of multi-physical field parameters and process adaptive optimization can be realized in the packaging operation process, the interface thermal resistance is remarkably reduced, and the heat-conducting property and the structural stability are improved.

The present invention relates to a Tesla valve-type ultra-thin planar thermal diode based on phase change heat transfer technology. The diode comprises a tube body, within which are disposed an evaporation end, a liquid working fluid cavity, a Tesla valve flow channel, a liquid wick filled with liquid working fluid, and a condensation end. The wick is disposed within the liquid working fluid cavity. The condensation end, the wick, and the evaporation end are sequentially connected to form a liquid working fluid path, while the evaporation end, the Tesla valve flow channel, and the condensation end are sequentially connected to form a gaseous working fluid path. The Tesla valve utilizes the fluid acceleration characteristics and unidirectional conductivity of the fluid to improve the unidirectional thermal conductivity of the ultra-thin planar thermal diode. During forward heating, the gaseous working fluid flows from the evaporation end to the condensation end, flowing downstream within the Tesla valve with low air resistance and high thermal conductivity. During reverse heating, the gaseous working fluid flows from the condensation end to the evaporation end, flowing countercurrently within the Tesla valve with high air resistance and low thermal conductivity, thereby achieving the effect of a thermal diode. The diode can be widely used in the microelectronics industry.

The internal combustion engine piston comprises a piston body, an inner cooling oil cavity is formed in the piston body, a groove is formed in the top of the inner cooling oil cavity and extends upwards from the top of the inner cooling oil cavity, the groove is filled with a heat conduction block, and the heat conduction block is used for conducting heat of the part, located above the inner cooling oil cavity, of the piston body to the inner cooling oil cavity. The heat conductivity of the heat conduction block is higher than that of the piston body, so that more heat is transferred to the inner cooling oil cavity from the top of the piston in unit time, the heat transfer speed of the heat of the part, located above the inner cooling oil cavity, of the piston body to the inner cooling oil cavity is increased, the heat taking efficiency of engine oil is improved, and the piston cooling capacity of the inner cooling oil cavity is improved. The problems of abnormal temperature of the piston, carbon deposition, clamping stagnation of movement of the ring group and the like are avoided, and heat dissipation of the piston in the movement process is met.

The utility model relates to an aerosol generating device and a heating assembly, the heating assembly comprises: a tubular ceramic substrate capable of transmitting infrared light, the inner side of which defines an accommodating cavity for accommodating an aerosol generating substrate; the protective layer is coated on the ceramic substrate, the thickness of the protective layer is smaller than that of the pipe wall of the ceramic substrate, and the thermal conductivity of the protective layer is lower than that of the ceramic substrate; the heating layer is arranged on the ceramic substrate and can heat the aerosol generating substrate by radiating infrared light waves, and at least part of the heating layer is located between the protective layer and the ceramic substrate. According to the heating layer of the heating assembly, the protective layer with the thermal conductivity lower than that of the ceramic substrate is arranged on the ceramic substrate, so that the strength of the ceramic substrate can be enhanced, it is guaranteed that the ceramic substrate has enough falling-cracking-preventing strength, the heat capacity of the ceramic substrate is further reduced, the purpose of rapid heating is achieved, energy efficiency is improved, the ceramic substrate is thinned, and the service life of the ceramic substrate is prolonged. The transmission efficiency of infrared light waves can be increased, and the energy efficiency is further improved.

The invention relates to the technical field of mine blasting, and discloses a high-temperature blasting drilling multi-layer thermal insulation charging device for strip mines, which comprises a multi-layer thermal insulation sleeve, a temperature monitoring module, an active cooling module and a quick release mechanism, the multi-layer thermal insulation sleeve comprises a phase change heat absorption layer, and an aerogel thermal insulation layer is fixedly mounted on the outer wall of the phase change heat absorption layer; a metal reflecting layer is fixedly installed on the outer wall of the aerogel heat insulation layer, the multiple layers of heat insulation sleeves are arranged, the high temperature of the external environment is effectively isolated through the multiple layers of structures of the multiple layers of heat insulation sleeves, internal explosives are protected against the influence of the high temperature, and the phase change heat absorption layer utilizes the phase change heat absorption characteristic of a paraffin-graphene composite material; a large amount of heat is absorbed and stored, temperature rise is effectively slowed down, the aerogel heat insulation layer further blocks heat transfer due to extremely low heat conductivity and excellent heat insulation performance, the metal reflection layer can effectively reflect solar radiation and heat radiation in the surrounding environment, and heat absorption is reduced.

The invention discloses a transformer design method and system based on a hierarchical genetic algorithm and a medium, and belongs to the field of transformer design. The method comprises the steps that a structural hierarchical model of an amorphous alloy three-dimensional roll iron core transformer is constructed based on transformer parameters; inputting the structure layering model into a preset multi-physics field coupling simulation model, calculating iron core no-load loss power and winding load loss power, and determining a simulation temperature field in combination with the amorphous alloy iron core thermal conductivity and a dynamically calibrated boundary convective heat transfer coefficient; according to the sequence of the three-dimensional roll iron core layer, the winding layer and the oil duct layer, hierarchical genetic algorithm optimization is executed to obtain an optimization scheme, iterative simulation is conducted on the optimization scheme until an obtained simulation result meets a first preset condition, and the amorphous alloy three-dimensional roll iron core transformer is constructed based on the determined target structure parameters. And the design rationality and the operation safety of the amorphous alloy three-dimensional roll iron core transformer can be improved.

The invention discloses a high-thermal-conductivity and insulating PTFE / BN ball and diamond composite thermal interface material and a dry preparation method of the high-thermal-conductivity and insulating PTFE / BN ball and diamond composite thermal interface material. The material is prepared from, by mass, 20%-30% of polytetrafluoroethylene (PTFE), 70%-80% of boron nitride balls (BN) and diamond powder through dry cold press molding, the thermal conductivity ranges from 12.3 W / m.K to 15.6 W / m.K, and the volume resistivity is gt; the thickness is 1015 omega.cm. The preparation process does not need a solvent, comprises the steps of BN ball and diamond dry mixing, PTFE powder vacuum ultrasonic dispersion, cold press molding and the like, and is environment-friendly and low in consumption. The obtained material has high thermal conductivity, electrical insulativity and flexibility, and is suitable for heat dissipation management of chips, 5G equipment and other high-temperature environments.

The invention belongs to the technical field of functional composite materials, and particularly relates to a phase-change high-thermal-conductivity material with efficient thermal management capability and a preparation method thereof. The phase-change high-thermal-conductivity material is prepared from the following raw materials: 40 to 45 percent of biomass charcoal, 10 to 15 percent of carbon nanotubes, 0.8 to 1.0 percent of a KH550 coupling agent, 0.3 to 0.6 percent of a KH560 coupling agent, 0.8 to 1.0 percent of a dispersing agent, 35 to 40 percent of a paraffin matrix and 3 to 5 percent of boron nitride nanosheets. By combining the stacking and filling of the boron nitride nanosheets and the bridging effect of the CNT, the thermal conductivity upper limit caused by disordered dispersion and interface scattering of traditional epoxy resin is broken through, and the thermal conductivity is improved by 76%-345%; an all-insulation filler system (BN / biomass charcoal) is adopted, so that the common electric conduction problem of a high-thermal-conductivity material is overcome; meanwhile, the paraffin base body endows the material with flexibility, the rigidity limitation of a traditional graphite material is broken through, and the material is adaptive to emerging scenes such as flexible electronics and special-shaped battery modules.

The utility model provides a battery monomer, a battery device and a power utilization device. A battery cell includes: a case; the electrode assembly is located in the shell and comprises an electrode main body and a tab, the electrode main body comprises a first end face and a second end face which are oppositely arranged in the first direction and a side face connected between the first end face and the second end face, and the tab is connected to the electrode main body and extends out of at least one of the first end face and the second end face; the heat conduction assembly comprises an insulating part and a heat conduction part, at least part of the insulating part forms a containing cavity, the heat conduction part is arranged in the containing cavity, the insulating part at least covers the side face, and the heat conduction part comprises a first heat conduction piece which is arranged on at least part of the side face and is in heat conduction connection with the side face. The thermal conductivity of the heat conduction piece is larger than that of the insulating piece and that of the shell.

The invention provides a low-thermal-conductivity refractory material and a preparation method thereof, and belongs to the technical field of refractory materials. The low-thermal-conductivity refractory material provided by the invention is prepared from the following raw materials in percentage by mass: 60-77% of magnesia, 20-37% of magnesium aluminate spinel, 2-3% of a binding agent and 0.1-0.2% of an additive, the additives are kaolin and quartz sand; the binding agent is one of a dextrin solution, a calcium lignosulphonate solution, a methyl cellulose solution and a sulfite paper pulp waste liquid; the mass ratio of the kaolin to the quartz sand is 1: (1-3). According to the invention, the kaolin and the quartz sand which are used as additives are preferentially melted during sintering, so that pores are formed in the sintering process, and the thermal conductivity of the refractory material is reduced; meanwhile, the addition amount of the additive is small, so that the strength of the refractory material is not influenced.

The invention provides a heat conduction type gas sensor chip and a gas concentration measuring method. The heat conduction type gas sensor chip comprises a sensing unit and a driving integrated circuit, the sensing unit comprises at least two cavities and heaters correspondingly suspended above the cavities, at least two heat dissipation areas with different heat conductivity are formed, and at least one temperature sensor is arranged on the surface of each heat dissipation area; and a mixed signal circuit system in the integrated driving circuit controls the heater and generates a target gas concentration signal according to the temperature signal of the temperature sensor. Through the structural design of the sensor chip and the synergistic effect of circuit integration and an intelligent algorithm, accurate measurement of the concentration of a target gas is realized, and meanwhile, the gas sensor chip has the capability of parallel detection of multiple gas components, so that the technical problems of insufficient anti-interference capability, relatively high power consumption and low integration degree of an existing gas sensor chip in a complex environment are solved.

The invention discloses an insulating boron nitride heat-conducting gasket and application thereof, and belongs to the technical field of heat-conducting materials. The preparation method comprises the following steps: S1, preparing boron nitride powder, a volatile organic solvent and silica gel into a BN dispersion liquid; s2, coating a substrate with the dispersion liquid; s3, drying the wet film to obtain a BN film; s4, the BN film is torn down and cut into BN thin strips; s5, the BN thin strips are flatly laid in the polytetrafluoroethylene grooves to be fixed; s6, addition type silica gel is injected into the groove to be cured, a primary BN sheet is formed, and the primary BN sheet is repeatedly prepared; s7, coating addition type silica gel on the upper surface and the lower surface of each primary BN sheet, stacking the primary BN sheets into a mold, and pressing and curing the primary BN sheets to form a BN block; and S8, cutting the BN block along the direction perpendicular to the arrangement direction of the BN thin strips to obtain the insulating boron nitride heat-conducting gasket. The insulating boron nitride heat-conducting gasket has the excellent properties of high orientation degree, high heat conductivity, controllable structure, stable performance, excellent insulativity, flexibility and the like.

The invention relates to a novel high-precision laser etching method for a high-thermal-conductivity metal film on the surface of an organic material. According to the principle that the arrangement mode of atoms in crystal lattices is determined by crystal defects, crystal sizes and crystal orientations in metal materials, so that the transfer mode of heat energy through phonons and electrons is influenced, and by regulating and controlling the crystal structures of the metal materials, the transverse heat conduction area of instantaneous laser energy in the metal film is reduced; therefore, the energy longitudinally conducted to the interface of the metal film and the substrate under the action of the laser is increased, so that the temperature of the interface of the laser spot edge area is higher than the thermal decomposition temperature of the substrate material, and the solid stripping phenomenon is generated. The method provided by the invention solves the problem that high-thermal-conductivity metal subjected to laser etching is easy to remain at present, improves the precision of a laser etching pattern, and has scientific and industrial practical potential.

The application discloses a kind of production methods and application of mushroom-shaped array via hole mould which avoid blockage, easy to clean, including steps: round hole array mould processing, hot-press forming, conductive treatment, end insulation, electroforming;The mushroom-shaped array via hole mould obtained by the method is applied in the preparation of mushroom-shaped bionic array by rolling;The metal mould prepared by the method has high mechanical strength, high thermal conductivity and good durability, and converts the processing problem of mushroom-shaped blind hole into mushroom-shaped via hole, forms mushroom-shaped via hole by inducing non-uniform deposition of metal ions in 3D limited space, effectively eliminates the limitation that the morphology of plating layer is completely determined by the morphology of core mould in conventional electrodeposition process, simplifies the geometry of electroforming core mould, reduces the manufacturing difficulty of electroforming core mould, and improves the controllability of plating layer morphology.

The utility model relates to the field of chemical oxygen generation and heat insulation, in particular to an onboard chemical oxygen generator with a heat insulation structure, which comprises a starting mechanism, a starting base detachably connected with the lower end of the starting mechanism, an upper connecting piece, a lower connecting piece and a heat insulation structure, the inner circumferential surface of the top end of the inner tank body is fixed with the outer circumferential surface of the lower end of the upper connecting piece; the upper end of the outer circumferential surface of the lower connecting piece is fixed with the inner circumferential surface of the bottom end of the inner tank body; due to the fact that the outer tank body is adopted and the annular space is formed between the outer tank body and the inner tank body, the problem that the temperature of the outer surface of the inner tank body is too high due to the fact that heat is generated in the inner tank body is effectively solved, and the temperature of the outer tank body meets the standard due to the fact that the static air layer in the annular space between the inner tank body and the outer tank body is low in heat conductivity. Meanwhile, air heat insulation is adopted in the annulus, so that the overall weight is reduced, and the requirement of light-weight products is met.

The utility model discloses a high-temperature-resistant upper cover plate for a printed circuit board, which belongs to the technical field of cover plates and comprises a cover frame, a plurality of supporting blocks are fixedly arranged in the cover frame, a ceramic heat insulation plate is arranged on the supporting blocks, a top metal plate is fixedly arranged on the cover frame, and the top metal plate is arranged on the top of the cover frame. The space between the top metal plate and the ceramic heat insulation plate is a heat insulation cavity; according to the utility model, the ceramic heat insulation plate is arranged, the plurality of supporting blocks are used for bearing the ceramic heat insulation plate, so that the ceramic heat insulation plate is stably placed, the ceramic heat insulation plate effectively prevents external heat from being conducted to the circuit board by utilizing the characteristic of low heat conductivity, the influence caused by heat conduction is greatly reduced, and the top metal plate not only can bear external mechanical impact, but also can bear external heat; the internal structure and the circuit board are protected, part of absorbed heat can be dissipated to the outside due to the heat radiation characteristic, heat transmitted to the heat insulation cavity and the circuit board is reduced, air in the heat insulation cavity serves as a poor conductor of heat, heat convection is limited, and heat is further prevented from being transmitted to the circuit board.

The application discloses a cold end compensation structure for thermocouple acquisition, which is characterized by the following: an opening groove is designed, an isothermal block is arranged in the opening groove of each thermocouple connector, and the isothermal block is tightly combined with two conductive copper plates of each thermocouple connector through a heat-conducting silica gel sheet, so that the thermocouple connector of each input channel is tightly combined through the heat-conducting silica gel sheet, thereby avoiding the inconsistency of the temperature of two electrodes of the thermocouple and the temperature between multiple thermocouples, ensuring the real-time performance and accuracy of the cold end compensation, and meanwhile, the isothermal block is also tightly combined with an internal temperature compensation circuit sensor of a thermocouple acquisition system on a PCB through the heat-conducting silica gel sheet, the overall heat capacity of the cold end structure is improved, and the temperature sensitivity of the cold end to the outside is reduced. Meanwhile, the temperature plate is a circuit board on which a channel temperature sensor is arranged, the thickness of the circuit plate is a customized thickness, the channel temperature sensor is lifted to be close to the rear end of the conductive copper plate of the thermocouple connector, and the accuracy of temperature measurement is ensured. In addition, the heat-conducting silica gel sheet is a buffer for connecting each part, which ensures high thermal conductivity and insulation.

The invention discloses a solid buoyancy material which is prepared from the following raw materials in parts by weight: 10 parts of epoxy resin, 1-1.5 parts of an active epoxy diluent, 3-11 parts of an epoxy curing agent, 0.5-1.5 parts of light heat-conducting filler and 6-8 parts of heat-conducting hollow glass beads. Wherein the heat-conducting hollow glass beads are prepared from the following raw materials in parts by weight: 10 parts of hollow glass beads, 1-5 parts of a heat-conducting material and 50-80 parts of light-cured waterborne polyurethane. According to the technical scheme, the hollow glass beads are modified, and the heat-conducting material and the light-cured waterborne polyurethane are added when the heat-conducting hollow glass beads are prepared, so that the whole solid buoyancy material forms a heat-conducting passage, and the heat conductivity is greatly improved; the toughness of the hollow glass beads is improved, the probability of damage in the stirring process is reduced, and meanwhile, the density of the buoyancy material is greatly reduced by introducing the light heat-conducting filler; the compatibility of the hollow glass beads and epoxy resin is improved, and the water absorption rate is reduced; and the overall hydrostatic pressure resistance of the solid buoyancy material is improved.

A method of manufacturing a semiconductor device includes: preparing a superposed substrate in which a first substrate and a second substrate are bonded via a heat conduction control film, a peeling promotion film, and a laser absorbing film; irradiating the laser absorbing film with laser; and separating the first substrate from the second substrate, in which the thermal conductivity control film, the peeling promoting film, and the laser absorbing film are laminated in this order from the first substrate side, the thermal conductivity of the thermal conductivity control film is different from the thermal conductivity of the peeling promoting film, and the thermal conductivity of the laser absorbing film is different from the thermal conductivity of the peeling promoting film. The thermal expansion coefficient of the peeling promoting film is greater than the thermal expansion coefficient of the laser absorbing film.

The invention discloses a diffusion welding method for an electrostatic chuck base and an insulating layer. The diffusion welding method comprises the following steps that (1) the base and the insulating layer are pretreated; (2) the three-layer composite brazing filler metal is subjected to laser cutting according to the size of a to-be-welded area; the cut three-layer composite brazing filler metal is subjected to ultrasonic cleaning, drying and vacuum sealing storage; (3) the base, the three layers of composite brazing filler metal and the insulating layer are stacked and assembled in sequence; (4) the assembly part is put into a vacuum diffusion welding furnace, vacuumizing is conducted till the pressure is smaller than or equal to 2 * 10 <-3 > Pa, the temperature is increased to 500-600 DEG C in a segmented mode, meanwhile, the axial pressure of 2-20 MPa is applied, and after pressure maintaining, the temperature is slowly reduced to the room temperature; and (5) carrying out nondestructive testing on the welding interface by adopting an X-CT and ultrasonic phased array detection system. The welding temperature can be reduced, so that the residual stress of a welding bonding interface can be reduced, the cracking risk in the using process of the electrostatic chuck is reduced, and the service life of the electrostatic chuck is prolonged; meanwhile, it is ensured that the bonding interface has high thermal conductivity, and the temperature uniformity of the wafer can be improved.

The invention provides a high-power and high-density digital power supply embedded temperature equalization and insulation integrated material which comprises a three-dimensional porous BN substrate, a high-thermal-conductivity metal alloy filled in a three-dimensional network, and a graphene layer sprayed on the outer surface. The integrated material is extremely heat-conducting, excellent in insulation and matched in thermal expansion, the graphene spraying outer layer can avoid flowing metal leakage, and meanwhile the heat conductivity is guaranteed.