189 results about "External circuit" patented technology

A power supply circuit and a power supply device, and the power supply circuit includes a bridge switching circuit, a transformer, a resonant circuit, a rectifier circuit. The bridge switching circuit, the transformer, the resonant circuit, and the rectifier circuit are sequentially connected in series. The resonant circuit includes an induction coil connected in series between the transformer and the rectifier circuit. In the case that the inductive coil is connected in series in the circuit, the inductive coil can participate in conductive charging as an inductor in the resonant circuit. Further, the inductive coil can also receive the inductive voltage wirelessly transmitted by the external circuit through electromagnetic induction, and the inductive voltage can be transmitted to the load through the rectifier circuit to achieve inductive charging.

This disclosure relates to a touch sensor, display device, touch apparatus, and touch system. The touch sensor includes: a plurality of touch electrodes for sensing touch signals; a control circuit electrically connected to a first terminal of each touch electrode; and a plurality of switching units, each switching unit electrically connected between the second terminals of two touch electrodes; wherein a sensing loop is formed between the conducting switching unit, the two electrically connected touch electrodes, and the control circuit. Due to the simple structure of the switching unit, the complexity of the touch sensor structure is reduced by replacing the external circuitry with the switching unit to form the sensing loop.

The invention discloses a stacked quantum chip supporting structure. The stacked quantum chip supporting structure comprises a first chip and a second chip, a cut-off layer is arranged on the end face between the first chip and the second chip, the cut-off layer is provided with multiple sets of limiting columns, and the first chip and the one or more second chips are aligned and bonded through the limiting columns to form a multi-layer stacked structure. According to the invention, a plurality of groups of limiting columns are arranged at the corresponding positions of one or more cut-off layers between the chips, so that the stress can be better balanced without influencing the wiring of the chips, the stress is more uniform and the chips are not deformed when the chips are subjected to flip-chip bonding or stacking design, and the sizes of the gaps between the chips can be determined by controlling the heights of the limiting columns, so that the yield of the chips is improved. Gaps and design are ensured to be consistent, and the problems of inclination, collapse and the like after multiple layers of chips are stacked are effectively solved; in addition, a lantern ring structure is formed by mutually embedding and connecting the coating cavities, so that the supporting stability is further improved, interconnected metal can be effectively prevented from overflowing to influence an external circuit structure, and the gap distance between the chips can be accurately controlled.

The application provides a kind of vehicle lamp intelligent control system with functional safety design, including communication module, main control module, execution module, detection module and power module.For main control module, monitor whether main control information processing fails, does not control vehicle lamp work correctly, if yes, reset control is carried out to external circuit;For communication module, monitor whether communication failure occurs according to communication response mechanism, remind driver of failure cause after monitoring communication failure;For power module, monitor power module output voltage, software and hardware failure, reset processing is carried out to power chip and MCU when failure occurs;For detection module, monitor whether execution module lights corresponding lamp according to requirements, if execution module does not light lamp as required, pass this information to main control module, remind driver of failure cause.The application can reduce system failure and random failure risk, the whole system is more reliable, and driver, passenger and road related personnel are safer.

According to various aspects, an electronic circuit (100) is provided, wherein the electronic circuit (100) comprises: an input interface (104) and an output interface (106) for coupling to an external circuit (160); and a trained artificial neural network (102) designed to: receive one or more input signals (110, 112) which represent one or more operating parameters (120) of the external circuit (160) at a predefined point in time within a first cycle of a duty cycle signal; determine a duty cycle (122) to be used in a second cycle of the duty cycle signal after the first cycle; and provide an output signal (114, 116) to the external circuit (160) which represents the determined duty cycle.

Systems, devices, and methods for reducing Vpass disturb are provided. In one aspect, a semiconductor device includes a first deck and a second deck, each including memory cells coupled to corresponding word lines; and a peripheral circuit coupled to the memory array structure. For programming a first memory cell of the first deck, the peripheral circuit configured to: apply a first voltage to a first word line coupled to the first memory cell; apply a second voltage to a second word line of the first deck; apply a third voltage to a third word line between the first word line and a fourth word line of the second deck; and apply a fourth voltage to the fourth word line. The first voltage is greater than the second voltage, the second voltage is greater than the fourth voltage, and the fourth voltage is greater than the third voltage.

A semiconductor structure and a forming method thereof, the structure comprising: a substrate comprising a plurality of active regions extending along a first direction and arranged in parallel along a second direction, the first direction being perpendicular to the second direction; a plurality of gate structures in each active region, the gate structures being arranged in parallel along the first direction and extending across the active region along the second direction; and source-drain doped layers in the active regions on both sides of the gate structures, the source-drain doped layers being arranged alternately with the gate structures along the first direction, and the source-drain doped layers comprising source regions and drain regions arranged alternately, the source regions being used for grounding and the drain regions being used for external circuit connection, the source regions and the drain regions of the source-drain doped layers of adjacent active regions being arranged alternately along the second direction. The present application is advantageous to improve the working performance of the semiconductor structure.

The application discloses a PIN type back incidence germanium-silicon photodiode based on inductance peaking, and the photodiode structure sequentially comprises a back incidence area, an absorption area and a collection area from top to bottom; the back incidence area comprises a silicon substrate and silicon microlenses formed by etching on the back surface of the silicon substrate; the absorption area comprises a doped area and a germanium absorption layer, the built-in electric field is formed by P-type and N-type doping of the doped area, and the germanium absorption layer is used for absorbing incident photons and generating photo-generated carriers; the collection area comprises a self-alignment resistance layer, an interlayer dielectric layer, a coplanar waveguide electrode and a metal bump, and the geometric parameters of the coplanar waveguide electrode are optimized to introduce a compensation inductance L p The inductance peaking is realized, so that the bandwidth of the photodiode is optimized; the metal bump is arranged on the surface of the coplanar waveguide electrode to realize flip-chip bonding of the photodiode and an external circuit. p The bandwidth of the device can be significantly improved under the premise of ensuring high responsivity and low dark current.

This application discloses a relay, relating to the field of relay technology. The relay includes a housing, a fixed terminal portion, a movable terminal portion, and an electromagnet. Both the fixed and movable terminal portions are housed within a cavity. The fixed terminal portion is used for electrical connection to an external circuit. The electromagnet includes a coil and an armature. The coil drives the armature to rotate. The armature is rotatably disposed in the housing and abuts against the movable terminal portion, and can drive the movable terminal portion to abut against or disengage from the fixed terminal portion. The relay also includes an auxiliary contact assembly. Mounting seats are provided at both ends of the coil. The auxiliary contact assembly is disposed in one of the mounting seats or the housing. The auxiliary contact assembly includes a fixed auxiliary contact and a movable auxiliary contact. The armature includes two spaced-apart push rods, and the movable auxiliary contact abuts against one of the push rods. The technical solution of this application can achieve compatibility with auxiliary contact assemblies in different mounting orientations, allowing the relay platform to adapt to different pin lead-out modes.

This invention provides a self-driven monitoring-type uranium adsorption and recovery system, belonging to the field of radioactive wastewater treatment and resource recovery technology. The system uses a proton exchange membrane (MFC) as its basic architecture, separating the anode and cathode chambers. Its core innovation lies in the biomimetic anode in the anode chamber, a three-dimensional porous conductive composite material formed by the self-assembly and freeze-drying of graphene oxide and uranium-reducing microorganisms, possessing both high-efficiency adsorption, biocatalysis, and rapid electron transfer functions. An external circuit monitoring system collects loop current / voltage signals in real time, using current decay as an early warning indicator of adsorption saturation. The uranium recovery unit removes UO2 particles from the biomimetic anode using physical or chemical methods, achieving resource recovery, and the anode is regenerable and reusable. This system integrates adsorption, in-situ reduction, self-driven monitoring, and resource recovery, solving the problems of difficult adsorbent regeneration, lagging monitoring, reliance on external energy, and complex recovery processes in existing technologies.

This invention proposes an optical module, comprising: a housing with an internal assembly cavity, an assembly hole at one end of the housing, and several through holes; a sleeve with a fixing part at its inner end, a fixing groove in the fixing part, and a light-transmitting hole coaxial with the sleeve at the bottom of the fixing groove, the outer end of the sleeve protruding through the assembly hole to the outside of the housing; and a TO optical component fixed in the fixing groove, with its light receiving end and / or light emitting end facing the light-transmitting hole, and its electrical pins protruding through the through holes to the outside of the housing. This invention's miniature optical module, with the TO optical component's electrical pins protruding to the outside of the housing for connection to an external circuit board, eliminates the need for a circuit board inside the housing, thus reducing the module's size. The TO optical component requires no complex support fixtures, has a compact structure and high integration, further reducing module size and achieving miniaturized packaging of the optical module.

The utility model discloses a charging pile power line connector, including shell and first electrically conductive column, first electrically conductive column is cylindrical, and the upper portion of first electrically conductive column is equipped with upper cavity, and the lower part is equipped with lower cavity, the upper end of upper cavity and the lower end of lower cavity all are equipped with the opening, and the crown spring is all equipped in upper cavity and lower cavity, be equipped with a plurality of first jack for accommodating first electrically conductive column in the shell, the top of shell is connected with the bottom of an expansion shell, and the second jack of being consistent with the first jack number is equipped in expansion shell, and the second jack is communicated with first jack one to one. Since the above technical scheme is adopted, compared with the prior art, the utility model realizes the pluggable connection between first electrically conductive column and external power line, so that the first electrically conductive column external circuit connection side will not be deformed, and the external wire and power line connector can be replaced and reused.

A power supply circuit and power supply equipment are disclosed. The power supply circuit includes a bridge switching circuit, a transformer, a resonant circuit, and a rectifier circuit. The bridge switching circuit, transformer, resonant circuit, and rectifier circuit are connected in series. The resonant circuit includes an induction coil connected in series between the transformer and the rectifier circuit. With the induction coil connected in series in the circuit, the induction coil can both act as an inductor in the resonant circuit to participate in conductive charging, and simultaneously, the induction coil can receive an induced voltage wirelessly transmitted from an external circuit through electromagnetic induction. This induced voltage can be transmitted to the load through the rectifier circuit to achieve inductive charging.

The application discloses a PIN type back incidence germanium-silicon photodiode based on inductance peaking, and the photodiode structure sequentially comprises a back incidence area, an absorption area and a collection area from top to bottom; the back incidence area comprises a silicon substrate and silicon microlenses formed by etching on the back surface of the silicon substrate; the absorption area comprises a doped area and a germanium absorption layer, the built-in electric field is formed by P-type and N-type doping of the doped area, and the germanium absorption layer is used for absorbing incident photons and generating photo-generated carriers; the collection area comprises a self-alignment resistance layer, an interlayer dielectric layer, a coplanar waveguide electrode and a metal bump, and the geometric parameters of the coplanar waveguide electrode are optimized to introduce a compensation inductance L p The inductance peaking is realized, so that the bandwidth of the photodiode is optimized; the metal bump is arranged on the surface of the coplanar waveguide electrode to realize flip-chip bonding of the photodiode and an external circuit. p The bandwidth of the device can be significantly improved under the premise of ensuring high responsivity and low dark current.

The present application relates to the technical field of batteries. Provided are a battery cell and an electric device. In the present application, the battery cell comprises a cell body and a connecting piece. The cell body is provided with a plurality of stacked tabs, the plurality of tabs forming a pre-welding region by means of ultrasonic welding. The connecting piece comprises a first connecting portion, a bending portion and a second connecting portion which are connected in sequence, wherein the bending portion has at least two separated sub-layers, such that the connecting piece can bend at the bending portion. The pre-welding region is connected to the first connecting portion by means of ultrasonic welding, and the second connecting portion is configured for connecting to the tabs and an external circuit. In this way, the welding quality and welding strength between the tabs and the connecting piece can be improved, thereby improving the quality of the battery cell.

This invention discloses a battery output structure and a battery structure. The battery output structure is used to connect a battery cell to an external circuit. It includes a battery management system and a top cover. The battery management system includes a connection side and an output side. The connection side is electrically connected to the battery cell. The output side is provided with a pin-type connection component for electrically connecting to an external circuit. The top cover is disposed on the output side and is fitted to the outer extension of the battery management system to form a sealed space. The top cover extends outward along the extension direction of the pin-type connection component to form a sleeve structure. The sleeve structure connects the sealed space and the outside. The pin-type connection component passes through the sleeve structure. This invention aims to solve the technical problems of complex battery output structures and poor sealing performance in the prior art.

The invention relates to a micro-ring modulation light engine based on glass substrate packaging and a manufacturing method thereof, and the light engine comprises a glass substrate which is provided with a first plate surface and a second plate surface; the micro-ring modulation optical chip and the electric chip are respectively mounted on the first plate surface through a first connecting structure, and the optical chip and the electric chip are electrically connected through an electric interconnection structure formed in the glass substrate; the engine substrate is electrically connected with the second board surface through a second connecting structure, so that the micro-ring modulation optical chip and the electric chip are electrically communicated with an external circuit; and the optical coupling element is optically coupled to the optical port of the optical chip. In the invention, the glass substrate is used as an adapter plate to connect the photoelectric chip and the engine substrate, so that the micro-ring modulation optical chip and the electric chip can be integrated on the glass substrate in a high-density manner through a packaging technology, and the problems of high I / O quantity and high-bandwidth electric interconnection between the micro-ring modulation optical chip and the driving chip can be well solved; the integration level and the photoelectron interconnection density which are far higher than those of a traditional packaging scheme are achieved; through high-density integration, extremely high bandwidth density is realized in an extremely small packaging size, and dual requirements of a CPO / NPO optical engine on extreme performance and compact space occupation can be met.

The utility model discloses a kind of integrally formed new shell structure, relate to hall component assembly technical field.The utility model includes plastic shell, and hall component is installed in the inside of plastic shell, laminated riveting magnetic core and copper bar;Hall component, laminated riveting magnetic core and copper bar are integrally formed with plastic shell using injection molding machine, Hall component, laminated riveting magnetic core and copper bar are prepositioned in mold cavity, and seamless fusion of each component and plastic shell is realized by high-temperature plastic melt injection coating solidification, the Hall component is fixed in the left side of plastic shell inner cavity, and its strip-shaped lead passes through shell reserved hole and extends to outside, convenient for welding with external circuit.The product of the utility model is integrally injection molded, so that Hall component, laminated riveting magnetic core, copper bar can be fixed, and the assembly of laminated riveting magnetic core has no difficulty, product can be directly formed on mould, without increasing additional cost.

This utility model relates to the field of charging socket technology, and more particularly to a waterproof TYPE-C side-plug charging socket. Its technical solution includes: a shell with a plug at one end, a first adhesive groove at the other end, and a second adhesive groove at the bottom; a metal bracket, which is fixed to the outside of the shell by a slot on the shell; an electrical connector located inside the shell, with its front end extending into the plug and having an upper row of terminals, and its bottom having a lower row of terminals; a rear cover located behind the electrical connector and connected to the shell; and a sealing ring installed in a limiting groove on the outside of the plug; wherein, the first adhesive groove is located between the shell and the rear cover, and waterproof adhesive is filled into the first and second adhesive grooves; the bottom of the metal bracket has a limiting clip for insertion into an external circuit board. This utility model, through the reasonable design of the adhesive groove, sealing ring, and metal bracket limiting structure, effectively improves waterproofness and installation stability, enhancing the overall performance of the charging socket.

The application discloses a battery monomer, a battery pack and a power utilization device, and relates to the technical field of batteries. One of the motor assemblies is a positive electrode assembly, the tabs of the positive electrode assembly are connected to each other, and the other motor assembly is a negative electrode assembly, the tabs of the negative electrode assembly are connected to each other. The positive electrode assembly and the negative electrode assembly are both connected with extended tabs, the tabs corresponding to the positive electrode assembly are connected with one tab and one extended tab, the tabs corresponding to the negative electrode assembly are connected with one tab and one extended tab, the distance between the extended tab and the tab is greater than the distance between the tab and the tab, and the extended tab is used for electrical connection with an external circuit. In the embodiment of the application, the extended tab and the tab are both connected to the corresponding tab, and the length of the extended tab extending out of the tab is greater than the length of the tab extending out of the tab. Electrical conduction between the extended tab and the outside can avoid the additional connection of the tab leading-out piece in the battery monomer, thereby saving the thickness of the tab leading-out piece and increasing the energy density of the battery monomer.

This application provides an integrated resistive LED chip and LED strip. The chip includes: a support carrier with a first pad, a second pad, and a third pad spaced apart sequentially; a resistive element with its two ends electrically connected to the first pad and the second pad, respectively; and an LED chip fixed to the second pad, with its first electrode electrically connected to the first pad and its second electrode electrically connected to the third pad. By directly mounting the resistive element on the support carrier and electrically connecting it to the pad, this application integrates the resistive function within the LED chip, allowing the LED chip to be directly connected to external circuits without the need for additional resistors, reducing assembly steps before use and improving product integration.

The application discloses an ultrasonic sensor, an assembling structure thereof and a robot, and belongs to the technical field of sensing and detection. The ultrasonic sensor comprises a shell, a circuit board and a piezoelectric ceramic arranged in the shell. The circuit board is provided with a wiring terminal, one end of the wiring terminal is directly fixed on the circuit board, and the other end of the wiring terminal extends from a first end of the shell and is used for being connected with a mating terminal outside. The ultrasonic sensor adopts the structure form that the wiring terminal is directly fixed on the circuit board, so that the stability and the universality of the sensor can be better improved, the problems that the wires are prone to be broken and loosened and the wires cannot be connected with external circuits due to insufficient reserved length of the wires are effectively solved, the overall structure of the ultrasonic sensor is more firm and reliable, the ultrasonic sensor can be assembled into different types of machines, the design is more flexible, and the universality is stronger.

The application relates to the technical field of automobile air conditioning systems, and discloses a temperature compensation device for an automobile air conditioner speed regulating resistor, which comprises a temperature compensation module, a speed regulating resistor module and a support assembly. The temperature compensation device for the automobile air conditioner speed regulating resistor is characterized in that the lead of the thermistor is vertically welded with the compensation circuit board, the constant pressure exerted by the elastic pressing piece in the connecting support is combined, the thermistor is ensured to be in zero-gap contact with the automobile air conditioner speed regulating resistor body, accurate compensation in the whole temperature range is realized, the stability of the fan rotating speed is improved, the connecting support integrates the compensation circuit board and the spring-driven clamping rod structure, the number of parts is reduced compared with a traditional scheme, the heat-conducting sheet is directly connected with the heat-dissipating sheet to replace the external heat-dissipating circuit, the external circuit design is reduced, the specific surface area can be increased through the honeycomb holes, the natural convection efficiency is improved through the micro-arc oxidation layer, the heat-dissipating effect is optimized, and the system complexity is reduced.

Provided are a flexible OLED light-emitting module and a preparation therefor. The flexible OLED light-emitting module includes: a flexible substrate having a plurality of holes A, an OLED having a plurality of holes B, an encapsulation layer having a plurality of holes C, and an external circuit, where the holes A, B and C coincide to form through-holes penetrating the light-emitting module, and the OLED device has a common organic light-emitting layer. The new flexible OLED light-emitting module has good air permeability due to through-holes and thus can be used in various phototherapy devices so that the phototherapy devices not only have a large light-emitting area, but also have good air permeability and are suitable for long-term wearing. Further provided are a method for preparing the flexible OLED light-emitting module and a phototherapy device including the flexible OLED light-emitting module.

The application discloses a perovskite photovoltaic module based on a sealing structure and a preparation method thereof. The perovskite photovoltaic module comprises a photovoltaic cover body and a conductive base, the photovoltaic cover body is a cover-shaped structure with an inner cavity and an opening, and the photovoltaic cover body comprises, from outside to inside, a light-transmitting conductive base cover, a perovskite-containing photovoltaic coating and a back electrode. The conductive base cover, the photovoltaic coating and the back electrode are combined into an integrated Ohmic contact. After excluding moisture and oxygen in the inner cavity, the opening end of the photovoltaic cover body is sealed through the conductive base. The module conductive base is designed as a circuit connection structure for connecting an external circuit. The application solves the problem of environmental degradation of the perovskite coating through structural design of the photovoltaic module, is suitable for outdoor photovoltaic modules, realizes low-cost maintenance and large-scale production, and the photovoltaic module can capture light in multiple directions, enhance light absorption, reduce reflection and improve photoelectric conversion performance.

The embodiment of the application relates to the technical field of semiconductor technology, and discloses a fast recovery diode and a power semiconductor device, the fast recovery diode comprising: a cathode electrode configured as a cathode lead-out end of the fast recovery diode, used for realizing electrical connection of an external circuit; a cathode-side semiconductor layer comprising a composite structure layer and an N-type semiconductor layer which are sequentially stacked in a direction away from the cathode electrode, the composite structure layer comprising P+ type semiconductor islands and an N+ type semiconductor layer; a plurality of P+ type semiconductor islands are spacedly embedded in the N+ type semiconductor layer, used for optimizing reverse recovery characteristics of the device; an anode-side PN junction structure located on a side of the cathode-side semiconductor layer away from the cathode electrode; and an anode structure located on a side of the anode-side PN junction structure away from the cathode-side semiconductor layer; the fast recovery diode provided by the application avoids the problem that the FRD device is invalid due to a step of reverse recovery current in the FRD reverse recovery process.