2251results about How to "Improve lighting efficiency" patented technology

The light-emitting device includes a light-emitting element chip; a package having a first recessed portion thereon, in which the light-emitting chip is disposed; a transparent flexible member covering at least the recessed portion; and a transparent rigid member disposed on or above the transparent flexible member. The package has at least a first front surface extending at least outwardly above the first recessed portion; a second front surface extending outwardly above the first front surface; and a third surface as the outside of the package extending outwardly above the second front surface. The rigid member is disposed in the outline of the second front surface with at least three points of contact. The flexible member is continuously provided along the first front surface, the second front surface and the back surface of the rigid member. This light-emitting device is capable of improved reliability without deteriorating its optical characteristics.

A new transparent conducting oxide (TCO), which can be expressed as Al_xGa_3−x−yIn_5+ySn_2−zO_16−2z; 0≦x<1, 0<y<3, 0≦z<2, has been used to improve the brightness and current spreading in GaN base LED process. The optical properties of this system are superior to regular Ni/Au transparent conducting layer in blue-green region, and the new Al₂O₃—Ga₂O₃—In₂O₃—SnO₂ system is able to increase the brightness at 1.5˜2.5 time to compare to regular process. Furthermore, the new transparent conducting oxide thin film has the highest conductivity, which is better than the Ni/Au transparent conducting thin film.

Disclosed is a light transmitting liquid crystal display apparatus used with advantage with a television receiver having a large-sized display not less than 30 inch. A backlight section (3) sending out illuminating light is formed by a plural number of rows made up of many light emitting units (15) arranged on the back surface of a liquid crystal display panel (8). Each light emitting unit includes many LED units (18) mounted on an interconnection substrate (17) and is mounted in this state on a heat dissipating plate (28). A reflecting section (6) for reflecting the light radiated from each LED is formed by a large number of reflective sheet pieces (27), assembled from one heat emitting unit to another, and a reflective plate (26) secured to reflecting plate supports (40) formed on the heat dissipating plate.

A color projection display device may include SLMs or other panels. One embodiment includes a device for displaying a color image including first and second sequences of temporally-integrateable primary color image components, the device also includes first (209) and second (206) SLM panels (604, 606), first and second driving circuitry, and first through fourth polarizing beam spitters.

A light emitting diode with a quasi-omnidirectional reflector comprises a luminescent gel which is coated surrounding a UV light LED chip and a quasi-omnidirectional reflector which is disposed above the luminescent gel. The quasi-omnidirectional reflector is a wild angle cut-off filter which is made by a cooperation of a method for an optical film coating and a property of a total reflection. According to the property of the optical film coating, a light with an incident angle smaller than a critical angle can be reflected, such that a light form the LED chip is confined in the luminescent gel, which makes the luminescent material is excited as much as possible for improving the conversion efficiency of the light. When this LED chip co-works with different colors of the luminescent gels, different colors of lights are excited and produced.

The light guide plate 32 has a light receiving portion 36 on one side thereof to receive light emitted by the LED 24 and a flexible light guide body 35 for transforming the light received by the light receiving portion 36 into planar light. The light guide body 35 is arranged along the liquid crystal panel 23 and has a plurality of light scattering portions 30 arranged on an outer surface thereof in a propagation direction of light emitted by the LED 24. Since the light guide plate 32 comprises a flexible member and thus can be arranged in a curved shape conforming to the liquid crystal panel 23 having a curved surface portion, the curved surface portion of the liquid crystal panel 23 can be illuminated uniformly. Further, the provision of the light scattering portions 30 can enhance a light reception efficiency and light emission efficiency even if the light guide plate 32 is thin.

A light emitting module 150 emits light through a light exit window 104 and comprises a base 110, a solid state light emitter 154, 156 and a partially diffusive reflective layer 102. The base 110 has a light reflective surface 112 which faces towards the light exit window 104. The light reflective surface 112 has a base reflection coefficient Rbase which i defined by a ratio between the amount of light that is reflected by the light reflective surface and the amount of light that impinges on the light reflective surface. The solid state light emitter 154, 156 emits light of a first color range 114, comprises a top surface 152, 158 and has a solid state light emitter reflection coefficient R_SSL which is defined by a ratio between the amount of light that is reflected by the solid state emitter 154, 156 and the amount of light that impinges on the top surface 152, 158 of the solid state light emitter 154, 156. The light exit window 104 comprises at least a part of the partially diffusive reflective layer 102. A solid state light emitter area ratio ρ_SSL is defined as the ratio between the area of the top surface of the at least one solid state light emitter and the area of the light reflective surface of the base. A relatively efficient light emitting module is obtained if Rbase>R_SSL+c*(1−R_SSL) and the factor c is 0.2≦c≦1 for 0<ρ_SSL<0.1, 0.3≦c≦1 for 0.1≦ρ_SSL≦0.25, and 0.4≦c≦1 for ρ_SSL>0.25.

A built in beat diffusion lamp body for LED lamp was invented. The purpose of the invention is to solve the difficulties of poor heat conduction and diffusion caused by the small heat diffusion surface of the material of a conventional LED lamp. The lamp body is made of a set of heat diffusion vanes encircling the heat diffusion complex. The vanes and heat diffusion complex are made from Aluminum alloy in a single process of extrusion moulding. The transverse section of the heat diffusion body is volute shaped. The bottom of the heat diffusion complex is fixed to an aluminum board or an aluminum circuit: board by interference fit. The heat generated by the LED elements can be absorbed and diffused by the board, the heat diffusion complex and the surrounding diffusion element. The outward appearance of the heat diffusion lamp body may be shaped into cup, ladder, or cylinder likeness to satisfy the application requirement. The advantages of current invention are: efficient heat absorption, conduction, and diffusion, low cost for manufacturing, and aesthetic appearance.

A light source device adapted to generate an illumination light beam for illuminating an illuminated surface includes a light source adapted to emit a light beam, a light path conversion member adapted to rotate around an axis perpendicular to a center axis of the light beam emitted from the light source to convert a light path of the light beam emitted from the light source, an overlapping illumination element adapted to overlap a light beam emitted from the light path conversion member on the illuminated surface, the overlapping illumination element having an entrance position of the light bream input to the overlapping illumination element varies with time, and a rotating section adapted to rotate the light path conversion member.

An opposed terminal structure including a supporting substrate, a first terminal, a nitride semiconductor with a light-emitting layer, and a second terminal. The second terminal forms an opposed terminal structure with the first terminal, which can be formed in a variety of patterns.

A light-emitting diode device includes an epitaxial layer, a current blocking layer and a current spreading layer. The current blocking layer is disposed on one side of the epitaxial layer and contacts with a portion of the epitaxial layer. The current spreading layer is disposed on one side of the epitaxial layer and contacts with at least a portion of the current blocking layer.

Efficiency of leading out light released from an active layer, i.e. the external quantum efficiency, can be improved remarkably by processing a light lead-out surface to have an embossment. A layer containing a p-type dopant like magnesium (Mg) is deposited near the surface of a p-type GaN layer to diffuse it there, and a p-side electrode is made on the p-type GaN layer after removing the deposited layer. This results in ensuring ohmic contact with the p-side electrode, preventing exfoliation of the electrode and improving the reliability.

In a light emitting device, a light emitting element which includes a transparent substrate and a stack of GaN-based compound semiconductor layers formed on the first surface of the transparent substrate is mounted on a lead frame or a printed circuit board so that the transparent substrate is located on the side of the stack of GaN-based compound semiconductor layers opposite to the lead frame or the printed circuit board. The second surface of the transparent substrate opposite to the first surface contains a portion inclined with respect to the first surface. Alternatively, an optical member is arranged in contact with the second surface of the transparent substrate, where a surface of the optical member located on the opposite side to the transparent substrate contains a portion inclined with respect to the first surface of the transparent substrate.

A solid-state lamp comprises a light guide having at least one light emitting face and at least one solid-state light source (LED) configured to couple light into the light guide. The lamp further comprises a pattern of light extracting features for promoting emission of light from the light guide wherein the pattern of light extracting features is formed on at least one face of the light guide.

The invention relates to a high power LED package having excellent light efficiency and heat dissipating characteristics. The LED package includes a base member, a reflector unit arranged on the base member and having a plurality of first reflectors, a plurality of LED chips mounted on the base member and surrounded by the first reflectors, and a connection unit arranged on the base member, for electrically connecting the LED chips to an outside. The reflector unit also includes a second reflector surrounding the first reflectors. The second reflector is arranged to surround the first reflectors in order to completely prevent any interference of emission lights and collect the emission lights together, thereby enabling excellent light efficiency. Furthermore, with the first reflectors surrounding the individual LED chips, it is possible to maximize heat dissipating efficiency of the lead frame, thereby stabilizing operating characteristics of the package.