The application relates to the fields of microelectronic packaging and novel display technology, and discloses a packaging method suitable for a
hybrid device packaging structure of a
MicroLED, which comprises the following steps: preparing a wide-bandgap
semiconductor driving
chip, a
logic control chip and a light-emitting pixel
chip; transferring and fixing the wide-bandgap
semiconductor driving chip, the
logic control chip and the light-emitting pixel chip on the surface of a carrier plate in a coplanar mode; depositing a
dielectric layer on the surface of the carrier plate to
expose electrode contacts; manufacturing
metal wires to build an internal electrical
interconnection structure and lead out a
peripheral interface;
coating a packaging material on the surface of the carrier plate to insulate and coat the internal electrical
interconnection structure; curing and
cutting to separate an independent pixel packaging body; and assembling the pixel packaging body to a display panel substrate and connecting the
peripheral interface to a global power
supply network. The application suppresses the
hot carrier effect under high-temperature working conditions, solves the problem of thermal failure, reduces the
parasitic capacitance of high-frequency driving
interconnection, removes potential failure products before macroscopic mounting, and improves the
assembly yield of a display panel array.