2167 results about "Thermal transmittance" patented technology

A workpiece support having dichotomy of thermal paths therethrough is provided for controlling the temperature of a workpiece support thereon. In one embodiment, a workpiece support includes a platen body having a plug centrally disposed in a workpiece support surface of the platen body. A lower surface of the plug defines a void between the plug and a bottom of the bore. The void creates a dichotomy of thermal paths through the platen body thus controlling the temperature of a wafer support surface. Alternatively, the plug and platen body may be fabricated from materials having different rates of thermal conductivity to created the dichotomy of thermal paths in addition to or in absence of the void.

Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. Methods for forming tunnels through lamination and etching are employed. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates.Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste. Alternating semiconducting materials may also be patterned in linear or radial fanout patterns through screening techniques and lamination of wire structures. A liquid channel within the faceplate is used to enhance thermal energy transfer.Thermoelectric devices are physically incorporated within the IC package using MLC technology.

A high R-rating window assembly storing multiple, reciprocating reflective flexible film layers in a sealed housing between rigid (e.g. glazed) layers. The glazed layers are separated on the order of 3 to 5-inches and are secured to low thermal conductivity framework pieces. The framework is capped with a motorized roller and film housing and the assembly is evacuated and filled with a desiccated, inert dry gas. Several plastic, reflective coated films are supported under tension in planar parallel relation between the glazing layers from the motorized roller and several guide rollers and guide tracks. Location sensors responsive to indicia on the films identify film position. Temperature sensors monitor ambient, internal and user set thermal conditions to control film exposure. The films are operable via a room control system and window controllers to define open, closed and partial exposure conditions. Alternative control functions may control film exposure in relation to room occupancy.