40results about How to "Crack suppression" patented technology

This invention discloses a black-based blue-spotted glaze with an earthworm-like pattern and its preparation method. The glaze consists of a body, a black base glaze, and a blue-spotted glaze from the inside out. The raw materials for the black base glaze are: feldspar, calcite, calcium borate, dolomite, talc, barium carbonate, quartz, bentonite, zirconium silicate, rutile, cobalt oxide, manganese oxide, and iron oxide. The raw materials for the blue-spotted glaze are: feldspar, limestone, alumina, talc, barium sulfate, Datong clay, zinc oxide, quartz, and titanium dioxide. The preparation method includes: 1. Wet ball milling the black base glaze raw materials to obtain a black base glaze slurry; 2. Wet ball milling the blue-spotted glaze raw materials to obtain a blue-spotted glaze slurry; 3. Bisque firing the body; 4. Applying the black base glaze slurry to the body and drying it; 5. Applying the blue-spotted glaze slurry to the body and drying it; 6. Oxidation firing and reduction firing of the body, followed by natural cooling to obtain the black-based blue-spotted glaze. The raw material formula of this invention is reasonable and environmentally friendly, which can improve the mechanical properties of the glaze; the preparation method is simple and the yield is high.

A coil component, a circuit board, and an electronic device are provided. A coil component of one embodiment includes a magnetic core including a plurality of ferrite crystal grains and a plurality of Bi-segregation regions existing at grain boundaries of the plurality of ferrite crystal grains, and a winding wound around the magnetic core. In one embodiment, a plurality of line profiles obtained by detecting the content of Bi along a plurality of scan lines intersecting the grain boundaries includes at least one first line profile including a detected peak of Bi at the grain boundary, and a plurality of second line profiles not including the detected peak.

The invention discloses a method for improving the structure and performance of a 6063 aluminum alloy formed through selective laser melting, and belongs to the technical field of selective laser melting. Titanium powder and zirconium hydride in a certain proportion are selected as doping agents, the doping agents are evenly mixed with 6063 aluminum alloy powder through a ball milling method, and then drying and dehumidification are conducted; and the mixed alloy powder is put into selected-area laser melting equipment, manufacturing is carried out on the surface of a base material under inert gas protection, and the 6063 aluminum alloy is obtained after laser, scanning, powder laying and deposition. According to the method, the microstructure and the mechanical property of the selective laser melting forming 6063 aluminum alloy are obviously improved, so that the selective laser melting forming 6063 aluminum alloy meets the industrial performance requirement of SLM, and good market competitiveness is achieved.

Provided is a secondary battery capable of suppressing the occurrence of wrinkles and cracks in a protective layer. The lithium ion secondary battery is characterized in that the positive electrode comprises a positive electrode core material and a positive electrode mixture layer arranged on the positive electrode core material, one side end part of the positive electrode core material is provided with a positive electrode core material exposed part in which the positive electrode mixture layer is not arranged, and a protective layer containing a water-insoluble polymer and an inorganic filler is arranged on the positive electrode core material exposed part. The protective layer has: a first protective layer disposed in a region facing the negative electrode with a separator interposed therebetween in the exposed positive electrode core part; and a second protective layer disposed in a region of the exposed portion of the positive electrode core material that is farther from the positive electrode mixture layer than in a region in which the first protective layer is disposed, the mass ratio of the inorganic filler in the first protective layer being greater than the mass ratio of the inorganic filler in the second protective layer. The mass ratio of the water-insoluble polymer in the second protective layer is greater than the mass ratio of the water-insoluble polymer in the first protective layer.

The application discloses a shrinkage-compensating concrete containing acid-free weak base expandable graphite and a preparation method thereof. The concrete comprises cement 200-500 parts, mineral admixtures 50-200 parts, fine aggregate 600-800 parts, coarse aggregate 1000-1300 parts, water 120-200 parts, additive 5-15 parts and acid-free weak base low-temperature expandable graphite 15-75 parts. The expansion trigger temperature of the graphite is 90-100 DEG C, and the pH value is 6.0-8.0. The method comprises the following steps: firstly, uniformly mixing and stirring cement, mineral admixtures, fine aggregate, coarse aggregate and acid-free weak base low-temperature expandable graphite to obtain dry mixture B; secondly, mixing water and additive and adding the mixture into the dry mixture B to uniformly stir to obtain a concrete mixture; and thirdly, forming the concrete mixture, carrying out steam curing after final setting, naturally cooling to room temperature and obtaining the shrinkage-compensating concrete. Therefore, the concrete self-shrinkage can be precisely and efficiently compensated in the steam curing process of the concrete.

The present invention relates to a transmission V-belt, which is a transmission V-belt comprising a cured form of a first rubber composition, wherein the first rubber composition comprises a polymer component (A) containing an ethylene-α-olefin elastomer, a crosslinking agent (B) containing a sulfur-based crosslinking agent, and short fibers (C), wherein the short fibers (C) are oriented along the belt width direction, the rubber hardness (JIS-A) of the cured form is 91 degrees or more, and the elongation at break of the cured form in the belt length direction is 100% or more.

The invention provides a preparation method of a composite patterned substrate, the composite patterned substrate and an LED chip, and the method comprises the steps: forming a plurality of holes in the surface of a sapphire substrate, and carrying out the gluing, exposure and development processing, and obtaining a preset pattern; depositing a SiOF layer on the substrate; removing the preset pattern below the SiOF layer through heat treatment to form a cavity; transferring a pattern on the substrate through a nanoimprint technology; and performing inductively coupled plasma etching to form a composite pattern structure. A cavity structure is formed in a sapphire substrate through laser drilling and heat treatment, the light extraction efficiency of an LED is improved by combining with a composite pattern constructed by a nanoimprint technology and utilizing a multi-interface light scattering effect, the propagation direction of light rays can be guided by combining a patterned structure with a cavity, light emitting angle distribution is optimized, and light emitting is more uniform or the directivity is more concentrated; epitaxial growth stress is released through the cavity, dislocation density is reduced, epitaxial layer cracks are effectively inhibited, and crystal integrity is improved.

The present invention is a method for manufacturing an AlN substrate, comprising: a brittle processing step (S10) for reducing the strength of a SiC base substrate (10); and a crystal growth step (S20) for forming an AlN layer (20) on the SiC base substrate (10). Further, the present invention is a method for suppressing generation of cracks in an AlN layer (20), comprising: a brittle processing step (S10) for reducing the strength of a SiC base substrate (10) before forming the AlN layer (20) on the SiC base substrate (10).

The invention discloses a non-contact welding method for diamond and quartz glass. The non-contact welding method comprises the steps that a diamond composite sheet and a quartz glass sheet are subjected to ultrasonic cleaning and blow-drying; naturally stacking the quartz glass sheets on the diamond compact to form non-contact assembly; transmitting femtosecond laser, focusing the femtosecond laser on the interface of the quartz glass sheet and the diamond compact, and welding along the outer edge of the quartz glass sheet to form a welding sample; the welding sample is placed in an annealing furnace to be subjected to annealing treatment; carrying out welding strength test on the annealed welding sample to obtain shear strength; in the whole welding process, femtosecond laser welding has extremely high peak power and extremely short energy deposition time, a heat affected zone can be controlled at the micro-nano scale, and generation of thermal stress and cracks is effectively restrained; an efficient and reliable method is provided for micro-nano connection of superhard heterogeneous materials, and high-strength welding of the diamond sheet and the quartz glass sheet under the non-clamping and non-contact conditions is achieved.

This invention belongs to the field of metallurgical technology, specifically relating to a high-strength, earthquake-resistant, and Cu-containing steel bar conforming to Korean standards, its preparation method, and its applications. The elemental composition of this steel bar, by mass percentage, is: C: 0.32%~0.37%, Si: 0.20%~0.30%, Mn: 1.65%~1.80%, P: 0.01%~0.02%, S: 0.01%~0.02%, V: 0.15%~0.16%, Nb: 0.015%~0.02%, Cu: 0.20%~0.25%, with the balance being Fe and unavoidable impurities. Through improvements in the elemental composition and technological advancements such as low superheat, weak secondary cooling water flow, and lower drawing speed, this steel bar achieves excellent compressive strength, yield strength, earthquake resistance, and corrosion resistance, making it suitable for use in environments with high earthquake resistance requirements or in corrosive conditions such as coastal areas.

The invention provides a laser powder bed melting anti-crack nickel-based superalloy and a preparation method thereof.The alloy is prepared from the following powder raw materials through a laser powder bed melting technology, and the powder raw materials comprise, by mass, 95%-96% of IN738LC alloy powder and 4%-5% of CoCrW alloy powder. The preparation method of the alloy comprises the steps that IN738LC alloy powder and CoCrW alloy powder are evenly mixed according to the proportion, and mixed powder is obtained; and placing the mixed powder in laser powder bed melting equipment, and forming under the protection of inert gas to obtain the laser powder bed melting crack-resistant nickel-based superalloy. According to the method, the alloy components and the solidification behavior are regulated and controlled, the liquidation crack sensitivity is remarkably reduced, and crack-free and high-density forming of the alloy can be achieved.

This invention relates to an embedded, transparent protective structure resistant to repeated impacts. It comprises a transparent ceramic curved armor plate, a transparent fiber-reinforced skeleton, a polycarbonate curved backplate, an epoxy resin coating, and an STF shear-thickening coating. The polycarbonate curved backplate has a central groove with a concave bottom. Each polygonal unit of the transparent fiber-reinforced skeleton contains a transparent ceramic curved armor plate. The gaps between the transparent ceramic curved armor plates and the transparent fiber-reinforced skeleton are filled with the STF shear-thickening coating. The bottom of the overall structure formed by the transparent ceramic curved armor plates, the transparent fiber-reinforced skeleton, and the STF shear-thickening coating is a convex curved surface, and the upper part of the overall structure is also a convex curved surface coated with an epoxy resin coating. This invention uses segmented, interlocking fibers in the armor plates to inhibit the propagation of crack damage, ensuring that the protective capabilities and visibility of other areas are not affected after an impact. Combined with the function of the curved structure, the overall structure is embedded in the curved backplate, forming an embedded structure.

A lighting device according to an embodiment of the present invention comprises: a support plate; the circuit board is arranged on the supporting plate; the plurality of bonding pads are arranged on one side of the circuit board; a light source portion disposed on the support plate and having a light emitting device and a plurality of bond pads; a plurality of connection members connecting the plurality of pads to the plurality of bond pads, respectively; and a plurality of molded portions covering different regions of at least one of the plurality of connecting members, in which an uppermost end of at least one of the plurality of molded portions may be disposed at a position higher than a highest point of the plurality of connecting members with respect to an upper surface of the circuit board.

The present invention provides a wiring substrate capable of suppressing warpage even when reflow processing is performed, and also capable of suppressing the occurrence of cracks in a cured product layer provided so as to cover a portion of a wiring layer. A wiring substrate is provided with a substrate, a wiring layer provided on at least one main surface of the substrate, a cured product layer provided so as to cover a part of the wiring layer, and a reinforcing member provided on the cured product layer with an adhesive layer interposed therebetween, and is characterized in that: the thickness of the reinforcing member is less than the thickness of the wiring layer; the reinforcing member has a rectangular shape provided with an opening exposing a semiconductor element mounting region, and satisfies the following relationship: Mst > Msr > Mad, where Msr (MPa) is the elastic modulus of the cured product layer, Mad (MPa) is the elastic modulus of the adhesive layer, and Mst (MPa) is the elastic modulus of the reinforcing member under a temperature condition of 25 DEG C. The semiconductor device is characterized in that the reinforcing member has a rectangular shape provided with an opening exposing the semiconductor element mounting region, and when Msr (MPa) is the elastic modulus of the cured product layer, Mad (MPa) is the elastic modulus of the adhesive layer, and Mst (MPa) is the elastic modulus of the reinforcing member.

The invention discloses a gold-copper alloy anti-abrasion antibacterial composite coating and a preparation method and application thereof.The gold-copper alloy anti-abrasion antibacterial composite coating comprises a bottom layer and an anti-abrasion antibacterial modified layer, the bottom layer comprises chromium and chromium nitride, and the anti-abrasion antibacterial modified layer comprises an anti-abrasion antibacterial modifier and polysiloxane modified acrylic resin; the wear-resistant antibacterial modifier is prepared from the following raw material components in parts by mass: 30 to 50 parts of zinc-doped mesoporous silicon dioxide nanospheres, 5 to 10 parts of hydroxyethyl methacrylate phosphate, 1 to 5 parts of nano cerium oxide, 1 to 3 parts of carboxylated graphene oxide, 1 to 5 parts of a polyacrylic acid dispersant, 3 to 5 parts of a polyether modified polysiloxane flatting agent and 2 to 6 parts of a polymer defoaming agent. 1-3 parts of a photoinitiator; the composite coating has excellent wear resistance and antibacterial property.

A method for manufacturing a wiring substrate is provided to suppress cracking around through-holes. The method includes the steps of: repeatedly irradiating a plurality of target regions (T1-T8) arranged linearly in a glass substrate with a laser to form a plurality of modified portions; and removing the plurality of modified portions by etching to form a plurality of through-holes in the plurality of target regions (T1-T8). The step of forming the modified portions includes the steps of: irradiating a first target region with a laser; and immediately after irradiating the first target region with a laser, irradiating a second target region with a laser, wherein the second target region is a target region other than an adjacent target region adjacent to the first target region.

This application relates to the field of ceramic materials technology, and discloses a heat-resistant ceramic glaze with high thermal shock resistance and low expansion, and its preparation method. The glaze comprises 70.0–80.0 parts of base powder, 20.0–30.0 parts of β-spodumene clinker, 50.0–60.0 parts of added water, 0.2–0.4 parts of sodium polyacrylate, 0.1–0.3 parts of sodium carboxymethyl cellulose, and 0.05–0.15 parts of calcium acetate. The base powder contains inorganic raw materials such as calcium borate. Within the system, a three-dimensional yield network structure is formed by the cross-linking of the molecular chains of sodium carboxymethyl cellulose and calcium ions ionized from calcium acetate. During preparation, the base powder and β-spodumene clinker are sequentially fed into a ball mill for grinding, and a cross-linking agent is added before stopping the mill. This invention utilizes the three-dimensional yield network structure to stably suspend large-particle-size β-spodumene clinker. When the ceramic product experiences drastic temperature changes, the low-expansion crystal remnants retained internally buffer thermal stress concentration, thereby effectively preventing glaze surface cracking.

The application discloses a hot forging process for a 7-series aluminum thin material product with a thick-thin gap structure. The application introduces a new process path of "pre-fabricated compensation deformation and partition collaborative control", effectively solves the problem of shear stress concentration and cracking at the junction caused by the mismatch of deformation capacity of the thick-thin area of the aluminum thin material in the background technology, and provides a systematic solution for the limit thin-wall forging of the 7-series aluminum. The stability of the extreme thin-wall structure in the forming and phase change process is ensured, so that the 7-series aluminum can be reliably forged to about 0.5mm thickness without cracking.

The utility model discloses a loess slope rainwater collection greening slope protection structure, and relates to the technical field of slope greening, the loess slope rainwater collection greening slope protection structure is characterized in that a plurality of ridges are arranged on a slope surface at equal intervals, fish-scale pits are formed in the slope surface among the plurality of ridges, protection mechanisms are arranged at the front parts of the plurality of ridges, the protection structures comprise supporting pieces, and the supporting pieces are inserted in the front sides of the ridges; a straw mat is arranged on the front side of the supporting piece, the supporting piece is partially inserted into the outer side of the straw mat and used for fixing the straw mat, the multiple earth ridges are arranged on the slope surface, silt in rainy days is intercepted layer by layer through the earth ridges, the multiple fish-scale pits are formed in the slope surface between the multiple earth ridges, and the rhombic nets are laid on the tops of the fish-scale pits; sediment is blocked through cooperation of the fish-scale pits and the rhombic nets, the rhombic nets disperse runoff impact force, the flow guide ripples reduce the flow speed, and the sediment interception rate is remarkably increased.

Provided is a semiconductor device capable of suppressing cracking of an insulating film of a lower layer of a pad opening portion even if the semiconductor device has a two-layer metal film. A semiconductor device (100) includes: a first wiring layer (151) formed on a surface of a semiconductor substrate (110); an insulating film (133) formed on an upper layer of the first wiring layer (151) and having a thick film portion (133a) and a thin film portion (133b); a metal film (152) formed on an upper layer of the insulating film (133); a protective film (160) formed on an upper layer of the metal film (152); and a pad opening portion (180) formed in the protective film (160) so as to expose a portion of the metal film (152) and formed at a position overlapping the thick film portion (133a) in plan view.

This invention provides a composite wiring substrate capable of suppressing cracks near a bonding material, a semiconductor device, and a method for manufacturing the composite wiring substrate. The composite wiring substrate comprises: a first wiring substrate having a first connection terminal, a second wiring substrate having a second connection terminal opposite to the first connection terminal, and a bonding material for bonding the first connection terminal and the second connection terminal. In plan view, a first profile of the first connection terminal is located inside a second profile of the second connection terminal. The bonding material comprises: a first portion formed of an intermetallic compound of Cu and Sn in contact with both the first and second connection terminals; and a second portion formed of an alloy of Bi and Sn, including the portion between the first and second profiles in plan view. The second portion contains Bi at a high concentration compared to the eutectic composition of the SnBi alloy. The second portion is separate from the second connection terminal.

The invention relates to high-strength anti-cracking GH3536 alloy powder for additive manufacturing based on niobium-lanthanum synergistic modification and a preparation method thereof, and relates to the technical field of powder for metal additive manufacturing. Niobium is added in the mother alloy smelting stage, lanthanum is excessively added for deep purification, and harmful impurities are removed; then, according to the atomization powder manufacturing process type, the time for adding the lanthanum element for the second time is accurately selected; in the solid electrode atomization process, adding is compensated through vacuum self-consuming remelting in the process of preparing a solid alloy electrode bar; the molten metal atomization process is added after alloy liquid is melted down and before atomization is started. Through step-by-step accurate regulation and control, the lanthanum content in the final powder is in a proper range, the formation of grain boundary continuous brittle carbides is effectively inhibited, the crack resistance is improved, meanwhile, the niobium element generates fine carbides in situ to play the roles of fine grain strengthening and dispersion strengthening, and the tensile strength of the material is improved.

A substrate for a semiconductor package has a side surface having an arithmetic mean roughness Ra of less than 450 nm. The side surface can be a polished surface. Alternatively, it can have a substrate body comprising an insulating resin layer and an inorganic fiber substrate disposed within the insulating resin layer.

An all-solid-state battery includes: a solid electrolyte layer; a positive electrode layer and a negative electrode layer facing each other and between which the solid electrolyte layer is positioned; a first external electrode connected to the positive electrode layer; a second external electrode connected to the negative electrode layer; and a positive electrode edge unit disposed between the positive electrode layer and the second external electrode. The positive electrode edge unit comprises a main layer and an auxiliary layer of which the shrinkage rate is lower than that of the main layer.

The present application provides a kind of LW reverse type of laminated ceramic capacitor with improved mechanical strength and can inhibit crack inside even thickness is thinned.In the laminated ceramic capacitor (1), the size (w) of the size relationship of the size (1) of the size (t) of the laminated body (10) in width direction>length direction>height direction, the length direction (L) of the length (e1) of the side surface exposed part (33) in the first lead-out part (31B) and the second lead-out part (32B) of the internal electrode layer (30) as the part exposed in the part of the first side (WS1) and the part of the second side (WS2) respectively is 10% or more and 44% or less relative to the length direction (L) of the size of the laminated body (10), and the length (e2) of the length direction (L) of the external electrode (40) is 17% or more and 48% or less relative to the length direction (L) of the size of the laminated body (10).

The method for manufacturing a rare earth-based sintered magnet of the present invention includes: a step of compressing a slurry containing alloy powder containing rare earth elements and a dispersion medium using a wet molding apparatus to produce a molded body; and a step of sintering the molded body, wherein when the slurry is injected into the space of the cavity forming the wet molding apparatus, no magnetic field is applied, and the dispersion medium contained in the slurry is discharged from the space by pressing the slurry.

The composition for thermal insulation materials comprises silica aerogel, a polymer having the dispersing function of the silica aerogel, inorganic particles having hydroxyl groups on the surface, and a liquid. When the stringability of a test liquid after removing the silica aerogel from the composition for thermal insulation materials is measured, the composition satisfies the following condition (I): "(I) The string length based on a stretching speed of 4 mm / s is 40 mm or less." According to the composition for thermal insulation materials, the generation of cracks during drying can be suppressed. The thermal insulation material comprises a cured product of the composition for thermal insulation materials. The cured product of the thermal insulation material has few cracks and excellent thermal insulation properties.

The application discloses a kind of flame-retardant water-resistant polyether type polyurethane elastomer and preparation method thereof, and relates to the technical field of polyurethane elastomer.The application first prepares boroxin intermediate BOX, then reacts with dimethyl methylphosphonate to obtain reactive phosphorus-containing boroxin flame retardant DMPB, which is introduced into polyurethane elastomer as halogen-free flame retardant.The obtained material has significantly improved limiting oxygen index, reaches UL-94 V-0 level, and has outstanding smoke suppression and toxicity reduction effect;continuous dense carbon layer is formed during combustion, and the mechanical and adhesive properties are excellent, halogen-free, environmentally friendly, water-resistant and stable, suitable for new energy vehicles and electronic components potting and other fields with high requirements for flame retardance and water resistance.

The invention discloses a composite fiber reinforced high-molecular polymer-solid waste-based marine grouting material and a preparation method thereof. Solid wastes such as recycled concrete micro powder are used as main raw materials, high-molecular polymers and composite fibers are compounded, and the total solid waste mixing amount is 51%-75%. The preparation method comprises the steps of raw material pretreatment, dry powder mixing, fiber dispersion, polymer mixing, wet mixing and the like, uniform mixing of all the components can be guaranteed, and the fiber dispersity is excellent. The grouting material has high compression resistance and tensile strength and excellent freezing and thawing resistance and marine medium corrosion resistance, can effectively resist complex load and severe environment corrosion in ocean engineering and prolong the service life of a structure, is simple in preparation process, is suitable for industrial production, and can be widely applied to grouting connection of foundation structures of ocean engineering such as offshore wind power and the like.