160 results about "Composite substrate" patented technology

This application relates to a polycrystalline diamond composite substrate, belonging to the technical field of superhard material composites. It includes a cylinder with one end serving as a bonding surface; a frustum located at one end of the bonding surface, comprising a truncated cone coaxially transitioning onto the cylinder and a frustum coaxially connected to the truncated cone; and a raised structure disposed on the frustum, comprising multiple sets of coaxially arranged raised units, each set of raised units being evenly distributed in a ring around the center of the bonding surface, with grooves formed between adjacent raised units, the grooves being concentric with the bonding surface. This application allows external forces applied to the composite to be more evenly distributed across different parts of the substrate, avoiding localized stress concentration. The raised structure increases the contact area between the substrate and the diamond layer, significantly enhancing the adhesion between them. During drilling, the diamond layer adheres more firmly to the substrate, reducing the risk of premature detachment of the diamond layer due to external forces.

A metal composite substrate suitable for forming a casing through stamping and bending is provided. The metal composite substrate includes a metal layer, an adhesive layer, and an appearance decoration layer. The metal layer has a first surface, a second surface opposite to the first surface, and a groove recessed in the first surface. The adhesive layer is disposed on the second surface. The appearance decoration layer is disposed on the adhesive layer and is attached to the metal layer through the adhesive layer. The casing formed from the metal composite substrate by stamping and bending has a bending chamfer, which includes a bending outer angle and a bending inner angle. A positive draft angle or a negative draft angle is formed at the bending outer angle, and the groove is located at the bending inner angle.

The present application belongs to the technical field of plant tissue culture, and particularly relates to a high-efficiency rooting and seedling raising method for plant tissue culture seedlings, S1 trimming and disinfection of S2 induction liquid immersion, S3 composite substrate implantation and gradient environment regulation, S4 substrate transplanting and planting; the core is to use modified magnetic biochar composite substrate loaded with FeO nanoparticles, cooperate with the synergistic effect of microencapsulated rooting hormone and melatonin, realize in-situ integrated seedling raising through composite spectrum containing UV-A, CO pulse supply, gradient humidity and PEG osmotic pressure domestication. The present application effectively inhibits basal browning, shortens the seedling raising period, improves the rooting quality and transplanting survival rate, overcomes the pollution prejudice of magnetic nanoparticles, is suitable for woody and herbaceous plants, and can be applied to plant tissue culture seedling production on a large scale.

The application relates to the technical field of laser packages, in particular to an in-situ optical shaping VCSEL array integration method and an optical interconnection module, which comprises the following steps: S1, a quartz substrate is used, a femtosecond laser pulse is focused and scanned in the quartz substrate, and a three-dimensional profile of a micro hole is defined in advance; S2, a VCSEL chip is precisely placed into the micro hole in an array arrangement with the VCSEL chip facing upwards, and epoxy resin is cured by heating; S3, a metal layer is sputtered on the quartz substrate, and an electrical interconnection track is formed through photolithography; S4, a two-photon polymerization direct writing system is used to initiate two-photon polymerization of photoresist, solidification is realized, and the production of a polymer lens is completed. The application selects fused quartz glass as the only passive integrated substrate; the substrate has four characteristics of optical transparency, electrical insulation, thermal stability and three-dimensional micro machining at the same time, replaces the multilayer composite substrate in a traditional scheme at one time, and realizes the original integration design basis of an optical path, an electrical circuit and a thermal path.

This utility model relates to a layered, bend-resistant composite substrate light strip in the field of composite substrate light strips. It includes a PI film layer, LED beads evenly spaced on the upper end of the PI film layer, a wavy stainless steel wire mesh layer on the lower end surface of the PI film layer, a honeycomb-shaped perforated layer on the lower end surface of the wavy stainless steel wire mesh layer, a silicone buffer layer at the lower end of the honeycomb-shaped perforated layer, and V-shaped stress relief grooves evenly distributed at the bending points on the upper end surface of the PI film layer. Semi-circular silicone covers are provided on the solder joints at both ends of the LED beads. This utility model achieves multi-layered buffering and stress dispersion through the wavy stainless steel wire mesh layer, honeycomb-shaped perforated layer, and silicone buffer layer. Combined with the V-shaped stress relief grooves to guide stress and the semi-circular silicone covers to protect the solder joints, it enhances the substrate's bend resistance, solving the problems of easy damage and short lifespan of traditional light strips, and is suitable for complex environments.

This invention discloses a smart responsive flame-retardant polypropylene foamed beads, its preparation method, and its application, specifically relating to the field of flame-retardant polymer foam materials technology. The preparation method includes firstly, co-extruding a skin melt and a core melt into a composite die to form a core-skin structure melt strip with the core melt as the core and the skin melt as the skin. The core-skin structure melt strip is then pelletized to obtain composite PP substrate microparticles. These microparticles are then placed in an EPP autoclave foaming equipment, where they undergo impregnation and stirring, programmed pressure relief, crushing, centrifugal drying, and fluidized bed drying to obtain composite EPP foamed beads. This invention, through the synergistic design of core-skin functional partitioning and smart responsive components, transforms the traditional passive and dispersed flame-retardant mode into an active and centralized high-efficiency barrier mode, achieving intelligent and efficient flame retardancy.

This invention discloses a SiC with an ultra-high temperature ceramic gradient coating. f / SiC composite materials, their preparation methods, and applications. A double-layer glow discharge plasma surface metallurgical method is used to prepare SiC composite materials. f A (Hf,Si,Ta)C gradient composite coating was prepared on the surface of the SiC composite material. This coating was able to resist SiC in an oxygen atmosphere at 1773 K. f Effective protection of SiC composite materials. The specific advantages of this invention are: (1) Ion bombardment of the substrate significantly improves the point defects and conductivity of the composite substrate; (2) The (Hf,Si,Ta)C coating has a continuous gradient structure, forming a good metallurgical bond between the coating and the substrate, with high bonding strength; (3) The similar thermal expansion coefficients of the (Hf,Si,Ta)C coating and the substrate can improve the thermal mismatch between the coating and the substrate, reducing the tendency for coating peeling and cracking during service; (4) The (Hf,Si,Ta)C coating system has a high service temperature and self-healing ability. The coating prepared by this invention has excellent high-temperature protection performance, improving the protection of SiC. f The high-temperature service life of SiC composite materials has broad application prospects in the aerospace field.

A preprocessed composite substrate (18) is provided that is used as a basis for further processing into electronic semiconductor components. A method for producing a pre-processed composite substrate (18) includes doping a donor substrate (12) with a first layer (21) of SiC by ion implantation using an energy filter (20), creating a predetermined damage site (26) in the donor substrate (12), and creating a bonded connection between the donor substrate (12) and an acceptor substrate (28). The first layer (21) is disposed in a region between the acceptor substrate (28) and a remaining portion (22) of the donor substrate (12). Finally, the donor substrate (12) is divided at the region of the predetermined damage site (26) to produce a pre-processed composite substrate (18), which includes an acceptor substrate (28) and a doped layer (32) connected to the acceptor substrate and constituting at least a portion of the first layer (21) of the donor substrate (12).

The invention relates to a method for preparing a support (1) for a composite substrate (S) comprising forming a surface porous layer (P) on a first face (1c) of the support (1), and applying a viscous solution comprising a solvent and a precursor of a filler material to the first face (1c) of the support (1) so as to absorb at least a portion of the viscous solution into open pores of the surface porous layer (P). In a fourth step, the support (1) is heat-treated to transform the viscous solution present in the open pores so that they are filled with the filler material. Figure to be published with the abbreviation: Fig 1

This invention belongs to the field of plant cultivation technology, specifically relating to a composite substrate for Phalaenopsis orchid cultivation and its application, comprising: sphagnum moss and fermented material, wherein the fermented material includes at least one of wolfberry branch fermented material and Caragana korshinskii branch fermented material; the volume ratio of the sphagnum moss to the fermented material is (5-7):(4-6). Experiments show that using the composite substrate of this application to cultivate Phalaenopsis orchids can promote healthy plant growth. Compared with pure sphagnum moss cultivation, the plant height of Phalaenopsis orchids increased by 15.03%, leaf width increased by 25.42%, and the number of flowers increased by 64.7%; and there was no significant difference in flower diameter, internode length, stem thickness, leaf length, leaf width, pedicel length, and pedicel thickness compared with sphagnum moss cultivation. At the same time, it greatly reduces the proportion of sphagnum moss used and the planting cost, and can realize the resource utilization of regional agricultural and forestry waste, promoting the development of ecological circular agriculture.

The application discloses a MiniLED chromatic aberration suppression method based on a thermal balance packaging structure and a display device, relates to the technical field of semiconductor display, and comprises a composite substrate, a thermoelectric cooler (TEC) array, a MiniLED chip array, a phase change material layer and a dynamic temperature control system; the MiniLED chromatic aberration suppression display method based on the thermal balance packaging structure comprises the following steps: S1, preparing the composite substrate: adopting a copper-graphene composite material as the substrate, forming a microchannel with a width of 200 mu m and a depth of 150 mu m in the substrate by laser etching; S2, the thermoelectric cooler (TEC) array: distributing TEC units on the back of the substrate according to regions; S3, the die bonding process: using high-thermal-conductivity silver glue to fix the MiniLED chip, applying a 5N die bonding pressure and curing at 80 DEG C; S4, filling the phase change material, which is suitable for solving the chromatic aberration problem caused by uneven temperature distribution and realizing high-precision display control of chromatic aberration.

The invention relates to a method for manufacturing a receiving substrate to form a composite substrate, comprising a step of supplying a base substrate, a step of deposition in a deposition chamber of an electrically charge-trapping layer in contact with the base substrate. The trapping layer comprises 40% to 80% silicon atoms, 0.1% to 45% oxygen atoms, and 0.2% to 50% nitrogen atoms. The deposition step of the trapping layer uses a precursor gas mixture. The mixture comprises a silicon gas, an oxygen gas, and a nitrogen gas. The nitrogen gas is ammonia or a set of molecules that form ammonia in the deposition chamber during the deposition step. (See Figure 1A for the abstract.)

A composite substrate is provided that exhibits excellent reflection properties at the interface of a wavelength conversion layer.The composite substrate comprises: a wavelength conversion layer configured to convert incident light into light of a different wavelength; and a multilayer film arranged adjacent to the wavelength conversion layer, the multilayer film comprising a plurality of refractive index layers, the wavelength conversion layer having a thickness-directed end section on one side on which the multilayer film is arranged, and in the thickness-directed end section of the wavelength conversion layer forming a region in which the abundance of an inert gas atom is 0.5 at% or more, and in the multilayer film a first refractive index layer among the plurality of refractive index layers being positioned closest to the wavelength conversion layer, and the abundance of the inert gas atom in the first refractive index layer being less than 0.5 at%.

A composite substrate includes a support substrate made of Si, a high acoustic velocity material layer, a low acoustic velocity film, and a piezoelectric layer. In Euler angles (φ, θ, ψ) of the Si, φ and θ are within regions indicated by hatching with slant lines in FIG. 4. An acoustic wave device includes an IDT electrode in contact with the piezoelectric layer of the composite substrate.

The invention relates to a transducer structure (200) of a surface acoustic device, comprising a composite substrate comprising a piezoelectric layer (212), a pair of interdigital comb electrodes (206, 208) comprising a plurality of electrode means (206-1, 206-2... 208-1, 208-2...) having a pitch p satisfying the Bragg condition, wherein the interdigital comb electrodes are embedded in the piezoelectric layer (212) such that, in use, an excitation of a wave propagation mode in the volume of the electrode means occurs and is the main propagation mode of the structure. The invention also relates to an acoustic wave device comprising at least one transducer structure as described above and to a method of manufacturing said transducer structure. The invention also relates to the use of the frequency of the bulk wave propagating in the electrode means of said transducer structure in an acoustic wave device to generate a contribution at high frequencies and in particular above 3 GHz.

This invention belongs to the field of semiconductor manufacturing technology, and relates to a diamond-silicon carbide composite substrate, its preparation method, and its application. The preparation method includes the following steps: coating a silicon substrate with SiC quantum dot sol and annealing it with pulsed laser to obtain a nucleation dot array; sequentially depositing a gradient buffer layer, a 3C-SiC thin film, and a diamond layer; and polishing the surface of the 3C-SiC thin film. The gradient buffer layer is a SiGeC gradient buffer layer with a thickness of 5-10 nm; the 3C-SiC thin film has a thickness of 0.5-5 μm. This invention can achieve stable composite formation of an ultrathin SiC layer with uniform thickness and a smooth surface with diamond while ensuring interfacial bonding strength and structural integrity, which is beneficial for the development and application of high-performance diamond-silicon carbide composite substrates.

This invention relates to the field of interior decoration materials, specifically to a paper-based tear-resistant substrate and its preparation method. A method for preparing a paper-textured tear-resistant substrate includes the following steps: S1: preparing a paper-textured slurry; S2: applying the paper-textured slurry to the surface of a non-woven fabric substrate in multiple steps; S3: heating and shaping with a pressure roller, and cooling to obtain a composite substrate; the paper-textured slurry, by weight, includes: 20-30 parts of water-based acrylic resin emulsion, 10-15 parts of water-based polyurethane emulsion, 1-8 parts of modified starch adhesive, 15-25 parts of kaolin, 10-15 parts of heavy calcium carbonate, 5-10 parts of titanium dioxide, 3-5 parts of shell powder, 0.5-2 parts of nanocellulose, 0.5-1 part of dispersant, 0.1-0.5 parts of polyether-modified organosilicon, and water, wherein the amount of water added makes the solid content of the paper-textured slurry 35-50%; the obtained substrate has a paper-textured feel, which facilitates ink adhesion and high-precision printing, and has good tear resistance.

The present application relates to a kind of cooling water-saving coupling refrigeration film based on bionic micro-nano structure and its preparation method, belong to the technical field of facility agriculture covering material.To solve the problem that existing technology cannot realize efficient refrigeration, atmospheric water collection, green preparation and agricultural adaptation simultaneously, the present application provides a kind of cooling water-saving coupling refrigeration film based on bionic micro-nano structure, including flexible composite substrate, the surface of flexible composite substrate has regularly arranged micro-pyramid array structure, and the inside of flexible composite substrate is uniformly dispersed with nano-particle of high emissivity to infrared light and high transmissivity to visible light;The top of micro-pyramid array is hydrophilic area, and the body and substrate are hydrophobic area, to form hydrophilic and hydrophobic hetero micro area.The present application has excellent radiative refrigeration, high-efficiency water collection capacity, self-cleaning weather resistance through bionic micro-nano structure and function synergistic design, preparation process is simple and controllable, energy-saving emission-reduction benefit is remarkable, adapts greenhouse application, and has practicality and industrialization potential.

The present application belongs to the field of ecological restoration technology, and particularly relates to a kind of composite substrate soil and dry-hot valley slope restoration method. Wherein, the composite substrate soil includes 50%-70% of engineering slag, 10% of topsoil, 7.5%-35% of livestock and poultry manure, 7.5%-35% of microbial fertilizer, 4.5%-5% of biochar, 5% of crop straw and 0.3%-0.5% of polyvinylamide; in the composite substrate soil, the crop straw has abundant fiber and higher porosity, which can effectively increase the porosity of the composite substrate soil, reduce the bulk density of the composite substrate soil, make the composite substrate soil more loose and breathable, ensure the water permeability and water retention capacity of the composite substrate soil, and through the synergistic effect of microbial fertilizer, livestock and poultry manure, biochar and polyvinylamide, the mechanical composition of the composite substrate soil is optimized, the physicochemical properties of the engineering slag are comprehensively improved, so that the composite substrate soil can meet and be suitable for plant growth.

This application discloses a fabrication process for a secondary-bonded lithium tantalate composite substrate and a flexible lithium tantalate composite substrate, belonging to the field of flexible ultrathin lithium tantalate wafer fabrication technology. The process includes the following steps: (1) ion implantation of a lithium tantalate wafer and pre-annealing of a substrate wafer; (2) activation and bonding of the implantation surface of the lithium tantalate wafer and the substrate wafer to obtain a first bond, and thinning the lithium tantalate wafer of the first bond to a thickness of 2-50 μm; (3) secondary bonding of the lithium tantalate wafer of the first bond to a flexible substrate to obtain a second bond; (4) annealing and peeling of the second bond to obtain a flexible lithium tantalate composite substrate and a heterogeneous thin-film bonded substrate. This method achieves permanent bonding between an ultrathin lithium tantalate wafer and a flexible substrate through a two-step bonding process, transforming the lithium tantalate wafer from a "fragile thin sheet" into a practical, integrable, and flexible lithium tantalate composite substrate suitable for flexible devices.

The application belongs to the technical field of aquaculture tail water treatment, and discloses a composite substrate for treating aquaculture tail water in a low-temperature environment.The technical problem to be solved by the application is that, when treating aquaculture tail water in a low-temperature environment, the existing substrate is difficult to balance the heat preservation performance and the purification performance, resulting in a significant decrease in purification efficiency.The composite substrate comprises four layers from top to bottom: an upper layer of a quartz sand layer with a particle size of 2-5 mm, accounting for 35% of the total volume; a middle layer of a coconut shell charcoal layer with a particle size of 2-5 mm, accounting for 20% of the total volume; a lower layer of a rock wool layer with a particle size of 3-8 mm, accounting for 10% of the total volume; and a bottom layer of a quartz sand layer with a particle size of 5-10 mm, accounting for 35% of the total volume.The composite substrate is formed by layering and compounding, and is used for treating aquaculture tail water in a low-temperature environment, so that heat loss in the substrate can be effectively reduced, the activity of microorganisms can be maintained, and the stable removal of pollutants such as nitrogen and phosphorus can be ensured.

The application provides a patterning substrate processing method, a chip and an electronic device, and comprises the following steps: screening according to the bottom width of a first patterning substrate, selecting the first patterning substrate with a bottom width lower than a preset bottom width as a second patterning substrate, and depositing a refractive layer on the second patterning substrate; spin coating photoresist on the refractive layer to form a photoresist layer, and the second patterning substrate, the refractive layer and the photoresist layer form a composite substrate; providing a master template, dropping AB glue on the master template, and heating and curing to form a soft film plate; placing the composite substrate and the soft film plate into a press machine, introducing nitrogen, pressing the composite substrate and the soft template, and exposing the composite substrate and the soft film plate to ultraviolet light to obtain a substrate to be etched; and performing dry etching on the substrate to be etched to obtain a final substrate. Through the above method, the patterning substrate with a small bottom width can be improved, the light extraction efficiency can be improved, and the rework and scrapping of the patterning substrate can be avoided.

Provided is a composite substrate that is capable of maintaining the performance as a charge trap, that can provide contribution to achieve high performance when used for a device for high frequency and / or higher harmonics, and that can be manufactured at a low cost. A composite substrate according to an embodiment of the present invention comprises a crystalline support substrate, a first modified layer, a second modified layer, and an active layer, in the stated order. The second modified layer includes an amorphous structure of an element that is the same as an element forming the support substrate. The first modified layer contains an element that is the same as an element forming the support substrate. Regularity of the atomic arrangement in the first modified layer and regularity of the atomic arrangement in the second modified layer are different from each other.

The application discloses a method for improving nucleation density of large-size single crystal diamond hetero-epitaxy based on iridium-amorphous carbon pre-implantation layer, which comprises the following steps: firstly, pretreating a single crystal silicon substrate through acid washing, acetone or ethanol ultrasonic cleaning method; sequentially epitaxially growing a nanometer-thickness yttrium stabilized zirconium oxide (YSZ) single crystal film buffer layer and an iridium single crystal film functional layer on the treated single crystal silicon surface; then, pre-implanting an amorphous carbon film on the surface of the iridium / YSZ composite substrate, and performing vacuum annealing stress relief and polishing graphite phase large particle removal treatment on the amorphous carbon film to obtain a smooth and flat surface; finally, epitaxially growing single crystal diamond on the surface of the iridium-amorphous carbon pre-implantation layer, and cutting and removing the composite substrate to obtain large-size single crystal diamond hetero-epitaxy. The method utilizes the amorphous carbon implantation layer to accelerate the dissolution-precipitation process of carbon ions entering the iridium film to form a supersaturated solid solution during bias nucleation, increases nucleation sites, and improves nucleation density, which is of great significance for preparing large-size high-quality single crystal diamond.

This invention discloses a polyphenylene sulfide (PPS) substrate, its preparation method, and a flexible circuit board. The PPS composite substrate includes a bottom layer A and surface layers B disposed on both sides of the bottom layer. Layer A is prepared from the following raw materials in parts by weight: 37-84 parts of first PPS, 5-30 parts of heat-resistant component, 5-30 parts of filler, 0.8-10 parts of chain extender, 1-7 parts of toughening agent, and 0.1-1 parts of additives. Layer B is prepared from the following raw materials in parts by weight: 84-97 parts of second PPS, 3-15 parts of toughening agent, and 0.1-1 parts of additives. The substrate prepared by this invention exhibits excellent CTI value, heat resistance, and mechanical properties through the synergistic combination of its components, and demonstrates good film-forming properties during the production process.

The application belongs to the field of graphene composite heating material and application, and particularly discloses a graphene composite base material flexible electric heating sheet; the heating sheet is a sandwich structure, comprising upper and lower two layers of water-repellent fabric layers which constitute outer layers, a graphene composite base material coating heating strip located between the upper and lower water-repellent fabric layers, copper foil electrode strips, and power supply lines; the graphene composite base material coating heating strip is attached to the inner surface of at least one of the upper and lower water-repellent fabric layers; a plurality of graphene composite base material coating heating strips are arranged into graphene coating strips in an array with intervals, three copper foil electrode strips are arranged at the upper and lower ends and the middle position of the graphene coating strips; a fourth copper foil electrode strip is connected in series with the copper foil electrode strips at the upper and lower ends; after the copper foil electrode strips at the upper and lower ends are connected in series, the copper foil electrode strip at the middle is connected in parallel with the copper foil electrode strips at the upper and lower ends; and two power supply lines are respectively welded with the electrode connectors of the electrode strips at the middle and the two ends. The electric heating sheet prepared by the application has good heating effect.

This composite substrate comprises a first single-crystal substrate layer and a second single-crystal substrate layer bonded to the first single-crystal substrate layer. The first single-crystal substrate layer has a higher threading dislocation density than that of the second single-crystal substrate layer. The composite substrate according to the present embodiment has a SORI of 40 μm or less.

The present application provides an LED chip based on an alumina-silica composite substrate and a fabrication method thereof. The LED chip comprises an alumina-silica composite PSS substrate, a composite buffer layer and an LED structural layer, wherein the composite buffer layer is epitaxially grown on the alumina-silica composite PSS substrate, and the LED structural layer is epitaxially grown on the composite buffer layer. The composite buffer layer comprises: an aluminium oxynitride / aluminium nitride layer and a silicon oxynitride layer, wherein the alumina in the alumina-silica composite PSS substrate is covered with the aluminium oxynitride / aluminium nitride layer, and the silica in the alumina-silica composite PSS substrate is covered with the aluminium oxynitride / aluminium nitride layer and the silicon oxynitride layer in a staggered manner.

The application provides an integrated thermal management and parallel interconnection humanoid robot data storage module and a preparation process, and relates to the technical field of humanoid robot special electronic module integration. The integrated thermal management and parallel interconnection humanoid robot data storage module and the preparation process comprise the following steps: based on the comprehensive requirements of high thermal conductivity, structural stability and parallel interconnection compatibility of the humanoid robot data storage module, a metal matrix composite material is selected and combined with a ceramic material to form a substrate; a high-thermal-conductivity composite substrate is prepared by using a laminated sintering process; and a heat diffusion layer structure is preset in the substrate to improve the overall heat conduction efficiency. By constructing the high-thermal-conductivity composite substrate and presetting the heat diffusion structure in the substrate, the overall heat conduction efficiency of the substrate is significantly improved, which lays a foundation for subsequent heat dissipation channels; a metallized microchannel is formed in the substrate by using a laser microprocessing and electrochemical deposition combined process, a high-efficiency longitudinal heat dissipation path is established, and the heat generated by high-power-density chips is effectively led out.