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468results about How to "Inhibit the generation of cracks" patented technology

Power semiconductor module, and power semiconductor device having the module mounted therein

A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each having power semiconductor elements to be cooled mounted thereon; a plurality of radiation fins projecting from the bottom surface side of the base plate; and a peripheral wall projecting from the bottom surface side of the base plate so as to surround the radiation fins, the projecting length of the radiation fins is less than or equal to that of the peripheral wall, and the peripheral wall has end surfaces present in the same plane. In addition, a power semiconductor device having the power semiconductor module mounted therein includes: at least one reinforcing plate disposed on the top surface side of the base plate via a first buffering member; and a cooling jacket fixed to the bottom surface side of the base plate via a second buffering member with a plurality of tightening fixtures passing through the reinforcing plate and the base plate, the cooling jacket having a flow passage for a cooling medium formed to intervene in a position with respect to the base plate, and the first buffering member and the second buffering member are respectively disposed at least inside and outside with respect to the tightening fixtures.
Owner:NICHICON CORP

Electrostatic chuck

An electrostatic chuck comprises: a ceramic plate provided with recesses on a major surface and provided with an electrode in an inner part of the ceramic plate; a temperature regulating plate bonded to the major surface of the ceramic plate; a first bonding agent provided between the ceramic plate and the temperature regulating plate; and a heater provided in the each of the recesses of the ceramic plate. The first bonding agent has a first major agent including an organic material, a first amorphous filler including an inorganic material, and a first spherical filler including an inorganic material. The first amorphous filler and the first spherical filler are dispersion-compounded into the first major agent. The first major agent, the first amorphous filler, and the first spherical filler are made of an electrically insulating material. An average diameter of the first spherical filler is greater than a maximum value of a minor axis of the first amorphous filler. A thickness of the first bonding agent is greater than or equal to the average diameter of the first spherical filler. A width of the each of the recesses is greater than a width of the heater, and a depth of the each of the recesses is greater than a thickness of the heater. The heater is adhered within the each of the recesses by a second bonding agent. A first distance between a major surface of the heater on the side of the temperature regulating plate and a major surface of the temperature regulating plate is greater than a second distance between the major surface between the recesses of the ceramic plate and the major surface of the temperature regulating plate.
Owner:TOTO LTD
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