Electromagnetic range and temperature determination method

Abstract

The embodiment of the invention discloses an electromagnetic range and a temperature determination method, relates to the technical field of electromagnetic ranges, and is used for improving the accuracy of cookware temperature detection of the electromagnetic range. An electromagnetic disk is arranged in the stove base, and the electromagnetic disk is used for heating cookware; a heating panel is arranged on the electromagnetic disk, and the heating panel is used for isolating the cookware from the electromagnetic disk; the first radiation sensor is used for detecting the cookware and the heating panel to obtain a first radiation quantity; wherein the cookware and the heating panel are both located on a radiation path of the first radiation sensor; the second radiation sensor is used for detecting a second radiation quantity of the heating panel; a controller configured to: acquire a first radiation amount detected by the first radiation sensor and a second radiation amount detected by the second radiation sensor; and determining the pot bottom temperature of the pot according to the first radiation quantity and the second radiation quantity.

Description

Technical Field

[0001] The present application relates to the technical field of electromagnetic cookers, and in particular to an electromagnetic cooker and a temperature determination method. Background Art

[0002] The induction cooker, also known as the electromagnetic cooker, does not require open flame or conductive heating, but generates heat directly at the bottom of the pot, so the thermal efficiency is greatly improved. It is an efficient and energy-saving kitchen appliance.

[0003] An induction cooker is an electrical cooking appliance made using the principle of electromagnetic induction heating. A high-frequency induction heating coil (i.e., excitation coil) generates alternating current through the coil under the stove surface to generate a magnetic field. When the magnetic lines of force in the magnetic field pass through the bottom of the pot, eddy currents are generated, causing the bottom of the pot to heat up rapidly, thereby achieving the purpose of heating food.

[0004] For induction cookers with a stovetop made of glass-ceramic, the industry currently has two solutions for measuring the temperature of pots using infrared sensors: one is to measure the temperature of the glass-ceramic to infer the temperature of the pot, and the other is to drill a small hole in the glass-ceramic to allow infrared rays to project through the hole for measurement. However, the temperature measured by these two solutions has large errors and poor practicality. Summary of the Invention

[0005] The present application provides an electromagnetic cooker and a temperature determination method for improving the accuracy of pot temperature detection of the electromagnetic cooker.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions.

[0007] In a first aspect, an embodiment of the present application provides an induction cooker, comprising: a cooker; a cooktop, wherein an electromagnetic disk is provided inside the cooktop, the electromagnetic disk being used to heat the cooker; a heating panel is provided on the electromagnetic disk, the heating panel being used to isolate the cooker and the electromagnetic disk; a first radiation sensor, for detecting the cooker and the heating panel to obtain a first radiation amount; wherein the cooker and the heating panel are both in the radiation path of the first radiation sensor; a second radiation sensor, for detecting a second radiation amount of the heating panel; a controller, configured to: obtain a first radiation amount detected by the first radiation sensor and a second radiation amount detected by the second radiation sensor; and determine a bottom temperature of the cooker based on the first radiation amount and the second radiation amount.

[0008] The technical solution provided by the embodiments of the present application brings at least the following beneficial effects: This technical solution sets two radiation sensors to detect the first radiation amount of the cookware and the heating panel and the second radiation amount of the heating panel respectively, without changing the structure of the induction cooker itself, and without the need to drill holes in the induction cooker for measurement, which makes it more practical. At the same time, the bottom temperature of the cookware is determined based on the first radiation amount and the second radiation amount, so that the obtained temperature data is more accurate, which enables users to better grasp the bottom temperature of the cookware to take different cooking operations, thereby improving the intelligence and reliability of the induction cooker.

[0009] In some embodiments, the controller is configured to determine the bottom temperature of the cookware based on the first radiation amount and the second radiation amount, and is specifically configured to: obtain the material type of the cookware and the material type of the heating panel; determine the first emissivity of the heating panel based on the first preset emissivity corresponding to the material type of the cookware and at least one discrete temperature value point of the bottom of the pot; determine the second emissivity of the cookware based on the second preset emissivity corresponding to the material type of the heating panel and at least one discrete temperature value point of the heating panel; determine the bottom temperature of the cookware based on the first radiation amount, the second radiation amount, the first emissivity and the second emissivity.

[0010] In some embodiments, the controller is configured to determine the bottom temperature of the cookware based on the first radiation amount, the second radiation amount, the first emissivity and the second emissivity, and is specifically configured to: determine the position correction coefficient of the second radiation sensor based on the distance between the first radiation sensor and the heating panel and the distance between the second radiation sensor and the heating panel; determine the bottom temperature of the cookware based on the first radiation amount, the second radiation amount, the first emissivity, the second emissivity and the position correction coefficient.

[0011] In some embodiments, the distance between the first radiation sensor and the heating panel, the distance between the second radiation sensor and the heating panel, and the position correction coefficient of the second radiation sensor satisfy the following relationship:

[0012] k=k2 / k1

[0013] Wherein, k is the position correction coefficient of the second radiation sensor, k2 is the distance between the second radiation sensor and the heating panel, and k1 is the distance between the first radiation sensor and the heating panel.

[0014] In some embodiments, the emissivity, the position correction coefficient, and the bottom temperature of the cookware satisfy the following relationship:

[0015]

[0016] Wherein, T is the bottom temperature of the cookware, m is the first emissivity, m1 is the second emissivity, T1 is the temperature value of the cookware under the first radiation amount, T2 is the temperature value of the heating panel under the second radiation amount, k is the position correction coefficient, and a and b are constants.

[0017] In a second aspect, an embodiment of the present application provides a temperature determination method, including: obtaining a first radiation amount of the cookware and the heating panel and a second radiation amount of the heating panel; and determining the bottom temperature of the cookware based on the first radiation amount and the second radiation amount.

[0018] In a third aspect, an embodiment of the present application provides a controller comprising: one or more processors; one or more memories; wherein the one or more memories are used to store computer program codes, the computer program codes comprising computer instructions, and when the one or more processors execute the computer instructions, the controller executes any one of the temperature determination methods provided in the second aspect.

[0019] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, which includes computer instructions. When the computer instructions are executed on a computer, the computer executes the method provided in the second aspect and possible implementation methods.

[0020] In the fifth aspect, an embodiment of the present invention provides a computer program product, which can be directly loaded into a memory and contains software code. After being loaded and executed by a computer, the computer program product can implement the method provided in the second aspect and possible implementation methods.

[0021] It should be noted that the above-mentioned computer instructions may be stored in whole or in part on a computer-readable storage medium. The computer-readable storage medium may be packaged together with the processor of the controller or separately from the processor of the controller, and this application does not limit this.

[0022] The beneficial effects described in the second to fifth aspects of this application can be analyzed by referring to the beneficial effects of the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.

[0024] Figure 1 A hardware structure block diagram of an electromagnetic cooker provided in an embodiment of the present application;

[0025] Figure 2 A hardware structure block diagram of another electromagnetic cooker provided in an embodiment of the present application;

[0026] Figure 3 A schematic diagram of the installation position of a radiation sensor provided in an embodiment of the present application;

[0027] Figure 4 A hardware structure block diagram of another electromagnetic cooker provided in an embodiment of the present application;

[0028] Figure 5 A schematic flow chart of a temperature determination method provided in an embodiment of the present application;

[0029] Figure 6 A flow chart of another temperature determination method provided in an embodiment of the present application;

[0030] Figure 7 A schematic diagram of the distribution of discrete points of temperature values provided in an embodiment of the present application;

[0031] Figure 8 A fitted straight line graph of emissivity provided in an embodiment of the present application;

[0032] Figure 9 A schematic diagram of the distribution of another discrete point of temperature values provided in an embodiment of the present application;

[0033] Figure 10 Another fitted straight line graph of emissivity provided in an embodiment of the present application;

[0034] Figure 11 A flow chart of another temperature determination method provided in an embodiment of the present application;

[0035] Figure 12 A schematic diagram of another arrangement position of a radiation sensor provided in an embodiment of the present application;

[0036] Figure 13 A schematic diagram of the structure of a temperature determination device provided in an embodiment of the present application;

[0037] Figure 14 A schematic structural diagram of another temperature determination device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0039] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0040] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout this application, unless otherwise specified, "plurality" means two or more.

[0041] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "connected" and "connect" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances. Furthermore, when describing pipelines, the terms "connected" and "connected" used in this application have the meaning of conducting electricity. The specific meanings need to be understood in the context.

[0042] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0043] As mentioned in the background art, the existing cookware temperature measurement method has a large error in measuring the cookware temperature and is less practical, which reduces the user experience.

[0044] Based on this, an embodiment of the present application provides an induction cooker, comprising: a cooker; a cooker base, wherein an electromagnetic disk is provided inside the cooker base, the electromagnetic disk being used to heat the cooker; a heating panel is provided on the electromagnetic disk, the heating panel being used to isolate the cooker and the electromagnetic disk; a first radiation sensor, used to detect the cooker and the heating panel to obtain a first radiation amount; wherein the cooker and the heating panel are both in the radiation path of the first radiation sensor; a second radiation sensor, used to detect a second radiation amount of the heating panel; a controller, configured to: obtain a first radiation amount detected by the first radiation sensor and a second radiation amount detected by the second radiation sensor; and determine the bottom temperature of the cooker based on the first radiation amount and the second radiation amount.

[0045] In this way, the temperature of the bottom of the cookware is determined by the two radiation quantities detected by the two radiation sensors, thereby improving the intelligence and reliability of temperature determination.

[0046] The embodiments provided in this application are described in detail below with reference to the accompanying drawings.

[0047] Figure 1 This is a hardware structure diagram of an electromagnetic cooker provided in an embodiment of the present application, such as Figure 1 As shown, the induction cooker 1 may include a processor 2 and a memory 3 .

[0048] In some embodiments, the processor 2 and the memory 3 are electrically connected directly or indirectly to achieve data transmission or interaction. For example, these elements can be electrically connected to each other via one or more communication buses or signal lines.

[0049] In some embodiments, the induction cooker 1 includes at least one software module that can be stored in the memory 3 in the form of software or firmware or fixed in the operating system (OS) of the cooking device 1 .

[0050] In some embodiments, the processor 2 is used to execute executable modules stored in the memory 3, for example, software function modules and computer programs included in the induction cooker 1, so as to implement the food cooking method.

[0051] In some embodiments, the processor 2 may execute a computer program after receiving an execution instruction. The processor 2 may be an integrated circuit chip having signal processing capabilities.

[0052] In some embodiments, the processor 2 may also be a general-purpose processor, for example, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a discrete gate or transistor logic device, or a discrete hardware component, which may implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of the present application. In addition, the general-purpose processor may be a microprocessor or any conventional processor, etc.

[0053] In some embodiments, the memory 3 may be, but is not limited to, a random access memory (RAM), a read only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), and an electrically erasable programmable read-only memory (EEPROM).

[0054] In some embodiments, the memory 3 is used to store a program, and the processor 2 executes the program after receiving an execution instruction.

[0055] Figure 2 This is a hardware structure diagram of another electromagnetic cooker provided in an embodiment of the present application, such as Figure 2 As shown, the electromagnetic cooker 1 may further include a pot 4, a cooktop 5, a first radiation sensor 6, a second radiation sensor 7 and a controller 1000 ( Figure 2 not shown).

[0056] In some embodiments, the pot 4 is used to hold cooking ingredients for cooking.

[0057] In some embodiments, the cooktop 5 is used to place the pot 4 , and an electromagnetic disk 51 is provided inside the cooktop 5 , and the electromagnetic disk 51 is used to heat the pot 4 .

[0058] In some embodiments, a heating panel 52 is disposed on the electromagnetic disk 51 .

[0059] In some embodiments, the heating panel 52 is used to heat the pot 4 .

[0060] It should be noted that the material type of the heating panel 52 can be microcrystalline glass, and this application does not limit the material type of the heating panel 52.

[0061] In some embodiments, the first radiation sensor 6 is used to detect the cookware 4 and the heating panel 52 to obtain a first radiation amount.

[0062] The pot 4 and the heating panel 52 are both located on the radiation path of the first radiation sensor.

[0063] In some embodiments, the second radiation sensor 7 is used to detect a second radiation amount of the heating panel 52 .

[0064] The pot 4 is not on the radiation path of the second radiation sensor 7 .

[0065] It should be noted that the first radiation sensor 6 and the second radiation sensor 7 may be infrared sensors, and the present application does not limit the types of the first radiation sensor 6 and the second radiation sensor 7 .

[0066] Figure 3 A schematic diagram of the arrangement position of a radiation sensor is provided for an embodiment of the present application, such as Figure 3 As shown, the detection angle of the first radiation sensor 6 needs to be aimed at the heating panel 52 and the pot 4 at the same time to detect the combined radiation amount of the heating panel 52 and the pot 4 (that is, the first radiation amount). The detection angle of the second radiation sensor 7 needs to be aimed at the heating panel 52 and not at the pot 4 to detect the second radiation amount of the heating panel 52.

[0067] In the embodiment shown in this application, the controller 1000 refers to a device that can generate an operation control signal based on an instruction operation code and a timing signal, thereby instructing the induction cooktop 1 to execute the control instruction. For example, the controller 1000 can be a central processing unit (CPU), a general-purpose processor, a network processor (NP), a digital signal processor (DSP), a microprocessor, a microcontroller, a programmable logic device (PLD), or any combination thereof. The controller 1000 can also be other devices with processing functions, such as circuits, devices, or software modules, and the embodiments of this application do not impose any restrictions on this.

[0068] In addition, the controller 1000 can be used to control various components inside the induction cooker 1 so that each component operates to achieve various predetermined functions of the induction cooker 1 .

[0069] In some embodiments, the controller 1000 is configured to obtain a first radiation amount detected by the first radiation sensor and a second radiation amount detected by the second radiation sensor.

[0070] In some embodiments, the controller 1000 is further configured to determine the bottom temperature of the cookware according to the first radiation amount and the second radiation amount.

[0071] In some embodiments, the controller 1000 is further configured to obtain the material type of the cookware and the material type of the heating panel.

[0072] In some embodiments, the controller 1000 is further configured to determine a first emissivity of the heating panel according to a first preset emissivity corresponding to the material type of the cookware and at least one discrete temperature value point of the bottom of the pot.

[0073] In some embodiments, the controller 1000 is further configured to determine a second emissivity of the cookware according to a second preset emissivity corresponding to the material type of the heating panel and at least one discrete temperature value point of the heating panel.

[0074] In some embodiments, the controller 1000 is further configured to determine the bottom temperature of the cookware according to the first radiation amount, the second radiation amount, the first emissivity, and the second emissivity.

[0075] In some embodiments, the controller 1000 is further configured to determine a position correction coefficient of the second radiation sensor according to the distance between the first radiation sensor and the heating panel and the distance between the second radiation sensor and the heating panel.

[0076] In some embodiments, the controller 1000 is further configured to determine the bottom temperature of the cookware according to the first radiation amount, the second radiation amount, the first emissivity, the second emissivity, and the position correction coefficient.

[0077] In some embodiments, memory 3 can be used to store software programs and data. The controller 1000 executes the various functions and data processing of the induction cooker 1 by running the software programs or data stored in memory 3. Memory 3 may include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state memory device. Memory 3 stores the operating system that enables the induction cooker 1 to operate. In this application, memory 3 can store the operating system and various application programs, and may also store code for executing the control method for the induction cooker 1 provided in the embodiments of this application.

[0078] Figure 4 This is a hardware structure block diagram of another electromagnetic cooker provided by this application according to an exemplary embodiment. Figure 4 As shown, the induction cooker 1 may further include a communication interface 8 .

[0079] In some embodiments, the communication interface 8 is used to establish a communication connection with other network entities, such as establishing a communication connection with a terminal device. The communication interface 8 may include a radio frequency (RF) module, a cellular module, a wireless fidelity (WIFI) module, and a GPS module. Taking the RF module as an example, the RF module can be used to receive and send signals, in particular, to send the received information to the controller 1000 for processing; in addition, to send the signal generated by the controller 1000. Typically, the RF circuit may include but is not limited to an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc.

[0080] Those skilled in the art will understand that Figure 4 The hardware structure shown in the figure does not constitute a limitation on the induction cooker. The induction cooker may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0081] Figure 5 A flow chart of a temperature determination method provided in an embodiment of the present application is applied to the above-mentioned electromagnetic cooker to determine the bottom temperature of the pot, such as Figure 5 As shown, the method includes the following steps:

[0082] S101: A controller obtains a first radiation amount and a second radiation amount.

[0083] Optionally, the controller may detect a first radiation amount of the cookware and the heating panel through a first radiation sensor and detect a second radiation amount of the heating panel through a second radiation sensor.

[0084] The cookware and the heating panel are both located on the radiation path of the first radiation sensor, and the cookware is not located on the radiation path of the second radiation sensor.

[0085] It should be noted that the first radiation amount is the radiation amount of the first radiation sensor reflected by the heating panel and the bottom of the pot, and the second radiation amount is the radiation amount of the second radiation sensor reflected by the heating panel.

[0086] In some embodiments, according to Boltzmann's law, there is a correlation between the radiation amount and temperature of an object, so the temperature of the object can be calculated by obtaining the radiation amount of the object. The calculated temperature value is more accurate and can avoid the influence of external factors (such as ambient temperature and uneven heating of the object) on the actual temperature of the object.

[0087] Furthermore, since a heating panel is provided in the pot and the electromagnetic disk, there may be errors in calculating the bottom temperature of the pot only by detecting the radiation amount of the pot. Therefore, two radiation sensors can be used, one radiation sensor detects the overall radiation amount of the pot and the heating panel (that is, the first radiation amount), and the other radiation sensor detects the second radiation amount of the heating panel, so that the bottom temperature of the pot can be calculated based on the first radiation amount and the second radiation amount.

[0088] S102: The controller determines the bottom temperature of the cookware according to the first radiation amount and the second radiation amount.

[0089] In some embodiments, the controller may determine the bottom temperature of the cookware according to the first radiation amount, the second radiation amount, the first emissivity of the cookware, and the second emissivity of the heating panel.

[0090] In some embodiments, the first emissivity is used to measure the relative strength of the ability of the cookware surface to release energy in the form of radiation, and the second emissivity is used to measure the relative strength of the ability of the heating panel surface to release energy in the form of radiation.

[0091] In some embodiments, according to Boltzmann's law, there is a correlation between the temperature, radiation amount, and emissivity of an object. Therefore, the emissivity of the object can be obtained and the temperature of the object can be calculated based on the radiation amount and emissivity of the object. In this way, the calculated temperature value is more accurate.

[0092] It should be noted that the emissivity of an object is the ratio of the energy radiated by the object at a certain temperature to the energy radiated by a blackbody at the same temperature. The emissivity of a blackbody is equal to 1, and the emissivity of other objects is between 0 and 1. The emissivity is only related to the properties (composition, structure) of the object's surface. Under given temperature conditions, the emissivity of any object is numerically equal to the absorptivity of this object.

[0093] In some embodiments, different object material types have different emissivities at different temperatures. Table 1 shows the emissivities of different object material types at different temperatures, as shown in Table 1:

[0094] Table 1

[0095] Object material type Surface condition of the object temperature emissivity aluminum polishing 100℃ 0.05 iron Cast iron, oxidation 100℃ 0.64 steel polishing 100℃ 0.07 ... ... ... ...

[0096] For example, for an object made of aluminum, when its surface is polished and the temperature is 100°C, the emissivity is 0.05; for an object made of iron, when its surface is cast iron, oxidized, and the temperature is 100°C, the emissivity is 0.64; for an object made of steel, when its surface is polished and the temperature is 100°C, the emissivity is 0.07.

[0097] It should be noted that Table 1 only exemplarily shows the emissivity corresponding to three types of object materials at different temperatures. The emissivity corresponding to other types of object materials at other temperatures are not listed here one by one.

[0098] In some embodiments, the emissivity of the electromagnetic cooker includes a first emissivity of the cookware and a second emissivity of the heating panel. The controller can determine the emissivity of the electromagnetic cooker according to the materials of the cookware and the heating panel. Figure 6 A flow chart of another temperature determination method provided in an embodiment of the present application, which is used to determine the emissivity of an electromagnetic cooker, such as Figure 6 As shown, the method includes the following steps:

[0099] S201. Controller the material type of the cookware and the material type of the heating panel.

[0100] In some embodiments, the controller can obtain the material type of the built-in heating panel and the material type of the cookware from the memory, or determine the material type of the heating panel and the material type of the cookware through material type information input by the user. This application does not limit the method of obtaining the material type.

[0101] S202: The controller determines a first emissivity of the cookware according to a first preset emissivity corresponding to the material type of the cookware and at least one discrete temperature point of the bottom of the cookware.

[0102] The at least one discrete temperature point of the cookware is a different moment corresponding to different temperature values during the heating process of the cookware.

[0103] For example, when the electromagnetic disk of the induction cooker starts to heat, taking the material type of the pot as aluminum, at least one discrete temperature value point of the pot may include the moment corresponding to the bottom temperature of the pot being 10°C, the moment corresponding to the bottom temperature of the pot being 50°C, the moment corresponding to the bottom temperature of the pot being 80°C, and the moment corresponding to the bottom temperature of the pot being 100°C.

[0104] Furthermore, the controller may fit a straight line according to the first preset emissivity corresponding to the material type of the cookware and at least one discrete temperature point, and use the slope of the straight line as the first emissivity of the cookware.

[0105] In some embodiments, since the emissivity corresponding to different material types may be different at different temperatures, after the first preset emissivity of the cookware is determined, the temperature value data of at least one discrete point on the cookware can be collected and tested, and fitted into a straight line using a linear regression method. The slope of the straight line can be calculated, which is the first emissivity of the cookware. Figure 7 A schematic diagram of the distribution of discrete points of temperature values provided in an embodiment of the present application is shown as follows: Figure 7 As shown, the horizontal axis t is the time point and the vertical axis T is the temperature value.

[0106] In some embodiments, as the electromagnetic disk heats the cookware, the temperature sensor on the electromagnetic cooktop can measure at least one discrete temperature value of the cookware over time, that is, Figure 7 The circles in the figure can be expressed in the form of coordinates as (t1, T1), (t2, T2), (t i , T i ) and (t n , T n ), and use the linear regression algorithm to infer a straight line that best fits these discrete points of temperature values.

[0107] Specifically, Figure 8 A fitted straight line graph of the emissivity provided in the embodiment of the present application is shown as follows: Figure 8 As shown, the straight line that best fits these discrete points of temperature values is straight line T Y1 For example, straight line T Y1 The inference method is as follows: if the coordinates of the nth discrete point are (t n , T n ), assuming that the coordinates correspond to T Y1 The point on (t n , T 回归n ), then the discrete point and its line T Y1 The calculation method of the distance variance e between the corresponding points is shown in formula (1):

[0108] e=(t n -T 回归n ) 2 Formula (1)

[0109] Furthermore, T 回归n The calculation method is shown in formula (2):

[0110] T 回归n =pt n +r Formula (2)

[0111] Among them, p and r are constants.

[0112] Furthermore, all discrete points of the pot are related to T Y1 The calculation method of the sum of the distance variances is shown in formula (3):

[0113]

[0114] In some embodiments, (p，r) is the minimum value, that is, e (p，r) = 0, the straight line T Y1 The best fit is to at least one discrete point of the temperature value of the cookware.

[0115] Furthermore, in order to make (p，r) =0, the partial derivative can be calculated, and the obtained formulas are shown in formulas (4) and (5):

[0116]

[0117]

[0118] Solve the above formulas (4) and (5) to obtain the values of p and r, and then obtain the solution formulas for p and r as shown in formulas (6) and (7):

[0119]

[0120]

[0121] In some embodiments, after multiple fitting processes, the offset of r is less than 0.001 and can be ignored. Then, the final regression formula corresponding to at least one discrete point of the temperature value of the cookware is T 锅具正面 =p1*t and T 锅具反面 =p2*t.

[0122] Furthermore, the first emissivity of the cookware is m=p1 / p2.

[0123] S203: The controller determines a second emissivity of the heating panel according to a second preset emissivity corresponding to the material type of the heating panel and at least one discrete temperature value point of the heating panel.

[0124] In some embodiments, when the electromagnetic disk of the induction cooker starts to heat, taking the material type of the heating panel as microcrystalline glass as an example, at least one discrete temperature value point of the heating panel may include the moment corresponding to the temperature value of the heating panel being 15°C, the moment corresponding to the temperature value of the heating panel being 45°C, the moment corresponding to the temperature value of the heating panel being 95°C, and the moment corresponding to the temperature value of the heating panel being 100°C.

[0125] Furthermore, the controller may fit a straight line according to the second preset emissivity corresponding to the material type of the heating panel and at least one discrete temperature point, and use the slope of the straight line as the second emissivity of the heating panel.

[0126] In some embodiments, after the material type of the heating panel is determined, the temperature value data of at least one discrete point on the heating panel can be collected and tested, and fitted into a straight line using a linear regression method. The slope of the straight line is calculated, which is the second emissivity of the heating panel. Figure 9 A schematic diagram of another distribution of discrete points of temperature values provided in an embodiment of the present application is shown as follows: Figure 9 As shown, the horizontal axis t is the time point and the vertical axis T is the temperature value.

[0127] Further, Figure 10 Another emissivity fitting straight line graph provided in the embodiment of the present application is as follows: Figure 10 As shown, the straight line that best fits these discrete points of temperature values is straight line T Y2 For example, straight line T Y2 The speculation and fitting method of is detailed in the above-mentioned straight line fitting method of the first emissivity, which will not be repeated here.

[0128] In some embodiments, after multiple fitting processes, the offset of r is less than 0.001 and can be ignored. Then, the final regression formula corresponding to at least one discrete point of the temperature value of the heating panel is T 加热面板正面 =p3*t and T 加热面板反面=p4*t.

[0129] Furthermore, the first emissivity of the cookware is m1=p3 / p4.

[0130] S204: The controller determines the bottom temperature of the cookware according to the first radiation amount, the second radiation amount, the first emissivity, and the second emissivity.

[0131] In some embodiments, the bottom temperature of the cookware can be determined according to the Boltzmann law, which is shown in formula (8):

[0132] M=a*m*T 4 Formula (8)

[0133] Wherein, M is the radiation amount of the cookware, a is the Boltzmann constant, m is the first emissivity, and T is the bottom temperature of the cookware when the radiation amount is M.

[0134] In some embodiments, since the first radiation amount is the radiation amount of the first radiation sensor reflected by the heating panel and the bottom of the pot, and the second radiation amount is the radiation amount of the second radiation sensor reflected by the heating panel, the radiation amount reflected by the bottom of the pot is calculated as shown in formula (9):

[0135] M=M1-M2 Formula (9)

[0136] Among them, M1 is the first radiation amount, and M2 is the second radiation amount.

[0137] Combined with the above formula (8), the calculation method of the first radiation amount is shown in formula (10):

[0138] M1=a*(m+m1)*T1 4 Formula (10)

[0139] Wherein, m is the first emissivity, m1 is the second emissivity, and T1 is the temperature of the pot bottom when the radiation amount of the heating panel and the pot bottom is M1 and the emissivity is m1+m.

[0140] Combined with the above formula (8), the calculation method of the second radiation amount is shown in formula (11):

[0141] M2=a*m1*T2 4 Formula (11)

[0142] Among them, T2 is the temperature of the bottom of the pot when the radiation amount of the heating panel is M2 and the emissivity is m1.

[0143] Furthermore, since M is the radiation amount of the cookware, and the bottom temperature of the cookware is T when the radiation amount is M and the emissivity is b, then combining formula (9), formula (10) and formula (11), the relationship between the first radiation amount, the second radiation amount, the first emissivity, the second emissivity and the bottom temperature of the cookware is as shown in formula (12):

[0144] M=M1-M2=a*(m+m1)*T1 4 -a*m1*T2 4 Formula (12)

[0145] Combining the above formulas (8) and (12), the relationship between the first radiation amount, the second radiation amount, the first emissivity, the second emissivity, and the bottom temperature of the cookware can also be expressed as formula (13):

[0146] a*m*T 4 =a*(m+m1)*T1 4 -a*m1*T2 4 Formula (13)

[0147] In some embodiments, since the first radiation sensor and the second radiation sensor may be set at different angles, the distances between the first radiation sensor and the second radiation sensor and the heating panel are also different, which affects the correspondence between the radiation amount and the pot bottom temperature.

[0148] Furthermore, the corresponding relationship between the radiation amount and the bottom temperature of the pot can be corrected by setting the position correction coefficient. Figure 11 A flow chart of another temperature determination method provided in an embodiment of the present application, which is used to determine the position correction coefficient, such as Figure 11 As shown, the method includes the following steps:

[0149] S301: The controller determines a position correction coefficient of the second radiation sensor according to the distance between the first radiation sensor and the heating panel and the distance between the second radiation sensor and the heating panel.

[0150] Optionally, the position correction coefficient may be a ratio of the distance between the first radiation sensor and the heating panel to the distance between the second radiation sensor and the heating panel.

[0151] For example, Figure 12 A schematic diagram of another arrangement position of a radiation sensor provided in an embodiment of the present application is shown in FIG. Figure 12 As shown, if the distance between the first radiation sensor and the heating panel is k1, and the distance between the second radiation sensor and the heating panel is k2, the position correction coefficient is calculated as shown in formula (14):

[0152] k=k2 / k1 Formula (14)

[0153] Where k is the position correction coefficient.

[0154] S302: The controller determines the bottom temperature of the cookware according to the first radiation amount, the second radiation amount, the first emissivity, the second emissivity, and the position correction coefficient.

[0155] In some embodiments, after the position correction coefficient is determined, the bottom temperature of the cookware can be determined based on the emissivity of the induction cooker and the position correction coefficient.

[0156] In some embodiments, in combination with the above formula (13) and formula (14), the relationship between the first radiation amount, the second radiation amount, the first emissivity, the second emissivity and the bottom temperature of the cookware can also be expressed as formula (15):

[0157] a*m*T 4 =a*(m+m1)*T1 4 -a*m1*k*T2 4 Formula (15)

[0158] Furthermore, the calculation method of the pot bottom temperature T is shown in formula (16):

[0159]

[0160] The technical solution provided by the embodiments of the present application brings at least the following beneficial effects: This technical solution sets two radiation sensors to detect the first radiation amount of the cookware and the heating panel and the second radiation amount of the heating panel respectively, without changing the structure of the induction cooker itself, and without the need to drill holes in the induction cooker for measurement, which makes it more practical. At the same time, the bottom temperature of the cookware is determined based on the first radiation amount and the second radiation amount, so that the obtained temperature data is more accurate, which enables users to better grasp the bottom temperature of the cookware to take different cooking operations, thereby improving the intelligence and reliability of the induction cooker.

[0161] In the embodiments of the present invention, electronic products, etc., can be divided into functional modules according to the above-mentioned method examples. For example, each functional module can be divided according to each function, or two or more functions can be integrated into a processing module. The above-mentioned integrated modules can be implemented in the form of hardware or software functional modules. It should be noted that the division of modules in the embodiments of the present invention is schematic and is only a logical functional division. In actual implementation, other division methods may be used.

[0162] In the case of dividing each functional module into corresponding functional modules, Figure 13 A schematic diagram of a temperature determination device provided in an embodiment of the present application is shown in FIG. Figure 13As shown, the temperature determination device 200 may include: an acquisition module 201 and a processing module 202 .

[0163] In some embodiments, the acquisition module 201 is configured to acquire a first radiation amount detected by a first radiation sensor and a second radiation amount detected by a second radiation sensor.

[0164] In some embodiments, the processing module 202 is configured to determine the bottom temperature of the cookware according to the first radiation amount and the second radiation amount.

[0165] In some embodiments, the acquisition module 201 is further configured to acquire the material type of the cookware and the material type of the heating panel.

[0166] In some embodiments, the processing module 202 is further configured to determine a first emissivity of the heating panel according to a first preset emissivity corresponding to the material type of the cookware and at least one discrete temperature value point of the bottom of the pot.

[0167] In some embodiments, the processing module 202 is further configured to determine a second emissivity of the cookware according to a second preset emissivity corresponding to the material type of the heating panel and at least one discrete temperature point of the heating panel.

[0168] In some embodiments, the processing module 202 is further configured to determine the bottom temperature of the cookware according to the first radiation amount, the second radiation amount, the first emissivity, and the second emissivity.

[0169] In some embodiments, the processing module 202 is further configured to determine a position correction coefficient of the second radiation sensor according to the distance between the first radiation sensor and the heating panel and the distance between the second radiation sensor and the heating panel.

[0170] In some embodiments, the processing module 202 is further configured to determine the bottom temperature of the cookware according to the first radiation amount, the second radiation amount, the first emissivity, the second emissivity, and the position correction coefficient.

[0171] In the case of an integrated unit, Figure 14 FIG. 1 shows a possible structural diagram of the temperature determination device involved in the above embodiment. Figure 14 As shown, the temperature determination device 200 may further include: a storage module 203 and a communication module 204. The communication module 204 may be used to support communication between the temperature determination device and other entities. The storage module 203 is used to store program codes and data of the temperature determination device.

[0172] In some embodiments, the processing module 202 may be a processor or a controller, the storage module 203 may be a memory, and the communication module 204 may be a transceiver, a transceiver circuit, or a communication interface.

[0173] When the processing module 202 is a processor, the storage module 203 is a memory, and the communication module 204 is a transceiver, the processor, the transceiver, and the memory can be connected via a bus. The bus can be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus. The bus can be divided into an address bus, a data bus, a control bus, etc.

[0174] An embodiment of the present invention further provides a computer-readable storage medium, which includes computer-executable instructions. When the computer-executable instructions are executed on a computer, the computer executes the method provided in the above embodiment.

[0175] An embodiment of the present invention further provides a computer program product, which can be directly loaded into a memory and contains software code. After being loaded and executed by a computer, the computer program product can implement the method provided in the above embodiment.

[0176] Those skilled in the art will appreciate that in one or more of the above examples, the functions described herein can be implemented using hardware, software, firmware, or any combination thereof. When implemented using software, these functions can be stored in a computer-readable medium or transmitted as one or more instructions or codes on a computer-readable medium. Computer-readable media include computer storage media and communication media, wherein communication media include any medium that facilitates the transmission of computer programs from one place to another. The storage medium can be any available medium that can be accessed by a general-purpose or special-purpose computer.

[0177] Through the description of the above implementation methods, technical personnel in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0178] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely exemplary. For example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components shown as units may be one physical unit or multiple physical units, that is, they may be located in one place, or they may be distributed in multiple different places. Some or all of the units can be selected according to actual needs to achieve the purpose of the scheme of this embodiment.

[0179] In addition, each functional unit in each embodiment of the present invention can be integrated into a processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit. If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application is essentially or in other words, the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for enabling a device (which can be a single-chip microcomputer, chip, etc.) or a processor to perform all or part of the steps of the method of each embodiment of the present invention. The aforementioned storage medium includes various media that can store program code, such as a USB flash drive, a mobile hard disk, a ROM, a RAM, a magnetic disk or an optical disk.

[0180] The above are only specific embodiments of the present application, but the scope of protection of the present application is not limited thereto. Any changes or replacements within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. An electromagnetic cooker, characterized in that: include: Cookware; A cooktop, wherein an electromagnetic disk is provided in the cooktop, and the electromagnetic disk is used to heat the pot; A heating panel is provided on the electromagnetic disk, and the heating panel is used to isolate the pot and the electromagnetic disk; a first radiation sensor, configured to detect the cookware and the heating panel to obtain a first radiation amount; wherein the cookware and the heating panel are both located in a radiation path of the first radiation sensor; a second radiation sensor, configured to detect a second radiation amount of the heating panel; The controller is configured as: acquiring a first radiation amount detected by the first radiation sensor and a second radiation amount detected by the second radiation sensor; The bottom temperature of the cookware is determined according to the first radiation amount and the second radiation amount.

2. The electromagnetic cooker according to claim 1, characterized in that The controller is configured to determine the bottom temperature of the cookware according to the first radiation amount and the second radiation amount, and is specifically configured to: Obtaining the material type of the cookware and the material type of the heating panel; determining a first emissivity of the cookware according to a first preset emissivity corresponding to the material type of the cookware and at least one discrete temperature value point of the bottom of the cookware; determining a second emissivity of the heating panel according to a second preset emissivity corresponding to the material type of the heating panel and at least one discrete temperature value point of the heating panel; The bottom temperature of the cookware is determined according to the first radiation amount, the second radiation amount, the first emissivity, and the second emissivity.

3. The electromagnetic cooker according to claim 2, characterized in that The controller is configured to determine the bottom temperature of the cookware according to the first radiation amount, the second radiation amount, the first emissivity, and the second emissivity, and is specifically configured to: determining a position correction coefficient of the second radiation sensor according to a distance between the first radiation sensor and the heating panel and a distance between the second radiation sensor and the heating panel; The bottom temperature of the cookware is determined according to the first radiation amount, the second radiation amount, the first emissivity, the second emissivity, and the position correction coefficient.

4. The electromagnetic cooker according to claim 3, characterized in that The distance between the first radiation sensor and the heating panel, the distance between the second radiation sensor and the heating panel, and the position correction coefficient of the second radiation sensor satisfy the following relationship: k=k2 / k1 Wherein, k is the position correction coefficient of the second radiation sensor, k2 is the distance between the second radiation sensor and the heating panel, and k1 is the distance between the first radiation sensor and the heating panel.

5. The electromagnetic cooker according to claim 4, characterized in that The emissivity, the position correction coefficient, and the bottom temperature of the cookware satisfy the following relationship: Among them, T is the bottom temperature of the cookware, m is the first emissivity, m1 is the second emissivity, T1 is the temperature value of the cookware corresponding to the first radiation amount, T2 is the temperature value of the heating panel corresponding to the second radiation amount, k is the position correction coefficient, and a and b are constants.

6. A temperature determination method, characterized in that: The method comprises: Acquire a first radiation amount of the cookware and the heating panel and a second radiation amount of the heating panel; The bottom temperature of the cookware is determined according to the first radiation amount and the second radiation amount.

7. The method according to claim 6, characterized in that The determining the bottom temperature of the cookware according to the first radiation amount and the second radiation amount includes: Obtaining the material type of the cookware and the material type of the heating panel; determining a first emissivity of the cookware according to a first preset emissivity corresponding to the material type of the cookware and at least one discrete temperature value point of the bottom of the cookware; Determine the second emissivity of the heating panel based on the second preset emissivity corresponding to the material type of the heating panel and at least one discrete temperature value point of the heating panel. The bottom temperature of the cookware is determined according to the first radiation amount, the second radiation amount, the first emissivity, and the second emissivity.

8. The method according to claim 7, characterized in that The determining the bottom temperature of the cookware according to the first radiation amount, the second radiation amount, the first emissivity, and the second emissivity includes: determining a position correction coefficient of the second radiation sensor according to a distance between the first radiation sensor and the heating panel and a distance between the second radiation sensor and the heating panel; The bottom temperature of the cookware is determined according to the first radiation amount, the second radiation amount, the first emissivity, the second emissivity, and the position correction coefficient.

9. The method according to claim 8, characterized in that The distance between the first radiation sensor and the heating panel, the distance between the second radiation sensor and the heating panel, and the position correction coefficient of the second radiation sensor satisfy the following relationship: k=k2 / k1 Wherein, k is the position correction coefficient of the second radiation sensor, k2 is the distance between the second radiation sensor and the heating panel, and k1 is the distance between the first radiation sensor and the heating panel.

10. The method according to claim 9, characterized in that The emissivity, the position correction coefficient, and the bottom temperature of the cookware satisfy the following relationship: Among them, T is the bottom temperature of the cookware, m is the first emissivity, m2 is the second emissivity, T1 is the temperature value of the cookware corresponding to the first radiation amount, T2 is the temperature value of the heating panel corresponding to the second radiation amount, k is the position correction coefficient, and a and b are constants.

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