212results about "Insulating layers/substrates working" patented technology

The invention discloses a three-bin type vacuum plug hole resin printing control system and method, and belongs to the technical field of printed circuits, and the three-bin type vacuum plug hole resin printing control system comprises the following modules: a feeding control module, an alignment control module, a feeding control module, a plug hole printing control module and a discharging control module. The three cabins which can be separated independently and communicated with one another are controlled, the telescopic feeding and discharging mechanism is matched, the vacuum state of the hole plugging cabin is guaranteed, meanwhile, one-way flow type product circulation can be completed, and the device is suitable for a PCB hole plugging printing production line with the high-beat and high-consistency requirements.

A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.

The present invention provides a "circuit board manufacturing method" that allows for the formation of multiple pixel circuits using a film with a thickness of a certain value or greater, while also enabling the appropriate connection of the wiring patterns of each pixel circuit with an appropriate amount of liquid metal. [Solution] In the first step, multiple pixel circuits 2 are formed on the PI film 1 with the pixels connected by the wiring pattern 3. In the second to second-fourth steps, the PI film 1 is processed to reduce the thickness at the positions between pixels, and the PI film 1 is divided into individual pixel pieces so that the PI film 1 is cut together with the wiring pattern 3 at the positions between pixels. This makes it possible to properly connect the wiring patterns 3 of each pixel circuit 2 with an appropriate amount of liquid metal 6 in the region where the liquid metal 6 is attached between pixels, by making the step difference between the wiring pattern 3 formed on the pixel circuit 2 and the flexible substrate 5 to which the individual pieces 4 are transferred less than a certain value, thereby enabling the wiring patterns 3 of each pixel circuit 2 to be properly connected with an appropriate amount of liquid metal 6.

There is provided a carrier-attached metal foil that enables accurate positional alignment of a laminate after mold forming and therefore allows appropriate downsizing of the laminate. The carrier-attached metal foil includes a carrier having a first surface and a second surface, a release layer provided on the first surface, and a metal layer provided on the release layer, and has at least one alignment mark on or in the vicinity of the second surface of the carrier.

A method of manufacturing a circuit board is disclosed. The method includes: a first step of forming a plurality of pixel circuits on a film with the pixels connected to each other by a wiring pattern; a second step of processing the film to thin the film at least at a position between pixels, and singulating the film into individual pixel units such that the film is cut together with the wiring pattern at the position between the pixels; a third step of transferring a plurality of singulated pieces, each having a pixel circuit formed thereon, onto a flexible substrate; and a fourth step of forming a stretchable interconnect by depositing liquid metal between wiring patterns cut in the second step.

The embodiment of the invention relates to the technical field of PCB manufacturing, in particular to a device-embedded circuit board bonding pad manufacturing method and device.The device-embedded circuit board bonding pad manufacturing method comprises the steps that a multi-layer PCB is obtained, and a device-embedded area of the multi-layer PCB is uncovered to manufacture an embedded groove; performing solder mask pretreatment on the PCB multilayer board, performing low solder mask ink spraying treatment on the embedding groove of the PCB multilayer board, and forming ink layers on the surface of the PCB board and the surface of the embedding groove; and performing DI exposure processing, developing processing and curing processing on the PCB multilayer board in sequence to form a target bonding pad at the bottom of the embedded groove. According to the method, the target bonding pad is formed by forming the ink layer on the surface of the embedding groove of the PCB multilayer board and performing exposure, development and curing treatment, so that the stability of a protective layer of the inner bonding pad in the multilayer pressing process is improved, and the welding reliability and the product quality are ensured.

The application discloses a guide rail protective cover cleaning device for AI server circuit board production, and relates to the technical field of PCB production equipment matching device, which comprises a driving unit, a distance adapting unit, a top pressing cover and a side pressing unit. The driving unit is arranged on the cover plate of the workpiece inlet and outlet end of a drilling machine during work, and the output end of the second linear mechanism is provided with a push plate. The distance adapting unit is in pairs and is arranged on the two sides of the driving unit, and comprises a scissors assembly and a plurality of third linear mechanisms with adjustable distances. The top pressing cover is in multiple and is arranged at the lower end of the distance adapting unit, and the upper end of the top pressing cover is provided with a plurality of vertical pipes penetrating through the top pressing cover. The side pressing unit is in pairs and is arranged at the two ends of each top pressing cover during work, and comprises a fourth linear mechanism, the output direction of which is parallel to the length direction of the top pressing cover, and the output end of the fourth linear mechanism is provided with a side plate. The application can improve the cleaning efficiency of the guide rail protective cover and quickly adjust the cleaning position.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.

A glass wafer includes a glass substrate having at least one opening having a surface having two mutually opposite lateral faces and one circumferential edge face, the glass substrate including a glass including a network former and at least one metal oxide. The at least one opening has a maximum lateral dimension of not more than 400 μm. The glass wafer has a thickness of at least 10 μm. A leaching depth of alkali metal ions in the surface of the at least one opening is greater at least by a factor of 1.1 than a leaching depth on the two lateral faces.

The application belongs to the technical field of circuit board processing machines, and relates to an electroplating device for integrated circuit board processing, which comprises a groove body, a protective cover horizontally and slidingly installed in the groove body, a drilling assembly rotatably installed on the protective cover, and a first driving assembly installed between the protective cover and the drilling assembly; the groove body has a vertical second partition plate inside, the groove body between the second partition plate and the protective cover has a vertical first partition plate, the first partition plate is provided with a clearance hole matched with the drilling, the first partition plate and the second partition plate have a polishing assembly; the protective cover and the first partition plate are provided with a collecting hopper below; the sidewall of the groove body between the first partition plate and the protective cover is provided with an air hole; the groove body is provided with a U-shaped frame, the U-shaped frame is provided with a clamping assembly, the lower portion of the U-shaped frame is provided with a drying assembly, and the groove body is provided with an electroplating assembly at the end away from the protective cover; the electroplating device can clean the circuit board in time after polishing and improve the subsequent electroplating quality. The circuit board can be dried in time after electroplating, which facilitates subsequent assembly work.

Provided is a spindle, a router device, and a cutting bit. The spindle may include: a spindle body having an internal space; a rotary shaft in the internal space, and having a receiving space configured to receive one end of a cutting bit, the cutting bit including a plurality of fastening portions spaced apart from each other in a longitudinal direction of the cutting bit and a plurality of cutting portions disposed between the plurality of fastening portions and configured to cut a substrate; and a support head at one end of the spindle body, and including a collet connected to one end of the rotary shaft and configured to selectively fasten at least one fastening portion among the plurality of fastening portions.

A method for fabricating vias in a multilayer dielectric PCB stack (50) comprising alternating plurality of first dielectric layers (52) and second dielectric layers (54), the first dielectric layers (52) comprising a first dielectric material having a first glass transition temperature (Tg), and the second dielectric layers (54) comprising a second dielectric material having a second glass transition temperature (Tg) higher than the first glass transition temperature (Tg), wherein a plurality of vias (64) are formed (202, 204) into the plurality of first dielectric layers (52) and second dielectric layers (54), the method comprising: at least partially dissolving (206) the first dielectric layers (52) between the vias (64); filling (208, 210) the vias (64) and the spaces formed between the second dielectric layers (54) due to the voids left by the at least partial dissolution of the first dielectric layers (52) with metal (68, 70), thereby obtaining a metal network (72) interconnecting the vias (64) with each other.

This application discloses a circuit board cutting device, which includes a drive mechanism with a power output end; a cutting mechanism including a first cutting component and a second cutting component; a feeding mechanism including a feeding component, which moves towards the cutting mechanism and causes the circuit board to move towards the cutting mechanism and separates from the circuit board when moving away from the cutting mechanism; and a transmission mechanism including a transmission rod assembly, which is tractively connected between the power output end, the first cutting component, and the feeding component. When driven by the drive mechanism, the transmission rod assembly reciprocates between a first position and a second position. When the transmission rod assembly moves, it drives the first cutting component to move to cut the circuit board and drives the feeding component to move to transport the circuit board. By simultaneously driving the first cutting component and the feeding component to move, the circuit board cutting device can continuously cut circuit boards, thereby reducing the number of drive devices in the circuit board cutting device.

A package substrate includes: a sheet including glass; build-up layers respectively on a top surface and on a bottom surface of the sheet; structures defining electrically conductive pathways within the sheet and within the build-up layers; and a ribbon-shaped edge structure in recesses defined at lateral edges of the sheet and defined with respect to lateral edges of the build-up layers, the ribbon-shaped edge structure extending in a direction along a thickness of the sheet, having a lateral edge surface facing away from the sheet, and comprising an edge structure material not including glass and not including metal.

The invention belongs to the field of PCB (printed circuit board) processing, and particularly relates to a PCB resin hole plugging and resin board grinding technological process manufacturing method. The method comprises the following steps: S1, drilling: drilling a PCB by using a numerical control drilling machine; s2, copper plating: performing PTH copper deposition treatment on the PCB to form a hole wall initial conductive layer, then performing cleaning and drying, performing copper treatment on the dried PCB, and thickening a copper layer of the hole wall to form a stable conductive layer; s3, negative film drying is conducted, the designed circuit pattern is subjected to the PCB resin hole plugging and resin board grinding process in the production process through the process of film pasting, exposure and development, the production process, production control and quality control of the PCB resin hole plugging and resin board grinding process can have a unified operation mode and control method, the production efficiency is improved, and the production cost is reduced. The process quality of the resin plug hole and the resin grinding plate is improved, and the conditions that the copper thickness is insufficient / too thick, the copper thickness is uneven and the plug holes are uneven in the actual production process of the resin plug hole and the resin grinding plate are avoided.

The application relates to the field of circuit boards, in particular to surface treatment equipment for PCB (Printed Circuit Board) processing, which comprises a bottom plate, a soaking box and a driving assembly; the soaking box is fixedly connected to the bottom plate; the bottom plate is connected with the driving assembly used for driving the movement of a fixing frame and parts thereon; the surface treatment equipment further comprises the fixing frame and the like; the driving assembly is connected with the fixing frame; a plurality of electric push rods I are fixedly connected to the fixing frame; the extension ends of all the electric push rods I are collectively fixedly connected with a connecting plate, and the connecting plate is slidingly connected with the fixing frame. The rectangular plate drives the connecting pipe and the absorption cylinder to move to the side close to the corresponding blind hole by controlling the electric push rod III, the absorption cylinder and the corresponding absorption cotton are separated from each other, until the absorption cylinder enters the blind hole, the sponge on the surface of the absorption cylinder absorbs and cleans the excess soaking liquid in the blind hole, and the problem that the soaking liquid remaining in the blind hole cannot be completely drained in the prior art, the thickness of the protective layer in the blind hole is relatively higher, and the draining efficiency is low is avoided.

The invention discloses an embedded packaging substrate and a processing method thereof, and the processing method comprises the steps: covering a preset position of a first line layer of a working board with a resin protection layer, and enabling the preset position to comprise a bonding pad of the first line layer; arranging an insulating adding layer and a copper foil adding layer on the first circuit layer, and laminating to obtain an intermediate plate A; performing at least two times of circuit manufacturing on the intermediate plate A to obtain an intermediate plate B provided with at least two second circuit layers, and partially projecting a circuit pattern of one second circuit layer adjacent to the first circuit layer on the resin protection layer; processing a caulking groove prototype on the intermediate plate B, wherein an opening of the caulking groove prototype is formed in the outer surface of the intermediate plate B, and a part on the circuit pattern of the second circuit layer and projected to the resin protection layer is taken as a groove bottom; and etching off the bottom of the caulking groove prototype, removing the resin protection layer with a certain thickness through laser ablation, and removing the remaining resin protection layer with liquid medicine to obtain the caulking groove with the exposed bonding pad. By means of the machining method, caulking grooves with different depths can be machined in a high-quality mode, and the deep groove machining requirement is met.

The application discloses an automatic plate folding machine, which comprises a rack, a continuous sheet positioning assembly arranged on one side of the rack, a gap passage provided on the continuous sheet positioning assembly and used for allowing a continuous sheet to pass outwards along an X-axis direction, the continuous sheet positioning assembly comprising a lower supporting plate and an upper stopper arranged above the lower supporting plate, the gap passage being formed between the lower supporting plate and the upper stopper, the height of the gap passage being slightly greater than the thickness of the continuous sheet, a continuous sheet conveying mechanism arranged on one side of the gap passage, a turnover plate folding assembly arranged on the other side of the gap passage, a plate folding driving mechanism arranged on the rack and used for controlling the rotation of the turnover plate folding assembly relative to the continuous sheet positioning assembly, and the turnover plate folding assembly being used for pressing the part of the continuous sheet passing out of the gap passage to make the part broken and separated when the plate is folded. The application can realize the automatic feeding and plate folding of the continuous circuit board, improve the production efficiency, reduce the production cost, and improve the yield rate and the consistency of the product. Meanwhile, the circuit board is subjected to uniform force, and the broken plate is neat and not easy to generate burrs.

Provided is a routing apparatus which cuts a bridge of a board placed on a jig table and separates the board into a unit board. The routing apparatus includes: a base body including a routing bit combined thereto in a downward direction for cutting the bridge on a first space located within the base body and moving in horizontal and vertical directions; a first body including a second space connected to the first space of the base body, combining to the base body to be detachable by surrounding the routing bit so that the routing bit is placed in the second space, and including a first brush at the end part thereof toward the board; and an absorbing unit absorbing the first space of the base body, wherein in a first mode, where the routing bit cuts the bridge, the first body is combined to the base body, the base body moves in a vertical direction, and the absorbing unit absorbs air and dust from the second space of the first body through the first space of the base body while the first brush contacts the board.

A system (10) for separating PCB elements (2') (printed circuit board) from multiple blocks (2) of PCB elements and for feeding them to an operating machine is described. The system (10) comprises: - a first set of separation lines (20) for separating the PCB elements (2') from their respective multiple blocks (2) of PCB elements, each separation line (20) comprising a separation station (24) and a transport system (21 A, 2 IB) for moving a plurality of workpiece-holding units (22), configured to receive, each, a multiple block (2) of PCB elements, at the separation station (24), said separation station being configured to separate the PCB elements (2') from their respective multiple blocks (2) of PCB elements without removing them from the workpiece-holding units (22); and - a second set of feeding lines (40) for feeding the separated PCB elements (2') to the operating machine, each feeding line (40) comprising a conveyor (41) configured for moving a mobile unit (42) configured to receive the separated PCB elements (2') of at least one multiple block (2) of PCB elements.

The application discloses an LED circuit board strip cutting device and a use method thereof, and particularly relates to the technical field of LED lamp production equipment. The LED circuit board strips cut on both sides are positioned by limiting pressing blocks. In the initial state, the upper and lower collecting frames are located below the end of the feeding belt, and the middle LED circuit board strips lack limitation. When the transfer frame reaches the end of the feeding belt and continues to rotate, the LED circuit board strips lacking positioning limitation and having a wide width fall into the upper collecting frame. When the LED circuit board strips having positioning limitation and having a short width reach the position of the lower collecting frame, the two limiting pressing blocks are opened, the LED circuit board strips having a short width are collected by the lower collecting frame, and the collection of LED circuit board strips with two different widths is realized. The upper collecting frame slides out of the material belt I for discharging, and the lower collecting frame slides out of the material belt II for discharging. The corresponding collecting frame is driven to rotate by a rotating motor, so that the LED circuit board strips in the collecting frame can be conveniently poured out.

The application discloses a circuit board film tearing and cutting device, which comprises a circuit board feeding device, a tape sticking module, a film tearing module and a cutting device. The tape sticking module is used for connecting adjacent films on the surface of the circuit board, and comprises a material receiving table and a tape sticking mechanism. The material receiving table is used for bearing the circuit board supplied by the feeding device. The tape sticking mechanism comprises a tape sticking base and a tape feeding assembly, a guide wheel assembly, a pressing wheel assembly and a cutter assembly arranged on the tape sticking base. The tape feeding assembly is used for supplying the guide wheel assembly with the tape. The tape sticking base is movable relative to the material receiving table under the driving of a moving mechanism, so as to drive the guide wheel assembly to stick the tape on the adjacent films on the surface of the circuit board. The pressing wheel assembly is movable to press on the tape on the surface of the circuit board and cooperate with the guide wheel assembly to tension the tape. The cutter assembly is used for cutting the tape between the pressing wheel assembly and the guide wheel assembly. The application has the advantages of high automation degree and high efficiency.

The invention relates to the field of flexible circuit board manufacturing, and provides a preparation method for improving interlayer layering and warping of a bending area of a flexible circuit board. The method comprises the following steps: determining the width of a non-adhesive region of a bending region of the flexible circuit board based on analysis of bending stress distribution; the method comprises the following steps: replacing an adhesive-free electrolytic copper foil used by a base material in a bending area with an adhesive-free rolled copper foil, and utilizing a grain structure which is formed by the rolled copper foil due to a rolling process and is internally compact and axially arranged; manufacturing a flexible circuit board, and manufacturing a non-glue area in a bending area of the flexible circuit board according to the determined width of the non-glue area; carrying out press-fit encapsulation, and carrying out overall press-fit on the flexible circuit board with the manufactured non-glue area; cutting the laminated and encapsulated flexible circuit board into single pieces by adopting high-precision laser cutting equipment; and carrying out a bending test, carrying out bending operation on the flexible circuit board which is cut into the single pieces, and verifying the bending effect and the improvement condition of the warping problem.

Provided is an integrated antenna device, which includes a substrate, at least one antenna, a radio-frequency integrated circuit (RFIC), multiple metal pillars, an encapsulation and a heat conducting structure. The antenna and the RFIC are respectively disposed on a first surface and a second surface of the substrate. A third surface of the RFIC is facing the second surface. Multiple first ends of the metal pillars that surround the RFIC are disposed on the second surface. The encapsulation is disposed on the second surface and encapsulates at least one portion of the RFIC and at least one portion of each of the metal pillars. The heat conducting structure is disposed above a fourth surface of the RFIC.

A method (200, 200a, 300) of manufacturing an integrated antenna device (100, 100a, 100b) includes: a circuit board assembly is provided; the circuit board assembly includes a substrate (110) and at least one antenna (120); an at least one radio-frequency integrated circuit module (189) is positioned to the second surface (114) of the substrate (110), each of the radio-frequency integrated circuit modules (189) includes a radio-frequency integrated circuit (130) and a heat conducting structure (160, 160b); at least one set of metal pillars (140) is positioned to the second surface (114); an encapsulant is disposed on the second surface (114), and solidified into an encapsulation (150, 152) to encapsulate each of the radio-frequency integrated circuit modules (189) and the metal pillars (140); and the encapsulation (150, 152) is polished until each of the heat conducting structures (160, 160b) and the second ends (144) are exposed from the encapsulation (150, 152).

The invention relates to the technical field, and discloses a circuit board processing punching device which comprises a protection box, a support is fixedly connected to the surface of the protection box, a supporting plate is fixedly connected to the surface of the protection box, a clamping and fixing device is arranged in the protection box, and a punching and polishing device is arranged in the protection box. When a motor is started, the output end drives a threaded rod to rotate, the threaded rod rotates to drive a clamping plate to move through a moving plate, the clamping plate moves in a moving groove through a supporting sliding rod, the clamping plate is more stable when moving, and the clamping plate moves so that the machine can conduct clamping work according to circuit boards of different sizes; meanwhile, when a clamping plate clamps the circuit board, an elastic rod is extruded, bending damage caused by excessive extrusion on the circuit board is avoided, when the machine conducts punching work on the circuit board, a pulley is made to extrude a shock pad through extrusion, force unloading is achieved, and the situation that normal use is affected due to bending caused by excessive extrusion in the middle of the circuit board in the punching process is avoided.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

The invention discloses a copper foil pressing process for a rigid-flex board with a gasket, and relates to the technical field of copper foil pressing, and the process comprises the following steps: S1, carrying out windowing processing on PP2 close to one side of a flexible region, and keeping PP1 close to one side of a copper foil in a non-windowing state; s2, a PTFE glue blocking gasket matched with the PP2 windowing area is prepared; s3, carrying out lamination riveting and lamination according to a preset sequence; s4, adopting a double mask protection mode; s5, processing an annular presplitting groove in the position, corresponding to the flexible area cover, of the exposed PP1 surface after etching; s6, monitoring the size of the micro gap in real time through a laser displacement sensor, and feeding back and adjusting temperature control parameters; and S7, the PTFE glue blocking gaskets are guided and collected from the micro gaps through the guide channels. According to the method, the pre-splitting groove is matched with a directional force coupling uncovering mode, and an existing uncovering scheme of blind groove laser milling and manual prying is replaced. And the pre-splitting groove provides an accurate path for fracture, so that the problems of irregular fracture and burr generation of the PP protective layer can be effectively avoided.