The invention discloses a high-strength and high-
conductivity copper-
nickel-
silicon alloy for a
lead frame and a preparation method of the high-strength and high-
conductivity copper-
nickel-
silicon alloy. The high-strength and high-
conductivity copper-
nickel-
silicon alloy comprises the following components in percentage by
mass: 1.75-1.86 wt% of Ni, 1.02-1.1 wt% of Co, 0.54-0.62 wt% of Si, 0.12-0.13 wt% of Mg, less than or equal to 1.0 wt% of Ag and the balance of Cu. The preparation method comprises the following steps: 1) preparing the raw materials according to the alloy components and the
mass percentage content, and carrying out alloy
casting by using a vacuum
melting furnace; (2) the cast
ingot is subjected to
solution treatment and then rapidly water-cooled to the
room temperature, so that the
solid solution state of the alloy is reserved; the method comprises the following steps of (1) carrying out primary cold rolling on a cast
ingot, (2) carrying out secondary cold rolling on the cast
ingot, (3) carrying out hot rolling on the cast ingot after surface defects of the cast ingot are milled off, (4) carrying out primary cold rolling, annealing for 4 hours at the temperature of 420-440 DEG C, carrying out secondary cold rolling, annealing for 4 hours at the temperature of 310-330 DEG C, carrying out aging treatment until the thickness is 0.2 mm, carrying out
tertiary aging treatment at the temperature of 100-400 DEG C for 2-20 hours, and carrying out
air cooling to the
room temperature. The highest tensile strength of the obtained
copper alloy strip is 825 MPa, the highest yield strength is 790 MPa, the highest
hardness is 252.9 HV, the highest electric conductivity is 46.17% IACS, and the highest elongation is 3.16%.