365results about "Insulating layers/substrates working" patented technology

The invention discloses a three-bin type vacuum plug hole resin printing control system and method, and belongs to the technical field of printed circuits, and the three-bin type vacuum plug hole resin printing control system comprises the following modules: a feeding control module, an alignment control module, a feeding control module, a plug hole printing control module and a discharging control module. The three cabins which can be separated independently and communicated with one another are controlled, the telescopic feeding and discharging mechanism is matched, the vacuum state of the hole plugging cabin is guaranteed, meanwhile, one-way flow type product circulation can be completed, and the device is suitable for a PCB hole plugging printing production line with the high-beat and high-consistency requirements.

The invention discloses an intelligent dynamic control method and system for a V-CUT machining process, and the method comprises the steps: arranging a multispectral laser displacement sensor array at a V-CUT cutter shaft, arranging a high-frequency piezoelectric micro-touch probe at a residual thickness measurement station, and generating point cloud data in real time based on a preset sampling frequency; synchronously mapping the point cloud data into a digital twin model corresponding to the V-CUT equipment, and updating the V-CUT groove depth, the PCB residual thickness and the V-CUT knife edge wear degree corresponding to the twin model in real time; predicting a cutter shaft machining drifting trend according to the groove depth, the residual thickness and the cutter edge abrasion state; and when the drift trend predicted value exceeds the process threshold value, a feed-forward compensation instruction is issued to a cutter shaft servo system, and closed-loop correction in the V-CUT machining process is achieved. According to the invention, production and detection integration can be realized, individual manual detection by personnel after shutdown is not needed, and quality improvement and production efficiency maximization can be effectively ensured.

The invention discloses a circuit board and a back drilling method thereof, and the method comprises the steps: placing a to-be-drilled circuit board on a drilling machine platform, enabling a back drilling surface to be located at one side, away from the drilling machine platform, of a non-back drilling surface, and placing a conductive plate between a first metal layer and an induction mushroom head; the to-be-drilled circuit board comprises a first via hole, and the first via hole is located between the second metal layer and the non-drillable layer; a drill bit is controlled to move towards the conductive plate, and when it is detected that the drill bit makes contact with the conductive plate, the distance between the Z-axis direction original point of the main shaft of the drilling machine and the first metal layer is obtained as the first height; an insulating layer is placed between the conductive plate and the induction mushroom head, and the induction mushroom head is electrically connected with the second metal layer; the distance between the Z-axis direction original point of the main shaft of the drilling machine and the non-drillable layer is obtained as a second height; and according to the first height and the second height, carrying out drilling, electroplating and back drilling on the to-be-drilled circuit board to form the circuit board. According to the technical scheme, the back drilling precision and the back drilling quality can be improved.

A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.

To produce a multilayer substrate with an integrated conductor structure, a layer 103 of an organic dielectric and a metal layer 104 are applied to one side 101a of a layered substrate 101 made of a dielectric inorganic material. The layered substrate 101 has at least one through-hole 102, which is thereby sealed, with the two layers 103 and 104 forming at least one bottom of the sealed hole and an inner side of the at least one bottom being formed by the layer 103 of the organic dielectric. The latter is removed in a subsequent step, so that the metal layer 104 of the at least one bottom is exposed.This is followed by filling the at least one sealed through-hole 102 with a metal by electrochemical deposition and subsequently structuring the metal layer 104 to form the conductor structure, or alternatively, removing the metal layer 104 and subsequently building the conductor structure on layer 103 from the organic dielectric. In addition to the process, multilayer substrates with the integrated conductor structure produced using this method are also described.

The invention belongs to the technical field of PCB (printed circuit board) processing, particularly relates to a multifunctional PCB labeling device, and provides the following scheme aiming at solving the problems that a PCB is not provided with a mark, so that the PCB may deflect during conveying, the deviation of the PCB during labeling processing is caused, the labeling precision of the PCB is influenced, and the subsequent processing operation is influenced. Comprising two guide rail bases, and a center plate table and a center stand column are arranged between the two guide rail bases; and the two guide rail plate tables are respectively arranged on the two guide rail bases. The multifunctional PCB labeling device disclosed by the invention has the effect of improving the labeling processing precision of the PCB, and during labeling operation, the device can restore the deflection angle of the PCB so as to ensure that the posture of the PCB is parallel to the posture of the device during processing, so that the deviation of the PCB during labeling processing is avoided, and the production efficiency of the PCB is improved. And the use effect of the device is improved.

The present invention provides a "circuit board manufacturing method" that allows for the formation of multiple pixel circuits using a film with a thickness of a certain value or greater, while also enabling the appropriate connection of the wiring patterns of each pixel circuit with an appropriate amount of liquid metal. [Solution] In the first step, multiple pixel circuits 2 are formed on the PI film 1 with the pixels connected by the wiring pattern 3. In the second to second-fourth steps, the PI film 1 is processed to reduce the thickness at the positions between pixels, and the PI film 1 is divided into individual pixel pieces so that the PI film 1 is cut together with the wiring pattern 3 at the positions between pixels. This makes it possible to properly connect the wiring patterns 3 of each pixel circuit 2 with an appropriate amount of liquid metal 6 in the region where the liquid metal 6 is attached between pixels, by making the step difference between the wiring pattern 3 formed on the pixel circuit 2 and the flexible substrate 5 to which the individual pieces 4 are transferred less than a certain value, thereby enabling the wiring patterns 3 of each pixel circuit 2 to be properly connected with an appropriate amount of liquid metal 6.

There is provided a carrier-attached metal foil that enables accurate positional alignment of a laminate after mold forming and therefore allows appropriate downsizing of the laminate. The carrier-attached metal foil includes a carrier having a first surface and a second surface, a release layer provided on the first surface, and a metal layer provided on the release layer, and has at least one alignment mark on or in the vicinity of the second surface of the carrier.

A busbar module (1) comprises: a flexible printed circuit board (3) with a main section (30) having a longitudinal direction (X) and a width direction (Y), and a branch section (31) connected to an edge of the main section in the width direction; a busbar (10) connected to the branch section of the flexible printed circuit board; and a housing (4) that accommodates the flexible printed circuit board and the busbar. The branch section is cut into a shape having: a base end (32) connected to the main section; and a section (33) extending longitudinally from the base end. The branch section is connected to the busbar (10) in a state where the section is deformed so that it extends in the width direction (Y).

A method of manufacturing a circuit board is disclosed. The method includes: a first step of forming a plurality of pixel circuits on a film with the pixels connected to each other by a wiring pattern; a second step of processing the film to thin the film at least at a position between pixels, and singulating the film into individual pixel units such that the film is cut together with the wiring pattern at the position between the pixels; a third step of transferring a plurality of singulated pieces, each having a pixel circuit formed thereon, onto a flexible substrate; and a fourth step of forming a stretchable interconnect by depositing liquid metal between wiring patterns cut in the second step.

The invention relates to the field of circuit boards, in particular to surface treatment equipment for PCB (printed circuit board) processing, which comprises a bottom plate, a soaking box and a driving assembly, the bottom plate is fixedly connected with a soaking box; the bottom plate is connected with a driving assembly used for driving the fixing frame and the parts on the fixing frame to move. The device further comprises a fixing frame and the like. The driving assembly is connected with a fixing frame; the fixed frame is fixedly connected with a plurality of electric push rods I; the telescopic ends of all the electric push rods I are jointly and fixedly connected with a connecting plate, and the connecting plate is slidably connected with the fixing frame. An electric push rod III is controlled to enable a rectangular plate to drive a connecting pipe and an absorption barrel to move towards one side close to a corresponding blind hole, the absorption barrel and corresponding absorption cotton are separated from each other until the absorption barrel enters the blind hole, redundant soaking liquid in the blind hole is absorbed and cleaned through the sponge on the surface of the absorption barrel, and the cleaning efficiency is improved. The problems that the thickness of a protective layer in the blind hole is relatively high and the draining efficiency is low due to the fact that residual soaking liquid in the blind hole cannot be thoroughly drained in the prior art are solved.

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

A wiring board manufacturing method including a step A of forming a laser-modified portion in a glass substrate by applying laser light to the glass substrate from a first surface toward an opposite surface thereof; a step B of forming, on the first surface of the glass substrate, a first surface wiring layer including a hydrofluoric acid resistant metal film and a copper layer; a step C of etching a surface of the glass substrate opposite to the first surface to form a through via in the laser-modified portion and form a second surface of the glass substrate, the second surface being an opposite surface to the first surface; a through via treatment step D of removing an etching residue of glass adhered to the hydrofluoric acid resistant metal film; and a step E of forming a through electrode in the through via.

The embodiment of the invention relates to the technical field of PCB manufacturing, in particular to a device-embedded circuit board bonding pad manufacturing method and device.The device-embedded circuit board bonding pad manufacturing method comprises the steps that a multi-layer PCB is obtained, and a device-embedded area of the multi-layer PCB is uncovered to manufacture an embedded groove; performing solder mask pretreatment on the PCB multilayer board, performing low solder mask ink spraying treatment on the embedding groove of the PCB multilayer board, and forming ink layers on the surface of the PCB board and the surface of the embedding groove; and performing DI exposure processing, developing processing and curing processing on the PCB multilayer board in sequence to form a target bonding pad at the bottom of the embedded groove. According to the method, the target bonding pad is formed by forming the ink layer on the surface of the embedding groove of the PCB multilayer board and performing exposure, development and curing treatment, so that the stability of a protective layer of the inner bonding pad in the multilayer pressing process is improved, and the welding reliability and the product quality are ensured.

The application discloses a guide rail protective cover cleaning device for AI server circuit board production, and relates to the technical field of PCB production equipment matching device, which comprises a driving unit, a distance adapting unit, a top pressing cover and a side pressing unit. The driving unit is arranged on the cover plate of the workpiece inlet and outlet end of a drilling machine during work, and the output end of the second linear mechanism is provided with a push plate. The distance adapting unit is in pairs and is arranged on the two sides of the driving unit, and comprises a scissors assembly and a plurality of third linear mechanisms with adjustable distances. The top pressing cover is in multiple and is arranged at the lower end of the distance adapting unit, and the upper end of the top pressing cover is provided with a plurality of vertical pipes penetrating through the top pressing cover. The side pressing unit is in pairs and is arranged at the two ends of each top pressing cover during work, and comprises a fourth linear mechanism, the output direction of which is parallel to the length direction of the top pressing cover, and the output end of the fourth linear mechanism is provided with a side plate. The application can improve the cleaning efficiency of the guide rail protective cover and quickly adjust the cleaning position.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.

A glass wafer includes a glass substrate having at least one opening having a surface having two mutually opposite lateral faces and one circumferential edge face, the glass substrate including a glass including a network former and at least one metal oxide. The at least one opening has a maximum lateral dimension of not more than 400 μm. The glass wafer has a thickness of at least 10 μm. A leaching depth of alkali metal ions in the surface of the at least one opening is greater at least by a factor of 1.1 than a leaching depth on the two lateral faces.

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming an opening through the film and the resin insulating layer, removing the film, treating the surface of the insulating layer, forming a second conductor layer on the surface of the resin insulating layer, and forming a via conductor connecting the first and second conductor layers. The insulating layer includes resin and inorganic particles including first and second particles. The surface of the insulating layer includes a surface of the resin and substantially flat exposed portions of the first particles, and the forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.

The application belongs to the technical field of circuit board processing machines, and relates to an electroplating device for integrated circuit board processing, which comprises a groove body, a protective cover horizontally and slidingly installed in the groove body, a drilling assembly rotatably installed on the protective cover, and a first driving assembly installed between the protective cover and the drilling assembly; the groove body has a vertical second partition plate inside, the groove body between the second partition plate and the protective cover has a vertical first partition plate, the first partition plate is provided with a clearance hole matched with the drilling, the first partition plate and the second partition plate have a polishing assembly; the protective cover and the first partition plate are provided with a collecting hopper below; the sidewall of the groove body between the first partition plate and the protective cover is provided with an air hole; the groove body is provided with a U-shaped frame, the U-shaped frame is provided with a clamping assembly, the lower portion of the U-shaped frame is provided with a drying assembly, and the groove body is provided with an electroplating assembly at the end away from the protective cover; the electroplating device can clean the circuit board in time after polishing and improve the subsequent electroplating quality. The circuit board can be dried in time after electroplating, which facilitates subsequent assembly work.

Provided is a spindle, a router device, and a cutting bit. The spindle may include: a spindle body having an internal space; a rotary shaft in the internal space, and having a receiving space configured to receive one end of a cutting bit, the cutting bit including a plurality of fastening portions spaced apart from each other in a longitudinal direction of the cutting bit and a plurality of cutting portions disposed between the plurality of fastening portions and configured to cut a substrate; and a support head at one end of the spindle body, and including a collet connected to one end of the rotary shaft and configured to selectively fasten at least one fastening portion among the plurality of fastening portions.

A circuit board (120), a backlight module (220), a display module, and an electronic device are provided. The circuit board (120) includes at least two sub-boards (10) that are spaced apart, the sub-boards (10) extend in a first direction (y) and are arranged in a second direction (x), the sub-board (10) includes a connection part, connection parts in adjacent sub-boards (10) are connected to each other to form a common connection part (20), and the common connection part (20) extends in the second direction (x). A plurality of functional devices (30) and at least one driver chip (40) are fastened on the sub-board (10). The sub-board (10) is divided into a plurality of partitions (Q), and each partition (Q) includes at least one functional device (30). The circuit board (120) includes a plurality of driving groups (Z), the driving group (Z) includes one driver chip (40) and at least two partitions (Q), and the driver chip (40) is configured to independently drive each partition (Q) in the driving group (Z). The driving groups (Z) include a first driving group (IZ), and a driver chip (40) and partitions (Q) in the first driving group (IZ) are located on a same sub-board (10).

A method for fabricating vias in a multilayer dielectric PCB stack (50) comprising alternating plurality of first dielectric layers (52) and second dielectric layers (54), the first dielectric layers (52) comprising a first dielectric material having a first glass transition temperature (Tg), and the second dielectric layers (54) comprising a second dielectric material having a second glass transition temperature (Tg) higher than the first glass transition temperature (Tg), wherein a plurality of vias (64) are formed (202, 204) into the plurality of first dielectric layers (52) and second dielectric layers (54), the method comprising: at least partially dissolving (206) the first dielectric layers (52) between the vias (64); filling (208, 210) the vias (64) and the spaces formed between the second dielectric layers (54) due to the voids left by the at least partial dissolution of the first dielectric layers (52) with metal (68, 70), thereby obtaining a metal network (72) interconnecting the vias (64) with each other.

This application discloses a circuit board cutting device, which includes a drive mechanism with a power output end; a cutting mechanism including a first cutting component and a second cutting component; a feeding mechanism including a feeding component, which moves towards the cutting mechanism and causes the circuit board to move towards the cutting mechanism and separates from the circuit board when moving away from the cutting mechanism; and a transmission mechanism including a transmission rod assembly, which is tractively connected between the power output end, the first cutting component, and the feeding component. When driven by the drive mechanism, the transmission rod assembly reciprocates between a first position and a second position. When the transmission rod assembly moves, it drives the first cutting component to move to cut the circuit board and drives the feeding component to move to transport the circuit board. By simultaneously driving the first cutting component and the feeding component to move, the circuit board cutting device can continuously cut circuit boards, thereby reducing the number of drive devices in the circuit board cutting device.

A package substrate includes: a sheet including glass; build-up layers respectively on a top surface and on a bottom surface of the sheet; structures defining electrically conductive pathways within the sheet and within the build-up layers; and a ribbon-shaped edge structure in recesses defined at lateral edges of the sheet and defined with respect to lateral edges of the build-up layers, the ribbon-shaped edge structure extending in a direction along a thickness of the sheet, having a lateral edge surface facing away from the sheet, and comprising an edge structure material not including glass and not including metal.

The invention discloses integrated circuit board production, processing and cleaning equipment and a use method thereof.The equipment comprises a mounting frame, inner barrels, a cover plate, an outer rotating sleeve, a box and a fan, a placement frame is arranged below the cover, cleaning liquid in the box is pumped into the inner barrel on the left side through a water pump, hot air is conveyed into the inner barrel on the right side through the fan, and the inner barrel is arranged in the placement frame; the method comprises the steps of feeding, cleaning, position changing, continuous cleaning and the like, and has the beneficial effects that a circuit board to be cleaned is placed in an inner barrel on the left side through a placement frame, and the cleaned circuit board is placed in an inner barrel on the right side through the placement frame; cleaning liquid in the box body is pumped into the inner barrel on the left side through the water pump to clean the circuit board, hot air is conveyed into the inner barrel on the right side through the draught fan to dry the circuit board, cleaning and drying operation of the circuit board can be achieved at the same time, and the cleaning effect is improved; and a plurality of circuit boards can be cleaned and dried at the same time, so that the efficiency is improved.

A technique for creating a printed circuit board (PCB) with 3D structure entails Manufacturing a main PCB and a plurality of PCB pieces. The plurality of PCB pieces are then loaded into a tape of a tape and reel assembly, and the main PCB is processed through an assembler, wherein a tape and reel placement machine is loaded with the tape and reel assembly. The assembler processes the main PCB such that one or more of the plurality of PCB pieces is placed on and affixed to the main PCB. The tape and reel placement machine may also contain a tape loaded with other SMTs, which may be affixed to the main PC.

The invention belongs to the field of PCB (printed circuit board) processing, and particularly relates to a PCB resin hole plugging and resin board grinding technological process manufacturing method. The method comprises the following steps: S1, drilling: drilling a PCB by using a numerical control drilling machine; s2, copper plating: performing PTH copper deposition treatment on the PCB to form a hole wall initial conductive layer, then performing cleaning and drying, performing copper treatment on the dried PCB, and thickening a copper layer of the hole wall to form a stable conductive layer; s3, negative film drying is conducted, the designed circuit pattern is subjected to the PCB resin hole plugging and resin board grinding process in the production process through the process of film pasting, exposure and development, the production process, production control and quality control of the PCB resin hole plugging and resin board grinding process can have a unified operation mode and control method, the production efficiency is improved, and the production cost is reduced. The process quality of the resin plug hole and the resin grinding plate is improved, and the conditions that the copper thickness is insufficient / too thick, the copper thickness is uneven and the plug holes are uneven in the actual production process of the resin plug hole and the resin grinding plate are avoided.

The application relates to the field of circuit boards, in particular to surface treatment equipment for PCB (Printed Circuit Board) processing, which comprises a bottom plate, a soaking box and a driving assembly; the soaking box is fixedly connected to the bottom plate; the bottom plate is connected with the driving assembly used for driving the movement of a fixing frame and parts thereon; the surface treatment equipment further comprises the fixing frame and the like; the driving assembly is connected with the fixing frame; a plurality of electric push rods I are fixedly connected to the fixing frame; the extension ends of all the electric push rods I are collectively fixedly connected with a connecting plate, and the connecting plate is slidingly connected with the fixing frame. The rectangular plate drives the connecting pipe and the absorption cylinder to move to the side close to the corresponding blind hole by controlling the electric push rod III, the absorption cylinder and the corresponding absorption cotton are separated from each other, until the absorption cylinder enters the blind hole, the sponge on the surface of the absorption cylinder absorbs and cleans the excess soaking liquid in the blind hole, and the problem that the soaking liquid remaining in the blind hole cannot be completely drained in the prior art, the thickness of the protective layer in the blind hole is relatively higher, and the draining efficiency is low is avoided.

The application discloses an auxiliary packaging device, an auxiliary packaging method and a computer readable storage medium. The auxiliary packaging device comprises a rack, a movement module having a placing part for placing a printed circuit board, and an auxiliary module having a lifting part and a jacking part. The lifting part is movable between a standby position and a lifting position, and the lifting part lifts the printed circuit board away from the placing part during movement from the standby position to the lifting position. The jacking part is movable between an initial position and a jacking position, and the jacking part jacks the printed circuit board away from the lifting part during movement from the initial position to the jacking position. According to the auxiliary packaging device, a worker does not need to hold the printed circuit board with one hand and put a bag with the other hand when packaging the printed circuit board in a bag, thereby reducing the labor intensity and physical burden of the worker, improving the efficiency of bag packaging, and reducing the production cost.