147 results about "Dicing tape" patented technology

This separation device performs separation with respect to a multilayer substrate in which a first substrate and a second substrate are joined. With respect to a holding jig that has a dicing frame which has an opening and dicing tape which is fixed to the dicing frame so as to cover the opening, the multilayer substrate is affixed to the dicing tape by being disposed in the opening. The separation device has a holding part that holds the multilayer substrate by suctioning the dicing tape of the holding jig. The holding part includes a center region and an outer peripheral region that is divided from the center region and that surrounds the center region from the outside. The holding part applies a suction pressure, which is for suctioning the dicing tape, to each of the center region and the outer peripheral region.

A dicing method of a bonded wafer including a first substrate and a second substrate is used. The first substrate having a first face, and a second face having a recessed portion. A space portion surrounded by the recessed portion and the second substrate, is formed. The method comprising: applying dicing tape to the first face; irradiating the bonding wafer by laser in a stacking direction so as to form a modified region along a dicing line, the dicing line being set on the first substrate so as to be included in a region corresponding to the space portion; dividing the bonded wafer and manufacturing a plurality of singular pieces, with the region corresponding to the space portion of the first substrate still held by the dicing tape, by expanding the dicing tape.

Provided are a semiconductor manufacturing device capable of performing an electrical characteristic inspection while a divided chip is attached to a dicing tape and a method of manufacturing a semiconductor device. A semiconductor device include: a stage on which a dicing tape to which a plurality of semiconductor chips are attached is disposed; a probe pin provided to the stage and inserted into an inner part of the dicing tape to be electrically connected to the semiconductor chips; and a tester performing an electrical characteristic inspection on the semiconductor chips via the probe pin.

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.

An adhesive sheet for a semiconductor device includes a dicing tape integrated backside protective film disposed at predetermined intervals in a longitudinal direction of a separator, and a support film disposed to be spaced apart from the outside of the dicing tape integrated backside protective film to include both long sides of the separator, in which the support film includes an adhesive layer in contact with the separator and a second dicing tape formed on the adhesive layer, and the second dicing tape protrudes toward the dicing tape integrated backside protective film more than the adhesive layer of the support film.

This band saw machine chip disposal method employs a band saw machine (91) capable of obliquely cutting a workpiece (W) by turning a turning member (T) through a prescribed angle, the turning member (T) including a cutting head (3) that circulates a band saw blade (34), and a conveyor unit (5) that is disposed in a direction perpendicular to the tooth tips of the band saw blade (34) which is facing the workpiece (W), and that operates so as to be capable of storing, accumulating or discharging chips generated during a cutting process, wherein, when the turning member (T) is at a first turning angle, the conveyor unit (5) is operated to discharge the stored and accumulated chips, and when the turning member (T) is at a second turning angle different from the first turning angle, the operation of the conveyor unit (5) is stopped, and chips generated during the cutting process are stored and accumulated.

A tape affixing system capable of automatically switching or replacing a dicing tape. A tape affixing system 1 includes a stocker 5 that stores tape magazines 4 each accommodating a dicing tape DT wound in a roll shape, an affixing apparatus 3 which includes movable guide rollers 32a and 32b, fixed guide rollers 33a and 33b, and a knife plate 35 that regulate a reel-out region R of the dicing tape DT to a predetermined track, on which each of the tape magazines 4 is replaceably mountable, and which affixes the dicing tape DT to a dicing frame DT and a workpiece W, and a first conveyance robot 6 that delivers the tape magazine 4 between the stocker 5 and the affixing apparatus 3.

A manufacturing apparatus (10) for a semiconductor device is provided with: a chip holder (12) for holding a dicing tape (110), to which a plurality of chips (100) are attached, in a posture in which the plurality of chips (100) face downward in a gravity direction; and a pickup tool (20) for picking up, in a non-contact manner, a target chip (100a), which is one of the plurality of chips (100), from a lower side of the chip holder (12).

To provide a technique capable of facilitating management of a wafer.SOLUTION: A semiconductor manufacturing apparatus includes a cassette mounting table on which a wafer cassette accommodating a wafer ring is mounted, a wafer holding table that holds the wafer ring, a head that picks up a die from a dicing tape to which a wafer attached to the wafer ring and divided into the die is attached, a UV irradiator, and a control device that is configured to irradiate the dicing tape with UV by the UV irradiator and can perform bidirectional communication of UV irradiation information associated with an ID of the wafer cassette with a host computer.SELECTED DRAWING: Figure 7

A technique for processing an integrated circuit / tape assembly having a plurality of integrated circuits supported by an underlying dicing tape involves: placing the integrated circuit / tape assembly on a bottom file frame carrier (FFC) frame having a structure (e.g., an inner edge or a flexible peg); placing a top FFC frame having a central opening over the integrated circuit / tape assembly; and mating the top and bottom FFC frames such that the dicing tape is pulled on the structure, thereby laterally stretching the dicing tape, which causes a wafer saw frame holding the integrated circuits together to break. The lateral stretching of the dicing tape increases the distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby preventing the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than a conventional FFC configuration, which makes shipment and storage more efficient.

To provide a temperature application device and a temperature application method capable of smoothly dividing a wafer into individual chips without being affected by differences in the amount of expansion of a dicing tape.SOLUTION: A temperature application device reduces the difference in the amount of expansion of a dicing tape that occurs when dividing a wafer into individual chips by expanding the dicing tape with a wafer attached thereto using an expanding ring, and includes temperature application means that locally makes the area of the dicing tape outside the expanding ring lower in temperature than the area to which the wafer is attached.SELECTED DRAWING: Figure 1

To provide a work holding device capable of stably performing suction and holding by correcting distortion or warpage of a dicing frame.SOLUTION: Provided is a device for holding a wafer W that is adhered to a dicing frame 11 via a dicing tape 12. The device comprises: a chuck table 14 including a chuck section 15 capable of sucking and holding the wafer W and a storage section 16 which is recessed in an outer periphery of the chuck section 15; and a chuck plate 18 in which a suction hole 18e opened on a top face 18d is formed and which is disposed in the storage section 16 and capable of sucking and holding the dicing frame 11. The suction hole 18e communicates with a sealed space 27 enclosed by the chuck table 14, the dicing frame 11 and the dicing tape 12 and when a negative pressure is supplied into the sealed space 27, a connection region 12a where the dicing frame 11 and the wafer W are connected in the dicing tape 12 approaches the chuck table 14.SELECTED DRAWING: Figure 5

Cutting device for cutting a band-shaped material, in particular a sticky cord band, comprising a bar-shaped lower blade (5) and a bar-shaped upper blade (6), which is moved vertically with respect to the fixed lower blade (5) for cutting, wherein the lower blade (5) is arranged on a blade carrier (3), which blade carrier (3) is mounted on a device frame (2) for linear and horizontal movement and is linearly movable via adjusting means (8) such that the position of the lower blade (5) relative to the upper blade (6) can be changed and a cutting gap (S) between the two can be adjusted, as well as a device for detecting the horizontal movement of the lower blade (5) relative to the upper blade (6), characterized in that the device comprises at least one sensor (9), via which a value representing a measure of the movement path of the blade carrier (3) achieved via the adjusting means (8),Sensor signal can be detected and transmitted to a processing device (11) which is set up to determine path information indicating the movement path based on the sensor signal, wherein the path information can be output on a display device (12).

A method for manufacturing a semiconductor chip (20A) with a resin layer includes: a step for preparing a laminate (20) including a semiconductor substrate (21) and a resin layer (23) laminated on the semiconductor substrate; a step in which the laminate is bonded to a dicing tape (42) such that the resin layer is exposed; a step for forming a protective layer (33) on the resin layer of the laminate; a step for forming a groove (34) penetrating the protective layer and the resin layer by laser ablation; a step for singulating the semiconductor substrate through the groove; and a step for removing the cut protective layer (33A).

A method of dicing a semiconductor wafer comprises steps of a) positioning a stencil mask over the semiconductor wafer, with the stencil mask being spaced from the semiconductor wafer by a gap such that the stencil mask does not touch a component arranged on the semiconductor wafer, the stencil mask having an aperture; and b) subsequently etching through the semiconductor wafer by performing a reactive ion etch, wherein the stencil mask controls the etch. The method may allow a wafer to be diced without the use of die attach tape and without need for a cleaning step, and may be useful for dicing wafers bearing microelectromechanical systems. Also provided are a stencil mask and system useful in the method.

A wafer cutting method includes forming a plurality of grooves by scanning a laser beam onto a front surface of a wafer, wherein the wafer comprises a plurality of layers, and the laser beam comprises at least two lights; polishing a rear surface of the wafer, mounting the wafer on a dicing tape, and cutting the wafer by expanding the dicing tape, wherein the forming the plurality of grooves includes forming at least two grooves by using the at least two lights, the at least two grooves having different widths on at least two layers, among the plurality of layers of the wafer.

A chip ejecting apparatus may include: a wafer stage configured to receive a dicing tape and a plurality of chips attached to the dicing tape; an ejector under the wafer stage, the ejector configured to eject gas toward a lower surface of the dicing tape while being in a non-contact state with the dicing tape; an orthogonal robot under the wafer stage, wherein the ejector is on an upper surface of the orthogonal robot; and a controller configured to: control the orthogonal robot and the ejector to move up and down in a first direction; control the orthogonal robot to move in a second direction or a third direction; control the ejector to move in a spiral manner in the second direction and the third direction by controlling the orthogonal robot to move in the spiral manner; and control an ejecting pressure of the gas of the ejector.

According to the embodiment of the present invention, a semiconductor device includes a first nanodevice comprised of a plurality of first transistors and a second nanodevice comprised of a plurality of second transistors. The first nanodevice includes a first source / drain contact. The second nanodevice includes a second source / drain contact. The second nanodevice is located adjacent to and parallel to the first nanodevice. A power bar is located between the first nanodevice and the second nanodevice. The power bar is connected to the second source / drain contact. A top surface of the power bar and the second source / drain contact are substantially in a same plane. The top surface of the power bar and the second source / drain contact are substantially a same height.

The purpose of the present invention is to provide a resin composition that has adequate antistatic properties and that suppresses the inconvenience of an antistatic agent contaminating a metal roll of a film-forming machine during film formation, a resin film of said resin composition, and a base film for an antistatic dicing tape. To achieve this purpose, the present invention is a resin composition that includes 20-99 parts by mass of (A) an ethylene resin, 1-80 parts by mass of (B) a propylene resin, and 1-39 parts by mass of (C) a block copolymer of propylene and a polyhydric alcohol; the sum of the amount of the component (A) ethylene resin blended and the amount of the component (B) propylene resin blended is 100 parts by mass; and the component (B) propylene resin does not include a block copolymer of propylene and a polyhydric alcohol. The mass ratio of the amount of the component (B) propylene resin blended and the amount of the component (C) block copolymer of propylene and a polyhydric alcohol blended is preferably 0.4 or greater.

Embodiments herein are generally directed to ejection assemblies for singulated dies and thinned wafers and methods related thereto. Die ejection assemblies may be used to minimize cracking or deformation of dies during post-singulation processing. Thus, the die ejection assemblies and methods described herein reduce the number of dies rejected after singulation and the number of failures during a die bonding process. In one general aspect, an apparatus for removing singulated dies from a dicing tape is provided. The apparatus may include a die ejector assembly, which may include a vacuum plate configured to engage with a portion of the dicing tape. A die ejector may be disposed in an ejector opening of the vacuum plate. One or more actuators may be configured to move at least a portion of the die ejector in a lateral direction relative to the upper surface of the vacuum plate.

A method for cutting a ribbon-shaped multilayer master adhesive tape (1), comprising at least one carrier and / or at least one liner and at least one adhesive layer, by shear cutting with at least two upper knives (21) and at least two lower knives (22) into at least one adhesive tape (1a), in which self-springing circular knives are used as upper knives (21), makes it possible to provide particularly narrow adhesive tapes (1a) with a width of less than 4 mm.

Method and apparatus for monitoring the tension of a cutting belt. A method for monitoring the tension of a cutting belt is described. The method includes obtaining tension data indicative of the tension of each cutting belt by means of an automatic optical inspection of each cutting belt.

A method of forming an integrated circuit (IC) is provided. The method includes applying a die attach film to a first surface of a wafer opposite a second surface. The method also includes applying a passivation layer to the second surface of the wafer. The method further includes patterning the passivation layer to define a number of scribe lines. The method yet further includes applying a dicing tape having a nonconductive material to the die attach film. The nonconductive material is resistant to plasma etching. The method includes plasma etching the wafer to form dies of a plurality of dies supported by the dicing tape based on the scribe lines.

A method of forming an integrated circuit (IC) is provided. The method includes applying a die attach film (104) to a first surface (106) of a wafer (100) opposite a second surface (108). The method also includes applying a passivation layer (110) to the second surface (108) of the wafer (100). The method further includes patterning the passivation layer (110) to define a number of scribe lines. The method yet further includes applying a dicing tape (102) having a nonconductive material to the die attach film (104). The nonconductive material is resistant to plasma etching. The method includes plasma etching the wafer (100) to form dies of a plurality of dies supported by the dicing tape (102) based on the scribe lines.

A manufacturing device (10) for manufacturing semiconductor devices can further improve the bonding quality of a chip to an object, comprising: a wafer holding device (12), a PU device (14) having a PU head (40) for holding an object chip (100) in a non-contact manner, an energy irradiation device (16) for irradiating energy from the back side of a dicing tape (130) toward the object chip (100) to reduce the adhesive force of the dicing tape (130), and a controller (22), wherein the adhesive layer of the dicing tape (130) is a self-peeling adhesive layer whose adhesive force decreases with the irradiation of the energy and causes the object chip (100) to float a small distance, and the controller (22) controls the position of the PU head (40) during the detachment preparation period so that the object chip (100) and the PU head (40) do not contact each other even if the object chip (100) floats.

A tape affixing apparatus and a tape magazine capable of automatically switching or replacing a dicing tape. An affixing apparatus 3 includes a base section 31 on which a tape magazine 4 accommodating a dicing tape DT wound in a roll shape with a part of the dicing tape DT reeled out is installed to be replaceably mountable, movable guide rollers 32a and 32b, fixed guide rollers 33a and 33b, and a knife plate 35 that are movable to regulate a reel-out region R where the part of the dicing tape DT is reeled out to a predetermined track.

The present invention provides a method for manufacturing a semiconductor chip, comprising the steps of: preparing a surface protective laminate having a semiconductor wafer having a circuit surface and a back surface, a protective layer, and a back surface grinding tape; grinding the semiconductor wafer from the back side, thereby thinning the semiconductor wafer; fixing the surface protection laminated body on the cutting tape; peeling off the back grinding tape from the surface protection laminate; forming a semiconductor chip by dividing the semiconductor wafer on the dicing tape together with the protective layer; and removing the protective layer attached to the semiconductor chip.

A die pickup module and a die bonding apparatus including the same are disclosed. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die separator disposed under the dicing tape and separating a die to be picked up from the dicing tape, a non-contact pickup for picking up the die in a non-contact manner such that a front surface of the die is not contacted, a vertical driving unit moving the non-contact pickup in a vertical direction to pick up the die, and a flip driving unit for flipping the non-contact pickup to flip the die picked up by the non-contact pickup.

To provide an apparatus for manufacturing a semiconductor device capable of appropriately picking up a target chip in a non-contact manner.SOLUTION: A semiconductor-device manufacturing device 10 includes a chip holder 12 for holding a dicing tape 110 to which a plurality of chips 100 are stuck in a posture in which the plurality of chips 100 face downward in a gravity direction, and a pickup tool 20 for picking up a target chip 100a, which is one of the plurality of chips 100, from a lower side of the chip holder 12 in a non-contact manner.SELECTED DRAWING: Figure 1

This invention provides a workpiece splitting device that eliminates the problem of chip quality degradation caused by contact between chips after splitting. [Solution] The workpiece splitting device includes an expand ring 14 for expanding the dicing tape 3, an expansion holding ring 18 formed in a ring shape having an elastically deformable fitting portion 26, which holds the expanded state of the dicing tape 3 by fitting the fitting portion 26 to the surface of the frame 4 when the dicing tape 3 is expanded by the expand ring 14, and a heating unit 28 that heats the fitting portion 26 of the expansion holding ring 18 before the fitting portion 26 of the expansion holding ring 18 is fitted to the surface of the frame 4.