Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same

A technology of pressure-sensitive adhesives and compositions, applied in the direction of non-polymer organic compound adhesives, adhesives, film/sheet adhesives, etc., which can solve the problems of complicated picking steps

Inactive Publication Date: 2008-07-30
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, typically when using known PSA compositions, UV-curable low molecular weight materials in the PSA migrate to the adjacent adhesive layer, which complicates the pick-up process

Method used

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  • Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
  • Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
  • Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same

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Experimental program
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Effect test

preparation example Construction

[0063] Preparation of Adhesive Films

[0064] An adhesive film ("Adhesive Film 1-3-a") was prepared by mixing the following compounds:

[0065] 400 g of acrylic resin (KLS-1046DR, hydroxyl value 13 mg KOH / g, acid value 63 mg KOH / g, Tg 38° C., average molecular weight 690,000, manufactured by Fujikura Kasei Co. Ltd. (Japan));

[0066] 60 g of acrylic resin (WS-023, hydroxyl value or acid value 20 mg KOH / g, Tg is -5 ° C, average molecular weight is 500,000, hydroxyl or carboxyl content is 20, manufactured by NagaseChemteX Corp. (Japan));

[0067] 60 g of cresol novolak epoxy resin (YDCN-500-4P, molecular weight 10,000 or less, manufactured by Kukdo Chemical Co. Ltd. (Korea));

[0068] 40 g of cresol novolak curing agent (MEH-7800SS, manufactured by Meiwa Plastic Industries (Japan));

[0069]0.1 g imidazole curing catalyst (2P4MZ, manufactured by Shikoku Chemicals Corp. (Japan));

[0070] 3 g of alkyl isocyanate trimethylolpropane modified pre-curing additive (L-45, manufact...

Embodiment 1-1

[0078] 300 g of an acrylic resin (PSA binder) with a solid content of 33%, a Tg of -30°C, and a weight-average molecular weight of 350,000 (PSA binder) was mixed with 80 g of U-324A (Shin -Nakamura (Japan)) mixed. Next, 2 g of polyisocyanate curing agent (L-45, Nippon Polyurethane (Japan)) and 1 g of IC-651 (Ciba-Geigy, (Switzerland)) were added to prepare a photocurable composition. This photocurable composition was coated on one side of a 38 μm thick PET separation film (MRF-38, Mitsubishi Polyester (Japan)) using an applicator. After drying at 100° C. for 2 minutes, a 100 μm thick polyolefin film (OGF-100, Osaka Godo (Japan)) was laminated by heating to 60° C. to obtain PSA film 1-4-a. The prepared PSA film 1-4-a had island regions with an average size of 5 μm.

Embodiment 1-2

[0080] 300g of acrylic resin (PSA binder) with a solid content of 33%, a Tg of -28°C, and a weight-average molecular weight of 290,000 (PSA binder) was mixed with 60g of QU-1000 (amino Ethyl formate, Mw 1,800, manufactured by QNTOP (Korea)) was mixed. Next, 2 g of polyisocyanate curing agent (L-45) and 1 g of IC-651 were added to prepare a photocurable composition. This photocurable composition was coated on one side of a 38 μm thick PET separation film (MRF-38) using an applicator. After drying at 100° C. for 2 minutes, a 100 μm thick polyolefin film (0GF-100) was laminated by heating to 60° C. to obtain a PSA film 1-4-b. The prepared PSA film 1-4-b had island regions with an average size of 6 μm.

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Abstract

A composition for forming an adhesive film is provided to prevent an acrylic adhesive binder and UV curable acrylate from being transferred to an adhesive layer when used in a dicing die bonding film, and to realize high pick-up property even in large chips greater than 10 mm X 10 mm after UV irradiation. A composition for forming an adhesive film comprises: (A) 100 parts by weight of a polymer binder resin; (B) 20-150 parts by weight of a low-molecular weight UV curable acrylate; (C) 0.1-10 parts by weight of a thermal curing agent; and (D) 0.1-5 parts by weight of a photopolymerization initiator based on 100 parts by weight of the UV curable acrylate. The adhesive film formed by the composition has a sea-island surface structure, wherein the island region has an average size of 1-10 micrometers.

Description

technical field [0001] The present invention relates to a composition for a pressure-sensitive adhesive film, a pressure-sensitive adhesive film, and a dicing wafer bonding film comprising the film. Background technique [0002] During semiconductor manufacturing, large diameter wafers (on which circuits are built) are diced into small chips (ie, wafers) in a dicing operation. For dicing operations, a dicing film can be attached to the wafer. Picking operations can then be performed and the separated chips are then attached for packaging. Each individual chip is attached to a support member such as another active device, printed circuit board (PCB), lead frame, etc. by adhesive bonding. This method involves two steps (cutting and sticking), and thus is disadvantageous in terms of cost and productivity. [0003] Another method known as "wafer backside attach die" uses a single film that integrates dicing tape and pressure sensitive adhesive (PSA). Such films include: a fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/02C09J4/00C09J7/02H01L21/301
CPCH01L2224/83191H01L24/27H01L24/29H01L2924/01005H01L21/6836H01L2924/01006H01L2224/2919H01L2224/83101H01L2924/0665H01L2224/29298H01L2924/1461
Inventor 黄龙河宋珪锡奇喜莲河京珍赵宰贤丁畅范
Owner CHEIL IND INC
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