The utility model relates to a glue uniformizing
assembly used in a COB (
Chip On Board) process, which comprises a dustproof cap, a central control telescopic rod, a first hydraulic device, a lifting platform, a sensor, a
barrel cover, a supporting disc, a
rotating disc, a second hydraulic device, a pipeline, an outlet, an annular belt, an opening, a sliding chute, a glue discharging pipeline, a screw rod, a third hydraulic device, a workpiece, a buffer slot and a spray head, the dustproof cap is fixedly arranged above the
barrel cover, the outlet is fixedly formed in the
barrel cover, the opening is fixedly formed in the lower portion of the front face of the device, the first hydraulic devices and the second hydraulic devices are evenly and fixedly arranged below the barrel cover, the sensors are arranged on the two sides of the inner wall of the device, and the sliding grooves are evenly distributed in the inner wall of the device. The third hydraulic device is fixedly arranged on the inner wall of the device. A hollow telescopic rod is matched with a micro
air pump to solve the problem of unsmooth flowing of glue, double filter screens, a sensor and a hydraulic device are matched to realize accurate positioning of a workpiece, and the design of a supporting ring wall and a glue discharging pipeline solves the problem of excessive glue treatment.