1003results about "Insulating layers/substrates working" patented technology

The invention relates to the field of circuit board processing, and discloses a printed circuit board splitting device, which comprises a workbench, the top end of the workbench is fixedly provided with a protective cover, and the outer wall of the protective cover is connected with an opening and closing door through a hinge; the movable cleaning assembly is arranged on the workbench and used for cleaning dust on the surface of the circuit board while moving the circuit board; the supporting and collecting assembly is arranged on the workbench and used for limiting the circuit board and collecting impurities generated during machining; the processing assembly is arranged on the workbench and used for cutting and splitting the circuit board; the auxiliary assembly is arranged on the workbench and used for assisting the machining assembly; and the placing assembly is arranged on the workbench and is used for placing the unprocessed circuit board and the processed circuit board. And through cooperation of internal structures of the movable cleaning assembly, the effect that residual dust and chippings on the surface of the circuit board are effectively cleaned through the cleaning device while the circuit board is accurately moved is achieved.

The invention relates to a laser drilling method for a thin copper HDI circuit board. The laser drilling method comprises the following steps that a circuit board to be machined is positioned and installed on a machining station of laser machining equipment; a first section of laser drilling is carried out, a first laser parameter is adopted, uncovering drilling is carried out on a preset machining area of the outer copper foil layer, and an initial hole structure is formed; performing second-section laser drilling, namely performing compensation drilling on the dielectric layer exposed at the bottom of the initial hole structure by adopting a second laser parameter of which the energy is lower than that of the first laser parameter to form a transition hole structure; and in the third section of laser drilling, a third laser parameter with energy lower than that of the second laser parameter is adopted, the bottom of the transition hole structure is trimmed, and a final hole channel is formed. According to the method, drilling is conducted in three sections, namely the first section of uncovering drilling, the second section of compensation drilling and the third section of finishing treatment. Therefore, the bottom cushion copper cannot absorb a large amount of heat in a short time, the base material layer below the bottom cushion copper can be protected from being burnt, and the product quality is improved.

The invention provides an automatic degumming device and degumming method for circuit board production, and the device comprises a conveying assembly which comprises a supporting frame, a side plate, a sliding groove, a sliding block, a mounting hole, and a chain. Through the elaborate design of the conveying assembly, the distance between the U-shaped frames is accurately adjusted through the synchronous electric cylinder so as to adapt to circuit boards with different widths, the stable and automatic conveying of the circuit boards among all degumming procedures is achieved in cooperation with the cooperative operation of the conveying motor, the driving wheel, the driven wheel and the chain, the degumming efficiency is greatly improved, the large-scale production requirement is met, and the production cost is reduced. Compared with a traditional manual or simple mechanical glue removing mode, the glue removing time of a single circuit board is greatly shortened, and the overall productivity of a production line is improved; the liquid collecting hopper and the filtering frame are arranged above the sol agent storage tank and the water storage tank, so that a sol agent and cleaning water which are scattered in the glue removing process can be collected and filtered, cyclic utilization of the sol agent and water resources is achieved, consumption of raw materials is reduced, and the production cost is reduced.

The invention discloses a high-precision etching device for manufacturing a copper-clad plate and an etching method, and relates to the technical field of copper-clad plate etching, the high-precision etching device comprises a box body, the outer wall of the top of the box body is fixedly connected with a liquid inlet pipe used for conveying etching liquid, and a spraying assembly used for etching a copper-clad plate body is arranged in the box body; the spraying assembly comprises a corrugated pipe fixedly connected to the end, located in the box body, of the liquid inlet pipe, one end of the corrugated pipe is fixedly connected with a first liquid guide pipe, the two ends of the first liquid guide pipe are fixedly connected with second liquid guide pipes, and the two ends of each second liquid guide pipe are connected with spraying pipes in an inserted mode. In the etching process of the copper-clad plate, the copper-clad plate can be kept stable even if being impacted by etching liquid, the side clamp only acts on the side face of the copper-clad plate body, the front face and the back face of the copper-clad plate body cannot be shielded, etching dead angles are effectively avoided, the etching precision is further improved, and meanwhile the side face clamping can prevent the side etching phenomenon.

A method for producing a core substrate for wiring boards, which includes hot pressing an intermediate base material including a fiber base material and a thermosetting resin composition impregnated into the fiber base material, thereby forming a core substrate having a core portion having a first main surface and a second main surface on the rear side of the first main surface, the core portion including the fiber base material and an insulating resin layer that is the cured or semi-cured thermosetting resin composition; and planarizing at least one surface of the first main surface or the second main surface, thereby forming a flat surface.

The description relates to electronic prototyping platforms. One example can include an electrically insulative substrate having generally opposing first and second major surfaces and that includes an orientation feature that is visible on both of the first and second major surfaces. The example can include a first mounting hole through the substrate that is bordered by a first electrical conductor associated with data transmission. The example can also include a second mounting hole through the substrate that is bordered by a second electrical conductor associated with electrical ground, and a third mounting hole through the substrate that is bordered by a third electrical conductor associated with electrical power. The example can also include an edge connector tab defined by the substrate and having three exposed electrically conductive contacts that are coupled to the data electrical conductor, the ground electrical conductor, and the power electrical conductor and insulated from one another.

An electronic component housing package includes an insulating substrate including a first surface with a mounting region mounting an electronic component, a second surface located opposite to the first surface, a plurality of side surfaces located between the first surface and the second surface, and a corner portion located between two of the side surfaces; an external connection conductor located on the second surface; and a corner conductor connected to the external connection conductor. The corner conductor is located from the external connection conductor toward the corner portion in a manner to increase the distance from the second surface.

An integrated machine for automatic cutting, polishing, stacking, and unloading of substrates, including a laser cutting machine, a mechanical laser arm, a polishing machine, a polishing device, a first finished product placement rack, a second finished product placement rack, and an automatic stacking device. The mechanical laser arm is fixed on the frame of the laser cutting machine, the polishing device is fixed on the polishing machine, and the first finished product placement rack and the second finished product placement rack are arranged on both sides of the automatic stacking device. The present disclosure can achieve cutting the substrates of any size, and can automatically polish the edges of the cut substrates. The present disclosure has the characteristics of automation, integration, and multi-functionality, effectively reducing the number of supporting equipment and occupying space.

The present disclosure provides a wiring harness production method, a nozzle and a wiring harness. The wiring harness production method includes: Step S10: preparing a substrate; Step S20: spraying a conductive material onto the substrate to form a conductive loop; and Step S30: forming an insulating protective layer at the periphery of the conductive loop and on a surface thereof. The present disclosure solves the technical problems of complex production process and high processing cost of a wiring harness for electrically connecting electrical components.

The invention provides a circuit board cleaning device and method, and belongs to the technical field of circuit board cleaning, the cleaning device comprises a box body, a spraying device and a clamping device, the clamping device comprises a bearing frame, a moving assembly and a clamping assembly, and the moving assembly and the clamping assembly are arranged on the bearing frame; the moving assembly comprises a liquid injection cavity, a piston rod and a moving frame. An elastic piece is further connected between the piston rod and the moving frame. The clamping assembly comprises a rotating shaft, a first clamping piece, a second clamping piece and a driving piece, the second clamping piece is rotationally connected with the bearing frame, and the piston rod drives the moving frame to move horizontally, so that the first clamping piece is close to the second clamping piece. The driving piece drives the circuit board to achieve reciprocating deflection within a certain range, the area of the spraying device for washing the circuit board is increased, cleaning dead angles are reduced, the first clamping piece and the second clamping piece clamp the circuit board through movement of the first clamping piece, and therefore the circuit board is fixed, and shaking in the deflection process of the circuit board is reduced.

The invention discloses a printed circuit board splitter, which relates to the technical field of circuit board processing, and comprises a machine base, a slitting mechanism installed inside the machine base, and a conveying mechanism installed on the inner wall of the bottom of the machine base, and also comprises: an operating table; a fixing mechanism, used for fixing the part to be cut off before cutting the substrate; a positioning mechanism, used for adjusting the position of each cut circuit board; a grinding mechanism, used for grinding two cut surfaces of the circuit board respectively; and a side-changing mechanism, used for driving the circuit board to rotate 180 degrees after being grinded once; the printed circuit board splitter, by clamping and fixing a row of circuit boards to be cut off before cutting, ensures that the row of circuit boards is directly positioned after being cut off, avoids the problem in the prior art that each circuit board is directly scattered and needs to be manually sorted after being cut off from the substrate, and solves the problem that the circuit boards need to be manually sorted after being cut off and then sent to the grinding equipment for grinding one by one.

The invention belongs to the technical field of circuit board processing machinery, and relates to an electroplating device for integrated circuit board processing, which comprises a tank body, a protective cover is horizontally and slidably mounted in the tank body, a drilling assembly is rotatably mounted on the protective cover, and a first driving assembly is mounted between the protective cover and the drilling assembly; a vertical second partition plate is arranged in the groove body, a vertical first partition plate is arranged in the groove body between the second partition plate and the protective cover, a receding hole matched with the drill hole is formed in the first partition plate, and a polishing assembly is arranged between the first partition plate and the second partition plate; a collecting hopper is arranged below the protective cover and the first partition plate; air holes are formed in the side wall of the tank body between the first partition plate and the protective cover; the U-shaped frame is arranged on the tank body, the clamping assembly is arranged on the U-shaped frame, the drying assembly is installed below the U-shaped frame, the electroplating assembly is installed at the end, away from the protective cover, in the tank body, abrasive dust of the circuit board is removed in time after polishing is completed, and the follow-up electroplating quality is improved. And after electroplating is completed, the circuit board is dried in time, and follow-up assembling work is facilitated.

The invention relates to the technical field of punching machines, and discloses a CCD automatic pre-alignment inner-layer punching machine for a PCB. The CCD automatic pre-alignment inner-layer punching machine comprises a bottom frame, a bottom plate is fixedly connected to the inner side face of the bottom frame, a top frame is fixedly connected to the upper portion of the bottom frame, a driving mechanism is arranged on the bottom face of the bottom plate, and a punching mechanism is arranged above the bottom plate; a supporting mechanism is arranged below the punching mechanism, and positioning mechanisms are arranged on the left side and the right side of the bottom plate correspondingly. The punching mechanism comprises a moving block, a hydraulic rod is fixedly connected to the bottom face of the moving block, a fixing plate is fixedly connected to the outer wall of the hydraulic rod, four vertical guide rods are fixedly connected to the upper surface of the fixing plate, a sliding plate is slidably connected to the outer surfaces of the vertical guide rods, and an inner cavity pressing rod is fixedly connected to the middle of the sliding plate. According to the automatic tin injection device, the follow-up tin injection step is simplified through automatic tin injection, and the element welding efficiency is improved.

The invention relates to the field of circuit board machining, in particular to an automatic machining tool for electronic components and a using method thereof.The automatic machining tool comprises a moving assembly, a machining platform, a mounting plate, a motor, a drill bit, an electric clamping plate and the like; the machining platform is connected with a moving assembly. The moving assembly is connected with a mounting plate and is used for driving the mounting plate to move; the mounting plate is fixedly connected with a motor; a motor output shaft is fixedly connected with a drill; the machining platform is fixedly connected with two electric clamping plates. Through shielding of the cover shell, the situation that chippings splash all around and are difficult to clean is prevented, fine bristles are arranged in the cover shell, in the shielding process, the chippings are sputtered on the fine bristles, the splashed chippings are intercepted and collected through the fine bristles, the situation that the chippings are secondarily sputtered in the cover shell is prevented, the situation that the chippings are secondarily sputtered on a drill bit, and the drill bit is damaged is avoided, and the service life of the drill bit is prolonged. And the drilling precision is influenced.

The invention relates to the technical field of cutting, and discloses a PCB pressing and cutting combined device which comprises a base, a groove is formed in the base, a vertical groove and two transverse grooves are formed in the bottom of the groove, a supporting table is slidably connected into the vertical groove, clamping plates are slidably connected into the transverse grooves, and first springs are arranged between the clamping plates and the transverse grooves; a cavity is formed in the base, movable mechanisms are symmetrically arranged on the two sides in the cavity, each movable mechanism comprises a wall groove and an inclined groove which are formed in the inner wall of the cavity, a wall block is slidably connected into the wall groove, a sliding groove is vertically formed in the wall block, a sliding block is slidably connected into the sliding groove, and the sliding block is fixedly connected with the supporting table; an auxiliary block is slidably connected into the inclined groove and fixedly connected with the sliding block. The adjusting mechanism is used for adjusting the distance between the two wall blocks, the driving mechanism is used for adjusting the distance between the two clamping plates, and the cutting mechanism is used for cutting the PCB. According to the scheme, the problem that a PCB is inconvenient to take out after being cut by an existing cutting device is solved.

The invention provides a layout system integrating punching, cleaning and drying of a pcb, and relates to a layout system. Comprising a circulating material frame arranged on a table top, a feeding transition line connected to the starting end of the circulating material frame, a laser drilling part, a cleaning part and a first product conveying line, wherein the laser drilling part and the cleaning part are located on the two sides of the feeding transition line, and the first product conveying line is used for achieving pcb conveying and transferring among the laser drilling part, the feeding transition line and the cleaning part. At least one detection line is further arranged on the side, away from the feeding transition line, of the cleaning part, a detection table is installed on each detection line in a linear driving mode, when the detection tables move to one ends of the detection lines, the detection tables are used for driving the cleaned pcb to be photographed and detected by the detection camera, and when the detection tables move to the other ends of the detection lines, the detection tables are used for bearing the terminating end of the circulating material frame. According to the invention, the production operation of a plurality of pcb boards can be synchronously carried out in the production line, and the whole process production line is penetrated by only one group of clips, so that the layout is more reasonable, the uniformity can be ensured, and the production efficiency can be greatly improved.

The invention discloses a three-bin type vacuum plug hole resin printing control system and method, and belongs to the technical field of printed circuits, and the three-bin type vacuum plug hole resin printing control system comprises the following modules: a feeding control module, an alignment control module, a feeding control module, a plug hole printing control module and a discharging control module. The three cabins which can be separated independently and communicated with one another are controlled, the telescopic feeding and discharging mechanism is matched, the vacuum state of the hole plugging cabin is guaranteed, meanwhile, one-way flow type product circulation can be completed, and the device is suitable for a PCB hole plugging printing production line with the high-beat and high-consistency requirements.

According to the printed circuit board and the manufacturing method for the same-layer local multiple-copper-thickness circuit pattern of the printed circuit board, the same-layer high-frequency signal circuit on the printed circuit board is patterned step by step, and the multiple-copper-thickness circuit is accurately constructed in the same circuit layer in combination with the two-time pattern electroplating process and the voltage conversion process. Specifically, a layer of surface copper foil is additionally covered on the surface of the copper foil of the copper-clad substrate to form a voltage-transferring substrate, the surface copper foil is used as a connecting layer between a first circuit layer and a second circuit layer, and two surfaces of the surface copper foil are independently electroplated twice, so that the copper thickness distribution of different circuit areas is accurately controlled, and the voltage-transferring effect is improved. And finally, a plurality of signal circuit patterns with coexisting copper thicknesses are constructed in the surface copper layer on the inner-layer voltage conversion substrate, so that the fineness and reliability of the signal circuit are ensured to meet the high-frequency signal transmission requirement, the layout flexibility of the signal circuit on the printed circuit board is improved, the impedance matching of the signal circuit is ensured, and the signal loss is reduced at the same time.

The invention relates to the technical field of PCB processing, and particularly discloses an anti-offset PCB short slot processing device. Comprising a fixing square plate, an electric push rod is fixedly connected to the bottom of the fixing square plate, a driving shaft of the electric push rod penetrates through the fixing square plate and is fixedly connected with a pressing plate, a square rubber pad is fixedly connected to the bottom of the pressing plate, and a bottom penetrating rod is fixedly connected to the bottom of the pressing plate. The square rubber pad is used for fixing the plate body in an elastic pressing mode, the static friction force of the plate body is increased through the rubber face of the square rubber pad, and the situation that the machining precision of the short groove hole is affected by continuous slight deviation caused by shaking or shaking when the plate body is subjected to drilling machining is prevented. And a hollow area is arranged between the fixed square plate and the pressing plate, so that cleaned scraps can be conveniently discharged to the outer side, and the situation that the cleaned scraps are pushed to the position between the fixed square plate and the pressing plate by the cleaning device to be accumulated to affect subsequent placement of the PCB during drilling of the drill bit is prevented.

Provided is a ceramic scribe substrate from which multiple parts having minimal burrs or chipping at the time of division can be obtained. The ceramic scribe substrate has a side scribe line and a corner scribe line, and an auxiliary scribe line crossing an intersection of the corner scribe line and the side scribe line along the side scribe line is formed in the vicinity of the intersection. The length of the auxiliary scribe line is 0.5 mm or more and 15.0 mm or less, and the side scribe line and the auxiliary scribe line are formed by dots.

A glass substrate includes a through hole that penetrates the glass substrate from a first surface to a second surface. The through hole has a minimum bore diameter in the through hole in a section of 1% to 10% from the first surface in a section from the first surface to the second surface.

A mounting plate, intended for attachment to an enclosure, comprises a component and a mounting section on which the component is mounted in a manner deviating from the designated mounting location of the mounting section. The mounting plate includes at least one fastener connected to the mounting section. This fastener is configured to be attached to the enclosure. The fastener has a configuration defined to correspond to information about the component's deviation from the designated mounting location of the mounting section.

The invention discloses an intelligent dynamic control method and system for a V-CUT machining process, and the method comprises the steps: arranging a multispectral laser displacement sensor array at a V-CUT cutter shaft, arranging a high-frequency piezoelectric micro-touch probe at a residual thickness measurement station, and generating point cloud data in real time based on a preset sampling frequency; synchronously mapping the point cloud data into a digital twin model corresponding to the V-CUT equipment, and updating the V-CUT groove depth, the PCB residual thickness and the V-CUT knife edge wear degree corresponding to the twin model in real time; predicting a cutter shaft machining drifting trend according to the groove depth, the residual thickness and the cutter edge abrasion state; and when the drift trend predicted value exceeds the process threshold value, a feed-forward compensation instruction is issued to a cutter shaft servo system, and closed-loop correction in the V-CUT machining process is achieved. According to the invention, production and detection integration can be realized, individual manual detection by personnel after shutdown is not needed, and quality improvement and production efficiency maximization can be effectively ensured.

The invention discloses a novel ball mounting method without a steel mesh and a substrate structure, and the method employs a pyrolysis film and laser drilling technology to replace a traditional steel mesh. The method comprises the core steps of pasting a pyrolysis film and a PET protective film, drilling a blind hole to a bonding pad through laser, cleaning glue residues through high-pressure water, blade-coating solder paste containing soldering flux, stripping the PET film, forming solder balls through reflow soldering, cleaning the soldering flux and flattening the solder balls. A steel mesh is replaced by the pyrolysis film and laser drilling, use of the steel mesh is eliminated, use of the steel mesh and customization of the steel mesh are not needed, the cost is saved, and the manufacturing period is shortened. The pyrolysis film is pasted on the substrate, the pattern is manufactured in a laser drilling mode, the expansion and contraction are completely consistent with those of the substrate, and the risk of solder ball deviation is reduced; in addition, the method does not need to change the design of the substrate, the ball mounting pattern is directly manufactured according to customer information, drilling is carried out, the process is simple, meanwhile, different types of substrates can be compatible, and compatibility is high.

The invention relates to an automatic board splitting production line applied to PCBs, which comprises a synchronous belt jig line, a jig carrying clamping jaw and a PCB jig positioning table, the PCB jig positioning table is arranged on one side of the synchronous belt jig line, the jig carrying clamping jaw is arranged above the PCB jig positioning table, and the jig carrying clamping jaw is arranged above the PCB jig positioning table. The PCB cap adsorption device is characterized in that a PCB cap adsorption assembly is arranged on the jig carrying clamping jaw, the PCB cap adsorption assembly comprises an adsorption head and an adsorption column, the adsorption head is connected with the adsorption column through a rotating pin, a PCB cap adsorption magnet is arranged in the adsorption head, and an adsorption head self-adaptive lower magnet is arranged above the PCB cap adsorption magnet. The method is simple in scheme, easy to implement, low in cost and convenient to integrate in highly automatic equipment, can be directly assembled after board splitting, reduces manual intervention, saves manpower, and can orderly discharge waste of residual PCBs after board splitting.

A ceramic substrate according to the embodiments is characterized by having two or more peaks in the 98-106 eV range in a spectrum obtained by measuring a laser irradiation region of a laser machining surface via XPS. Also provided are a ceramic circuit substrate and a semiconductor device comprising the ceramic substrate, and manufacturing methods for the ceramic circuit substrate and a ceramic divided substrate.

The invention discloses a manufacturing method of a longitudinal and transverse line large current-carrying thick copper flexible circuit board, which comprises the following steps of: taking a double-sided copper-clad plate with the copper thickness of more than or equal to 50 microns, and then manufacturing a through hole to form a through hole plate; the through holes comprise exhaust holes formed in the plate edge of the jointed plate structure and drainage holes formed between the adjacent unit plates; manufacturing a dry film pattern on the through hole plate, etching a part of copper thickness, turning over and horizontally rotating by 90 degrees, etching the residual copper thickness, stripping the film, and forming an etched plate on the whole plate; taking the covering film, and windowing the covering film corresponding to the through hole to form a windowing covering film; attaching a covering film with at least one windowed surface to the etching plate, filling glue into the exhaust holes, and forming a circuit board through post-process processing; the exhaust holes are formed, so that gas between the covering film and the plate body in the laminating process of the covering film can be effectively exhausted, and the problems of plate explosion and the like caused by infirm laminating are effectively avoided; and the drain holes are formed between the adjacent unit plates, so that a'pool effect 'is effectively avoided, and the etching quality is improved.

The invention relates to the technical field of cleaning equipment, in particular to PCB hole cleaning equipment and a PCB thereof.The PCB hole cleaning equipment comprises a rack, a first cleaning mechanism, a second cleaning mechanism and a third cleaning mechanism, a moving mechanism is arranged on the top face of the rack and arranged along the long edge of the rack, and the first cleaning mechanism comprises a first liquid supply assembly and a spraying assembly; one end of the spraying assembly is connected with the output end of the first liquid supply assembly; the second cleaning mechanism is arranged on one side of the first cleaning mechanism, the second cleaning mechanism comprises a first spraying assembly, the first spraying assembly is arranged at the top of the moving mechanism, and the first spraying assembly can obliquely spray water flow; the fourth cleaning mechanism comprises a first rolling brush set, and the first rolling brush set is rotationally connected to the top of the rack; the ultrasonic cleaning mechanism is arranged on one side of the fourth cleaning mechanism; and the fifth cleaning mechanism is located on one side of the ultrasonic cleaning mechanism, so that the PCB can be cleaned more thoroughly.

The invention discloses a circuit board and a back drilling method thereof, and the method comprises the steps: placing a to-be-drilled circuit board on a drilling machine platform, enabling a back drilling surface to be located at one side, away from the drilling machine platform, of a non-back drilling surface, and placing a conductive plate between a first metal layer and an induction mushroom head; the to-be-drilled circuit board comprises a first via hole, and the first via hole is located between the second metal layer and the non-drillable layer; a drill bit is controlled to move towards the conductive plate, and when it is detected that the drill bit makes contact with the conductive plate, the distance between the Z-axis direction original point of the main shaft of the drilling machine and the first metal layer is obtained as the first height; an insulating layer is placed between the conductive plate and the induction mushroom head, and the induction mushroom head is electrically connected with the second metal layer; the distance between the Z-axis direction original point of the main shaft of the drilling machine and the non-drillable layer is obtained as a second height; and according to the first height and the second height, carrying out drilling, electroplating and back drilling on the to-be-drilled circuit board to form the circuit board. According to the technical scheme, the back drilling precision and the back drilling quality can be improved.