The invention provides an FCCSP packaging structure and a preparation method thereof. The
active surface of a
chip faces a circuit layer and is electrically connected with the circuit layer; the plastic
package layer is located on the circuit layer and wraps the periphery of the
chip, and the cooling fin is located on the
chip and the plastic
package layer; heat dissipation glue is arranged between the heat dissipation sheet and the chip, and
adhesive glue is arranged between the heat dissipation sheet and the
plastic packaging layer. According to the FCCSP packaging structure, the cooling fins are connected with the chip through heat-conducting glue to optimize the
cooling effect, the cooling fins are connected with the
plastic packaging layer around the chip through
adhesive glue to optimize the fixing effect, and the
cooling capacity and the
structural reliability of the FCCSP packaging structure are improved; in addition, the heat
conductivity coefficient of the heat dissipation glue and the viscidity of the
adhesive glue are set, so that the heat dissipation capacity and the
structural reliability are both improved; and finally, when the FCCSP packaging structure is prepared, the process units are
cut firstly, and then the cooling fins are arranged for the process units respectively, so that the problem of
delamination and stripping between the cooling fins and the process units, which is easily caused by the fact that the FCCSP packaging structure which is easily warped is
cut after the cooling fins are integrally arranged, is solved, and the
structural reliability is further improved.