1384 results about "Die bonding" patented technology

The invention relates to the technical field of semiconductor mounting equipment, in particular to double-track die bonding equipment and a die bonding method. The double-track die bonding equipment comprises a bearing table, the bearing table is provided with a mounting area, a glue dipping area and a feeding area, and the glue dipping area and the feeding area are arranged adjacently and are adjacent to the same side of the mounting area; the mobile die bonding table assembly and the mobile transfer table assembly are arranged on the bearing table, the mobile die bonding table assembly comprises a first track, a second track, a first die bonding table and a second die bonding table, the first die bonding table is in sliding connection with the first track, and the second die bonding table is in sliding connection with the second track; the first track and the second track respectively extend from the glue dipping area to the mounting area. By introducing the design of the double die bonding tables which work alternately, glue dipping is only carried out on a partial area of the substrate each time, and chip mounting is immediately carried out on the partial area, so that the mounting quality and efficiency are ensured.

The invention provides a chip bonding wire three-dimensional measurement method and system based on an inner cavity reflection camera system, and relates to the technical field of three-dimensional measurement. The method comprises the following steps: performing one-time exposure imaging on a chip bonding wire to be detected through an inner cavity reflection camera system to obtain at least three mutually independent visual angle images in the same frame; performing brightness normalization compensation and geometric calibration on the visual angle image to obtain a visual angle data set with uniform brightness and correlation; pairing the view angle data sets in pairs, extracting parallax information by using a feature matching algorithm based on optical flow, and fusing multiple pairs of parallax to generate a lead three-dimensional point cloud; performing noise filtering and curved surface reconstruction on the three-dimensional point cloud to obtain a continuous three-dimensional grid model of a lead; and performing texture mapping on the three-dimensional grid model by adopting any visual angle in the visual angle image or the combination of the visual angles, and outputting a lead three-dimensional reconstruction result with textures. According to the invention, high-precision, large-depth-of-field and rapid three-dimensional measurement of the chip bonding wire is realized.

The invention relates to the technical field of semiconductor die bonding equipment, in particular to die bonding equipment and a die bonding method. According to the die bonding equipment, a track module comprises a first track and a second track, the second track is arranged in the connecting line direction of a feeding module and a discharging module, and the first track is arranged between the feeding module and the second track and extends downwards in the width direction of the first track; the dispensing module comprises a first dispensing mechanism and a second dispensing mechanism. The first dispensing mechanism is arranged at the end, away from the second track, of the first track. The crystal supply module and the transfer table module are located on the side face, close to the first dispensing mechanism, of the second track and correspond to the dispensing module; and the mounting binding head module is arranged above the second track, and a second visual detector and a second dispensing mechanism are arranged on the mounting binding head module. The die bonding equipment can realize two working modes of first dispensing and then identification and first identification and then dispensing, is suitable for mounting of different types of chips, and has higher applicability.

The invention relates to the technical field of semiconductors, in particular to die bonding equipment and a die bonding method, and the die bonding equipment comprises a bearing table, and a feeding device, a discharging device, a mounting device, a glue dipping device, a transfer table device and a die supply device which are mounted in the bearing table; the feeding device and the discharging device are arranged at the two opposite ends of the bearing table in parallel, the surface mounting device is arranged between the discharging end of the feeding device and the feeding end of the discharging device, the glue dipping device is located on one side of the feeding device, and the glue dipping device and the transfer table device are arranged on the two sides of the surface mounting device respectively. The crystal supply device is located on the side, away from the mounting device, of the transfer table device. A movable main binding head assembly, a first binding head assembly and a second binding head assembly are arranged in the bearing table, the main binding head assembly is arranged on one side of the discharging device, the first binding head assembly is arranged on one side of the feeding device, and the second binding head assembly is arranged on one side of the crystal supplying device.

The present disclosure provides an automated die bonding of LED substrates system in which an automated die bonding inspection module is used to determine the quality of incoming processing material and an automated die bonding process module is used to process the processing material, an automated die bonding post-process module is used to inspect the resultant process material for acceptability, and an automated die bonding historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated die bonding process module and an automated die bonding integration module to update the automated die bonding process module based upon the results of the automated die bonding historical module.

The invention belongs to the technical field of semiconductor processing and manufacturing, and discloses a chip bonding device and a chip bonding system. The chip bonding device comprises a shell, a driving assembly, a sensor assembly and an adsorption assembly, the driving assembly comprises a first driving piece fixedly installed on the shell and a rotating shaft arranged at the output end of the first driving piece, the rotating shaft rotatably penetrates through the shell, and the shell is connected with the rotating shaft through a first thrust piece; the sensor assembly is fixedly installed on the shell, the sensor assembly is connected with the rotating shaft through the second thrust piece, and the sensor assembly can detect the force in the first range and the force in the second range; the adsorption assembly is arranged at the end, away from the first driving piece, of the rotating shaft and used for adsorbing chips. According to the chip bonding device, the problem of poor signal stability and reliability caused by rotation of the sensor assembly is avoided; due to the arrangement of the first thrust piece and the second thrust piece, the axial stress is effectively eliminated, and the accuracy of pressure measurement and feedback is ensured.

The invention discloses a multi-chip stacked packaging structure and a manufacturing method, and the manufacturing method comprises the steps: designing a welding spot which is downwards connected to a lower-layer chip and a welding spot which is upwards connected to an upper-layer chip on a metal frame according to the connection demands of a wafer, placing the wafer in a welding pad on the standardized metal frame, and carrying out the die bonding treatment, bonding the pin interconnection point of the wafer with the welding point through a connecting line to obtain an electric connection module; carrying out injection molding packaging on the electric connection module, then carrying out cutting processing to form a plurality of single chips, and carrying out test processing on the single chips; and stacking the plurality of qualified single chips on the circuit board in the vertical direction, and packaging the stacked structure in the single packaging cavity to obtain the multi-chip stacked packaging structure. According to the invention, through vertical stacking and single packaging cavity packaging, high integration level and miniaturized packaging are realized, the excellent thermal conductivity of the metal frame enables the heat dissipation performance of the chip to be improved, and the service life of the chip is prolonged.

The invention relates to the technical field of semiconductors, in particular to a chip mounter binding head device, a mounting method and die bonding equipment, and the chip mounter binding head device comprises a mounting module, a force control module and a fixed seat; the mounting module comprises a main shaft and a main shaft seat, the main shaft rotatably penetrates through the main shaft seat, and the working end of the main shaft is exposed out of the main shaft seat; the force control module comprises a voice coil driving assembly, a force control connecting block and a guide rail assembly, the voice coil driving assembly comprises a voice coil motor and a controller, the voice coil motor is installed on the fixing base, and the controller is electrically connected with the voice coil motor; the force control connecting block is respectively connected with the voice coil motor and the bottom of the spindle seat; the guide rail assembly is arranged between the spindle seat and the fixing seat, and the spindle seat is slidably connected with the fixing seat through the guide rail assembly. The mounting method and the die bonding equipment provided by the embodiment of the invention have the same beneficial effects as the head binding device of the chip mounter.

A device includes a photonic routing structure including a silicon waveguide, photonic devices, and a grating coupler, wherein the silicon waveguide is optically coupled to the photonic devices and to the grating coupler; an interconnect structure on the photonic routing structure, wherein the grating coupler is configured to optically couple to an external optical fiber disposed over the interconnect structure; and computing sites on the interconnect structure, wherein each computing site includes an electronic die bonded to the interconnect structure, wherein each electronic die of the computing sites is electrically connected to a corresponding photonic device of the photonic devices.

In an embodiment, a package includes a first package structure including a first die having a first active side and a first back-side, the first active side including a first bond pad and a first insulating layer a second die bonded to the first die, the second die having a second active side and a second back-side, the second active side including a second bond pad and a second insulating layer, the second active side of the second die facing the first active side of the first die, the second insulating layer being bonded to the first insulating layer through dielectric-to-dielectric bonds, and a conductive bonding material bonded to the first bond pad and the second bond pad, the conductive bonding material having a reflow temperature lower than reflow temperatures of the first and second bond pads.

The invention relates to a binding head device, a mounting method and die bonding equipment. The binding head device is used for picking up a chip and mounting the chip on a substrate, and comprises a force control detection module, a force control driving module and a mounting module; the force control detection module comprises a reference block, a photoelectric sensor and a signal amplifier, and the signal amplifier is in signal connection with the photoelectric sensor; the mounting module comprises a main shaft and a main shaft seat, the main shaft penetrates through the main shaft seat and can lift relative to the main shaft seat, and the working end of the main shaft is exposed out of the main shaft seat; the top end of the reference block is connected with the force control driving module; the bottom end of the reference block is connected with the transmission end of the main shaft; the photoelectric sensor is arranged on the spindle seat, one end of the photoelectric sensor emitting a light source extends into the spindle seat, the other end of the photoelectric sensor is connected to the signal amplifier, and the photoelectric sensor can emit the light source to the top end face of the reference block. And when the chip is in contact with the substrate, the signal amplifier determines the height variation of the reference block by detecting the light quantity variation reflected and received by the light source.

The invention relates to a die bonding device and method. The die bonding equipment is used for realizing chip packaging on a mounting base, and comprises a bearing platform, and a base bearing device, a mounting binding head device and an upper view positioning device which are mounted on the bearing platform, the base bearing device moves on the bearing platform in the X-axis direction and the Y-axis direction, and the mounting binding head device moves above the base bearing device in the X-axis direction, the Y-axis direction and the Z-axis direction. The base bearing device is provided with a hollow channel in the vertical direction, and the top view positioning device moves in the hollow channel in the Z-axis direction. The base bearing device is provided with a base bearing platform for placing the mounting base, when the mounting base is arranged on the base bearing platform, the supporting part of the mounting base is detachably fixed on the base bearing platform, and the mounting part and the upper view alignment part of the mounting base are respectively positioned on one side close to the mounting binding head device and the upper view positioning device; when the base bearing device moves, the base bearing table and the mounting base move synchronously, so that the upper view alignment part and the supporting part enter the recognition area of the upper view positioning device.

The invention relates to the technical field of semiconductor display devices, in particular to an anti-crosstalk light-emitting unit and a manufacturing method thereof, and a color filter layer, a color conversion layer, an inorganic layer, a chip bonding layer, a micro light-emitting diode layer and a reflecting layer are sequentially manufactured on a substrate from bottom to top; manufacturing a discontinuous filling layer on the surface of the reflecting layer; and grinding, thinning, cutting and splitting the substrate to form an independent discrete device. By arranging the reflecting layer covering the packaging structure and the discontinuous chip bonding layer, light emitted by the quantum dots and the micro light-emitting diodes is reflected by the reflecting layer, light crosstalk between the display units is avoided, the reflected light excites the quantum dots again to emit light, and the light efficiency is improved. The chip bonding layer and the filling and leveling layer are arranged discontinuously, so that substrate warping caused by temperature rise and fall during large-size manufacturing is avoided. When cutting and splitting are carried out, the laser technology frequency can be reduced, the mass production efficiency can be improved, and the organic layer is removed, so that the occurrence of the double-cell problem of the chip can be greatly avoided.

The invention discloses die bonding equipment, and relates to the technical field of die bonding. The die bonding equipment comprises a rack, a die taking and pasting mechanism and a dispensing mechanism, and the die taking and pasting mechanism and the dispensing mechanism are both arranged on the rack. The wafer taking and pasting mechanism comprises a wafer disc, an overturning group and a pasting group which are continuously distributed along a first space axis; and the dispensing mechanism comprises a dispensing group and a chip mounting group which are continuously distributed along the axis of the second space. According to the technical scheme, the wafer disc, the overturning set and the chip mounting set of the wafer taking and chip mounting mechanism are continuously distributed along the first space axis, then the dispensing set and the chip mounting set of the dispensing mechanism are continuously distributed along the second space axis, and the first space axis and the second space axis are arranged in a spatial non-coplanar mode. The first space axis and the second space axis form the adjustable inclined included angle on the horizontal projection plane, the longitudinal space is effectively utilized, waste of the longitudinal space is reduced, and the space utilization rate is improved.

The invention discloses a preparation method and structure of an omnibearing heat dissipation Micro LED packaging module. The preparation method comprises the following steps: S1, customized manufacturing of a VC vapor chamber; s2, laminating a VC vapor chamber; s3, carrying out low-thermal-resistance die bonding; s4, gold wire protection and heat dissipation are integrated; s5, the VC vapor chamber is covered with packaging glue; s6, the VC vapor chamber is attached to the bottom of the optical lens; s7, connecting the module with a driver; s8, power-on detection is carried out; the structure comprises a multi-layer composite heat dissipation substrate, an FPCB, a packaging adhesive layer, an optical lens and a driving board. The multi-layer composite heat dissipation substrate, the FPCB, the packaging adhesive layer, the optical lens and a VC soaking plate in the driving plate form a closed-loop heat dissipation network; the VC vapor chamber with active circulation heat dissipation is obtained by changing the structure of the heat dissipation substrate, and the VC vapor chamber covers the gold wire protection glue, the bottom of the optical lens, the drive board shell and the back surface of the FPCB, so that the heat dissipation efficiency is improved, the working temperature of the module is reduced, the brightness of the product is improved, and the service life of the product is prolonged.

The invention discloses an AI visual detection method and system for a chip bonding packaging structure, and the method comprises the steps: collecting a preset number of historical normal chip bonding images, and marking a soldering tin region in the normal chip bonding images and the geometric parameters of corresponding soldering tin to form a training data set; constructing a preset semantic segmentation neural network capable of being trained, and performing deep learning training on the semantic segmentation neural network by using the training data set to obtain a soldering tin recognition model; collecting a to-be-detected bonding image of a to-be-detected chip bonding packaging structure, and inputting the to-be-detected bonding image into the soldering tin identification model to obtain geometric parameters of soldering tin in the to-be-detected bonding image; according to the geometric parameters of the soldering tin in the bonding image to be detected, whether bonding defects exist in the chip bonding packaging structure to be detected or not is judged according to a preset rule. According to the invention, the problem of low accuracy during chip bonding quality detection in the prior art is solved.

An original substrate structure is rearranged, a bonding pad comprises a bonding wire part and a die bonding part matched with the bonding wire part, the die bonding part comprises a common electrode part arranged in the center of a substrate and four die bonding sub-parts arranged in the circumferential direction of the common electrode part, and the die bonding sub-parts are used for bearing RGB chips. Wherein the arrangement mode of the RGB chips is changed into circumferential arrangement from linear arrangement, lamp bead abnormity caused by poor die bonding in the manufacturing process is reduced, meanwhile, each die bonding sub-part is electrically connected with the corresponding wire bonding part through a bonding wire, and the wire bonding parts and the common electrode parts are electrically connected with the corresponding pins, so that five pins exist on the back of the substrate, and the reliability of the substrate is improved. And finally, a bowl cup is fixedly arranged on the substrate and used for delineating any die bonding sub-part and the corresponding wire bonding part, the delineating die bonding sub-part is used for die bonding of the blue light chip, and the bowl cup is filled with white light packaging glue and used for displaying white light and improving the overall brightness of the lamp bead.

In an aspect, an IC device may include a structure wafer and a first die bonded to the structure wafer by a bonding layer. A first metallization structure is disposed below and electrically coupled to the first die opposite the structure wafer. A fill material is disposed between the structure wafer and the first metallization structure. A second metallization structure is disposed on top of the structure wafer. The second metallization structure includes a second plurality of inorganic dielectric layers. A second die is disposed on top of the second metallization structure and electrically coupled to the second metallization structure by a plurality of die connectors. A plurality of throughsubstrate vias electrically couple the first metallization structure to the second metallization structure.

The invention discloses a preparation method of an inverted LED packaging device, and relates to the technical field of semiconductor devices.The inverted preparation method comprises the steps that stamping, electroplating and injection molding are conducted on a tape-winding type metal plate, and a tape-winding type LED support is formed; bonding the flip LED chip on the tape winding type LED bracket through soldering paste to complete die bonding; the bonding pad of the flip LED chip is connected with the conductive area on the winding type LED support through the soldering paste in a reflow soldering mode; packaging glue is filled in the groove of the tape type LED support in a glue brushing mode, and baking and curing are carried out; according to the flip LED packaging device and the manufacturing method of the flip LED packaging device, the technical problem that in the prior art, a sheet type LED support is adopted for packaging, and the process efficiency is low can be solved.

Embedded sensor structures and stretchable embedded sensor films including a plurality of embedded sensor packages are described. An embedded sensor structure may include a sensor package including an integrated circuit (IC) die and sensor die bonded to a front side of the IC die, with the sensor die including a diaphragm that is deflectable toward a cavity. A planarization layer laterally surrounds the sensor package, and metal routing is formed on a top side of the sensor die and spanning over the planarization layer. Other aspects are also described and claimed.

The invention relates to the technical field of semiconductors, in particular to a die bonder and a correction method thereof, a computer readable storage medium and packaging equipment. The device is applied to a die bonder, and the die bonder comprises a swing arm capable of rotating, a suction nozzle fixedly connected with the swing arm, a die bonding lens and a die taking lens which are located above the swing arm, and a downward-looking flying shooting lens located below the swing arm. When the swing arm rotates, the suction nozzle passes through the visual fields of the three camera lenses, and a calibration jig is arranged on the swing arm; the correction method of the die bonder comprises the following steps: driving a swing arm to swing, and respectively acquiring camera pixel ratios and camera coordinate calibration of three camera lenses based on a calibration jig; the center coordinate of the center point of the suction nozzle is obtained through the down-looking flying shooting lens, the crystal taking coordinate of the suction nozzle is obtained through the crystal taking lens, and the crystal fixing coordinate of the suction nozzle is obtained through the crystal fixing lens; and based on the center coordinate, the die bond coordinate, the die pick-up coordinate, the die bond pixel ratio and the camera pixel ratio, acquiring a die pick-up position offset and a die bond position offset. The position of the suction nozzle can be accurately obtained.

The invention relates to the technical field of die bonding, and particularly discloses a preheating device and a preheating method for a eutectic machine, the preheating device comprises a mounting seat, a heating piece is arranged in the mounting seat, the heating piece can transfer heat to the mounting seat, and a mounting groove is formed in the bottom side of the mounting seat; the suction nozzle comprises an adsorption head and a suction pipe which are connected, the adsorption head is installed in the installation groove, the adsorption end of the adsorption head is exposed out of the outer side of the installation groove, and a temperature control gap is reserved between the adsorption head and the inner wall of the installation groove; and the adjusting part is arranged in the mounting seat and is used for adjusting the size of the temperature control gap so as to adjust the heat conduction efficiency between the mounting seat and the adsorption head. According to the invention, the chip can be preheated while being transferred, so that the working efficiency can be improved; through the arrangement of the temperature control gap, the heat conduction efficiency between the mounting seat and the adsorption head can be flexibly adjusted through the adjusting piece, so that the preheating temperature and the preheating efficiency of the chip are accurately controlled.

A method of manufacturing an electronic device is provided. The method includes the following steps: providing a substrate; forming a circuit structure on the substrate; forming a hole in the substrate; forming a conductive element in the hole; bonding a chip to the circuit structure; and performing a first cutting step to cut a portion of the circuit structure and the substrate, and forming a groove in the substrate.

The invention relates to the technical field of die bonding, in particular to a mounting assembly and die bonding equipment. The mounting assembly comprises a first fixing seat, a first fixing plate and a second fixing plate are arranged on the first fixing seat at intervals, a first driving part is mounted on the first fixing plate, a second driving part is mounted on the second fixing plate, a load mechanism is mounted on the first driving part, and a mounting mechanism is mounted on the second driving part; and the loading mechanism and the mounting mechanism are driven by the first driving piece and the second driving piece to move towards each other or move away from each other. The vibration generated in the moving process of the mounting mechanism is counteracted through the reverse movement of the load mechanism, so that the mounting precision is improved.

Gap-fill dielectrics for die structures and methods of forming the same are provided. In an embodiment, a device includes: an outer gap-fill dielectric having a first coefficient of thermal expansion; a first integrated circuit die in the outer gap-fill dielectric; a second integrated circuit die in the outer gap-fill dielectric; an inner gap-fill dielectric between the first integrated circuit die and the second integrated circuit die, the inner gap-fill dielectric having a second coefficient of thermal expansion, the second coefficient of thermal expansion being greater than the first coefficient of thermal expansion; and a third integrated circuit die over the inner gap-fill dielectric, the third integrated circuit die bonded to the first integrated circuit die and to the second integrated circuit die.

A structure includes a first device having a first chip and a second chip. The second chip has a first side with a plurality of bumps and a second side with a plurality of first superconducting lines. A solder bonded layer attaches the first chip to the second chip. A second device has a first side with a plurality of pads facing the plurality of bumps in the second chip and a second side opposite the first side having a plurality of second superconducting lines. A solder shield material surrounds the plurality of bumps and the plurality of pads, and the plurality of bumps on the second chip are bonded to the plurality of pads on the second device. The solder shield material is connected to the plurality of first superconducting lines of the first device and to the plurality of second superconducting lines of the second device.

The invention discloses a chip bonding head, and particularly relates to the technical field of chip manufacturing, the chip bonding head comprises a rotating assembly, an upper force control assembly, a height measurement assembly, a guide assembly and a lower force control assembly, a spring and a second suction nozzle are arranged in the lower force control assembly, the second suction nozzle is compressed and arranged at an upper connecting piece, and the spring is pressed at a step of the upper connecting piece. A middle hole of the lower force control assembly is connected with a first gas circuit of the main shaft, an inner hole of the end cover and a gas pipe of the hollow elastic body inner connector and used for chip adsorption, the gas circuits are independent of other gas circuits and do not affect other gas circuits, the accuracy of chip detection is guaranteed, and the position precision of chip bonding is improved.

The invention discloses a semiconductor die bonder based on intelligent visual control and a control method. The semiconductor die bonder comprises a vacuum adsorption bonding head, a chip transfer platform, a visual detection module, a dispensing module, an angle correction module and a die bonding module. On the basis of high-response high-precision positioning and detection of the visual detection module, angle deviation correction is carried out in the chip grabbing process, high-precision dispensing is achieved, and the die bonding efficiency and accuracy are improved.

A stacked quantum computing device including a first chip that includes a first dielectric substrate and a superconducting qubit on the first dielectric substrate, and a second chip that is bonded to the first chip and includes a second dielectric substrate, a qubit readout element on the second dielectric substrate, a control wire on the second dielectric substrate, a dielectric layer covering the control wire, and a shielding layer covering the dielectric layer.

The invention discloses a die bonding head. The die bonding head comprises a power element, a transmission air bag, an air bearing and a suction nozzle mechanism, the air floating bearing comprises an air floating shaft sleeve and an air floating shaft, the air floating shaft is rotationally arranged in the air floating shaft sleeve, and an air film gap is formed between the air floating shaft and the air floating shaft sleeve; the power element is connected with the transmission air bag and is used for outputting rotary motion; the transmission air bag is connected with the first end of the air floating shaft and used for power transmission. And the suction nozzle mechanism is arranged at the second end of the air floating shaft. The transmission air bag is arranged between the power element and the air floating bearing, so that power output by the power element is transmitted to the air floating shaft after passing through the transmission air bag and is finally transmitted to the suction nozzle mechanism. During die bonding, the transmission air bag buffers the pressure applied by the die bonding head to the wafer, thereby preventing the rigid impact of the die bonding head to the wafer, preventing or reducing the breakage of the wafer, and improving the safety of the wafer.