The invention provides a
semiconductor device and a manufacturing method thereof. An insulating ring penetrating through a substrate is formed in the substrate, and the substrate in the insulating ring serves as a first polar plate of a
capacitor structure; a through hole is formed in the first polar plate, and a
dielectric layer is formed on the side wall of the through hole and conducting layersare filled in the through hole; the first polar plate is led out through a leading-out structure, all conducting
layers are electrically connected through a second leading-out structure and are led out, and second polar plates, connected in parallel via all conducting
layers, of the
capacitor structure are formed; the
dielectric layer in the through hole is an insulating layer between polar plates of two
capacitor structures, and the connection and use of the capacitor structures can be realized through the leading-out structures. The capacitor structures have a larger capacity, and meanwhile, the conducting
layers in the through hole are connected in parallel through the leading-out structures to realize the capacitors of any required capacity, and the
semiconductor device has better expandability, so that a capacitor structure with larger capacity can be formed on a smaller
chip area, and the integration level of a
chip is effectively improved.