662 results about "Thermal transmittance" patented technology

The invention relates to the technical field of chip heat dissipation, and discloses a bare chip cooling fin and an installation method thereof, and the cooling fin comprises a heat dissipation substrate, through hole supporting columns, a mixed fixing assembly and a heat dissipation fin array. The heat dissipation substrate is made of high-thermal-conductivity copper alloy, and the surface of the heat dissipation substrate is plated with a nano oxide layer to improve the heat radiation efficiency; the height of the through hole supporting column is matched with that of elements around the chip, and the bottom is provided with an anti-skid rubber pad to prevent installation inclination and buffer mechanical stress; the mixed fixing assembly comprises screw fixing holes distributed diagonally and plastic buckle fixing holes distributed diagonally, a plastic buckle can rotate by 0-90 degrees, a limiting spring is arranged in the plastic buckle to provide tactile feedback, and rapid installation and damage-free disassembly are achieved; the radiating fin array adopts a gradient height design, is matched with heat source distribution of the chip and optimizes an airflow channel. Through the dual-redundancy fixing structure and the gradient heat dissipation design, the heat dissipation efficiency and the installation reliability are remarkably improved, and the heat dissipation device is suitable for high-vibration and high-heat-dissipation-demand scenes such as data centers and automatic driving.

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1

The invention provides a temperature control system of an electrostatic adsorption disc and an improvement method of temperature control performance. According to the system, a temperature control layer is arranged in an electrostatic adsorption disc, and the temperature control layer comprises a graphite heat absorption layer and a graphene heat conduction layer; the system further comprises a laser generator and a controller. During working, the laser generator emits heating laser to the graphite heat absorption layer, so that the graphite heat absorption layer efficiently absorbs energy to generate heat, and then the heat is quickly and uniformly conducted to the surface of the electrostatic adsorption disc through the graphene heat conduction layer with ultrahigh heat conductivity. Laser heating is used for replacing traditional resistance heating, graphene heat conduction is used for replacing traditional metal heat conduction, the method has the advantages of being high in temperature switching speed, high in control precision, good in temperature uniformity and the like, and the temperature control performance of the electrostatic adsorption disc can be remarkably improved.

The invention discloses a silica gel pad with high thermal conductivity and heat resistance and a preparation method thereof, and the method comprises the following steps: preparing a composite thermal conductive filler, mixing boron nitride nanosheets and graphene according to a certain mass ratio, adding a silane coupling agent, carrying out ball milling, adding spherical alumina, and mixing; preparing modified organic silicon resin, wherein methyl vinyl silicone rubber, hydrogen-containing silicone oil, a platinum catalyst and MQ silicon resin react to obtain the modified organic silicon resin; mixing and defoaming the modified organic silicon resin, the composite heat-conducting filler, the flame retardant and the antioxidant to obtain a heat-conducting silica gel mixture; preparing a reinforced base material, carrying out plasma treatment on glass fiber cloth, and then impregnating the glass fiber cloth with vinyl ester resin for pre-curing; and grinding the mixture by three rollers, coating the mixture on a reinforced base material, and heating and curing. The thermal conductivity of the obtained silica gel pad is 2.5-3.5 W / m.K, the volume resistivity is larger than 1012 omega.cm, the long-term heat-resistant temperature reaches 200 DEG C or above, the tensile strength is larger than 5 MPa, the peel strength is larger than 15 N / cm, and the silica gel pad has excellent thermal conductivity, insulativity, heat resistance and mechanical strength.

The invention discloses a heat-conducting phase-change coating which comprises the following components: a bonding material agent, a solvent, an initiator, a heat-conducting filler, a phase-change material and a wetting dispersant. The heat-conducting phase change coating with high heat conductivity, high enthalpy value and high polymerization strength is obtained by researching a temperature change material, a heat-conducting filler, a binding material and the like. When the continuous working temperature is high, the phase-change material still keeps good cohesive strength, all the components are not separated, the phase-change coating does not become dry or hard, the thermal resistance is not increased, heat can be rapidly conducted and dissipated, and the service life of the phase-change coating is prolonged. Besides, the coating is convenient to use, the whole material can be packaged by different materials after being coated in a high-temperature state, and the coating is convenient to use, install and process in a solid state and can be widely applied to the fields of electronics, aerospace and the like.

An MIM preparation method for an ultrahigh heat-conducting composite material based on diamonds and red copper. The method comprises the preparation of a mixture, internal mixing granulation, injection molding, and degreasing sintering. By means of the MIM process, not only can uniform mixing and high-density molding of diamonds and a red copper powder be achieved, thereby effectively overcoming the technical problems of non-uniform dispersity, low density, etc. during the preparation of a high-heat-conductivity composite material by means of a traditional process, but the shape and size of a product can also be accurately controlled, particularly during the production of a sheet material having a thickness of less than 1 mm; moreover, the heat conductivity (the heat conductivity thereof being up to 500-800 W / (m·K)) thereof is significantly improved and is significantly higher than that of a traditional metal material. In addition, by optimizing MIM process parameters and selecting raw materials having higher cost effectiveness, the present invention effectively reduces the production cost, such that large-scale use of the high heat-conducting composite material based on diamonds and red copper becomes possible, thereby satisfying the high-standard requirements of high-performance electronic equipment for heat dissipation materials.

The present application provides a curable composition, a thermal interface material (TIM), and a use thereof. In the present application, the curable composition or thermal interface material, and the like can exhibit low adhesion force to a given adherend while exhibiting high thermal conductivity. Also, in the present application, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. In the present application, the curable composition can also exhibit a precisely controlled curing rate and simultaneously have excellent curability. The present application can also provide a product comprising the curable composition, or a cured body thereof, or a thermal interface material thereof.

According to the high-thermal-conductivity flame-retardant copper-clad laminate and the preparation method thereof, the thermal conductivity and the limit oxygen index of a copper-clad plate can be effectively improved, so that the high-thermal-conductivity flame-retardant property of the copper-clad plate is effectively improved; modified aluminum nitride and phosphoric acid modified aluminum nitride powder in the heat-conducting filler can keep good hydrolysis resistance in the ball milling process; polyvinyl butyral and polyethylene glycol are compounded as a binder, so that the modified aluminum nitride has good sphericity and surface smoothness, and the spherical aluminum nitride prepared by water-based spray granulation is suitable for being used as a heat-conducting filler of a thermal interface material; modified silicon dioxide in the heat-conducting filler adopts cerium-doped hollow mesoporous silicon dioxide nanospheres coated with polydopamine, and a corrosion inhibitor MBT (2-mercaptobenzothiazole) is loaded by the cerium-doped hollow mesoporous silicon dioxide nanospheres; controllable release of the corrosion inhibitor MBT and rare earth cerium ions is achieved, the process of corroding the cathode and the anode can be inhibited at the same time, and the corrosion resistance and the corrosion self-repairing performance of the copper-clad plate can be effectively improved.

The invention discloses a flexible light heat-insulation streamline oxide nanofiber aerogel and a preparation method and application thereof.The fiber aerogel is prepared through preparation of a spinning precursor solution, an air flow spinning technology and a heat treatment process, the spinning solution is stretched into fibers through the air flow spinning technology, and under the influence of a flow field, the flexible light heat-insulation streamline oxide nanofiber aerogel is obtained. The fibers present streamlines with different curvatures, high-quality dry fibers are obtained through a heating field, and the high-quality dry fibers are stacked in a receiver to form a three-dimensional structure; and finally, the three-dimensional streamline oxide nanofiber aerogel with ultralow thermal conductivity and low density is obtained by combining thermal treatment with a folding process, has excellent thermal protection performance and can be widely applied as a light high-temperature-resistant thermal insulation material.

The invention discloses a lightweight alumina foamed ceramic refractory material and a preparation method thereof, and relates to the technical field of ceramic materials. When the light aluminum oxide foamed ceramic refractory material is prepared, zirconium acetylacetonate, yttrium nitrate hexahydrate and aluminum nitrate nonahydrate are mixed to prepare a spinning solution for electrostatic spinning, nano aluminum titanate is loaded by using a nano spraying technology during spinning, and doped modified zirconium oxide fibers are prepared after high-temperature heat treatment and defibering and dispersing; mixing aluminum oxide micro powder, hollow aluminum oxide, a high-temperature foaming agent, doped modified zirconium oxide fibers and a sintering aid, and then performing ball milling and sieving to prepare aluminum oxide-based mixed powder; and carrying out mold pressing on the alumina-based mixed powder to prepare a green body, sintering, and cooling to prepare the lightweight alumina foamed ceramic refractory material. The light aluminum oxide foamed ceramic refractory material prepared by the invention has the advantages of light weight, low thermal conductivity, high compressive strength, high bending strength and good thermal shock resistance.

The present application provides a curable composition, a thermal interface material (TIM), and a use thereof. In the present application, the curable composition or thermal interface material, and the like can exhibit low adhesion force to a given adherend while exhibiting high thermal conductivity. Also, in the present application, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. In the present application, the curable composition can also exhibit a precisely controlled curing rate and simultaneously have excellent curability. The present application can also provide a product comprising the curable composition, or a cured body thereof, or a thermal interface material thereof.

The present disclosure provides a susceptor. The susceptor includes: a base member including a first cooling gas flow path configured to introduce a cooling gas; a thermal insulation member having a thermal conductivity of 20 W / mK or less, the thermal insulation member including a second cooling gas flow path in communication with the first cooling gas flow path and being stacked on the base member; and an insulating plate stacked on the thermal insulation member, the insulating plate including a plurality of gas holes in communication with the second cooling gas flow path and configured to discharge the cooling gas to cool a substrate.

Provided is a battery module comprising: a first cell stack and a second cell stack, each of which has a plurality of battery cells stacked thereon; a housing having an inner space in which the first cell stack and the second cell stack are accommodated; an insulating fluid configured to flow in the inner space of the housing; and a barrier assembly disposed between the first cell stack and the second cell stack, wherein the barrier assembly includes: a heat insulation cover configured to be capable of blocking heat propagation between the first cell stack and the second cell stack; and a heat dissipation member in contact with the insulating fluid and including a material having a higher thermal conductivity than the heat insulation cover.

The invention discloses high-temperature reaction equipment which comprises a reaction cavity; the base is arranged at the bottom of the reaction cavity and used for bearing a substrate, and the base comprises a central area, a base disc area and an edge area which are sequentially arranged close to the side wall of the reaction cavity in the radial direction; the top surface of the reaction cavity is provided with the first heat insulation plate and a baffle, the baffle is opposite to the base, the first heat insulation plate is arranged on the side, away from the base, of the baffle, an airflow gap is formed between the first heat insulation plate and the baffle, and the first heat insulation plate comprises a plurality of sub heat insulation plates; and the comprehensive thermal conductivity of the sub-thermal-insulation plate corresponding to the base plate area is greater than that of the sub-thermal-insulation plate corresponding to the central area and the edge area.

The invention relates to the technical field of heat-conducting materials, in particular to a boron nitride heat-conducting film and a preparation method thereof.The boron nitride heat-conducting film is prepared through a coating technology and a roll forming technology, deionized water is selected as a solvent, and the boron nitride heat-conducting film is green and environmentally friendly and is combined with the coating technology and the roll forming technology; the preparation method is simple, the production speed is high, the efficiency is high, the cost is low, large-scale industrialization can be achieved, the boron nitride nanosheets in the slurry can be directionally arranged under the action of a coating process, so that a heat-conducting network is formed in the boron nitride heat-conducting film, the boron nitride heat-conducting film has excellent heat-conducting performance, and the service life of the boron nitride heat-conducting film is prolonged. And the in-plane thermal conductivity of the finally formed heat conduction film can reach 54.46 W / (m.K), so that the technical problems that in the preparation process of the heat conduction film in the prior art, the preparation method is complex, the environment is not friendly, and the production efficiency is low due to the adoption of sheet flat pressing molding are solved.

The invention provides a mold partition thermal conductivity design method and system based on keyhole regulation and control, relates to the technical field of additive manufacturing, and aims to solve the problem that mold performance is affected due to unreasonable keyhole distribution when a mold component is subjected to melt processing by a laser powder bed at present. The key hole distribution is reduced in the area close to the cooling water channel to improve the heat conductivity, the key hole distribution is increased far away from the cooling water channel to reduce the heat conductivity, and the key hole defect is converted into the functional characteristic of regulating the heat conductivity of the mold component, so that the problem that the heat conductivity partition adjustment cannot be insufficient in the traditional technology is solved, and the partition heat management requirement is met; the mold performance is improved.

This land-based aquaculture tank comprises: an inner side wall that is formed from a material having a high thermal conductivity and stores aquaculture water on the inner side; an outer side wall that is formed from a material having a low thermal conductivity and is provided outside the inner side wall so as to surround the inner side wall at a distance, thereby providing a double structure; a warming space portion that is formed by a gap between the inner side wall and the outer side wall and is filled with air; and a heater disposed in the warming space portion. The present invention is configured such that the inner side wall is heated by heat radiation and heat conduction from the heater, and the aquaculture water stored on the inner side is heated.

The invention provides a power device and a sintering method thereof, and the method comprises the steps: providing a heat dissipation substrate which is provided with a sintering surface; printing a sintering material layer on the sintering surface of the heat dissipation substrate; drying the heat dissipation substrate printed with the sintering material layer; mounting a power module on the heat dissipation substrate with the dried sintering material layer, wherein the power module is in contact with the sintering material; and carrying out pressure sintering on the heat dissipation substrate on which the power module is mounted so as to complete connection between the power module and the heat dissipation substrate. By means of the mode that the sintering material layer is subjected to pressure sintering after being dried, large-area reliable interconnection between the power module and the heat dissipation substrate can be achieved, meanwhile, it is guaranteed that the thickness of a connecting layer is controllable, the defects of layering, overflowing, cracking, air holes, air channels and the like do not exist, and high heat conductivity and high long-term working temperature are achieved.

The invention relates to a sensor arrangement and a measuring method for measuring the respective concentrations of three gas components in a gas sample (Gp). One gas component is a paramagnetic gas. The gas sample (Gp) is passed through a measuring chamber (2). A magnetic field with an oscillating magnetic field strength is applied to the measuring chamber (2). The thermal conductivity of the gas sample (Gp) and the magnetically modulated thermal conductivity of the gas sample in the measuring chamber (2) are measured. The three concentrations of the three gas components are determined using predetermined densities of the three gas components, as well as the measured thermal conductivity, the measured magnetically modulated thermal conductivity, and the measured density.

The invention discloses a device and a method for testing concrete property evolution of an anti-seepage wall, and aims to solve the problems of test result distortion and the like caused by non-uniform heat transfer of concrete in a deep ground environment due to heat conductivity difference of a contact material and large deviation between laboratory maintenance and on-site working conditions in the prior art. A plurality of nested movable frames are arranged in an inner tank from low to high, and the frames are filled with stones, water-containing sponges and gravel media for simulating the deep ground environment; quick splicing and anti-dislocation fixation of the movable frame are realized through a nested structure of the T-shaped blocks and the T-shaped grooves; a stirring mechanism is used for balancing the temperature of a water body between a test tank and an inner tank, a pressure assembly is combined for simulating a high-pressure environment, a multi-dimensional sensor and an intelligent control system are integrated, temperature, pressure and seepage parameters are dynamically regulated and controlled, and the multi-field coupling thermodynamic evolution process of concrete in ultra-deep diaphragm wall construction is accurately reproduced; the test data reliability is remarkably improved, a scientific basis is provided for construction parameter optimization, and the device has the characteristics of convenience in operation, stable structure, high simulation precision and the like.

The invention discloses an aerogel / spacer fabric composite material as well as a preparation method and application thereof, and belongs to the technical field of thermal insulation materials. A three-dimensional spacer fabric with the upper surface layer being a hexagonal mesh structure and the lower surface layer being a chaining and weft insertion structure is selected as a substrate, the lower surface layer of the fabric is firstly filled with an aerogel coating in a coating mode, and then the fabric is completely filled with the coating on the upper surface layer; and drying to obtain the aerogel / three-dimensional spacer fabric composite material with better heat preservation effect and flexibility. The two-phase composite structure thermal insulation material obtained by the method has the characteristics of light weight, high strength and low thermal conductivity. Meanwhile, by adding the three-dimensional spacer fabric, the mechanical property of the material is effectively improved. The thermal insulation material can be used as a thermal insulation material for buildings, engineering, vehicles and the like, and is wide in application range and good in market prospect. The preparation process is simple, short in flow, mild in reaction condition and suitable for industrial production.

In some implementations, a thermal management system includes a heat source and a heat pipe connected to the heat source and configured to transfer thermal energy from the heat source to a plurality of condensers, each of the plurality of condensers branching off from a main pipe of the heat pipe. The heat pipe can be a variable conductance heat pipe containing a working fluid vapor. Each condenser contains a reservoir of non-condensable gas (NCG). At least one of the condensers can be controlled by heating / cooling the respective reservoir of NCG, by reservoir volume changing via bellows, and / or by NCG amount changing via NCG insertion / extraction.

The invention discloses a multi-physical-field intelligent optimization system and method for low-thermal-resistance stacked electrode packaging, and relates to the technical field of packaging thermal management. According to the system, a thermal, mechanical and electric multi-physics field coupling model of the stacked electrode packaging structure is established in a unified computational domain through a modeling module; the measurement module collects thermal resistance, thermal conductivity and interface stress data in real time through an integrated sensor; the self-correction optimization module executes a self-adaptive residual iterative algorithm based on the deviation between the model simulation result and the actually measured data, corrects model parameters and generates process control variables; and the process regulation and control module dynamically adjusts the sintering temperature, the coating thickness and the pressing pressure according to the control variables and feeds back updated data to form closed-loop optimization. According to the method, collaborative operation of modeling, measurement, optimization and process regulation and control is realized, dynamic self-correction of multi-physical field parameters and process adaptive optimization can be realized in the packaging operation process, the interface thermal resistance is remarkably reduced, and the heat-conducting property and the structural stability are improved.

The invention relates to the field of litchi thawing, and particularly provides a modeling method of a temperature prediction model for efficient litchi thawing, and the modeling method specifically comprises the following steps: step 1, selecting frozen litchis as a sample; step 2, placing all litchis in the same unfreezing environment at the same moment, and recording temperature data of each litchis at different moments; 3, constructing a heat conduction equation based on laser heating, optimizing the heat conduction equation to obtain the heat conductivity of the anisotropic litchi, and performing iterative optimization on the heat conduction equation according to the actually measured temperature data and the temperature data predicted by the heat conduction equation to obtain the heat conductivity; 4, obtaining a temperature prediction model according to the thermal conductivity; and 5, optimizing the temperature prediction model. The model constructed by the invention can more accurately predict the temperature of the inside of the litchi in an unfreezing process.

The present invention relates to a Tesla valve-type ultra-thin planar thermal diode based on phase change heat transfer technology. The diode comprises a tube body, within which are disposed an evaporation end, a liquid working fluid cavity, a Tesla valve flow channel, a liquid wick filled with liquid working fluid, and a condensation end. The wick is disposed within the liquid working fluid cavity. The condensation end, the wick, and the evaporation end are sequentially connected to form a liquid working fluid path, while the evaporation end, the Tesla valve flow channel, and the condensation end are sequentially connected to form a gaseous working fluid path. The Tesla valve utilizes the fluid acceleration characteristics and unidirectional conductivity of the fluid to improve the unidirectional thermal conductivity of the ultra-thin planar thermal diode. During forward heating, the gaseous working fluid flows from the evaporation end to the condensation end, flowing downstream within the Tesla valve with low air resistance and high thermal conductivity. During reverse heating, the gaseous working fluid flows from the condensation end to the evaporation end, flowing countercurrently within the Tesla valve with high air resistance and low thermal conductivity, thereby achieving the effect of a thermal diode. The diode can be widely used in the microelectronics industry.

A vacuum insulation layer is wrapped around the length of a warhead to thermally insulate the warhead from fire or aerodynamic heating. The vacuum insulation layer may be integrally formed into the warhead casing or provided as a sleeve that may be permanently or removably positioned about the warhead casing. The vacuum insulation layer is held under vacuum with a pressure of less than 25 Torr and a thermal conductivity Tcond_vac of less than one-third of the thermal conductivity of air Tcond_air.

The internal combustion engine piston comprises a piston body, an inner cooling oil cavity is formed in the piston body, a groove is formed in the top of the inner cooling oil cavity and extends upwards from the top of the inner cooling oil cavity, the groove is filled with a heat conduction block, and the heat conduction block is used for conducting heat of the part, located above the inner cooling oil cavity, of the piston body to the inner cooling oil cavity. The heat conductivity of the heat conduction block is higher than that of the piston body, so that more heat is transferred to the inner cooling oil cavity from the top of the piston in unit time, the heat transfer speed of the heat of the part, located above the inner cooling oil cavity, of the piston body to the inner cooling oil cavity is increased, the heat taking efficiency of engine oil is improved, and the piston cooling capacity of the inner cooling oil cavity is improved. The problems of abnormal temperature of the piston, carbon deposition, clamping stagnation of movement of the ring group and the like are avoided, and heat dissipation of the piston in the movement process is met.

The invention relates to the technical field of radiators, in particular to a 3D VC radiator and a preparation method thereof.The 3D VC radiator comprises a shell composed of a VC upper cover and a VC lower cover; wherein the VC upper cover is provided with a heat dissipation surface, a plurality of hollow columnar bodies which are uniformly distributed are formed on the heat dissipation surface, the columnar bodies increase the heat dissipation area and replace a supporting structure in the shell, the VC upper cover and the VC lower cover are both made of oxygen-free high-thermal-conductivity copper, the columnar bodies are rhombic or in other preset geometrical shapes, and the VC lower cover is made of oxygen-free high-thermal-conductivity copper. The inner surface of the VC upper cover and the inner surface of the VC lower cover are provided with capillary structures, the inner side of the VC upper cover is provided with a plurality of rhombic, hexagonal or concentric circular columnar body arrays which are evenly distributed, the actually available heat dissipation area is increased, the heat dissipation fins serve as heat dissipation fins to increase the surface area, a traditional supporting structure is replaced, and the heat dissipation efficiency is improved. Double optimization of heat dissipation and mechanical strength is achieved, the internal structure is simplified, the columnar body and the upper cover are manufactured into a whole through precision machining, a welding interface is eliminated, and thermal resistance is reduced.

To provide a silicon nitride-based sintered compact and a silicon nitride-based heat dissipation substrate that achieve increased strength while maintaining high thermal conductivity.SOLUTION: A silicon nitride-based sintered compact is mainly composed of silicon nitride-based particles and a grain boundary phase surrounding the silicon nitride-based particles, and contains a compound including silicon (Si), group 4 elements (Ti, Zr, Hf), and iron (Fe), the total content of the compound being 0.20 to 10 vol.%. This constitution can provide a silicon nitride-based sintered compact that achieves increased strength while maintaining high thermal conductivity.SELECTED DRAWING: Figure 1

The utility model relates to an aerosol generating device and a heating assembly, the heating assembly comprises: a tubular ceramic substrate capable of transmitting infrared light, the inner side of which defines an accommodating cavity for accommodating an aerosol generating substrate; the protective layer is coated on the ceramic substrate, the thickness of the protective layer is smaller than that of the pipe wall of the ceramic substrate, and the thermal conductivity of the protective layer is lower than that of the ceramic substrate; the heating layer is arranged on the ceramic substrate and can heat the aerosol generating substrate by radiating infrared light waves, and at least part of the heating layer is located between the protective layer and the ceramic substrate. According to the heating layer of the heating assembly, the protective layer with the thermal conductivity lower than that of the ceramic substrate is arranged on the ceramic substrate, so that the strength of the ceramic substrate can be enhanced, it is guaranteed that the ceramic substrate has enough falling-cracking-preventing strength, the heat capacity of the ceramic substrate is further reduced, the purpose of rapid heating is achieved, energy efficiency is improved, the ceramic substrate is thinned, and the service life of the ceramic substrate is prolonged. The transmission efficiency of infrared light waves can be increased, and the energy efficiency is further improved.