The invention belongs to the field of circuit board
processing, and particularly relates to a circuit board and a
processing method thereof, and the method comprises the following steps: transferring an image on a production film to a plate;
electroplating a conductive layer on the exposed
copper sheet of the circuit pattern of the board and the hole wall; removing an anti-
electroplating covering film layer of the plate by using a cleaning solution to
expose a non-circuit
copper layer of the plate; the plate is installed in a
machining device to be subjected to acid
pickling, an exposed
copper layer on the plate is removed through an acid
pickling solution, and the residual acid
pickling solution on the plate is removed while the plate is separated from the acid pickling solution; the board is immersed in water, the board is cleaned, residual water on the board is removed while the board is separated from the water, the board is dried, and the circuit board is obtained; according to the method, the residual pickling solution on the plate can be removed while the plate is separated from the pickling solution, and the pickling solution is prevented from dripping on other equipment.