The invention belongs to the technical field of
semiconductor equipment, and particularly relates to a
wafer mapping mechanism for detecting the placement state of wafers in a
wafer cassette, which comprises two groups of correlation sensor assemblies, and each group of correlation sensor
assembly comprises a transmitting end structure and a receiving end structure, the transmitting end structures of the two sets of correlation sensor assemblies are installed on the lifting cavity door, and the receiving end structures of the two sets of correlation sensor assemblies are installed on the inner side face of the side wall, away from the lifting cavity door, of the
lifting equipment cavity. Projections of light rays emitted by the transmitting end structures of the two groups of correlation sensor assemblies on a
vertical plane intersect but are not parallel. Through cooperative arrangement of the two groups of correlation sensor assemblies, two groups of detection data can be adopted for comparison, and comprehensive logic judgment is performed, so that the scanning time can be effectively shortened, the defect that
wafer crossing or lamination is possibly misreported when the wafer box is inclined is effectively avoided, the accuracy and efficiency of an identification result are improved, the mounting structure is relatively simple, and the practicability is high. Adjustment and maintenance are convenient.