The invention belongs to the technical field of
semiconductor processing, and particularly relates to a shell
welding technology and device for
semiconductor vacuum equipment manufacturing, and the technology comprises the steps: carrying out the
surface cleaning of a to-be-welded region of a
semiconductor vacuum equipment shell, and removing an oxidation layer, oil stains and impurities; the shell is placed on a special
welding tool and fixed through a positioning pin and a clamp, and the accuracy and stability of the
welding position are ensured; the welding tool and the shell are placed in a
vacuum chamber, local heating is conducted on a welding area in a high-frequency
induction heating or resistance heating mode, the
heating temperature is controlled to be 80%-95% of the material
melting point, and the
heating time is controlled to be 1-10 seconds; applying
constant pressure to the welding area to ensure sufficient bonding of a welding interface; and after heating is stopped, the pressure is kept, the shell is slowly cooled to the
room temperature, vacuum degree testing and appearance inspection are conducted on the welded shell, it is ensured that the welding quality meets the requirement, and the effects that the high vacuum degree requirement is considered, cost is reduced, and operation is simplified are achieved.