664 results about "Die bonding" patented technology

The present disclosure provides an automated die bonding of LED substrates system in which an automated die bonding inspection module is used to determine the quality of incoming processing material and an automated die bonding process module is used to process the processing material, an automated die bonding post-process module is used to inspect the resultant process material for acceptability, and an automated die bonding historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated die bonding process module and an automated die bonding integration module to update the automated die bonding process module based upon the results of the automated die bonding historical module.

The invention discloses an AI visual detection method and system for a chip bonding packaging structure, and the method comprises the steps: collecting a preset number of historical normal chip bonding images, and marking a soldering tin region in the normal chip bonding images and the geometric parameters of corresponding soldering tin to form a training data set; constructing a preset semantic segmentation neural network capable of being trained, and performing deep learning training on the semantic segmentation neural network by using the training data set to obtain a soldering tin recognition model; collecting a to-be-detected bonding image of a to-be-detected chip bonding packaging structure, and inputting the to-be-detected bonding image into the soldering tin identification model to obtain geometric parameters of soldering tin in the to-be-detected bonding image; according to the geometric parameters of the soldering tin in the bonding image to be detected, whether bonding defects exist in the chip bonding packaging structure to be detected or not is judged according to a preset rule. According to the invention, the problem of low accuracy during chip bonding quality detection in the prior art is solved.

The invention discloses a chip bonding device and semiconductor equipment, and belongs to the technical field of semiconductor equipment. The chip bonding device comprises an adsorption unit and a bonding unit, a driving unit; the transmission guide unit comprises a transmission assembly and a guide assembly; and the rotating unit drives the adsorption unit to rotate around the axis parallel to the third direction. Through the driving unit, the transmission guide unit, the rotating unit and the adsorption unit which are sequentially arranged in the third direction, high-precision linear motion of the adsorption unit in the third direction and precise rotation of the adsorption unit around the axis parallel to the third direction are achieved. The structure can perform angle compensation on the posture of the chip adsorbed by the adsorption unit, the requirements of semiconductor processes such as bonding on the alignment precision and flatness of the chip are met, meanwhile, a guide assembly in the transmission guide unit is of a single guide piece structure, the transverse occupied space of the device is reduced while the guide precision is guaranteed, and the production efficiency is improved. And the miniaturization design of the device is facilitated.

The invention provides a chip bonding method, and relates to the technical field of chip bonding. The method comprises the following steps: etching a silicon-based electric chip to form a groove, spin-coating photosensitive BCB on the upper surface of the silicon-based electric chip to form a BCB bonding layer, carrying out UV light irradiation on the BCB bonding layer, carrying out exposure and development on the BCB bonding layer, removing the BCB bonding layer in a non-groove corresponding area, and only reserving the BCB bonding layer corresponding to the groove. The BCB bonding layer is baked, the baking temperature ranges from 50 DEG C to 95 DEG C, and finally the optical chip is bonded on the BCB bonding layer through a bonding technology. According to the technical scheme, the BCB bonding layer is partially crosslinked under the irradiation of the UV light, and the curing reaction can be completed without high temperature in subsequent baking, so that the baking temperature of the BCB bonding layer can be reduced to be within 100 DEG C, which is particularly powerful for a temperature-sensitive heterogeneous integrated system, and the problem that thermal stress and material expansion are not matched due to high temperature is avoided.

The invention relates to the technical field of integrated circuit packaging, solves the problem that a calibration process in the prior art lacks a stable displacement reference consistent with actual movement of equipment, and provides an integrated circuit visual positioning calibration method based on a pulse displacement reference and a medium. The method comprises the following steps: controlling a motion platform to move along a first direction and a second direction from a preset starting point according to a preset pulse number, and obtaining a calibration data set; acquiring pulse deviation data and pixel change data according to the calibration data set; according to the pulse deviation data and the pixel change data, obtaining a rotation deviation angle between the motion coordinate system and the imaging coordinate system; and when a target chip comprising an integrated circuit is subjected to die bonding, compensating a conversion relation between an imaging coordinate system and a motion coordinate system according to the rotation deviation angle. According to the invention, pulse displacement is introduced as a unified calibration reference, and the reliability of a visual positioning result in an integrated circuit die bonding process is improved.

The invention provides a dual-chip die-bonding chip mounter, and relates to the technical field of semiconductor packaging, and the dual-chip die-bonding chip mounter comprises a chip mounter main body, a lead frame feeding mechanism is hung on the left side of the chip mounter main body, and a lead frame receiving mechanism is hung on the right side of the chip mounter main body; the lead frame conveying mechanism is installed in a working area inside the chip mounter main body, the left end of the lead frame conveying mechanism is attached to a discharging port of the lead frame feeding mechanism, and the right end of the lead frame conveying mechanism is attached to a feeding port of the lead frame receiving mechanism; the whole process is automatically circulated from empty frame feeding, conveying to finished product receiving, manual frequent intervention and turnover are not needed, the labor intensity is reduced, the automation level and operation continuity of a production line are improved, and the problems that manual intervention or cooperative operation of multiple sets of manipulators is often needed, the automation degree is limited, high integration of feeding and discharging mechanisms cannot be achieved, and the production efficiency is high are solved. The overall coordination of the equipment is insufficient; and the time consumption of the die bonding and surface mounting process is long.

The invention relates to the field of agricultural lighting equipment, and discloses a plant light quality regulation and control integrated LED light source with a uniform spectral space and a method of the plant light quality regulation and control integrated LED light source. The multispectral LED chip group is arranged on the lamp bead substrate in a die bonding manner; the plurality of groups of independent bonding pads are arranged on the lamp bead substrate and are electrically isolated from one another; and the transparent optical lens adhesive layer covers the chip group. And different spectrum chip groups in the multi-spectrum LED chip group are electrically connected with the corresponding independent bonding pads respectively. Driving current is provided for the multiple groups of independent bonding pads through an external driving circuit, and the luminous intensity of different spectral components is independently adjusted by independently adjusting the magnitude of the current input to different bonding pad groups, so that the output composite spectrum is changed. According to the invention, the multispectral chip is integrated in a single packaging body, the problem of non-uniform spectral space is solved from the physical source, the accurate regulation and control of the spectral ratio are realized through multichannel independent control, and the design and manufacturing cost of the lamp is reduced at the same time.

The invention relates to the technical field of die bonders, in particular to die bonding equipment. The die bonding equipment comprises a base, a table board assembly and a guide rail assembly, the guide rail assembly comprises a fixed module and a movable module, the fixed module comprises a first fixed guide rail and a second fixed guide rail which are arranged at the two opposite ends of the base in parallel, and the movable module comprises a first movable guide rail and a second movable guide rail which are arranged in parallel. The sides, close to each other, of the first moving guide rail and the second moving guide rail are each connected with a binding head assembly, and each binding head assembly is provided with a suction nozzle and a dispensing assembly so as to execute chip mounting and dispensing actions. The first moving guide rail and / or the second moving guide rail move along the length directions of the first fixed guide rail and the second fixed guide rail so as to drive the corresponding binding head assemblies to move synchronously; the binding head assemblies are in sliding connection with the corresponding first moving guide rails or the second moving guide rails and can move in the length direction of the first moving guide rails or the second moving guide rails. The problems that existing die bonding equipment is poor in applicability and low in efficiency are solved.

The invention relates to a die bonding swing arm device which comprises a main shaft rotating motor which is fixed on a base below, and the output end of the bottom of the main shaft rotating motor is connected with a rotating main shaft which can rotate around a vertical axis; the two independent lifting modules are symmetrically and fixedly mounted on the left side and the right side of the rotating main shaft by taking the axis of the rotating main shaft as a symmetric center; and the two swing arm assemblies are installed on the swing arm fixing bases of the two lifting modules correspondingly, and a suction cup is installed at the tail end of each swing arm assembly. According to the double-swing-arm alternating parallel operation mode, crystal taking and crystal fixing actions are almost synchronously carried out, the theoretical carrying efficiency is nearly doubled compared with that of a single swing arm, and the equipment productivity is greatly improved.

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate with a cavity, where the first substrate comprises glass. In an embodiment, a second substrate is in the cavity. In an embodiment, a bond film covers a bottom of the second substrate and extends up sidewalls of the second substrate.

Photonics integrated circuit (PIC) dies bonded to photonics substrates, related apparatuses, systems, and methods of fabrication are disclosed. A photonics substrate and a PIC die include corresponding optical bonding regions one or both of which are surrounded by hydrophobic structures. A liquid droplet is applied to the PIC die or photonics substrate optical bonding region and the PIC die is placed on the optical bonding region of the photonics substrate. Capillary forces cause the PIC die to self-align to the optical bonding region, and an optical bond is formed by evaporating the liquid and subsequent anneal.

The invention relates to the technical field of semiconductor packaging, in particular to a Micro-LED packaging structure and a manufacturing method thereof, and the packaging structure comprises a substrate, a color filter layer, a color conversion layer, an inorganic layer, a chip bonding layer, a micro light-emitting diode layer, a first filling layer, a reflecting layer and a second filling layer from bottom to top. And grinding, thinning, cutting and splitting the substrate to form an independent discrete device. By arranging the reflecting layer covering the packaging structure and the discontinuous chip bonding layer, light emitted by the quantum dots and the micro light-emitting diodes is reflected by the reflecting layer, and light crosstalk between the packaging structures is avoided. The first filling and leveling layer with the slope surface is arranged between the reflecting layer and the micro light-emitting diode, so that the side light-emitting path is kept away from the micro light-emitting diode body, and the light-emitting efficiency is improved. The micro light-emitting diodes are arranged in an offset mode, so that top damage is prevented when the packaging structure is transferred. The packaging structure has the advantages of preventing optical crosstalk and facilitating mass production of laser cutting while improving the lighting effect and preventing damage.

This invention discloses a Mini-LED packaging device, a Mini-LED packaging method, an apparatus, and a computer-readable storage medium. The method, applied to a Mini-LED packaging device, involves adjusting the position of the Mini-LED chip to be fixed on a substrate to embed the electrodes of the Mini-LED chip into a groove. Solder paste is placed on a filter screen inside the groove. During the fixing of the Mini-LED chip, a height limiting plate restricts the upward displacement of the Mini-LED chip during the curing process of the solder paste, allowing the solder paste to pass through the filter screen and enter the gap during curing. This invention reduces the overly stringent requirements for solder paste usage and the process difficulty of Mini-LED chip die bonding by designing the substrate structure, thereby avoiding the adverse effects of inaccurate solder paste usage on Mini-LED chip die bonding and improving display performance.

The invention relates to the technical field of electronic devices, discloses a low-thermal-resistance insulation integrated top heat dissipation power device, and aims to solve the problems that a traditional power device is high in thermal resistance, insufficient in insulation reliability and complex in assembly. The device comprises a frame base island, an insulating layer, a SiC chip, a bonding aluminum wire, a pin, an injection molding body and a metal heat dissipation top cover, the insulating layer is a high-thermal-conductivity ceramic layer such as aluminum nitride, the thickness of the insulating layer is 20-150 micrometers, the insulating layer and the frame base island are integrated through high-temperature oxidation bonding, and the metal heat dissipation top cover is bonded with the insulating layer in a low-thermal-resistance mode. An external insulation part is not needed, the assembly process is simplified, an efficient heat dissipation channel is constructed, contact thermal resistance is reduced, meanwhile, wide-temperature-range insulation stability is guaranteed, long-term operation reliability and service life of the device are improved, and the structure is suitable for a high-power-density power electronic scene.

The dustproof beauty mask relates to the cosmetic technical field, including the mask body of the silicone rubber material, the FPC circuit board arranged in the recess of the mask body, the illuminator arranged on the FPC circuit board, the transparent protective layer of the silicone rubber material covering the FPC circuit board and the illuminator, the anti-static cloth is arranged on the outer side of the mask body, the hot melt adhesive film is arranged between the anti-static cloth and the outer side of the mask body, the illuminator is a semiconductor illuminator, more than one semiconductor illuminator constitutes a group of illuminator groups, the illuminator groups are uniformly distributed on the FPC circuit board, and the semiconductor illuminator is fixed on the FPC circuit board through the die bonding technology.Compared with the prior art, the dustproof mask has the advantages that the silicone rubber static level can be effectively reduced, the mask body appearance pattern is enriched, the density of the illuminator can be increased, the uniformity of illumination can be improved, the mask thickness can be significantly reduced to facilitate modeling, the material consumption can be reduced, and the manufacturing cost can be reduced.

A solid state drive (SSD) device includes a substrate, a first buffer chip disposed on the substrate, a second buffer chip disposed on the first buffer chip, a plurality of first non-volatile memory chips connected to the second buffer chip through wire bonding, a controller configured to send a control signal to the plurality of first non-volatile memory chips through a first channel, and a first redistribution layer disposed in the substrate and configured to electrically connect the first channel to the first buffer chip, wherein the first buffer chip is connected to the first redistribution layer through flip chip bonding, and the second buffer chip is connected to the first redistribution layer through first wires.

Disclosed is a film-like adhesive. The film-like adhesive contains metal particles, a thermosetting resin, a setting agent, and an elastomer. The average diameter (D50) of the metal particles is 1.0-2.5 μm. A manufacturing method for the film-like adhesive is also disclosed. The manufacturing method for the film-like adhesive comprises a step for preparing an adhesive varnish by mixing a starting material varnish containing metal particles, a thermosetting resin, a setting agent, an elastomer, and an organic solvent at a mixing temperature of 50°C or higher, and a step for using the adhesive varnish to form a film-like adhesive.

The application relates to the field of semiconductor packaging, in particular to a small-angle adjusting TO die bonding machine which comprises a die bonding table, X-axis and Y-axis moving mechanisms arranged on the die bonding table, and a work box with a material disc fixing assembly mounted at the output end of the Y-axis moving mechanism; an angle rotating mechanism of the die bonding table drives the die bonding table to rotate so that the top surface of a TO packaging tube base is horizontal; a dispensing mechanism dispenses the TO packaging tube base; and a wafer transferring mechanism transfers a wafer to the TO packaging tube base after dispensing. The angle of the whole die bonding table can be actively adjusted, so that the top surface of the TO packaging tube base with different preset inclination angles can be accurately corrected to the horizontal state. The design solves the problem that the die bonding must rely on a customized material disc with a specific angle in the prior art.

A chip bonding device according to an embodiment of the present invention comprises a body, a substrate transfer unit installed on the body for transferring a substrate, a bond head transfer unit disposed on the upper surface of the body, an alignment unit installed on the body for confirming the position of the substrate and the position of the chip, and a bond head installed on the bond head transfer unit for moving and adsorbing a chip at the bottom, wherein the bond head has a chip bonding part that adsorbs a chip at the bottom, and the chip bonding part comprises a chip bonding part body in which an installation groove is formed, a pushing module in which one end is inserted and disposed in the installation groove, and an attachment module having a deformable member that is deformed by the pushing module, wherein the deformable member may be provided with a deformable part that is deformed by being pressed by the pushing module and adsorbs a chip on its bottom surface.

The invention provides a packaging structure and a preparation method thereof, and the preparation method comprises the steps: forming a substrate which is provided with a first surface and a second surface which are oppositely arranged, providing at least one chip, bonding the chip to the first surface of the substrate, forming a plurality of supporting rubber columns, and pasting the plurality of supporting rubber columns to the first surface of the substrate, the supporting columns are distributed on the outer side of the chip and are symmetrical about the center of the chip, a heat dissipation layer is formed on the face, away from the substrate, of the chip, a heat dissipation cover is provided and pasted to the first face of the substrate so that the chip can be contained in the heat dissipation cover, and the face, close to the chip, of the heat dissipation cover is bonded with the heat dissipation layer and the supporting rubber columns. According to the preparation method of the packaging structure, the problem of delamination of the heat dissipation layer can be solved, the heat dissipation performance and reliability of a product are improved, and large-scale production is facilitated.

This invention provides a multifunctional bonding fixture and its usage method. The fixture uses a chip processing stage as a base. After the chip is processed on the base, a cover plate is placed on top of the base and connected to it. A clamping rod and a push rod are located in the middle of the cover plate. The clamping rod and push rod are simultaneously inserted into the fixing post of the base. By pressing the clamping rod on the top of the cover plate, the clamping element located at the lower end of the clamping rod is engaged between the outer side of the fixing post and the inner side of the push rod, thus fixing the clamping rod and push rod to the base 1. By grasping the push rod or clamping rod, the chip can be transferred immediately after processing without waiting for it to cool down, significantly shortening the overall chip bonding operation time.

Semiconductor dies and semiconductor wafers are provided. A first semiconductor die, a second semiconductor die, and a detector are configured to determine the degree of alignment accuracy with the first semiconductor die being coupled to the second semiconductor die. First test pads of each of first test pad groups of the first semiconductor die are electrically connected to each other through a line extending in a first direction, and second test pads of each of second test pad groups of the second semiconductor die are electrically connected to each other through a line extending in a third direction transversing the first direction. The detector detects misalignment between the first semiconductor die and the second semiconductor die, based on current flowing between the first test pads of each first test pad group and the second test pads of each second test pad group.

The invention relates to the technical field of semiconductor packaging and integrated circuit manufacturing, belongs to the field of ultrasonic welding in metal wire bonding, and discloses a gold wire high-strength bonding structure and method on an organic substrate. One end of the gold bonding wire is welded on the chip, the other end of the gold bonding wire is welded on the substrate, and the welding end of the gold bonding wire on the substrate is fixed between the gold wire ball unit groups through superposition. According to the invention, the technical problems of two-welding crescent exposure, low bonding strength and poor reliability in the prior art are solved.

The LED lamp bead comprises an LED support and a plurality of chips, the LED support comprises a bonding pad set, a bowl cup and a white channel, the bonding pad set comprises a first bonding pad and a second bonding pad which are arranged at an interval, the white channel is arranged between the first bonding pad and the second bonding pad, the first bonding pad is provided with a first bonding wire area and a die bonding area, the second bonding pad is provided with a second bonding wire area, the die bonding area is provided with the plurality of chips, and the bowl cup is arranged on the bowl cup. The two ends of the plurality of chips are electrically connected with the first bonding wire area and the second bonding wire area through leads respectively, a first hollow part and at least one second hollow part are arranged on the two opposite sides of the cup wall of the bowl cup, the first bonding wire area is located in the first hollow part, and the second bonding wire area and the white channel are located in the second hollow part; the first hollow-out part and the second hollow-out part are respectively provided with a reflecting colloid; the enlargement of the die bonding area of the die bonding area provides conditions for the arrangement of a plurality of chips, and avoids the limitation of a bonding wire and a white channel on the placement scheme of the plurality of chips, thereby unifying the specification of the PCB.

The invention relates to the technical field of semiconductor packaging, solves the problem that in the prior art, the accuracy of dispensing control in the packaging process cannot be improved based on light source structural characteristics and luminescence performance feedback, and provides a colorful light source packaging method, device and equipment based on dispensing parameter adjustment. The method comprises the following steps: determining preset packaging size information, preset bonding pad size information and preset bonding pad layout information according to a light source type of a colorful light source to be packaged; acquiring an initial dispensing parameter corresponding to the type of the colorful light source; according to the initial dispensing parameters, performing initial dispensing treatment on the multicolor light source, and performing luminescence performance detection to obtain a detection value; according to a deviation value between the detection value and a target value, adjusting the initial dispensing parameter to obtain a target dispensing parameter; and according to the target dispensing parameter, carrying out dispensing treatment and die bonding treatment on a light source of the same type as the multicolor light source, and completing packaging treatment of the multicolor light source. According to the invention, the accuracy of dispensing control is improved.

The utility model discloses a test device for verifying the influence of epoxy glue high-temperature gas release on a gold-aluminum bonding point, which comprises a shell, the inner wall of the shell is provided with a gold-plated layer, and the thickness of the gold-plated layer is 1-5 microns; the edge of the chip is bonded on the inner wall of the shell through a plurality of gold bonding wires; an epoxy glue layer is coated on the part, which is not bonded with the chip, of the inner wall of the shell; the cover plate is installed at the opening of the shell in a sealed mode. The inner wall of the shell is provided with the gold-plated layer, and the chip can be directly bonded on the gold-plated layer in the shell, so that the test process is free from interference of external factors. The shell is made of ceramic, the main component of the ceramic is Al2O3, the high-temperature resistance is excellent, excessive gas and stress release are avoided in the test process, and the interference to the test result is avoided. The airtight grade in the shell is 10-9, and the sealing requirement is met. In the test process, gas released by the epoxy glue layer cannot leak and can continuously act on the bonding points, and the test effect can be improved.

A buffer chip is wire-bonded to memory dies. A semiconductor package includes a semiconductor die stack, a first set of wire bonds connected to a first set of semiconductor dies, a second set of wire bonds connected to a second set of semiconductor dies, and the buffer chip. The second set of semiconductor dies are on the first set of semiconductor dies. The buffer chip includes a first set of die bond pads being close to the semiconductor die stack, and a second set of die bond pads being distant from the semiconductor die stack. The second set of wire bonds extends to the first set of die bond pads of the buffer chip, and the first set of wire bonds extends to the second set of die bond pads of the buffer chip.

The present application relates to a kind of growth substrate assembly, light emitting component and its manufacturing method, growth substrate is equipped with several light emitting chips, the bottom surface of each light emitting chip is away from growth substrate and grows positive electrode and negative electrode;There is hot melt adhesive layer on the growth substrate, and the bottom surface of light emitting chip is partially covered, and the positive electrode, the negative electrode and the region between the two on the bottom surface of light emitting chip are exposed to hot melt adhesive layer;When the light emitting chip on the growth substrate is transferred to the circuit board, the side of growth substrate grown with light emitting chip is set with the side of circuit board with chip bonding area after alignment, then heat hot melt adhesive layer at least to make the region covered on the bottom surface of light emitting chip liquefied and flow to the glue column formed on the two sides of circuit board in light emitting chip, the channel formed by the glue column on the two sides of light emitting chip after being peeled off from growth substrate falls on the corresponding chip bonding area, so as to realize the direct transfer of light emitting chip to the circuit board, transfer efficiency is higher, and transfer cost is lower.

A method for bonding chips including the following steps: a) providing a donor substrate wherein chips are formed, the donor substrate including a front face and a back face, b) mounting the front face of the donor substrate to a temporary substrate, by direct bonding, c) preferably thinning the donor substrate, d) bonding the assembly consisting of donor substrate and temporary substrate on a handling device including a solid frame and an adhesive film, with the back face of the donor substrate bonded to the adhesive film, e) separating the temporary substrate from the donor substrate, f) cutting the donor substrate so as to singularize the chips, g) bonding the chips to the receiver substrate by direct bonding.

According to the LED chip assembly and the manufacturing method thereof, a P-type ohmic contact metal layer is embedded into an epitaxial layer in an etching and metal evaporation mode before chip bonding, so that ohmic contact is formed. After transferring, the chip is manufactured by introducing the P-type ohmic contact metal layer into the surface layer of the core particle in an overlay etching manner, so that the light-emitting area of a light-emitting layer is increased, and the brightness of the whole core particle is greatly improved; in addition, due to evaporation of the oxide layer, the epitaxial wafer and the metal can be well wrapped, the difficulty of ultra-planarization is small, fusion of the metal and the epitaxial wafer is indirectly completed through fusion after the substrate is removed, and the operation process is shortened.