124 results about "Dicing tape" patented technology

This separation device performs separation with respect to a multilayer substrate in which a first substrate and a second substrate are joined. With respect to a holding jig that has a dicing frame which has an opening and dicing tape which is fixed to the dicing frame so as to cover the opening, the multilayer substrate is affixed to the dicing tape by being disposed in the opening. The separation device has a holding part that holds the multilayer substrate by suctioning the dicing tape of the holding jig. The holding part includes a center region and an outer peripheral region that is divided from the center region and that surrounds the center region from the outside. The holding part applies a suction pressure, which is for suctioning the dicing tape, to each of the center region and the outer peripheral region.

Provided are a semiconductor manufacturing device capable of performing an electrical characteristic inspection while a divided chip is attached to a dicing tape and a method of manufacturing a semiconductor device. A semiconductor device include: a stage on which a dicing tape to which a plurality of semiconductor chips are attached is disposed; a probe pin provided to the stage and inserted into an inner part of the dicing tape to be electrically connected to the semiconductor chips; and a tester performing an electrical characteristic inspection on the semiconductor chips via the probe pin.

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.

A tape affixing system capable of automatically switching or replacing a dicing tape. A tape affixing system 1 includes a stocker 5 that stores tape magazines 4 each accommodating a dicing tape DT wound in a roll shape, an affixing apparatus 3 which includes movable guide rollers 32a and 32b, fixed guide rollers 33a and 33b, and a knife plate 35 that regulate a reel-out region R of the dicing tape DT to a predetermined track, on which each of the tape magazines 4 is replaceably mountable, and which affixes the dicing tape DT to a dicing frame DT and a workpiece W, and a first conveyance robot 6 that delivers the tape magazine 4 between the stocker 5 and the affixing apparatus 3.

A manufacturing apparatus (10) for a semiconductor device is provided with: a chip holder (12) for holding a dicing tape (110), to which a plurality of chips (100) are attached, in a posture in which the plurality of chips (100) face downward in a gravity direction; and a pickup tool (20) for picking up, in a non-contact manner, a target chip (100a), which is one of the plurality of chips (100), from a lower side of the chip holder (12).

To provide a technique capable of facilitating management of a wafer.SOLUTION: A semiconductor manufacturing apparatus includes a cassette mounting table on which a wafer cassette accommodating a wafer ring is mounted, a wafer holding table that holds the wafer ring, a head that picks up a die from a dicing tape to which a wafer attached to the wafer ring and divided into the die is attached, a UV irradiator, and a control device that is configured to irradiate the dicing tape with UV by the UV irradiator and can perform bidirectional communication of UV irradiation information associated with an ID of the wafer cassette with a host computer.SELECTED DRAWING: Figure 7

A technique for processing an integrated circuit / tape assembly having a plurality of integrated circuits supported by an underlying dicing tape involves: placing the integrated circuit / tape assembly on a bottom file frame carrier (FFC) frame having a structure (e.g., an inner edge or a flexible peg); placing a top FFC frame having a central opening over the integrated circuit / tape assembly; and mating the top and bottom FFC frames such that the dicing tape is pulled on the structure, thereby laterally stretching the dicing tape, which causes a wafer saw frame holding the integrated circuits together to break. The lateral stretching of the dicing tape increases the distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby preventing the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than a conventional FFC configuration, which makes shipment and storage more efficient.

A method for manufacturing a semiconductor chip (20A) with a resin layer includes: a step for preparing a laminate (20) including a semiconductor substrate (21) and a resin layer (23) laminated on the semiconductor substrate; a step in which the laminate is bonded to a dicing tape (42) such that the resin layer is exposed; a step for forming a protective layer (33) on the resin layer of the laminate; a step for forming a groove (34) penetrating the protective layer and the resin layer by laser ablation; a step for singulating the semiconductor substrate through the groove; and a step for removing the cut protective layer (33A).

A method of dicing a semiconductor wafer comprises steps of a) positioning a stencil mask over the semiconductor wafer, with the stencil mask being spaced from the semiconductor wafer by a gap such that the stencil mask does not touch a component arranged on the semiconductor wafer, the stencil mask having an aperture; and b) subsequently etching through the semiconductor wafer by performing a reactive ion etch, wherein the stencil mask controls the etch. The method may allow a wafer to be diced without the use of die attach tape and without need for a cleaning step, and may be useful for dicing wafers bearing microelectromechanical systems. Also provided are a stencil mask and system useful in the method.

A wafer cutting method includes forming a plurality of grooves by scanning a laser beam onto a front surface of a wafer, wherein the wafer comprises a plurality of layers, and the laser beam comprises at least two lights; polishing a rear surface of the wafer, mounting the wafer on a dicing tape, and cutting the wafer by expanding the dicing tape, wherein the forming the plurality of grooves includes forming at least two grooves by using the at least two lights, the at least two grooves having different widths on at least two layers, among the plurality of layers of the wafer.

A chip ejecting apparatus may include: a wafer stage configured to receive a dicing tape and a plurality of chips attached to the dicing tape; an ejector under the wafer stage, the ejector configured to eject gas toward a lower surface of the dicing tape while being in a non-contact state with the dicing tape; an orthogonal robot under the wafer stage, wherein the ejector is on an upper surface of the orthogonal robot; and a controller configured to: control the orthogonal robot and the ejector to move up and down in a first direction; control the orthogonal robot to move in a second direction or a third direction; control the ejector to move in a spiral manner in the second direction and the third direction by controlling the orthogonal robot to move in the spiral manner; and control an ejecting pressure of the gas of the ejector.

According to the embodiment of the present invention, a semiconductor device includes a first nanodevice comprised of a plurality of first transistors and a second nanodevice comprised of a plurality of second transistors. The first nanodevice includes a first source / drain contact. The second nanodevice includes a second source / drain contact. The second nanodevice is located adjacent to and parallel to the first nanodevice. A power bar is located between the first nanodevice and the second nanodevice. The power bar is connected to the second source / drain contact. A top surface of the power bar and the second source / drain contact are substantially in a same plane. The top surface of the power bar and the second source / drain contact are substantially a same height.

The purpose of the present invention is to provide a resin composition that has adequate antistatic properties and that suppresses the inconvenience of an antistatic agent contaminating a metal roll of a film-forming machine during film formation, a resin film of said resin composition, and a base film for an antistatic dicing tape. To achieve this purpose, the present invention is a resin composition that includes 20-99 parts by mass of (A) an ethylene resin, 1-80 parts by mass of (B) a propylene resin, and 1-39 parts by mass of (C) a block copolymer of propylene and a polyhydric alcohol; the sum of the amount of the component (A) ethylene resin blended and the amount of the component (B) propylene resin blended is 100 parts by mass; and the component (B) propylene resin does not include a block copolymer of propylene and a polyhydric alcohol. The mass ratio of the amount of the component (B) propylene resin blended and the amount of the component (C) block copolymer of propylene and a polyhydric alcohol blended is preferably 0.4 or greater.

Embodiments herein are generally directed to ejection assemblies for singulated dies and thinned wafers and methods related thereto. Die ejection assemblies may be used to minimize cracking or deformation of dies during post-singulation processing. Thus, the die ejection assemblies and methods described herein reduce the number of dies rejected after singulation and the number of failures during a die bonding process. In one general aspect, an apparatus for removing singulated dies from a dicing tape is provided. The apparatus may include a die ejector assembly, which may include a vacuum plate configured to engage with a portion of the dicing tape. A die ejector may be disposed in an ejector opening of the vacuum plate. One or more actuators may be configured to move at least a portion of the die ejector in a lateral direction relative to the upper surface of the vacuum plate.

A method of forming an integrated circuit (IC) is provided. The method includes applying a die attach film to a first surface of a wafer opposite a second surface. The method also includes applying a passivation layer to the second surface of the wafer. The method further includes patterning the passivation layer to define a number of scribe lines. The method yet further includes applying a dicing tape having a nonconductive material to the die attach film. The nonconductive material is resistant to plasma etching. The method includes plasma etching the wafer to form dies of a plurality of dies supported by the dicing tape based on the scribe lines.

A method of forming an integrated circuit (IC) is provided. The method includes applying a die attach film (104) to a first surface (106) of a wafer (100) opposite a second surface (108). The method also includes applying a passivation layer (110) to the second surface (108) of the wafer (100). The method further includes patterning the passivation layer (110) to define a number of scribe lines. The method yet further includes applying a dicing tape (102) having a nonconductive material to the die attach film (104). The nonconductive material is resistant to plasma etching. The method includes plasma etching the wafer (100) to form dies of a plurality of dies supported by the dicing tape (102) based on the scribe lines.

A manufacturing device (10) for manufacturing semiconductor devices can further improve the bonding quality of a chip to an object, comprising: a wafer holding device (12), a PU device (14) having a PU head (40) for holding an object chip (100) in a non-contact manner, an energy irradiation device (16) for irradiating energy from the back side of a dicing tape (130) toward the object chip (100) to reduce the adhesive force of the dicing tape (130), and a controller (22), wherein the adhesive layer of the dicing tape (130) is a self-peeling adhesive layer whose adhesive force decreases with the irradiation of the energy and causes the object chip (100) to float a small distance, and the controller (22) controls the position of the PU head (40) during the detachment preparation period so that the object chip (100) and the PU head (40) do not contact each other even if the object chip (100) floats.

A tape affixing apparatus and a tape magazine capable of automatically switching or replacing a dicing tape. An affixing apparatus 3 includes a base section 31 on which a tape magazine 4 accommodating a dicing tape DT wound in a roll shape with a part of the dicing tape DT reeled out is installed to be replaceably mountable, movable guide rollers 32a and 32b, fixed guide rollers 33a and 33b, and a knife plate 35 that are movable to regulate a reel-out region R where the part of the dicing tape DT is reeled out to a predetermined track.

The present invention provides a method for manufacturing a semiconductor chip, comprising the steps of: preparing a surface protective laminate having a semiconductor wafer having a circuit surface and a back surface, a protective layer, and a back surface grinding tape; grinding the semiconductor wafer from the back side, thereby thinning the semiconductor wafer; fixing the surface protection laminated body on the cutting tape; peeling off the back grinding tape from the surface protection laminate; forming a semiconductor chip by dividing the semiconductor wafer on the dicing tape together with the protective layer; and removing the protective layer attached to the semiconductor chip.

A die pickup module and a die bonding apparatus including the same are disclosed. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die separator disposed under the dicing tape and separating a die to be picked up from the dicing tape, a non-contact pickup for picking up the die in a non-contact manner such that a front surface of the die is not contacted, a vertical driving unit moving the non-contact pickup in a vertical direction to pick up the die, and a flip driving unit for flipping the non-contact pickup to flip the die picked up by the non-contact pickup.

To provide an apparatus for manufacturing a semiconductor device capable of appropriately picking up a target chip in a non-contact manner.SOLUTION: A semiconductor-device manufacturing device 10 includes a chip holder 12 for holding a dicing tape 110 to which a plurality of chips 100 are stuck in a posture in which the plurality of chips 100 face downward in a gravity direction, and a pickup tool 20 for picking up a target chip 100a, which is one of the plurality of chips 100, from a lower side of the chip holder 12 in a non-contact manner.SELECTED DRAWING: Figure 1

This invention provides a workpiece splitting device that eliminates the problem of chip quality degradation caused by contact between chips after splitting. [Solution] The workpiece splitting device includes an expand ring 14 for expanding the dicing tape 3, an expansion holding ring 18 formed in a ring shape having an elastically deformable fitting portion 26, which holds the expanded state of the dicing tape 3 by fitting the fitting portion 26 to the surface of the frame 4 when the dicing tape 3 is expanded by the expand ring 14, and a heating unit 28 that heats the fitting portion 26 of the expansion holding ring 18 before the fitting portion 26 of the expansion holding ring 18 is fitted to the surface of the frame 4.

To provide a dicing die bond film or the like capable of maintaining a separation distance (kerf) between adjacent semiconductor chips for a long period of time and exhibiting good pickup properties.SOLUTION: The dicing die-bonding film includes a dicing tape having a base layer and a pressure-sensitive adhesive layer superposed on one surface of the base layer, and a die-bonding sheet superposed on the pressure-sensitive adhesive layer, wherein the dicing tape has a stress relaxation ratio of 65% or more when stretched by 5% and held for 3 minutes, and the pressure-sensitive adhesive layer has an adhesive strength of 0. 30N / 20mm or less with respect to the die-bonding sheet.SELECTED DRAWING: Figure 1

A non-contact semiconductor die singulation process utilizes compressed air to separate a first portion of a semiconductor wafer from a second portion of the semiconductor wafer. During the non-contact semiconductor die singulation process, the semiconductor wafer is placed on dicing tape. A channel is formed along various scribe lines in the semiconductor wafer. When the channels are formed, a compressed air tool applies compressed air along a length of the channel. Pressure from the compressed air causes the semiconductor wafer to deform. As the semiconductor wafer deforms, the semiconductor wafer cracks or splits along the length of the scribe line thereby separating the first portion of the semiconductor wafer from the second portion.

To provide a dicing tape and a dicing bond film which are excellent in cutting properties and pickup properties, in a semiconductor manufacturing process.SOLUTION: A dicing tape 10 is composed of: a base material film 1 having an average value of Young's modulus in an MD direction and an elastic modulus in 5% elongation in a TD direction at 0°C of 165-260 MPa; and an adhesive layer 2 which contains 2.4-7.0 pts.mass of a polyisocyanate crosslinking agent with respect to 100 pts.mass of an acrylic adhesive polymer having an active energy ray reactive carbon-carbon double bond and a hydroxyl value of 12.0-40.5 mgKOH / g, has an equivalent ratio (-NCO / -OH) of the isocyanate group contained in the polyisocyanate-based crosslinking agent to the hydroxyl group contained in the acrylic adhesive polymer of 0.14-1.32, adhesive force to a stainless steel plate at 23°C after irradiation with ultraviolet light in the presence of oxygen of 3.50 N / 25 mm or less, and adhesive force thereto after irradiation with ultraviolet light in the absence of oxygen of 0.25-0.70 N / 25 mm.SELECTED DRAWING: Figure 2

Disclosed are a multi-stage ejector for separating a pickup-target chip from dicing tape in stages, and a method of driving the multi-stage ejector. The multi-stage ejector includes a plurality of ejecting blocks each including a contact portion that comes into contact with dicing tape, a lifting unit including a driving module configured to move the ejecting blocks upward or downward, and a restriction unit configured to limit a lifting height of each of the ejecting blocks. The ejecting blocks are configured such that the lifting height of an nth ejecting block is greater than the lifting height of an (n−1)th ejecting block positioned on a relatively outer side with respect to the nth ejecting block.

A die bonding apparatus includes a push-up unit, a head having a collet that sucks a die, and a control device. The control device is configured to suck a dicing tape using a dome plate; land the collet onto the die using the head; suck the die using the collet; lift plural blocks from the dome plate; stop the outermost block disposed on the outermost side among the plural blocks from lifting at a height where the die is peeled off from the dicing tape; and lift blocks other than the outermost block among the plural blocks higher than the outermost block to a predefined height.

A non-contact semiconductor die singulation process utilizes compressed air to separate a first portion of a semiconductor wafer from a second portion of the semiconductor wafer. During the non-contact semiconductor die singulation process, the semiconductor wafer is placed on a dicing tape. A channel is formed along various scribe lines in the semiconductor wafer. When the channel is formed, a compressed air tool applies compressed air along the length of the channel. Pressure from the compressed air deforms the semiconductor wafer. When the semiconductor wafer is deformed, the semiconductor wafer breaks or cracks along the length of the scribe line, thereby separating the first portion from the second portion of the semiconductor wafer.

This invention discloses a silicon powder collection and processing device and method for single-crystal silicon wafer cutting, specifically relating to the field of silicon powder collection devices. The device includes a cutting worktable, a cutting machine, and a silicon powder collection box. The silicon powder collection box is connected to one side of the cutting worktable. A first guide plate bent downwards and a second guide plate bent upwards are respectively installed on the top and bottom inner walls of the cutting worktable. A support frame is fixedly connected inside the silicon powder collection box, and a transmission roller is rotatably connected to the inner wall of the support frame. A rotary motor and a suction pump are respectively connected to both ends of the transmission roller. The suction pump is used to suction the silicon powder generated during the cutting of single-crystal silicon wafers within the cutting worktable. A liquid storage tank and a dust storage tank are fixedly connected to the top and bottom of the silicon powder collection box, respectively, ultimately causing the silicon powder on the dust baffle to fall into the dust storage tank. This solves the problem that workers need to disassemble the silicon powder collection device each time to remove the silicon powder and avoids the problem of the silicon powder being ignited by electrical sparks or heat generated during the cutting process.

The invention provides a semiconductor manufacturing apparatus and a manufacturing method of a semiconductor device, which can perform electrical characteristic inspection in a state that a separated chip is pasted on a cutting belt. A semiconductor device according to the present invention comprises: a stage on which a dicing tape on which a plurality of semiconductor chips are attached is placed; a probe which is provided on the stage, is inserted into the dicing tape, and is in contact with the semiconductor chip; and a tester that inspects the electrical characteristics of the semiconductor chip through the probe.