2582 results about "Bonding process" patented technology

The present invention describes a process for three-dimensional integration of semiconductor devices and a resulting device. The process combines low temperature wafer bonding methods with backside/substrate contact processing methods, preferably with silicon on insulator devices. The present invention utilizes, in an inventive fashion, low temperature bonding processes used for bonded silicon on insulator (SOI) wafer technology. This low temperature bonding technology is adopted for stacking several silicon layers on top of each other and building active transistors and other circuit elements in each one. The back-side/substrate contact processing methods allow the interconnection of the bonded SOI layers.

A method and apparatus for a bonding process in a user terminal having a Bluetooth module. The method includes recognizing a barcode of a Bluetooth device to be connected using a camera module, acquiring bonding information of the Bluetooth device from the barcode, performing pairing with the Bluetooth device using the acquired bonding information, and establishing a connection between the user terminal and the Bluetooth device after performing pairing. The bonding information may also be acquired using a secure cable in another embodiment.

Disclosed are a method and a system for Bluetooth communication. In the Bluetooth system, a Bluetooth device includes: a Radio Frequency Identification (RFID) reader for reading out RFID information from the RFID Tag within an effective transmission and receiving range and outputting the RFID information; a control unit for activating the RFID reader when a request for Bluetooth connection using the RFID is inputted by a user in a Bluetooth communication mode, extracting the bonding information from the RFID information inputted from the RFID reader, and outputting the bonding information; and a Bluetooth module for receiving the bonding information outputted from the control unit, pairing the first Bluetooth device using the bonding information, and performing Bluetooth communication.

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation.

The invention discloses a specie limitation-free eucaryote gene targeting method having no bio-safety influence and a helical-structure DNA sequence, and belongs to the field of gene engineering. The specie limitation-free eucaryote gene targeting method comprises the following steps of 1, designing and constructing CRISPR/Cas9 and chimeric RNA, and 2, carrying out Cas9mRNA internal translation so that Cas9 nuclease and the chimeric RNA are bonded, carrying out fixed point clipping so that DNA double-chain cleavage is realized after the clipping, and introducing an exogenous DNA by induction of a natural DNA restoration process which is a non-homologous end bonding process of cells so that cell endogenous gene modification is realized. The specie limitation-free eucaryote gene targeting method has simple processes, realizes flexible site recognition and has low energy consumption.

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is disclosed, wherein the method lends itself to better automation of the manufacturing line as well as to improving the quality and reliability of the packages produced therefrom. This is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal formed into a web-like lead frame on one side, in contrast with the conventional fully etched stencil-like lead frames, so that the web-like lead frame, which is solid and flat on the other side is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation without having to cut into any additional metal. The use of the instant partially patterned lead frame in making ELP, ELPF and ELGA-type CSPs is also disclosed.

Methods and devices that include the use of venting elements for enhancing bonded substrate yields and regulating temperature. Venting elements are generally fabricated proximal to functionalized regions in substrate surfaces to prevent bond voids that form during bonding processes from affecting the functionalized regions. Venting elements generally include venting channels or networks of channels and/or venting cavities.

The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatuses may include a pattern roll including a pattern element protruding radially outward. The pattern element includes a pattern surface and includes one or more channels adjacent the pattern surface. The pattern roll may be positioned adjacent an anvil roll to define a nip between the pattern surface and the anvil roll, wherein the pattern roll is biased toward the anvil roll to define a nip pressure between pattern surface and the anvil roll. As substrates advance between the pattern roll and anvil roll, the substrates are compressed between the anvil roll and the pattern surface to form a discrete bond region between the first and second substrates. As such, during the bonding process, some yielded substrate material flows from under the pattern surface and into the channel to form a channel grommet region.

A hollow component for gas turbine engine, for example an outlet guide vane, is assembled from a body having at recessed pocket formed therein, and an aerodynamic cover bonded over the pocket. Both the cover and the body are constructed from materials which are not readily fusion weldable. The cover is attached to the body by a solid state bonding process, for example friction stir welding. The hollow component may also be built up from multiple individual components which are bonded to each other by a solid state bonding process such as friction stir welding.

A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass members together to create a water resistant electronic device.

This invention relates to a novel method of decreasing porosity of ceramics produced by sol-gel processing. The process of preparing chemically bonded sol-gel ceramics comprises phosphating a sol-gel derived oxide or hydrated oxide and polymerizing the phosphated product with heat treatment. Such combined sol-gel/chemical bonding process can be used to fabricate dense, thick ceramics or ceramic coatings for a variety of applications, including high temperature corrosion protection, wear resistance, dielectric properties, non-sticky surfaces, bio-active ceramics, thermal barrier ceramics, non-wetted surfaces, and others.

A golf club head (20) having a body (22) with a front wall (30) with an opening (32) and a striking plate insert (40) is disclosed herein. The striking plate insert (40) preferably includes an outer layer (61) and an inner layer (65) that are joined together by an explosion bonding process. The inner layer (65) is preferably composed of a material that has a lower yield strength than that of the outer layer (61). The explosion bonding process results in the striking plate insert having an increased yield strength relative to the yield strengths of the individual layers. The golf club head (20) preferably has a moment of inertia, Izz, about the Z axis through the center of gravity of the golf club head ranging from 2700 g-cm² to 4000 g-cm².

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation.

A method for fabricating semiconductor and electronic devices at the wafer level is described. In this method, dielectric material is used to wafer bond a device wafer to a submount wafer, after which vias can be structured into the submount wafer and dielectric bonding material to access contact pads on the bonded surface of the device wafer. The vias may subsequently be filled with electrically and thermally conducting material to provide electrical contacts to the device and improve the thermal properties of the finished device, respectively. The post-bonding process described provides a simple, cost-effective, non-alignment method for fabricating a variety of electronic and semiconductor devices, particularly light emitting diodes with electrical contacts at the bottom of the chip.

Electrically conductive workpieces with facing surfaces are bonded with an adhesive that is filled with conductive metal particles that are reactive with the surfaces of the workpieces. In the bonding process the surfaces are coated with the adhesive, pressed together and an electric current passed between them to momentarily melt the conductive particles. The molten droplets agglomerate and wet the facing surfaces. When the molten clusters re-solidify, electrically conductive paths are formed between the workpieces. For example, the practice is useful for bonding ferrous-based or aluminum-based alloy sheets, strips or plates in making products such as bipolar plates for fuel cells.