1843 results about "Die bonding" patented technology

The invention relates to the technical field of semiconductor mounting equipment, in particular to double-track die bonding equipment and a die bonding method. The double-track die bonding equipment comprises a bearing table, the bearing table is provided with a mounting area, a glue dipping area and a feeding area, and the glue dipping area and the feeding area are arranged adjacently and are adjacent to the same side of the mounting area; the mobile die bonding table assembly and the mobile transfer table assembly are arranged on the bearing table, the mobile die bonding table assembly comprises a first track, a second track, a first die bonding table and a second die bonding table, the first die bonding table is in sliding connection with the first track, and the second die bonding table is in sliding connection with the second track; the first track and the second track respectively extend from the glue dipping area to the mounting area. By introducing the design of the double die bonding tables which work alternately, glue dipping is only carried out on a partial area of the substrate each time, and chip mounting is immediately carried out on the partial area, so that the mounting quality and efficiency are ensured.

The invention provides a chip bonding wire three-dimensional measurement method and system based on an inner cavity reflection camera system, and relates to the technical field of three-dimensional measurement. The method comprises the following steps: performing one-time exposure imaging on a chip bonding wire to be detected through an inner cavity reflection camera system to obtain at least three mutually independent visual angle images in the same frame; performing brightness normalization compensation and geometric calibration on the visual angle image to obtain a visual angle data set with uniform brightness and correlation; pairing the view angle data sets in pairs, extracting parallax information by using a feature matching algorithm based on optical flow, and fusing multiple pairs of parallax to generate a lead three-dimensional point cloud; performing noise filtering and curved surface reconstruction on the three-dimensional point cloud to obtain a continuous three-dimensional grid model of a lead; and performing texture mapping on the three-dimensional grid model by adopting any visual angle in the visual angle image or the combination of the visual angles, and outputting a lead three-dimensional reconstruction result with textures. According to the invention, high-precision, large-depth-of-field and rapid three-dimensional measurement of the chip bonding wire is realized.

An apparatus includes a semiconductor wafer including a first die and a second die, each including, a selector circuit including a first input terminal coupled to a first die bond pad, a second input terminal, and an output terminal, the selector circuit configured to selectively couple the first input terminal and the second input terminal to the output terminal, a conductor selectively configured to couple the second input terminal to either a first power supply or a second power supply, and an address determined based on a signal value at the output terminal of the selector circuit.

The invention relates to the technical field of semiconductor die bonding equipment, in particular to die bonding equipment and a die bonding method. According to the die bonding equipment, a track module comprises a first track and a second track, the second track is arranged in the connecting line direction of a feeding module and a discharging module, and the first track is arranged between the feeding module and the second track and extends downwards in the width direction of the first track; the dispensing module comprises a first dispensing mechanism and a second dispensing mechanism. The first dispensing mechanism is arranged at the end, away from the second track, of the first track. The crystal supply module and the transfer table module are located on the side face, close to the first dispensing mechanism, of the second track and correspond to the dispensing module; and the mounting binding head module is arranged above the second track, and a second visual detector and a second dispensing mechanism are arranged on the mounting binding head module. The die bonding equipment can realize two working modes of first dispensing and then identification and first identification and then dispensing, is suitable for mounting of different types of chips, and has higher applicability.

The invention relates to the technical field of chip mounting, in particular to a die bonder and a die bonding method. The die bonder comprises a track device, a feeding device, a gluing device, a mounting device, a chip supply device and a discharging device. The feeding device and the discharging device are arranged at the two ends of the track device in the length direction correspondingly. The gluing device is arranged at the end, close to the feeding device, of the side edge of the rail device. The mounting device is arranged at the end, close to the discharging device, of the side edge of the rail device, the mounting device and the gluing device are located on the same side of the rail device, and the mounting device comprises a visual positioning component and a mounting component which are independently arranged; and the chip supply device is arranged on the other side of the track device and corresponds to the mounting device. The die bonder provided by the invention is compact in structure, the moving distance of each link is reduced, and the mounting efficiency is improved.

The invention relates to the technical field of semiconductors, in particular to die bonding equipment and a die bonding method, and the die bonding equipment comprises a bearing table, and a feeding device, a discharging device, a mounting device, a glue dipping device, a transfer table device and a die supply device which are mounted in the bearing table; the feeding device and the discharging device are arranged at the two opposite ends of the bearing table in parallel, the surface mounting device is arranged between the discharging end of the feeding device and the feeding end of the discharging device, the glue dipping device is located on one side of the feeding device, and the glue dipping device and the transfer table device are arranged on the two sides of the surface mounting device respectively. The crystal supply device is located on the side, away from the mounting device, of the transfer table device. A movable main binding head assembly, a first binding head assembly and a second binding head assembly are arranged in the bearing table, the main binding head assembly is arranged on one side of the discharging device, the first binding head assembly is arranged on one side of the feeding device, and the second binding head assembly is arranged on one side of the crystal supplying device.

The present disclosure provides an automated die bonding of LED substrates system in which an automated die bonding inspection module is used to determine the quality of incoming processing material and an automated die bonding process module is used to process the processing material, an automated die bonding post-process module is used to inspect the resultant process material for acceptability, and an automated die bonding historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated die bonding process module and an automated die bonding integration module to update the automated die bonding process module based upon the results of the automated die bonding historical module.

The invention relates to an optical chip structure and a preparation method thereof, and the method comprises the steps: providing a substrate and a semi-finished chip, the substrate comprises a first substrate, an isolation dielectric layer formed on the first substrate, a first semiconductor optical device and a first waveguide, and the semi-finished chip comprises a second substrate and a semi-finished film layer located at one side of the second substrate, the semi-finished product film layer and the first waveguide are made of different materials, and the first substrate comprises a silicon substrate; forming a groove in the isolation dielectric layer, wherein at least part of the first waveguide is located between the groove and the first substrate; bonding the semi-finished product chip in the groove through the semi-finished product film layer, so that the semi-finished product film layer is optically coupled with the first waveguide; removing the second substrate of the semi-finished chip to form a second semiconductor optical device; and metallization is carried out to form electrode structures which are respectively connected with the first semiconductor optical device and the second semiconductor optical device.

The invention belongs to the technical field of semiconductor processing and manufacturing, and discloses a chip bonding device and a chip bonding system. The chip bonding device comprises a shell, a driving assembly, a sensor assembly and an adsorption assembly, the driving assembly comprises a first driving piece fixedly installed on the shell and a rotating shaft arranged at the output end of the first driving piece, the rotating shaft rotatably penetrates through the shell, and the shell is connected with the rotating shaft through a first thrust piece; the sensor assembly is fixedly installed on the shell, the sensor assembly is connected with the rotating shaft through the second thrust piece, and the sensor assembly can detect the force in the first range and the force in the second range; the adsorption assembly is arranged at the end, away from the first driving piece, of the rotating shaft and used for adsorbing chips. According to the chip bonding device, the problem of poor signal stability and reliability caused by rotation of the sensor assembly is avoided; due to the arrangement of the first thrust piece and the second thrust piece, the axial stress is effectively eliminated, and the accuracy of pressure measurement and feedback is ensured.

The invention belongs to the technical field of die bonders, and particularly relates to a high-precision die bonder and a use method of the high-precision die bonder. The gantry assembly is provided with a working table plate, side edge plates arranged on the two sides of the working table plate in the Y-axis direction, a gantry Y-axis assembly arranged on the top of each side edge plate, two gantry X-axis assemblies connected between the two gantry Y-axis assemblies in a sliding mode, a die bonding module connected to the first gantry X-axis assembly in a sliding mode, and a glue dipping module connected to the second gantry X-axis assembly in a sliding mode; the die bonding module is used for moving in a three-dimensional space to pick up a chip and placing the chip to a specified die bonding position; the glue dipping module is used for moving in a three-dimensional space, and glue is smeared on a specified die bonding position of a substrate placed on the working table plate. The using method comprises the steps of detecting the position of a chip on a wafer, picking up the chip, caching the chip, carrying out chip die bonding, and carrying out product glue dipping and dispensing. According to the invention, the die bonding precision of the chip is improved.

The invention discloses a multi-chip stacked packaging structure and a manufacturing method, and the manufacturing method comprises the steps: designing a welding spot which is downwards connected to a lower-layer chip and a welding spot which is upwards connected to an upper-layer chip on a metal frame according to the connection demands of a wafer, placing the wafer in a welding pad on the standardized metal frame, and carrying out the die bonding treatment, bonding the pin interconnection point of the wafer with the welding point through a connecting line to obtain an electric connection module; carrying out injection molding packaging on the electric connection module, then carrying out cutting processing to form a plurality of single chips, and carrying out test processing on the single chips; and stacking the plurality of qualified single chips on the circuit board in the vertical direction, and packaging the stacked structure in the single packaging cavity to obtain the multi-chip stacked packaging structure. According to the invention, through vertical stacking and single packaging cavity packaging, high integration level and miniaturized packaging are realized, the excellent thermal conductivity of the metal frame enables the heat dissipation performance of the chip to be improved, and the service life of the chip is prolonged.

The invention relates to the technical field of semiconductors, in particular to a chip mounter binding head device, a mounting method and die bonding equipment, and the chip mounter binding head device comprises a mounting module, a force control module and a fixed seat; the mounting module comprises a main shaft and a main shaft seat, the main shaft rotatably penetrates through the main shaft seat, and the working end of the main shaft is exposed out of the main shaft seat; the force control module comprises a voice coil driving assembly, a force control connecting block and a guide rail assembly, the voice coil driving assembly comprises a voice coil motor and a controller, the voice coil motor is installed on the fixing base, and the controller is electrically connected with the voice coil motor; the force control connecting block is respectively connected with the voice coil motor and the bottom of the spindle seat; the guide rail assembly is arranged between the spindle seat and the fixing seat, and the spindle seat is slidably connected with the fixing seat through the guide rail assembly. The mounting method and the die bonding equipment provided by the embodiment of the invention have the same beneficial effects as the head binding device of the chip mounter.

A device includes a photonic routing structure including a silicon waveguide, photonic devices, and a grating coupler, wherein the silicon waveguide is optically coupled to the photonic devices and to the grating coupler; an interconnect structure on the photonic routing structure, wherein the grating coupler is configured to optically couple to an external optical fiber disposed over the interconnect structure; and computing sites on the interconnect structure, wherein each computing site includes an electronic die bonded to the interconnect structure, wherein each electronic die of the computing sites is electrically connected to a corresponding photonic device of the photonic devices.

The invention provides a chip bonding device and method. The chip bonding device comprises a bonding head used for adsorbing a chip to be bonded and adjusting the pose of the chip; the infrared vision system is used for penetrating through the chip so as to acquire images of the first mark on the back surface of the chip and the second mark at the target bonding position of the chip; and a controller configured to: acquire, via the infrared vision system, an image with the first marker and the second marker; analyzing the image to determine the poses of the first mark and the second mark in the image; adjusting the pose of the bonding head according to the pose difference of the first mark and the second mark in the image, so that the chip is aligned with the target bonding position; and bonding the chip to the target bonding position through the bonding head. According to the invention, extra errors caused by using a calibration sheet as an intermediate medium in the bonding process can be avoided, the bonding precision is improved, and the bonding process is simplified, so that the bonding efficiency is improved, and the productivity of equipment is improved.

A memory device includes a memory die bonded to a logic die. A logic die that is bonded to a memory die via a wafer-on-wafer bonding process can receive signals indicative of input data from a global data bus of the memory die and through a bond of the logic die and memory die. The logic die can also receive signals indicative of kernel data from local input / output (LIO) lines of the memory die and through the bond. The logic die can perform a plurality of operations at a plurality of vector-vector (VV) units utilizing the signals indicative of input data and the signals indicative of kernel data. The inputs and the outputs to the VV units can be configured based on a mode of the logic die.

The invention provides a bonding device and method. The bonding device comprises a wafer table which is located at the upper part of the bonding device and is used for adsorbing the back surface of a wafer to be bonded from top to bottom; the wafer table is positioned at the lower part of the bonding device and is used for adsorbing the back surface of the chip to be bonded from bottom to top; the pickup assembly is located on the wafer table and used for adsorbing the front face, to be bonded, of the chip so as to pick up the chip from the wafer table and turn over the chip upwards; the bonding assembly is positioned on the pickup assembly and is used for adsorbing the back surface of the chip so as to obtain the chip from the pickup assembly, and upwards overturning the chip again so as to bond the front surface of the chip to a preset bonding position on the front surface of the wafer; and the at least one group of fan filtering unit is positioned on the side surface of the bonding device and is used for providing a transverse wind field between the wafer tables.

In an embodiment, a package includes a first package structure including a first die having a first active side and a first back-side, the first active side including a first bond pad and a first insulating layer a second die bonded to the first die, the second die having a second active side and a second back-side, the second active side including a second bond pad and a second insulating layer, the second active side of the second die facing the first active side of the first die, the second insulating layer being bonded to the first insulating layer through dielectric-to-dielectric bonds, and a conductive bonding material bonded to the first bond pad and the second bond pad, the conductive bonding material having a reflow temperature lower than reflow temperatures of the first and second bond pads.

The utility model provides a semiconductor die bonder and a positioning system thereof, the positioning system comprises a visual acquisition device and a heat insulation protection device, and the heat insulation protection device comprises a heat insulation cylinder, a light transmitting mirror and an air source. An air inlet hole and an air outlet hole are formed in the cylinder wall of the heat insulation cylinder, and the air source is communicated with the air inlet hole and used for filling normal-temperature or low-temperature air into the air inlet hole. Normal-temperature gas enters the thermal insulation protection device through the gas inlet, hot gas generated in the thermal insulation protection device is exhausted through the gas outlet, the interior of the thermal insulation protection device is cooled, meanwhile, the normal-temperature gas is continuously and slowly input for circulation, the gas in the thermal insulation protection device is kept in a normal-temperature state all the time, and therefore image shaking caused by hot air is eliminated; the problem that the picture position and the real position deviate is avoided, the reality of the picture is well ensured, the calculated coordinate is the real position coordinate, the accurate positioning of the die bonding workbench is ensured, the die bonding precision is improved, and the product quality is ensured.

The invention discloses a chip bonding mechanism and bonding equipment, and belongs to the technical field of semiconductors. The chip bonding mechanism is mounted on a space moving unit of the bonding equipment and comprises a mounting bracket, an adapter plate, a bonding head and a posture adjusting module. And the bonding suction nozzle of the bonding head adopts an arc-shaped design, so that the contact area is optimized, and air residue caused by the attachment of the whole plane is avoided. A posture adjusting module and a space XYZ moving unit of the bonding head are matched to adopt six-axis interpolation motion, and it is guaranteed that the posture and path of a bonding suction nozzle can be planned. According to the invention, by using the interpolation motion of the six-axis mechanism and cooperating with the small-area fitting contact of the arc-shaped suction nozzle, the bonding contact point can roll and move outwards along a vortex-shaped track from the center of the chip, and air is effectively extruded, so that a bonding cavity is eliminated. The method is suitable for advanced packaging, and especially suitable for the bonding requirement of mixed bonding and the hole inhibition requirement.

The invention relates to a binding head device, a mounting method and die bonding equipment. The binding head device is used for picking up a chip and mounting the chip on a substrate, and comprises a force control detection module, a force control driving module and a mounting module; the force control detection module comprises a reference block, a photoelectric sensor and a signal amplifier, and the signal amplifier is in signal connection with the photoelectric sensor; the mounting module comprises a main shaft and a main shaft seat, the main shaft penetrates through the main shaft seat and can lift relative to the main shaft seat, and the working end of the main shaft is exposed out of the main shaft seat; the top end of the reference block is connected with the force control driving module; the bottom end of the reference block is connected with the transmission end of the main shaft; the photoelectric sensor is arranged on the spindle seat, one end of the photoelectric sensor emitting a light source extends into the spindle seat, the other end of the photoelectric sensor is connected to the signal amplifier, and the photoelectric sensor can emit the light source to the top end face of the reference block. And when the chip is in contact with the substrate, the signal amplifier determines the height variation of the reference block by detecting the light quantity variation reflected and received by the light source.

The invention relates to a die bonding device and method. The die bonding equipment is used for realizing chip packaging on a mounting base, and comprises a bearing platform, and a base bearing device, a mounting binding head device and an upper view positioning device which are mounted on the bearing platform, the base bearing device moves on the bearing platform in the X-axis direction and the Y-axis direction, and the mounting binding head device moves above the base bearing device in the X-axis direction, the Y-axis direction and the Z-axis direction. The base bearing device is provided with a hollow channel in the vertical direction, and the top view positioning device moves in the hollow channel in the Z-axis direction. The base bearing device is provided with a base bearing platform for placing the mounting base, when the mounting base is arranged on the base bearing platform, the supporting part of the mounting base is detachably fixed on the base bearing platform, and the mounting part and the upper view alignment part of the mounting base are respectively positioned on one side close to the mounting binding head device and the upper view positioning device; when the base bearing device moves, the base bearing table and the mounting base move synchronously, so that the upper view alignment part and the supporting part enter the recognition area of the upper view positioning device.

The invention relates to a double-camera precision positioning method and device in a bonding system, equipment and a storage medium, and the method comprises the steps: collecting and continuously monitoring a bonding tool and a bonding interface through a first camera and a second camera, and obtaining a bonding image; carrying out image processing on the bonding image and extracting features, and obtaining the position and posture of a bonding tool and geometric features of a bonding area; obtaining a current moving path of the bonding tool through a pre-constructed bonding path planning model, and outputting an instruction for controlling the bonding tool to carry out chip bonding according to the current moving path; and the first camera and the second camera are utilized to monitor the bonding process of the bonding tool executing the bonding operation according to the current moving path in real time, so that the purpose of performing high-precision and high-efficiency positioning and completing chip bonding through the double cameras in a bonding system in a complex temperature environment is achieved.

The invention relates to the technical field of semiconductor display devices, in particular to an anti-crosstalk light-emitting unit and a manufacturing method thereof, and a color filter layer, a color conversion layer, an inorganic layer, a chip bonding layer, a micro light-emitting diode layer and a reflecting layer are sequentially manufactured on a substrate from bottom to top; manufacturing a discontinuous filling layer on the surface of the reflecting layer; and grinding, thinning, cutting and splitting the substrate to form an independent discrete device. By arranging the reflecting layer covering the packaging structure and the discontinuous chip bonding layer, light emitted by the quantum dots and the micro light-emitting diodes is reflected by the reflecting layer, light crosstalk between the display units is avoided, the reflected light excites the quantum dots again to emit light, and the light efficiency is improved. The chip bonding layer and the filling and leveling layer are arranged discontinuously, so that substrate warping caused by temperature rise and fall during large-size manufacturing is avoided. When cutting and splitting are carried out, the laser technology frequency can be reduced, the mass production efficiency can be improved, and the organic layer is removed, so that the occurrence of the double-cell problem of the chip can be greatly avoided.

The invention discloses die bonding equipment, and relates to the technical field of die bonding. The die bonding equipment comprises a rack, a die taking and pasting mechanism and a dispensing mechanism, and the die taking and pasting mechanism and the dispensing mechanism are both arranged on the rack. The wafer taking and pasting mechanism comprises a wafer disc, an overturning group and a pasting group which are continuously distributed along a first space axis; and the dispensing mechanism comprises a dispensing group and a chip mounting group which are continuously distributed along the axis of the second space. According to the technical scheme, the wafer disc, the overturning set and the chip mounting set of the wafer taking and chip mounting mechanism are continuously distributed along the first space axis, then the dispensing set and the chip mounting set of the dispensing mechanism are continuously distributed along the second space axis, and the first space axis and the second space axis are arranged in a spatial non-coplanar mode. The first space axis and the second space axis form the adjustable inclined included angle on the horizontal projection plane, the longitudinal space is effectively utilized, waste of the longitudinal space is reduced, and the space utilization rate is improved.

The invention discloses a preparation method and structure of an omnibearing heat dissipation Micro LED packaging module. The preparation method comprises the following steps: S1, customized manufacturing of a VC vapor chamber; s2, laminating a VC vapor chamber; s3, carrying out low-thermal-resistance die bonding; s4, gold wire protection and heat dissipation are integrated; s5, the VC vapor chamber is covered with packaging glue; s6, the VC vapor chamber is attached to the bottom of the optical lens; s7, connecting the module with a driver; s8, power-on detection is carried out; the structure comprises a multi-layer composite heat dissipation substrate, an FPCB, a packaging adhesive layer, an optical lens and a driving board. The multi-layer composite heat dissipation substrate, the FPCB, the packaging adhesive layer, the optical lens and a VC soaking plate in the driving plate form a closed-loop heat dissipation network; the VC vapor chamber with active circulation heat dissipation is obtained by changing the structure of the heat dissipation substrate, and the VC vapor chamber covers the gold wire protection glue, the bottom of the optical lens, the drive board shell and the back surface of the FPCB, so that the heat dissipation efficiency is improved, the working temperature of the module is reduced, the brightness of the product is improved, and the service life of the product is prolonged.

A novel semiconductor IC integrated circuit support feeding structure relates to the technical field of semiconductor die bonding equipment, has a material stacking and feeding mode and a material box feeding mode, and comprises a base, a material stacking frame, a feeding tray, a suction cup material taking assembly, a material pushing box assembly and a material pushing assembly. The suction cup material taking assembly sequentially sucks the supports to be subjected to die bonding to the feeding track of the feeding tray, and the material pushing assembly pushes the supports to be subjected to die bonding on the feeding track into a feeding channel of the die bonder. When the material box feeding mode is used for feeding, the feeding track on the feeding tray is detached, the suction cup material taking assembly moves to the side, away from the material stacking frame, of the feeding tray, the material box pushing assembly pushes the material box to the feeding tray, and the material pushing assembly sequentially pushes the supports to be subjected to die bonding in the material box into a feeding channel of the die bonder. By the adoption of the technical scheme, the stacking feeding mode and the material box feeding mode can be compatible, the production efficiency is improved, operation is easy and convenient, and market popularization is facilitated.

A device structure includes: an interposer including interposer dielectric material layers having formed therein interposer metal interconnect structures and die-side interposer bonding pads; at least one semiconductor die having formed therein in-die bonding pads that are bonded to a respective one of the die-side interposer bonding pads by metal-to-metal bonding; and a composite die frame laterally surrounding the at least one semiconductor die. The composite die frame includes a molding compound die frame portion including a molding compound material and frame edge reinforcement structures located at corners of the composite die frame and including a material having a lower coefficient of thermal expansion at 20 degrees Celsius than the molding compound material.

The invention discloses an AI visual detection method and system for a chip bonding packaging structure, and the method comprises the steps: collecting a preset number of historical normal chip bonding images, and marking a soldering tin region in the normal chip bonding images and the geometric parameters of corresponding soldering tin to form a training data set; constructing a preset semantic segmentation neural network capable of being trained, and performing deep learning training on the semantic segmentation neural network by using the training data set to obtain a soldering tin recognition model; collecting a to-be-detected bonding image of a to-be-detected chip bonding packaging structure, and inputting the to-be-detected bonding image into the soldering tin identification model to obtain geometric parameters of soldering tin in the to-be-detected bonding image; according to the geometric parameters of the soldering tin in the bonding image to be detected, whether bonding defects exist in the chip bonding packaging structure to be detected or not is judged according to a preset rule. According to the invention, the problem of low accuracy during chip bonding quality detection in the prior art is solved.

An original substrate structure is rearranged, a bonding pad comprises a bonding wire part and a die bonding part matched with the bonding wire part, the die bonding part comprises a common electrode part arranged in the center of a substrate and four die bonding sub-parts arranged in the circumferential direction of the common electrode part, and the die bonding sub-parts are used for bearing RGB chips. Wherein the arrangement mode of the RGB chips is changed into circumferential arrangement from linear arrangement, lamp bead abnormity caused by poor die bonding in the manufacturing process is reduced, meanwhile, each die bonding sub-part is electrically connected with the corresponding wire bonding part through a bonding wire, and the wire bonding parts and the common electrode parts are electrically connected with the corresponding pins, so that five pins exist on the back of the substrate, and the reliability of the substrate is improved. And finally, a bowl cup is fixedly arranged on the substrate and used for delineating any die bonding sub-part and the corresponding wire bonding part, the delineating die bonding sub-part is used for die bonding of the blue light chip, and the bowl cup is filled with white light packaging glue and used for displaying white light and improving the overall brightness of the lamp bead.

A package includes a package substrate including an insulating layer having a trench and a package component bonded to the package substrate. The package component includes a redistribution structure, an optical die bonded to the redistribution structure, the optical die including an edge coupler near a first sidewall of the optical die, a dam structure on the redistribution structure near the first sidewall of the optical die, a first underfill between the optical die and the redistribution structure, an encapsulant encapsulating the optical die, and an optical glue in physical contact with the first sidewall of the optical die. The first underfill does not extend along the first sidewall of the optical die. The optical glue separates the dam structure from the encapsulant. The package further includes a second underfill between the insulating layer and the package component. The second underfill is partially disposed in the trench.