The invention relates to a
semiconductor technology installation, in particular an EUV
lithography installation, comprising: a housing (25), in which a plurality of preferably reflective optical elements (M1, M2,...) are provided in a beam path (33) of the
semiconductor technology installation; and an inspection device, in particular a camera (30), which comprises an imaging optical unit (31) for imaging at least one sub-region (T1, T2,...) of an
optical surface (M1', M2',...) of at least one optical element (M1, M2,...) to be inspected in the housing (25) onto a spatially resolving
detector (32). The inspection device is designed to image at least the sub-region (T2, T3,...) of the
optical surface (M2', M3',...) of the optical element (M2, M3,...) to be inspected via at least one
optical surface (M1', M2',...) of at least one optical element (M1, M2,…), which is situated in the beam path (33) between the optical element (M2, M3,...) to be inspected and the inspection device in the housing (25). The invention further relates to an associated method.