452 results about "Thin film encapsulation" patented technology

A display device includes an organic light emitting diode emitting light, an antireflection layer disposed on the organic light emitting diode and preventing reflection of external light incident from an outside, and a thin film encapsulation layer disposed on the antireflection layer.

The invention belongs to the technical field of perovskite solar cells, and particularly relates to a perovskite photovoltaic module and a preparation method thereof. The perovskite solar cell sequentially comprises toughened glass, a planarization layer, a TCO conductive film, a hole transport layer, a perovskite layer, an electron transport layer and an electrode layer from bottom to top. A thin film encapsulation layer is arranged above the electrode layer and coats the hole transport layer, the perovskite layer, the electron transport layer and the electrode layer; and a protective film is arranged on the outer layer of the thin film packaging layer and covers the thin film packaging layer. The thickness of the substrate of the perovskite photovoltaic module can be effectively reduced on the premise of ensuring that the rigid effect of the substrate of the perovskite photovoltaic module is relatively good, so that the overall thickness of the perovskite photovoltaic module is relatively low, and meanwhile, the preparation cost of the perovskite photovoltaic module can be effectively reduced.

A display module includes a display area and a non-display area disposed outside the display area on a plane. The display module includes a base layer, a circuit device layer, a display device layer, a thin film encapsulation layer, and a touch sensing layer. An inorganic layer of the touch sensing layer contacts an inorganic layer of the circuit device layer exposed by an organic layer of the circuit device layer. An inorganic layer of the thin film encapsulation layer is disposed between the inorganic layer of the touch sensing layer and the inorganic layer of the circuit device layer to block a moisture penetration path which causes delamination of the thin film encapsulation layer.

A display device includes an organic light emitting diode emitting light, an antireflection layer disposed on the organic light emitting diode and preventing reflection of external light incident from an outside, and a thin film encapsulation layer disposed on the antireflection layer.

A display device includes: a substrate; a display element on the substrate; a thin-film encapsulation layer on the display element, the thin-film encapsulation layer including at least one inorganic layer and at least one organic layer; and a lower layer below the thin-film encapsulation layer, the lower layer including a first surface parallel to an upper surface of the substrate and a second surface extending in a direction crossing the upper surface of the substrate. The at least one inorganic layer is has a first thickness on the first surface of the lower layer and a second thickness on the second surface of the lower layer, the first thickness is greater than or equal to the second thickness, and a ratio of the second thickness to the first thickness is about 0.51 or more.

A display device includes a display area and a peripheral area. A display layer includes a plurality of display elements arranged thereon. A thin-film encapsulation layer is arranged on the display layer and includes first, second, and third encapsulation layers. The second encapsulation layer is on the first encapsulation layer. The third encapsulation layer is on the second encapsulation layer. A touch sensing layer is arranged on the thin-film encapsulation layer and includes touch electrodes and trace lines. The display area is partially bent about an axis, and the third encapsulation layer is bent along the axis and has a structure in which a first layer and a second layer are alternately stacked. The first layer includes an inorganic insulating material, and the second layer includes a silicon carbon compound material.

The invention relates to the technical field of packaging of organic light-emitting devices, in particular to a photocuring composition for packaging an organic light-emitting device, a packaging structure and a display device. The light-cured composition comprises a light-curable vinyl ether monomer, a light-curable diluting monomer and an initiator; the molecular structure of the photocurable vinyl ether monomer contains C6-C30 substituted or unsubstituted aryl, the aryl at least contains two photocurable cross-linking groups, and the cross-linking groups contain at least one vinyl ether functional group. The photocuring composition has the advantages of high light transmittance, high curing rate, low gas output, high heat resistance, air curing and the like, and can meet the high-performance requirement of thin film packaging.

An electronic device may have a display. The display has pixels configured to display an image. The display is mounted in a housing. The housing may include head-mounted support structures configured to support the display for viewing through lenses. The pixels of the display may be covered by a layer of thin-film encapsulation. The thin-film encapsulation may be covered with a cover layer such as a glass cover layer that is attached to the thin-film encapsulation layer by a layer of adhesive. To suppress internal light reflections, the display may include reflection suppression structures. The reflection suppression structures may include an antireflection layer and / or polarizer and waveplate layers. The reflection suppression structures may be formed on an outwardly facing surface of the cover layer and / or between the thin-film encapsulation layer and the cover layer.

The invention relates to a temperature control type automatic sealing machine and a control method thereof.The temperature control type automatic sealing machine comprises a transferring mechanism, a cleaning mechanism located above the transferring mechanism, a sealing mechanism and a control module electrically connected with the cleaning mechanism, and a film packaging part is provided with a temperature control heating part used for controlling the film temperature. The temperature control heating component is electrically connected with the control module, the cleaning mechanism comprises a cleaning frame arranged above the transferring mechanism in a covering mode and a fan electrically connected with the control module, an air outlet of the fan is aligned with a film packaging opening of the film packaging component, and the control module is used for controlling the fan to blow out dry hot air to books. And / or controlling the temperature control heating part to heat the thin film. The temperature control heating part is used for heating the thin film to ensure that the thin film is kept at a proper temperature when a book is packaged, so that the bonding effect of the hot melt adhesive is improved; and the fan blows dry hot air to the books, so that high-efficiency and high-quality book packaging and sealing can be kept at different environment temperatures.

A display apparatus includes: a substrate including a display area and a peripheral area around the display area, the substrate having a bent portion; a plurality of display elements in the display area; and a thin film encapsulation layer over the plurality of display elements and including a first encapsulation layer, a second encapsulation layer over the first encapsulation layer, and an organic encapsulation layer between the first encapsulation layer and the second encapsulation layer, wherein the second encapsulation layer includes a plurality of inorganic thin layers and a plurality of organic thin layers alternately arranged, and a thickness of the second encapsulation layer is equal to or less than a thickness of the first encapsulation layer.

The invention belongs to the technical field of thin film packaging materials, and particularly discloses acrylate containing a calixarene structure, a synthesis method of the acrylate, low-dielectric thin film packaging ink prepared from the acrylate, a use method of the low-dielectric thin film packaging ink and application of the low-dielectric thin film packaging ink. The thin film packaging ink comprises 10 to 30 parts of acrylate, 30 to 60 parts of a photocurable monomer, 10 to 30 parts of a bridge ring type photocurable monomer and 0.1 to 10 parts of a photoinitiator, wherein the acrylate adopts acrylate containing a calixarene structure; the photocurable monomer is a mixture of bifunctional acrylate and polyfunctional acrylate, and the mass ratio of the bifunctional acrylate to the polyfunctional acrylate is (1-2): (2-4). The film packaging ink has moderate viscosity and surface tension, and the formed organic barrier layer not only has high curing rate, high light transmittance, good heat resistance and low dielectric constant, but also has high Tg temperature, excellent flexibility and good adhesive force, is applied to electronic components, and can effectively block water and oxygen erosion and prolong the service life.

The invention discloses an organic light emitting display device and a method of manufacturing the same. The manufacturing method comprises the steps of forming an auxiliary cathode layer, a first partition layer and a second partition layer on a first insulating layer, forming an organic light-emitting layer, a cathode and a first thin film packaging layer on an upper layer of an anode, and removing the second partition layer and the organic light-emitting layer, the cathode and the first thin film packaging layer above the second partition layer. And forming a second thin film encapsulation layer on the first thin film encapsulation layer. According to the organic light-emitting display device and the manufacturing method thereof provided by the embodiment of the invention, the whole prepared organic light-emitting layer is segmented through the first partition layer and the second partition layer, so that a smaller pixel size and a higher resolution ratio are realized, and the manufacturing cost is lower; furthermore, the second partition layer influencing light emission is removed, so that light is prevented from being reflected on the side wall of the second partition layer, the scattering phenomenon generated on the side wall of the second partition layer is eliminated, and the display effect is improved.

A display device includes: a base layer including a display area (DA) and a non-DA; a circuit element layer on the base layer and including: a power supply electrode (PSE) overlapping the non-DA, circuit elements, and a shielding electrode connected to the PSE and overlapping some of the circuit elements; a display element layer on the circuit element layer and including: a light emitting element including a first electrode, a light emitting unit, and a second electrode, and a connection electrode connecting the second electrode to the PSE and including first through-holes; a thin film encapsulation layer (TFEL) on the display element layer and including an organic layer overlapping the DA; and an input sensing layer on the TFEL and including sensing electrodes and sensing signal lines connected to the sensing electrodes. The sensing signal lines overlap the connection electrode. Some of the first through-holes overlap the shielding electrode.

A display device includes: a base layer including a display area (DA) and a non-DA; a circuit element layer on the base layer and including: a power supply electrode (PSE) overlapping the non-DA, circuit elements, and a shielding electrode connected to the PSE and overlapping some of the circuit elements; a display element layer on the circuit element layer and including: a light emitting element including a first electrode, a light emitting unit, and a second electrode, and a connection electrode connecting the second electrode to the PSE and including first through-holes; a thin film encapsulation layer (TFEL) on the display element layer and including an organic layer overlapping the DA; and an input sensing layer on the TFEL and including sensing electrodes and sensing signal lines connected to the sensing electrodes. The sensing signal lines overlap the connection electrode. Some of the first through-holes overlap the shielding electrode.

The utility model provides a display substrate and a display device.The display substrate comprises a substrate with a via hole, a blocking dam located in the peripheral area of the hole, a plurality of isolation columns located on the side, away from a display area, of the blocking dam, and a blocking structure located on the side, away from the blocking dam, of the isolation columns; the thin film packaging layer is positioned on one side, far away from the substrate, of the blocking dam; wherein the hole peripheral area is arranged around the via hole, and the display area is arranged around the hole peripheral area; wherein the thin film packaging layer covers the display area, and extends to one side, deviating from the substrate, of the barrier structure through the barrier dam and the plurality of isolation columns; at least one inorganic layer is arranged between the plurality of isolation columns and the substrate; the blocking structure is used for blocking propagation of cutting cracks.

A display module includes a display area and a non-display area disposed outside the display area on a plane. The display module includes a base layer, a circuit device layer, a display device layer, a thin film encapsulation layer, and a touch sensing layer. An inorganic layer of the touch sensing layer contacts an inorganic layer of the circuit device layer exposed by an organic layer of the circuit device layer. An inorganic layer of the thin film encapsulation layer is disposed between the inorganic layer of the touch sensing layer and the inorganic layer of the circuit device layer to block a moisture penetration path which causes delamination of the thin film encapsulation layer.

The invention relates to the technical field of perovskite solar cell functional thin film packaging, in particular to a solar cell with a perovskite active layer packaged by a double-sided thin film and a preparation method of the solar cell. Al2O3 is used for depositing a layer of Al2O3 thin film between the perovskite active layer and a P-type carrier transport layer (hole transport layer HTL); a layer of SiO2 thin film is deposited between a perovskite active layer and an N-type carrier transport layer (electron transport layer ETL), and a double-sided thin film wrapping layer is formed by an Al2O3 thin film and the SiO2 thin film; through the design and preparation method of the Al2O3 / SiO2 double-sided thin film packaging perovskite active layer, the core stability problem of the perovskite active layer is effectively solved. The double-sided packaging structure can efficiently block water and oxygen permeation, and the perovskite is prevented from being decomposed due to water and oxygen erosion; meanwhile, diffusion of metal electrode ions to a perovskite layer and migration of halogen ions in perovskite to the electrode can be inhibited, bidirectional damage is reduced, and the sensitivity of perovskite to water and oxygen and performance degradation caused by interface ion migration are relieved fundamentally.

A display apparatus includes a substrate having a display area and a peripheral area surrounding the display area. Display elements are arranged in the display area. A spacer is disposed between the display elements and includes a lateral side having a first slope. A thin film encapsulation layer covers the display area and includes a buffer encapsulation layer, an inorganic, encapsulation layer, an organic encapsulation layer, and a composite encapsulation layer sequentially stacked on one another. The composite encapsulation layer includes a plurality of sub-layers stacked on each other. Each of the sub-layers has a thickness that is less than a thickness of the inorganic encapsulation layer. An upper surface of the buffer encapsulation layer has a second slope that is smaller than the first slope. The second slope overlaps the first slope in a direction of a thickness of the substrate.

The embodiment of the utility model provides a flexible foam piezoresistive tactile sensor and a pressure imaging system. The flexible foam piezoresistive tactile sensor comprises a conductive sensing layer, an interdigital electrode layer, an insulating diaphragm layer and a thin film packaging layer, a hole array is engraved on the insulating diaphragm layer; the conductive sensing layer, the interdigital electrode layer and the insulating diaphragm layer are located between the two thin film packaging layers, and the conductive sensing layer, the insulating diaphragm layer and the interdigital electrode layer are stacked in sequence; the flexible or telescopic foam is used as the substrate, so that the sensor has better flexibility and stretchability and can perfectly fit a human body. Besides, based on the structure, the size and the shape of the sensor, high-precision measurement of the surface pressure between the two contact surfaces is realized, and multi-dimensional pressure imaging can be realized. By introducing the foam material, the advantages of the traditional piezoresistive sensor are maintained, the limitation of the traditional piezoresistive sensor is overcome, and the applicability and the performance of the sensor are improved.

The invention discloses a flexible sensor with pressure and humidity sensing functions and a preparation method thereof, and relates to the technical field of flexible electronics and sensing devices, and the flexible sensor comprises a microporous moisture-permeable protective layer, a dual-mode composite sensing layer, a pressure-sensitive microstructure layer, an elastomer protective layer and a thin film packaging layer which are sequentially attached from top to bottom, the dual-mode composite sensing layer comprises a humidity sensing layer, a film base material and a pressure sensing electrode layer, the humidity sensing layer is arranged on one side of the film base material, the pressure sensing electrode layer is arranged on the other side of the film base material, and the pressure sensing electrode layer is oppositely attached to the fingerprint-imitating microstructure of the pressure-sensitive microstructure layer; the pressure-sensitive microstructure layer is arranged in the gap of the elastomer protection layer, and the film packaging layer covers the pressure-sensitive microstructure layer and the elastomer protection layer. The flexible sensor provided by the invention can realize efficient sensing of pressure and humidity, and has wide application prospects in the fields of robot interaction, intelligent prostheses and the like.

An organic light-emitting display apparatus includes a display substrate and a thin film encapsulation layer on the display substrate. The display substrate includes at least one hole, a thin film transistor, a light-emitting portion electrically connected to the thin film transistor, and a plurality of insulating layers. The light-emitting portion includes a first electrode, an intermediate layer, and a second electrode. The display substrate includes an active area, an inactive area between the active area and the hole, and a plurality of insulating dams. Each insulating dam includes at least one layer. The inactive area includes a first area different from a laser-etched area and a second laser-etched area.

A display panel includes: a substrate including a first area, a second area at least partially surrounding the first area, and an intermediate area between the first area and the second area; an insulating layer on the substrate; a plurality of display elements in the second area, and each including a pixel electrode, an opposite electrode, and an intermediate layer between the pixel electrode and the opposite electrode; a groove in the intermediate area; a thin-film encapsulation layer covering the plurality of display elements, and including an inorganic encapsulation layer and an organic encapsulation layer; and an inorganic layer over the thin-film encapsulation layer, wherein at least one sub-layer included in the intermediate layer is disconnected around the groove, and the inorganic layer directly contacts the insulating layer beyond an edge of the at least one sub-layer located in the intermediate area and an edge of the inorganic encapsulation layer.

This invention provides a flexible display panel, comprising: a display area and a border area surrounding the display area. The border area includes an upper border area, a lower border area, and a side border area connecting the upper and lower border areas. The upper border area includes at least one pyroelectric sensing area, which is provided with: a flexible substrate; a thin-film encapsulation layer on the flexible substrate; and a pyroelectric sensor located on the side of the thin-film encapsulation layer away from the flexible substrate. The pyroelectric sensor generates electrical signals of different intensities upon receiving infrared radiation of different intensities. The flexible display panel provided by this invention does not require an opening in the sensing area to accommodate the sensor, enabling a full-screen display.

A display device may include a substrate, a light emitting structure on the substrate, a thin film encapsulation layer on the light emitting structure, a color filter layer on the thin film encapsulation layer and including a red color filter selectively transmitting a red light and a blue color filter selectively transmitting a blue light, and an overcoat layer, exhibiting two or more absorption wavelength bands and configured to provide wavelength-selective filtering including a green wavelength band, on the color filter layer and including at least one selected from a dye and a pigment, wherein an upper surface of the red color filter may be lower than an upper surface of the blue color filter.

The present disclosure relates to a method of manufacturing a display device, including: a step of disposing a plurality of cells on a carrier substrate, the plurality of cells including a substrate including a display area and a non-display area surrounding at least a portion of the display area; a step of forming a thin film encapsulation layer including at least one inorganic encapsulation layer and at least one organic encapsulation layer in each of the plurality of cells; a step of checking whether foreign matter is contained in the thin film encapsulation layer; a step of irradiating laser light along a first irradiation path on a first portion corresponding to the non-display region of the thin film encapsulation layer containing the foreign matter; a step of irradiating laser light along a second irradiation path on a second portion corresponding to the display area of the thin film encapsulation layer; and a step of separating the at least one inorganic encapsulation layer and the at least one organic encapsulation layer of the thin film encapsulation layer containing the foreign matter from each other, and the first irradiation path includes at least one linear path and at least one curved path, and the second irradiation path includes at least one linear path.

The present application discloses a display panel and a display terminal, wherein the display panel includes a flat display area and a curved display area connected to the flat display area, and the display panel includes: a first sub-pixel circuit and a first light-emitting device, wherein the first sub-pixel circuit is arranged in the flat display area, and the first light-emitting device is arranged in the curved display area; and a connecting electrode is electrically connected between the first sub-pixel circuit and the first light-emitting device. The present application arranges the first sub-pixel circuit of the curved display area in the flat display area, thereby reducing the number of film layers of the inorganic layer in the curved display area and reducing the distance from the thin film encapsulation layer to the substrate in the curved display area. When the curved display area is bent, cracks in the film layer of the inorganic layer can be avoided, and the inorganic layer in the thin film encapsulation layer is closer to the bent stress neutral layer, thereby avoiding cracks in the inorganic layer in the thin film encapsulation layer and improving the anti-bending performance.

This invention discloses a silicon-based OLED device with an inverted trapezoidal sharp-corner stress-blocking structure and its fabrication method, belonging to the field of display panel packaging technology. The device includes a CMOS driving substrate, a pixel anode, a PDL pixel definition layer, an OLED functional layer and a cathode layer, a TFE thin-film encapsulation layer, a Fill planarization optical adhesive layer, a Dam (dam) barrier, and an encapsulation cover plate, stacked sequentially. The PDL pixel definition layer has stress-blocking units with inverted trapezoidal protrusions on the outer edge of the AA area. The Fill adhesive layer fills the grooves between the protrusions, with its top surface higher than the top surface of the protrusions, forming a flat surface that supports the Dam. The TFE encapsulation layer completely covers the dicing area. This invention can efficiently block wafer dicing stress, avoid encapsulation layer cracking, eliminate the need to etch the dicing encapsulation layer, and simplify the process. It also solves the problems of Dam barrier collapse and adhesive overflow, significantly improving device mass production yield and reliability, and exhibiting strong compatibility with existing mass production processes.

The invention provides a micro display screen light field control structure and a preparation method thereof, and relates to the technical field of micro display. Comprising a substrate, a silicon-based OLED device, a thin film packaging layer and a liquid crystal control layer, wherein a pixel definition layer with a specific inverted trapezoidal structure is arranged on the substrate; the silicon-based OLED device is evaporated on the substrate; the thin film packaging layer covers the silicon-based OLED device and forms a water vapor isolation layer; the cover plate glass is carved into a strip-shaped conductive thin film and distributed with a strip-shaped cathode of the silicon-based OLED device in a crossed mode, the driving circuit is used for controlling the deflection state of liquid crystal molecules, and the silicon-based OLED device comprises a chiral OLED device film layer structure and is used for emitting circularly polarized light. According to the invention, the light field distribution can be stably regulated and controlled, the high-quality naked-eye 3D display effect is realized, and the stable operation of the silicon-based OLED device is effectively ensured.

A detection sensor and a display device are disclosed. The display device includes: a base substrate; a self-emissive element located on the base substrate; a thin-film encapsulation layer located on the self-emissive element; a first sensing electrode located on the thin-film encapsulation layer and including an opening; a second sensing electrode located on the thin-film encapsulation layer and spaced apart from the first sensing electrode; a conductive pattern located in the opening and spaced apart from the first sensing electrode; and a sensor controller configured to detect changes in the mutual capacitance between the first sensing electrode and the second sensing electrode in a first mode, and configured to detect changes in the mutual capacitance between the conductive pattern and the first sensing electrode in a second mode different from the first mode.

A chip-on-film package includes a base film having a top surface and a bottom surface, and a circuit region; a source driver chip and a gate driver chip mounted on the circuit region; a first conductive line on the top surface of the base film, a second conductive line on the bottom surface of the base film, and a conductive via that connects the first and second conductive lines to each other; a first row of bonding pads on the circuit region and connected to the source driver chip; a second row of bonding pads on the circuit region and connected to the source driver chip and the gate driver chip; and a test pad outside the circuit region and connected to the first and second conductive lines and the conductive via.