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996 results about "Thermal transmittance" patented technology

Thermal transmittance is the rate of transfer of heat through matter. The thermal transmittance of a material (such as insulation or concrete) or an assembly (such as a wall or window) is expressed as a U-value.

Intelligent temperature control system for hot compress salt physiotherapy bag

The invention relates to the technical field of local heating, in particular to an intelligent temperature control system for a hot compress salt physiotherapy bag, which comprises a multi-layer tissue modeling module for calculating the heat conduction rate of a multi-layer tissue according to the heat conduction characteristic of physiotherapy bag salt particles in combination with the heat conductivity of a skin layer and the thickness of a fat layer, integrating a heat flow input value and a heat attenuation path, and calculating the heat conduction rate of the multi-layer tissue; the accumulated heat flow decreases progressively and the surface heat conduction rate is increased. According to the invention, the heat conduction rate and path are accurately predicted by combining the heat conduction characteristic of the salt particles and the heat transfer rule of the multi-layer tissue, the heat concentration or dispersion phenomenon is avoided, the heat distribution uniformity is improved, the temperature difference is monitored in real time, the power distribution is dynamically adjusted, and the temperature control precision is improved and the energy consumption is optimized; heat loss is reduced, it is ensured that the temperature is stabilized in a suitable range, the problem of overheating or supercooling is avoided, the balance of the hot compress effect is integrally enhanced, the physical therapy requirements of multiple parts are met, energy waste is reduced, and meanwhile the safety and reliability of equipment operation are improved.
Owner:LINYI QIANYUAN VARIETY SALT CO LTD

Bare chip cooling fin installation method and electronic equipment

The invention relates to the technical field of chip heat dissipation, and discloses a bare chip cooling fin and an installation method thereof, and the cooling fin comprises a heat dissipation substrate, through hole supporting columns, a mixed fixing assembly and a heat dissipation fin array. The heat dissipation substrate is made of high-thermal-conductivity copper alloy, and the surface of the heat dissipation substrate is plated with a nano oxide layer to improve the heat radiation efficiency; the height of the through hole supporting column is matched with that of elements around the chip, and the bottom is provided with an anti-skid rubber pad to prevent installation inclination and buffer mechanical stress; the mixed fixing assembly comprises screw fixing holes distributed diagonally and plastic buckle fixing holes distributed diagonally, a plastic buckle can rotate by 0-90 degrees, a limiting spring is arranged in the plastic buckle to provide tactile feedback, and rapid installation and damage-free disassembly are achieved; the radiating fin array adopts a gradient height design, is matched with heat source distribution of the chip and optimizes an airflow channel. Through the dual-redundancy fixing structure and the gradient heat dissipation design, the heat dissipation efficiency and the installation reliability are remarkably improved, and the heat dissipation device is suitable for high-vibration and high-heat-dissipation-demand scenes such as data centers and automatic driving.
Owner:SINO TELECOM TECHNOLOGY CO INC

A metal semi-solid pulping cooling device and pulping equipment

The present invention relates to a metal semi-solid pulping cooling device and pulping equipment, including a rotating mechanism, two or more stirring mechanisms, a spoon, a cooling mechanism, a heat dissipation mechanism and a controller. The technical solution of the present application sets a stirring and quenching rod with a solid structure and uses a low-temperature metal alloy in a molten state as the heat transfer medium of the stirring and quenching rod that needs to be cooled, and utilizes the high thermal conductivity and high boiling point of the low-temperature metal alloy to quickly and reliably reduce the stirring and quenching rod to the initial temperature. The stirring and quenching rod can have a lower initial temperature and have a better heat transfer effect on the high-temperature metal liquid, which helps to improve the pulping quality and shorten the pulping time to increase production capacity. Compared with the prior art, the heat dissipation mechanism of the coolant and the rotating mechanism are separately set, which does not affect the life of the rotating mechanism, and even if the circulating pump is abnormal, it is not easily affected by the temperature to cause the risk of boiling and cracking of the stirring rod.
Owner:FUZHOU JINGYOU MATERIAL TECH CO LTD

Rigid, non-flexible fiber reinforced insulation composite

The present disclosure relates to non-flexible composite insulation materials comprising a metal oxide matrix reinforced with a fibrous material embedded therein. Specifically, the present disclosure relates to use of the non-flexible composite insulation materials for thermal batteries and the like. The non-flexible composite insulation materials with low thermal conductivity provided herein is capable of meeting the mechanical requirements for thermal battery design yet provides improved handleability compared to the commercially available insulators.
Owner:ASPEN AEROGELS INC

Manufacturing method of ultrathin high-density multilayer interconnection ceramic board

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1
Owner:SHENZHEN BOMIN ELECTRONICS CO LTD

Temperature control system of electrostatic adsorption disc and method for improving temperature control performance

The invention provides a temperature control system of an electrostatic adsorption disc and an improvement method of temperature control performance. According to the system, a temperature control layer is arranged in an electrostatic adsorption disc, and the temperature control layer comprises a graphite heat absorption layer and a graphene heat conduction layer; the system further comprises a laser generator and a controller. During working, the laser generator emits heating laser to the graphite heat absorption layer, so that the graphite heat absorption layer efficiently absorbs energy to generate heat, and then the heat is quickly and uniformly conducted to the surface of the electrostatic adsorption disc through the graphene heat conduction layer with ultrahigh heat conductivity. Laser heating is used for replacing traditional resistance heating, graphene heat conduction is used for replacing traditional metal heat conduction, the method has the advantages of being high in temperature switching speed, high in control precision, good in temperature uniformity and the like, and the temperature control performance of the electrostatic adsorption disc can be remarkably improved.
Owner:SHANGHAI HUALI INTEGRATED CIRCUIT CORP

Silica gel pad with high thermal conductivity and heat resistance and preparation method thereof

The invention discloses a silica gel pad with high thermal conductivity and heat resistance and a preparation method thereof, and the method comprises the following steps: preparing a composite thermal conductive filler, mixing boron nitride nanosheets and graphene according to a certain mass ratio, adding a silane coupling agent, carrying out ball milling, adding spherical alumina, and mixing; preparing modified organic silicon resin, wherein methyl vinyl silicone rubber, hydrogen-containing silicone oil, a platinum catalyst and MQ silicon resin react to obtain the modified organic silicon resin; mixing and defoaming the modified organic silicon resin, the composite heat-conducting filler, the flame retardant and the antioxidant to obtain a heat-conducting silica gel mixture; preparing a reinforced base material, carrying out plasma treatment on glass fiber cloth, and then impregnating the glass fiber cloth with vinyl ester resin for pre-curing; and grinding the mixture by three rollers, coating the mixture on a reinforced base material, and heating and curing. The thermal conductivity of the obtained silica gel pad is 2.5-3.5 W / m.K, the volume resistivity is larger than 1012 omega.cm, the long-term heat-resistant temperature reaches 200 DEG C or above, the tensile strength is larger than 5 MPa, the peel strength is larger than 15 N / cm, and the silica gel pad has excellent thermal conductivity, insulativity, heat resistance and mechanical strength.
Owner:JIUYU ELECTRONIC TECH (JIANGSU) CO LTD

Heat-conducting phase change coating and preparation method thereof

The invention discloses a heat-conducting phase-change coating which comprises the following components: a bonding material agent, a solvent, an initiator, a heat-conducting filler, a phase-change material and a wetting dispersant. The heat-conducting phase change coating with high heat conductivity, high enthalpy value and high polymerization strength is obtained by researching a temperature change material, a heat-conducting filler, a binding material and the like. When the continuous working temperature is high, the phase-change material still keeps good cohesive strength, all the components are not separated, the phase-change coating does not become dry or hard, the thermal resistance is not increased, heat can be rapidly conducted and dissipated, and the service life of the phase-change coating is prolonged. Besides, the coating is convenient to use, the whole material can be packaged by different materials after being coated in a high-temperature state, and the coating is convenient to use, install and process in a solid state and can be widely applied to the fields of electronics, aerospace and the like.
Owner:DONGGUAN JUNQING ELECTRONIC TECH CO LTD

MIM process preparation method for ultrahigh heat-conducting composite material based on diamonds and red copper, and cold plate type liquid-cooling heat-dissipation system part made of composite material

An MIM preparation method for an ultrahigh heat-conducting composite material based on diamonds and red copper. The method comprises the preparation of a mixture, internal mixing granulation, injection molding, and degreasing sintering. By means of the MIM process, not only can uniform mixing and high-density molding of diamonds and a red copper powder be achieved, thereby effectively overcoming the technical problems of non-uniform dispersity, low density, etc. during the preparation of a high-heat-conductivity composite material by means of a traditional process, but the shape and size of a product can also be accurately controlled, particularly during the production of a sheet material having a thickness of less than 1 mm; moreover, the heat conductivity (the heat conductivity thereof being up to 500-800 W / (m·K)) thereof is significantly improved and is significantly higher than that of a traditional metal material. In addition, by optimizing MIM process parameters and selecting raw materials having higher cost effectiveness, the present invention effectively reduces the production cost, such that large-scale use of the high heat-conducting composite material based on diamonds and red copper becomes possible, thereby satisfying the high-standard requirements of high-performance electronic equipment for heat dissipation materials.
Owner:CAI MINGFANG

Curable composition

The present application provides a curable composition, a thermal interface material (TIM), and a use thereof. In the present application, the curable composition or thermal interface material, and the like can exhibit low adhesion force to a given adherend while exhibiting high thermal conductivity. Also, in the present application, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. In the present application, the curable composition can also exhibit a precisely controlled curing rate and simultaneously have excellent curability. The present application can also provide a product comprising the curable composition, or a cured body thereof, or a thermal interface material thereof.
Owner:LG CHEM LTD

Double-sheath mineral insulated heating cable and preparation method and application thereof

The invention relates to the technical field of petroleum and natural gas development, and discloses a double-sheath mineral insulated heating cable and a preparation method and application thereof. The double-sheath mineral insulation heating cable sequentially comprises a core body, an insulation heat conduction layer, an inner sheath layer and an outer sheath layer from inside to outside. Wherein the yield strength of the inner sheath layer is greater than or equal to 205 MPa, the tensile strength is greater than or equal to 520 MPa, the ductility is greater than or equal to 35%, and the hardness is less than or equal to 32 HRC; the yield strength of the outer sheath layer is greater than or equal to 205 MPa, the tensile strength is greater than or equal to 520 MPa, the elongation is greater than or equal to 35%, and the hardness is less than or equal to 32 HRC; the thickness of the outer sheath layer is 30%-50% smaller than that of the inner sheath layer, the heat conductivity of the inner sheath layer is not larger than that of the outer sheath layer, and the heat conductivity of the inner sheath layer is not smaller than that of the insulating heat conduction layer. The double-sheath mineral insulation heating cable can be suitable for being applied to deep wells and ultra-deep wells of H2S, CO2 and Cl <->, the use temperature is 350-750 DEG C, and the service life is more than 3 years.
Owner:CHINA NAT PETROLEUM CORP +2

Paraffin and liquid metal composite phase change energy storage radiator

The invention discloses a paraffin and liquid metal composite phase change energy storage radiator, and relates to the technical field of radiators, the paraffin and liquid metal composite phase change energy storage radiator comprises an upper shell and a lower shell which are arranged in a split manner, the upper shell is provided with an upper heat dissipation groove, the lower shell is provided with a lower heat dissipation groove, the upper shell is embedded in the lower heat dissipation groove, a heat dissipation cavity is formed between the lower heat dissipation groove and the upper heat dissipation groove, and the upper shell and the lower shell are provided with heat dissipation holes. A liquid metal filling cavity is formed in the position, corresponding to the high-power chip, of the heat dissipation cavity, a paraffin filling cavity is formed in the position, corresponding to the low-power chip, of the heat dissipation cavity, the paraffin filling cavity and the liquid metal filling cavity are separated through an annular liquid cooling flow channel, and a plurality of air cooling flow channels are formed in the bottom of the lower shell in a penetrating mode. The low-melting-point liquid metal is combined with a traditional phase change energy storage radiator, the high heat conductivity of the liquid metal is utilized, heat of a chip with large power consumption is conducted to a heat storage area of a phase change material more rapidly, and the heat dissipation problems that the requirement for the overall heat capacity of an electronic component is high, and a large chip needs to be subjected to rapid temperature equalization are effectively solved.
Owner:SICHUAN WEIZE COMM TECH CO LTD

High-thermal-conductivity flame-retardant copper-clad laminate and preparation method thereof

According to the high-thermal-conductivity flame-retardant copper-clad laminate and the preparation method thereof, the thermal conductivity and the limit oxygen index of a copper-clad plate can be effectively improved, so that the high-thermal-conductivity flame-retardant property of the copper-clad plate is effectively improved; modified aluminum nitride and phosphoric acid modified aluminum nitride powder in the heat-conducting filler can keep good hydrolysis resistance in the ball milling process; polyvinyl butyral and polyethylene glycol are compounded as a binder, so that the modified aluminum nitride has good sphericity and surface smoothness, and the spherical aluminum nitride prepared by water-based spray granulation is suitable for being used as a heat-conducting filler of a thermal interface material; modified silicon dioxide in the heat-conducting filler adopts cerium-doped hollow mesoporous silicon dioxide nanospheres coated with polydopamine, and a corrosion inhibitor MBT (2-mercaptobenzothiazole) is loaded by the cerium-doped hollow mesoporous silicon dioxide nanospheres; controllable release of the corrosion inhibitor MBT and rare earth cerium ions is achieved, the process of corroding the cathode and the anode can be inhibited at the same time, and the corrosion resistance and the corrosion self-repairing performance of the copper-clad plate can be effectively improved.
Owner:JIANG SU YAO HONG ELECTRONICS CO LTD

Thermal-conductive silicone composition, production method therefor, and semiconductor device

A thermal-conductive silicone composition containing: (A) a hydrolysable organopolysiloxane having an alkoxysilyl group; and (B) aluminum nitride particles having an average particle size of 0.5 μm or more and 2.0 μm or less and contained in an amount of 50 to 70 volume %. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the entire aluminum nitride particles, the coarse particles having particle sizes of 10 μm or more according to a particle size distribution measurement method by laser diffraction. The thermal-conductive silicone composition has a heat conductivity of 1.3 W / mK or more according to a hot disc method. The present invention provides: a thermal-conductive silicone composition having high heat conductivity and being compressible to 10 μm or less; and a production method of the thermal-conductive silicone composition.
Owner:SHIN ETSU CHEMICAL CO LTD

Preparation method and application of heat-resistant high-thermal-conductivity modified simethicone

PendingCN119264666AImprove liquidityhigh flash pointMethyl benzeneHeat stability
The invention relates to a preparation method and application of heat-resistant high-thermal-conductivity modified dimethyl silicone oil. Adding a certain proportion of phenylalkoxysilane into dimethyl silicone oil, blowing in water vapor, heating to 60-70 DEG C, stirring, adding zirconium caprylate, heating to 100-180 DEG C, continuously blowing in high-purity nitrogen, preserving heat, stirring and dispersing uniformly to obtain a heat-resistant additive; the preparation method comprises the following steps: adding a liquid metal composite material into dimethyl silicone oil while stirring, heating to 160-230 DEG C, dropwise adding a heat-resistant additive, continuously blowing high-purity nitrogen, and continuously stirring and homogenizing to obtain the metal bright-color modified dimethyl silicone oil. In the dimethyl silicone oil, the modified dimethyl silicone oil can be obtained by taking methyl phenyl alkoxy silane, zirconium octoate, a liquid metal composite material and the like as modifiers, the thermal conductivity can be improved to 4-8W / m.K, the weight loss mass fraction at 350 DEG C * 30min is less than 1.0%, and the heat-resistant stability and the thermal conductivity are greatly improved.
Owner:HUBEI XINGRUI SILICON MATERIAL CO LTD

Multi-layer composite heat-conducting gasket

The utility model discloses a multi-layer composite heat-conducting gasket, which comprises a heat-conducting protective layer and a second radiating fin arranged at the bottom of the heat-conducting protective layer, when the multi-layer composite heat-conducting gasket is used, a multi-layer material composite structure of the first stainless steel layer, the second stainless steel layer, the first cooling fin, the second cooling fin and the alloy layer improves heat transfer stability, the heat-conducting fins are made of silica gel materials so as to provide flexibility, the heat-conducting fins make full contact with elements and protect the elements, and the service life of the elements is prolonged. The stainless steel layer is arranged to provide high thermal conductivity and rigidity, so that the installation is convenient, the alloy layer is subjected to phase change when being heated and is softened into a semi-liquid state from an original solid state, so that the thermal conductivity is improved, the thermal conductive protective layer is used for packaging the five thermal conductive layers, the stability is improved, the five thermal conductive layers are prevented from being stripped and scattered during use, and the service life is prolonged. A compression spring is installed on the inner side of the stainless steel layer and can exert continuous compression force on the heat-conducting fin, so that the heat-conducting fin is in full contact with the element, and heat resistance is reduced.
Owner:KUNSHAN ZHAOKE ELECTRONIC MATERIALS CO LTD

Flexible light-weight heat-insulation streamline oxide nanofiber aerogel as well as preparation method and application of flexible light-weight heat-insulation streamline oxide nanofiber aerogel

The invention discloses a flexible light heat-insulation streamline oxide nanofiber aerogel and a preparation method and application thereof.The fiber aerogel is prepared through preparation of a spinning precursor solution, an air flow spinning technology and a heat treatment process, the spinning solution is stretched into fibers through the air flow spinning technology, and under the influence of a flow field, the flexible light heat-insulation streamline oxide nanofiber aerogel is obtained. The fibers present streamlines with different curvatures, high-quality dry fibers are obtained through a heating field, and the high-quality dry fibers are stacked in a receiver to form a three-dimensional structure; and finally, the three-dimensional streamline oxide nanofiber aerogel with ultralow thermal conductivity and low density is obtained by combining thermal treatment with a folding process, has excellent thermal protection performance and can be widely applied as a light high-temperature-resistant thermal insulation material.
Owner:SOUTHEAST UNIV

High-thermal-conductivity heat-conducting silica gel sheet and preparation method thereof

The invention relates to the technical field of preparation of heat-conducting silica gel sheets, and discloses a high-heat-conductivity heat-conducting silica gel sheet which comprises the following raw materials in parts by weight: 90 parts of silicone rubber, 40-50 parts of heat-conducting filler, 1-5 parts of a reinforcing agent, 1-3 parts of an anti-aging agent, 1-3 parts of an antioxidant, 2-3 parts of a cross-linking agent, 3-6 parts of a flame retardant and 1-2 parts of a catalyst. The silicon rubber is organic silicon rubber; the heat-conducting filler is graphite and aluminum oxide, and the ratio of the graphite to the aluminum oxide is 1: 2. When the heat-conducting silica gel sheet is prepared, the mechanical property and the heat resistance of the heat-conducting silica gel sheet can be improved by adding the reinforcing agent, and the weather resistance and the aging resistance of the heat-conducting silica gel sheet can be enhanced by the anti-aging agent, so that the heat-conducting silica gel sheet can be used outdoors or in a severe environment; by using the antioxidant, the oxidation resistance of the heat-conducting silica gel sheet can be improved, the service life of the heat-conducting silica gel sheet can be prolonged, and by using the flame retardant, the flame retardance of the heat-conducting silica gel sheet can be improved, and the safety of the heat-conducting silica gel sheet at high temperature is ensured.
Owner:SHENZHEN SHILONGXIANG TECH CO LTD

Lightweight alumina foamed ceramic refractory material and preparation method thereof

The invention discloses a lightweight alumina foamed ceramic refractory material and a preparation method thereof, and relates to the technical field of ceramic materials. When the light aluminum oxide foamed ceramic refractory material is prepared, zirconium acetylacetonate, yttrium nitrate hexahydrate and aluminum nitrate nonahydrate are mixed to prepare a spinning solution for electrostatic spinning, nano aluminum titanate is loaded by using a nano spraying technology during spinning, and doped modified zirconium oxide fibers are prepared after high-temperature heat treatment and defibering and dispersing; mixing aluminum oxide micro powder, hollow aluminum oxide, a high-temperature foaming agent, doped modified zirconium oxide fibers and a sintering aid, and then performing ball milling and sieving to prepare aluminum oxide-based mixed powder; and carrying out mold pressing on the alumina-based mixed powder to prepare a green body, sintering, and cooling to prepare the lightweight alumina foamed ceramic refractory material. The light aluminum oxide foamed ceramic refractory material prepared by the invention has the advantages of light weight, low thermal conductivity, high compressive strength, high bending strength and good thermal shock resistance.
Owner:SHANDONG LIANGJI TEMPERATURE DOMAIN NEW MATERIALS CO LTD

Hybrid platform manufacturing

A method of assembling a ceramic matrix composite (CMC) component is provided. The method includes assessing which portions of the CMC component require relatively high-temperature capability and which portions require at least one of strength, thickness and increased thermal conductivity, making the portions that require the relatively high temperature capability with chemical vapor infiltration (CVI), making the portions that require the at least one of strength, thickness and increased thermal conductivity with melt infiltration (MI) and combining the portions that require the relatively high temperature capability with the CVI and the portions that require the at least one of strength, thickness and increased thermal conductivity with the MI.
Owner:RTX CORP

Curable composition

The present application provides a curable composition, a thermal interface material (TIM), and a use thereof. In the present application, the curable composition or thermal interface material, and the like can exhibit low adhesion force to a given adherend while exhibiting high thermal conductivity. Also, in the present application, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. In the present application, the curable composition can also exhibit a precisely controlled curing rate and simultaneously have excellent curability. The present application can also provide a product comprising the curable composition, or a cured body thereof, or a thermal interface material thereof.
Owner:LG CHEM LTD

Susceptor For High Temperature Semiconductor Process

The present disclosure provides a susceptor. The susceptor includes: a base member including a first cooling gas flow path configured to introduce a cooling gas; a thermal insulation member having a thermal conductivity of 20 W / mK or less, the thermal insulation member including a second cooling gas flow path in communication with the first cooling gas flow path and being stacked on the base member; and an insulating plate stacked on the thermal insulation member, the insulating plate including a plurality of gas holes in communication with the second cooling gas flow path and configured to discharge the cooling gas to cool a substrate.
Owner:MICOCERAMICS LTD

Gas concentration sensor and sensor calibration without use of a target gas

A sensor calibration system includes a gas sensor configured to measure a thermal conductivity of a target gas. The gas sensor includes a reference chamber containing a reference gas, a measurement chamber containing a measurement gas, and a calibration circuit. The reference gas has a first thermal conductivity profile and the measurement gas has a, different, second thermal conductivity profile that are dependent on a first environmental stimulus and a second environmental stimulus. The calibration circuit is configured to, while the first environmental stimulus is varied and the second environmental stimulus is fixed, acquire a plurality of measurements. Each measurement of the plurality of measurements is representative of a difference in thermal conductivity between thermal conductivities of the reference gas and the measurement gas. The calibration circuit is configured to determine a target gas sensitivity of the gas sensor to the target gas based on the plurality of measurements.
Owner:INFINEON TECHNOLOGIES AG

Battery module

Provided is a battery module comprising: a first cell stack and a second cell stack, each of which has a plurality of battery cells stacked thereon; a housing having an inner space in which the first cell stack and the second cell stack are accommodated; an insulating fluid configured to flow in the inner space of the housing; and a barrier assembly disposed between the first cell stack and the second cell stack, wherein the barrier assembly includes: a heat insulation cover configured to be capable of blocking heat propagation between the first cell stack and the second cell stack; and a heat dissipation member in contact with the insulating fluid and including a material having a higher thermal conductivity than the heat insulation cover.
Owner:LG ENERGY SOLUTION LTD

Graphite flake laminate and method for producing same, and heat conduction member and heat dissipation structure each using same

[Problem] To provide: a graphite flake laminate that exhibits a high heat conductivity and can be used as a sheet-like heat conduction member; and a production method with which it is possible to produce the graphite flake laminate by using a safe and simple production facility. [Solution] Provided is a graphite flake laminate in which a large number of graphite flakes are laminated, wherein the porosity in a cross section in the lamination direction is 20.0% or less, and the median value of the aspect ratios of gaps present between the graphite flakes is 6.5 or more. This material is used as a heat conduction member for a heat dissipation structure or the like. The laminate can be produced by a method in which a specific acid is added to a liquid dispersion in which a carbon material comprising aggregates of graphene, and a carbonate salt or a hydrogencarbonate salt are dispersed in a dispersion medium.
Owner:NISSAN MOTOR CO LTD

Boron nitride heat conduction film and preparation method thereof

The invention relates to the technical field of heat-conducting materials, in particular to a boron nitride heat-conducting film and a preparation method thereof.The boron nitride heat-conducting film is prepared through a coating technology and a roll forming technology, deionized water is selected as a solvent, and the boron nitride heat-conducting film is green and environmentally friendly and is combined with the coating technology and the roll forming technology; the preparation method is simple, the production speed is high, the efficiency is high, the cost is low, large-scale industrialization can be achieved, the boron nitride nanosheets in the slurry can be directionally arranged under the action of a coating process, so that a heat-conducting network is formed in the boron nitride heat-conducting film, the boron nitride heat-conducting film has excellent heat-conducting performance, and the service life of the boron nitride heat-conducting film is prolonged. And the in-plane thermal conductivity of the finally formed heat conduction film can reach 54.46 W / (m.K), so that the technical problems that in the preparation process of the heat conduction film in the prior art, the preparation method is complex, the environment is not friendly, and the production efficiency is low due to the adoption of sheet flat pressing molding are solved.
Owner:CHONGQING HFC ELECTRONIC NEW MATERIAL CO LTD

Die partition thermal conductivity design method and system based on keyhole regulation and control

The invention provides a mold partition thermal conductivity design method and system based on keyhole regulation and control, relates to the technical field of additive manufacturing, and aims to solve the problem that mold performance is affected due to unreasonable keyhole distribution when a mold component is subjected to melt processing by a laser powder bed at present. The key hole distribution is reduced in the area close to the cooling water channel to improve the heat conductivity, the key hole distribution is increased far away from the cooling water channel to reduce the heat conductivity, and the key hole defect is converted into the functional characteristic of regulating the heat conductivity of the mold component, so that the problem that the heat conductivity partition adjustment cannot be insufficient in the traditional technology is solved, and the partition heat management requirement is met; the mold performance is improved.
Owner:SHANDONG UNIV

Land-based aquaculture tank

This land-based aquaculture tank comprises: an inner side wall that is formed from a material having a high thermal conductivity and stores aquaculture water on the inner side; an outer side wall that is formed from a material having a low thermal conductivity and is provided outside the inner side wall so as to surround the inner side wall at a distance, thereby providing a double structure; a warming space portion that is formed by a gap between the inner side wall and the outer side wall and is filled with air; and a heater disposed in the warming space portion. The present invention is configured such that the inner side wall is heated by heat radiation and heat conduction from the heater, and the aquaculture water stored on the inner side is heated.
Owner:SEASIDE CONSULTING INC

Method and system for determining thermal properties of soil

A computer-implemented method of determining subsurface thermal conductivity of target soil is disclosed. The method comprises receiving, from a heat flow penetrometer that is surrounded by target soil, temperature data comprising a temperature at each time point of n time points, determining, for each time point a measured temperature difference, based on estimated values of thermal conductivity and volumetric heat capacity of the target soil, using a solution space to generate a calculated temperature difference for the estimated values of thermal conductivity and volumetric heat capacity for each of a predetermined series of time points of the solution space. The solution space comprises a plurality of values of thermal conductivity, a plurality of values of volumetric heat capacity, and pre-computed values of temperature difference for each combination of values of thermal conductivity and volumetric heat capacity and for each of the predetermined series of time points of the solution space. Unlocking insights from Geo-Data, the present invention further relates to improvements in sustainability and environmental developments: together we create a safe and liveable world.
Owner:FNV IP BV