548results about "Insulating layers/substrates working" patented technology

The invention relates to a laser drilling method for a thin copper HDI circuit board. The laser drilling method comprises the following steps that a circuit board to be machined is positioned and installed on a machining station of laser machining equipment; a first section of laser drilling is carried out, a first laser parameter is adopted, uncovering drilling is carried out on a preset machining area of the outer copper foil layer, and an initial hole structure is formed; performing second-section laser drilling, namely performing compensation drilling on the dielectric layer exposed at the bottom of the initial hole structure by adopting a second laser parameter of which the energy is lower than that of the first laser parameter to form a transition hole structure; and in the third section of laser drilling, a third laser parameter with energy lower than that of the second laser parameter is adopted, the bottom of the transition hole structure is trimmed, and a final hole channel is formed. According to the method, drilling is conducted in three sections, namely the first section of uncovering drilling, the second section of compensation drilling and the third section of finishing treatment. Therefore, the bottom cushion copper cannot absorb a large amount of heat in a short time, the base material layer below the bottom cushion copper can be protected from being burnt, and the product quality is improved.

The invention belongs to the technical field of circuit board processing machinery, and relates to an electroplating device for integrated circuit board processing, which comprises a tank body, a protective cover is horizontally and slidably mounted in the tank body, a drilling assembly is rotatably mounted on the protective cover, and a first driving assembly is mounted between the protective cover and the drilling assembly; a vertical second partition plate is arranged in the groove body, a vertical first partition plate is arranged in the groove body between the second partition plate and the protective cover, a receding hole matched with the drill hole is formed in the first partition plate, and a polishing assembly is arranged between the first partition plate and the second partition plate; a collecting hopper is arranged below the protective cover and the first partition plate; air holes are formed in the side wall of the tank body between the first partition plate and the protective cover; the U-shaped frame is arranged on the tank body, the clamping assembly is arranged on the U-shaped frame, the drying assembly is installed below the U-shaped frame, the electroplating assembly is installed at the end, away from the protective cover, in the tank body, abrasive dust of the circuit board is removed in time after polishing is completed, and the follow-up electroplating quality is improved. And after electroplating is completed, the circuit board is dried in time, and follow-up assembling work is facilitated.

The invention relates to the technical field of cutting, and discloses a PCB pressing and cutting combined device which comprises a base, a groove is formed in the base, a vertical groove and two transverse grooves are formed in the bottom of the groove, a supporting table is slidably connected into the vertical groove, clamping plates are slidably connected into the transverse grooves, and first springs are arranged between the clamping plates and the transverse grooves; a cavity is formed in the base, movable mechanisms are symmetrically arranged on the two sides in the cavity, each movable mechanism comprises a wall groove and an inclined groove which are formed in the inner wall of the cavity, a wall block is slidably connected into the wall groove, a sliding groove is vertically formed in the wall block, a sliding block is slidably connected into the sliding groove, and the sliding block is fixedly connected with the supporting table; an auxiliary block is slidably connected into the inclined groove and fixedly connected with the sliding block. The adjusting mechanism is used for adjusting the distance between the two wall blocks, the driving mechanism is used for adjusting the distance between the two clamping plates, and the cutting mechanism is used for cutting the PCB. According to the scheme, the problem that a PCB is inconvenient to take out after being cut by an existing cutting device is solved.

The invention discloses a three-bin type vacuum plug hole resin printing control system and method, and belongs to the technical field of printed circuits, and the three-bin type vacuum plug hole resin printing control system comprises the following modules: a feeding control module, an alignment control module, a feeding control module, a plug hole printing control module and a discharging control module. The three cabins which can be separated independently and communicated with one another are controlled, the telescopic feeding and discharging mechanism is matched, the vacuum state of the hole plugging cabin is guaranteed, meanwhile, one-way flow type product circulation can be completed, and the device is suitable for a PCB hole plugging printing production line with the high-beat and high-consistency requirements.

According to the printed circuit board and the manufacturing method for the same-layer local multiple-copper-thickness circuit pattern of the printed circuit board, the same-layer high-frequency signal circuit on the printed circuit board is patterned step by step, and the multiple-copper-thickness circuit is accurately constructed in the same circuit layer in combination with the two-time pattern electroplating process and the voltage conversion process. Specifically, a layer of surface copper foil is additionally covered on the surface of the copper foil of the copper-clad substrate to form a voltage-transferring substrate, the surface copper foil is used as a connecting layer between a first circuit layer and a second circuit layer, and two surfaces of the surface copper foil are independently electroplated twice, so that the copper thickness distribution of different circuit areas is accurately controlled, and the voltage-transferring effect is improved. And finally, a plurality of signal circuit patterns with coexisting copper thicknesses are constructed in the surface copper layer on the inner-layer voltage conversion substrate, so that the fineness and reliability of the signal circuit are ensured to meet the high-frequency signal transmission requirement, the layout flexibility of the signal circuit on the printed circuit board is improved, the impedance matching of the signal circuit is ensured, and the signal loss is reduced at the same time.

The invention relates to the technical field of PCB processing, and particularly discloses an anti-offset PCB short slot processing device. Comprising a fixing square plate, an electric push rod is fixedly connected to the bottom of the fixing square plate, a driving shaft of the electric push rod penetrates through the fixing square plate and is fixedly connected with a pressing plate, a square rubber pad is fixedly connected to the bottom of the pressing plate, and a bottom penetrating rod is fixedly connected to the bottom of the pressing plate. The square rubber pad is used for fixing the plate body in an elastic pressing mode, the static friction force of the plate body is increased through the rubber face of the square rubber pad, and the situation that the machining precision of the short groove hole is affected by continuous slight deviation caused by shaking or shaking when the plate body is subjected to drilling machining is prevented. And a hollow area is arranged between the fixed square plate and the pressing plate, so that cleaned scraps can be conveniently discharged to the outer side, and the situation that the cleaned scraps are pushed to the position between the fixed square plate and the pressing plate by the cleaning device to be accumulated to affect subsequent placement of the PCB during drilling of the drill bit is prevented.

The invention discloses an intelligent dynamic control method and system for a V-CUT machining process, and the method comprises the steps: arranging a multispectral laser displacement sensor array at a V-CUT cutter shaft, arranging a high-frequency piezoelectric micro-touch probe at a residual thickness measurement station, and generating point cloud data in real time based on a preset sampling frequency; synchronously mapping the point cloud data into a digital twin model corresponding to the V-CUT equipment, and updating the V-CUT groove depth, the PCB residual thickness and the V-CUT knife edge wear degree corresponding to the twin model in real time; predicting a cutter shaft machining drifting trend according to the groove depth, the residual thickness and the cutter edge abrasion state; and when the drift trend predicted value exceeds the process threshold value, a feed-forward compensation instruction is issued to a cutter shaft servo system, and closed-loop correction in the V-CUT machining process is achieved. According to the invention, production and detection integration can be realized, individual manual detection by personnel after shutdown is not needed, and quality improvement and production efficiency maximization can be effectively ensured.

The invention discloses a novel ball mounting method without a steel mesh and a substrate structure, and the method employs a pyrolysis film and laser drilling technology to replace a traditional steel mesh. The method comprises the core steps of pasting a pyrolysis film and a PET protective film, drilling a blind hole to a bonding pad through laser, cleaning glue residues through high-pressure water, blade-coating solder paste containing soldering flux, stripping the PET film, forming solder balls through reflow soldering, cleaning the soldering flux and flattening the solder balls. A steel mesh is replaced by the pyrolysis film and laser drilling, use of the steel mesh is eliminated, use of the steel mesh and customization of the steel mesh are not needed, the cost is saved, and the manufacturing period is shortened. The pyrolysis film is pasted on the substrate, the pattern is manufactured in a laser drilling mode, the expansion and contraction are completely consistent with those of the substrate, and the risk of solder ball deviation is reduced; in addition, the method does not need to change the design of the substrate, the ball mounting pattern is directly manufactured according to customer information, drilling is carried out, the process is simple, meanwhile, different types of substrates can be compatible, and compatibility is high.

The invention relates to an automatic board splitting production line applied to PCBs, which comprises a synchronous belt jig line, a jig carrying clamping jaw and a PCB jig positioning table, the PCB jig positioning table is arranged on one side of the synchronous belt jig line, the jig carrying clamping jaw is arranged above the PCB jig positioning table, and the jig carrying clamping jaw is arranged above the PCB jig positioning table. The PCB cap adsorption device is characterized in that a PCB cap adsorption assembly is arranged on the jig carrying clamping jaw, the PCB cap adsorption assembly comprises an adsorption head and an adsorption column, the adsorption head is connected with the adsorption column through a rotating pin, a PCB cap adsorption magnet is arranged in the adsorption head, and an adsorption head self-adaptive lower magnet is arranged above the PCB cap adsorption magnet. The method is simple in scheme, easy to implement, low in cost and convenient to integrate in highly automatic equipment, can be directly assembled after board splitting, reduces manual intervention, saves manpower, and can orderly discharge waste of residual PCBs after board splitting.

A ceramic substrate according to the embodiments is characterized by having two or more peaks in the 98-106 eV range in a spectrum obtained by measuring a laser irradiation region of a laser machining surface via XPS. Also provided are a ceramic circuit substrate and a semiconductor device comprising the ceramic substrate, and manufacturing methods for the ceramic circuit substrate and a ceramic divided substrate.

The invention discloses a manufacturing method of a longitudinal and transverse line large current-carrying thick copper flexible circuit board, which comprises the following steps of: taking a double-sided copper-clad plate with the copper thickness of more than or equal to 50 microns, and then manufacturing a through hole to form a through hole plate; the through holes comprise exhaust holes formed in the plate edge of the jointed plate structure and drainage holes formed between the adjacent unit plates; manufacturing a dry film pattern on the through hole plate, etching a part of copper thickness, turning over and horizontally rotating by 90 degrees, etching the residual copper thickness, stripping the film, and forming an etched plate on the whole plate; taking the covering film, and windowing the covering film corresponding to the through hole to form a windowing covering film; attaching a covering film with at least one windowed surface to the etching plate, filling glue into the exhaust holes, and forming a circuit board through post-process processing; the exhaust holes are formed, so that gas between the covering film and the plate body in the laminating process of the covering film can be effectively exhausted, and the problems of plate explosion and the like caused by infirm laminating are effectively avoided; and the drain holes are formed between the adjacent unit plates, so that a'pool effect 'is effectively avoided, and the etching quality is improved.

The invention relates to the technical field of cleaning equipment, in particular to PCB hole cleaning equipment and a PCB thereof.The PCB hole cleaning equipment comprises a rack, a first cleaning mechanism, a second cleaning mechanism and a third cleaning mechanism, a moving mechanism is arranged on the top face of the rack and arranged along the long edge of the rack, and the first cleaning mechanism comprises a first liquid supply assembly and a spraying assembly; one end of the spraying assembly is connected with the output end of the first liquid supply assembly; the second cleaning mechanism is arranged on one side of the first cleaning mechanism, the second cleaning mechanism comprises a first spraying assembly, the first spraying assembly is arranged at the top of the moving mechanism, and the first spraying assembly can obliquely spray water flow; the fourth cleaning mechanism comprises a first rolling brush set, and the first rolling brush set is rotationally connected to the top of the rack; the ultrasonic cleaning mechanism is arranged on one side of the fourth cleaning mechanism; and the fifth cleaning mechanism is located on one side of the ultrasonic cleaning mechanism, so that the PCB can be cleaned more thoroughly.

The invention discloses a circuit board and a back drilling method thereof, and the method comprises the steps: placing a to-be-drilled circuit board on a drilling machine platform, enabling a back drilling surface to be located at one side, away from the drilling machine platform, of a non-back drilling surface, and placing a conductive plate between a first metal layer and an induction mushroom head; the to-be-drilled circuit board comprises a first via hole, and the first via hole is located between the second metal layer and the non-drillable layer; a drill bit is controlled to move towards the conductive plate, and when it is detected that the drill bit makes contact with the conductive plate, the distance between the Z-axis direction original point of the main shaft of the drilling machine and the first metal layer is obtained as the first height; an insulating layer is placed between the conductive plate and the induction mushroom head, and the induction mushroom head is electrically connected with the second metal layer; the distance between the Z-axis direction original point of the main shaft of the drilling machine and the non-drillable layer is obtained as a second height; and according to the first height and the second height, carrying out drilling, electroplating and back drilling on the to-be-drilled circuit board to form the circuit board. According to the technical scheme, the back drilling precision and the back drilling quality can be improved.

A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.

The invention discloses a gong machine with a burr removing function for PCB processing and a use method thereof, and belongs to the technical field of PCB processing. Laser emitted by a cutting head is used for pre-ablating a PCB, ablating a PI layer near an appearance line of the PCB, and completely ablating the PI layer on the PCB until a hard board layer material of the PCB is exposed; the method comprises the following steps of: cutting a PCB (printed circuit board) into a whole, then normally carrying out routing appearance production, ablating and removing PI (polyimide) in an area, close to a routing line, of a routing cutter feeding position, so that the problem of burrs on the PI of the soft board during routing can be avoided, carbon powder can be generated at an ablated position, a dust hood can suck the generated carbon powder, and after burning, the routing cutter can synchronously move with a cutting head and carry out routing appearance production on the PCB, so that the production efficiency is improved. The PCB machining efficiency is improved, dust generated by PCB machining through the milling cutter is sucked by the dust suction hood, then the machining environment is optimized, the product quality is guaranteed, and batch production work of PCBs is facilitated.

To produce a multilayer substrate with an integrated conductor structure, a layer 103 of an organic dielectric and a metal layer 104 are applied to one side 101a of a layered substrate 101 made of a dielectric inorganic material. The layered substrate 101 has at least one through-hole 102, which is thereby sealed, with the two layers 103 and 104 forming at least one bottom of the sealed hole and an inner side of the at least one bottom being formed by the layer 103 of the organic dielectric. The latter is removed in a subsequent step, so that the metal layer 104 of the at least one bottom is exposed.This is followed by filling the at least one sealed through-hole 102 with a metal by electrochemical deposition and subsequently structuring the metal layer 104 to form the conductor structure, or alternatively, removing the metal layer 104 and subsequently building the conductor structure on layer 103 from the organic dielectric. In addition to the process, multilayer substrates with the integrated conductor structure produced using this method are also described.

The invention belongs to the technical field of PCB (printed circuit board) processing, particularly relates to a multifunctional PCB labeling device, and provides the following scheme aiming at solving the problems that a PCB is not provided with a mark, so that the PCB may deflect during conveying, the deviation of the PCB during labeling processing is caused, the labeling precision of the PCB is influenced, and the subsequent processing operation is influenced. Comprising two guide rail bases, and a center plate table and a center stand column are arranged between the two guide rail bases; and the two guide rail plate tables are respectively arranged on the two guide rail bases. The multifunctional PCB labeling device disclosed by the invention has the effect of improving the labeling processing precision of the PCB, and during labeling operation, the device can restore the deflection angle of the PCB so as to ensure that the posture of the PCB is parallel to the posture of the device during processing, so that the deviation of the PCB during labeling processing is avoided, and the production efficiency of the PCB is improved. And the use effect of the device is improved.

The invention belongs to the technical field of drilling processes, and particularly relates to a multi-step drilling process for circuit board hole wall ultra-low roughness forming, the drilling process takes drilling equipment as a use basis, and the drilling equipment comprises a drilling machining table, an equipment mounting beam, a mounting plate, a movable drilling plate and a horizontal guide rail; a circumferential sliding groove is formed in the top of the drilling machining table, and at least two guide sliding blocks are embedded in the equipment mounting beam. According to the circuit board drilling device, a drill bit rotates and moves downwards and drills the circuit board drilling position, a plurality of thin drilling openings drill the outline of a hole, in this way, the damage situation of the hole wall is reduced, a motor is driven to work, a second gear ring drives a fourth gear to rotate, namely, a second butt joint shaft drives a first butt joint shaft to rotate, and a third gear drives the second gear to rotate; and the rotating shaft drives the horizontal guide rail to rotate, so that the polishing head does circular motion, the polishing head polishes the hole wall, and the roughness of the hole wall of the circuit board is greatly reduced.

The invention relates to the technical field of PCBs (Printed Circuit Board), and discloses a novel manufacturing method of an embedded copper block, which comprises the following steps: S1, preparing materials; s2, lamination and groove milling treatment; s3, pre-burying a copper block; s4, performing vacuum resin hole plugging for the first time; s5, performing vacuum resin hole plugging for the second time; and S6, plate grinding treatment. The method is not influenced by the stacking structure, and the copper-embedded block can also be manufactured by using the stacking structure laminated by the copper foil; according to the technology for manufacturing the embedded copper block through the vacuum plug hole, only one-time shape milling is needed, the cost of the vacuum plug hole is slightly lower than that of the embedded copper block manufactured through lamination, the price of the embedded copper block manufactured through lamination is related to the number of used core plates and the number of PP, and along with increasing of layers, the price advantage of the embedded copper block manufactured through the vacuum plug hole is larger; the convex groove design is added in the milling groove design, so that the requirement of partial embedded copper blocks on the alignment degree can be met; when the embedded copper block is manufactured through vacuum resin hole plugging, the copper block is fixed through the adhesive tape, the copper block deviation problem is avoided, and the finished product qualification rate can be improved to a certain degree.

A circuit board continuous edge trimming device with a self-positioning function, relating to the technical field of trimming left and right edge materials of circuit boards, and comprising a workbench (1), a positioning mechanism (2) arranged on the workbench and used for positioning a circuit board, a trimming mechanism (3) arranged directly above the positioning mechanism, and a feeding mechanism (4) arranged on the right side of the positioning mechanism. The positioning mechanism comprises a frame (5) fixedly arranged on the workbench, a rotating shaft (6) rotatably installed in the frame, and a driving motor (7) fixedly arranged on the right side wall of the frame; positioning air cylinders (10) are fixedly arranged at the bottoms of two blind recesses; the acting end of a piston rod of each positioning air cylinder is fixedly provided with a positioning column (11) located in the blind recess; the trimming mechanism comprises a support (12) fixedly arranged on the top surface of the workbench and a trimming oil cylinder (13) fixedly arranged at the top of the support; cutters (15) are welded to two ends of the bottom surface of the lifting / lowering block (14); the inner end surfaces of the two cutters are flush with the left end surface and the right end surface of a positioning platform (9). The device shortens the circuit board edge trimming time, and greatly improves the circuit board edge trimming efficiency. Further provided is a circuit board continuous edge trimming method with a self-positioning function.

The present invention provides a "circuit board manufacturing method" that allows for the formation of multiple pixel circuits using a film with a thickness of a certain value or greater, while also enabling the appropriate connection of the wiring patterns of each pixel circuit with an appropriate amount of liquid metal. [Solution] In the first step, multiple pixel circuits 2 are formed on the PI film 1 with the pixels connected by the wiring pattern 3. In the second to second-fourth steps, the PI film 1 is processed to reduce the thickness at the positions between pixels, and the PI film 1 is divided into individual pixel pieces so that the PI film 1 is cut together with the wiring pattern 3 at the positions between pixels. This makes it possible to properly connect the wiring patterns 3 of each pixel circuit 2 with an appropriate amount of liquid metal 6 in the region where the liquid metal 6 is attached between pixels, by making the step difference between the wiring pattern 3 formed on the pixel circuit 2 and the flexible substrate 5 to which the individual pieces 4 are transferred less than a certain value, thereby enabling the wiring patterns 3 of each pixel circuit 2 to be properly connected with an appropriate amount of liquid metal 6.

The invention provides a drilling tool and a processing method of a conductive hole in a circuit board. The machining method comprises the steps that a drilling tool is arranged on one side of the circuit board, an electromagnetic induction control system is arranged on the other side of the circuit board, and the electromagnetic induction control system can generate magnetic force; a conductive material is arranged in the drilling tool, drilling is started, and generated sweeps are discharged out of the hole under the action of magnetic force; the conductive material flows out of the drilling tool, so that the conductive material is attached to the hole wall or the hole is filled with the conductive material; and curing the conductive material in the hole to obtain the conductive hole. On the premise that the conductive hole meeting the electrical requirement is manufactured, the processes of glue removal, black shadow removal and black hole removal are not needed, the processes are simplified, and a large number of chemical agents and water resources are saved.

There is provided a carrier-attached metal foil that enables accurate positional alignment of a laminate after mold forming and therefore allows appropriate downsizing of the laminate. The carrier-attached metal foil includes a carrier having a first surface and a second surface, a release layer provided on the first surface, and a metal layer provided on the release layer, and has at least one alignment mark on or in the vicinity of the second surface of the carrier.

A busbar module (1) comprises: a flexible printed circuit board (3) with a main section (30) having a longitudinal direction (X) and a width direction (Y), and a branch section (31) connected to an edge of the main section in the width direction; a busbar (10) connected to the branch section of the flexible printed circuit board; and a housing (4) that accommodates the flexible printed circuit board and the busbar. The branch section is cut into a shape having: a base end (32) connected to the main section; and a section (33) extending longitudinally from the base end. The branch section is connected to the busbar (10) in a state where the section is deformed so that it extends in the width direction (Y).

A method of manufacturing a circuit board is disclosed. The method includes: a first step of forming a plurality of pixel circuits on a film with the pixels connected to each other by a wiring pattern; a second step of processing the film to thin the film at least at a position between pixels, and singulating the film into individual pixel units such that the film is cut together with the wiring pattern at the position between the pixels; a third step of transferring a plurality of singulated pieces, each having a pixel circuit formed thereon, onto a flexible substrate; and a fourth step of forming a stretchable interconnect by depositing liquid metal between wiring patterns cut in the second step.

The invention relates to the technical field of base material slitting and cutting, and discloses a dust-free slitting and cutting machine used on PCB cutting equipment, the dust-free slitting and cutting machine comprises a mounting plate, the top surface of the mounting plate is fixedly connected with a top plate, the top surface of the top plate is fixedly connected with a hydraulic rod, the bottom end of the hydraulic rod is fixedly connected with a lower pressing plate, and the lower pressing plate is fixedly connected with an upper pressing plate. A cutting mechanism is arranged below the lower pressing plate; the cutting mechanism comprises two connecting rod fixing plates, two vertical sliding rods are fixedly connected to the bottom faces of the connecting rod fixing plates, a lifting frame is slidably connected to the outer surfaces of the vertical sliding rods, sliding groove guide plates are arranged on the front side and the rear side of the lifting frame correspondingly, and a right moving frame and a left moving frame are fixedly connected to the bottom faces of the two sliding groove guide plates correspondingly. The right moving frame and the left moving frame move relatively to drive the chuck end to get close to clamp the splicing chuck on the side face of the cutting disc, so that the splicing chuck is rapidly fixed and installed, and the splicing chuck can be rapidly replaced after being abraded subsequently.

The invention relates to the field of circuit boards, in particular to surface treatment equipment for PCB (printed circuit board) processing, which comprises a bottom plate, a soaking box and a driving assembly, the bottom plate is fixedly connected with a soaking box; the bottom plate is connected with a driving assembly used for driving the fixing frame and the parts on the fixing frame to move. The device further comprises a fixing frame and the like. The driving assembly is connected with a fixing frame; the fixed frame is fixedly connected with a plurality of electric push rods I; the telescopic ends of all the electric push rods I are jointly and fixedly connected with a connecting plate, and the connecting plate is slidably connected with the fixing frame. An electric push rod III is controlled to enable a rectangular plate to drive a connecting pipe and an absorption barrel to move towards one side close to a corresponding blind hole, the absorption barrel and corresponding absorption cotton are separated from each other until the absorption barrel enters the blind hole, redundant soaking liquid in the blind hole is absorbed and cleaned through the sponge on the surface of the absorption barrel, and the cleaning efficiency is improved. The problems that the thickness of a protective layer in the blind hole is relatively high and the draining efficiency is low due to the fact that residual soaking liquid in the blind hole cannot be thoroughly drained in the prior art are solved.

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

A wiring board manufacturing method including a step A of forming a laser-modified portion in a glass substrate by applying laser light to the glass substrate from a first surface toward an opposite surface thereof; a step B of forming, on the first surface of the glass substrate, a first surface wiring layer including a hydrofluoric acid resistant metal film and a copper layer; a step C of etching a surface of the glass substrate opposite to the first surface to form a through via in the laser-modified portion and form a second surface of the glass substrate, the second surface being an opposite surface to the first surface; a through via treatment step D of removing an etching residue of glass adhered to the hydrofluoric acid resistant metal film; and a step E of forming a through electrode in the through via.