1015 results about "Split lines" patented technology

The invention provides a method for separating semiconductor light-emitting devices formed on a substrate. In the method, a pulse laser beam having a pulse width less than 10 ps in a substrate is focused on the substrate, to thereby cause multi-photon absorption in the substrate. Through multi-photon absorption, a groove is formed through the pulse laser beam along a split line predetermined on a surface of the substrate, the groove being substantially continuous in the direction of the predetermined split line. In addition, internal structurally changed portions are formed through the pulse laser beam at a predetermined depth of the substrate on a predetermined split face, the structurally changed portions being discontinuous in the direction of the predetermined split line. Subsequently, an external force is applied to thereby form a split face along the continuous groove and the discontinuous internal structurally changed portions, whereby the semiconductor light-emitting devices are separated from one another

A machining apparatus utilizing a laser beam, the machining apparatus being capable of efficiently forming a deterioration zone of a required thickness along a division line. A laser beam from laser beam generation means is focused not to a single focused spot, but to at least two focused spots displaced in the direction of an optical axis.

A method of singulating a microelectronic wafer. The method comprises: providing a microelectronic wafer; focusing a laser beam in an interior region of the wafer from the backside of the wafer to form a modified region extending along the severance lines of the wafer dividing the wafer IC chips, the modified region further extending from an undersurface of the active surface and ending at a predetermined depth with respect to the backside. The modified region comprises a plurality of modified sites of the wafer molten by the laser and resolidified. The method further includes reducing a thickness of the wafer in a direction from the backside toward the active surface by a reduction amount equal to at least the predetermined depth; and dividing the wafer into individual IC chips along the severance lines at the modified sites.

A wafer has, on a front face thereof, a device region in which a device is formed in regions partitioned by a plurality of scheduled division lines. An outer peripheral region surrounds the device region. A reflecting film of a predetermined width is formed from the outermost periphery of the wafer on a rear face of the wafer corresponding to the outer peripheral region. The front face side of the wafer is held in a chuck table, and a focal point of a pulsed laser beam of a wavelength having permeability through the wafer is positioned in the inside of the wafer corresponding to the scheduled division lines. The pulsed laser beam is irradiated from the rear face side of the wafer to form modified layers individually serving as a start point of division along the scheduled division lines in the inside of the wafer.

There is provided a lane departure warning apparatus capable of preventing false warnings and absence of a warning regarding lane departure which is attributed to special road geometries such as junctions and tollgates. The lane departure warning apparatus for outputting a warning signal upon determining departure of a vehicle from a lane, performing the steps of: when one dividing line in a vehicle width direction of the vehicle is non-detected, estimating a position of the one dividing line based on a position of the other dividing line as a first estimation dividing line; estimating a position of the non-detected one dividing line based on a position of the one dividing line prior to non-detection as a second estimation dividing line; and comparing the first estimation dividing line with the second estimation dividing line to determine lane departure.

A method for repairing an ex-service gas turbine component (10) includes the steps of: removing a damaged section (13) from the gas turbine component (10), manufacturing a 3-D article, which fits in the gas turbine component (10) to replace the removed damaged section (13), and joining the gas turbine component (10) and the 3-D article inserted therein. Reduced cost, improved flexibility and productivity, and simplified handling are achieved by removing the damaged section (13) in the form of a cut-out section along a split line (14) as one single cut-out piece (15), measuring the cut-out piece (15) to obtain the actual non-parametric geometry data set of the cut-out piece (15), and manufacturing the 3-D article based on the geometry data set of the cut-out piece (15).

A wafer formed from an SiC substrate having a first surface and a second surface is divided into individual device chips. A division start point formed by a laser has a depth corresponding to the finished thickness of each device chip along each division line formed on the first surface. The focal point of the laser beam is set inside the SiC substrate at a predetermined depth from the second surface, and the laser beam is applied to the second surface while relatively moving the focal point and the SiC substrate to thereby form a modified layer parallel to the first surface and cracks extending from the modified layer along a c-plane, thus forming a separation start point. An external force is applied to the wafer, thereby separating the wafer into a first wafer having the first surface and a second wafer having the second surface.

Presented herein are methods and devices for designing dental components, such as physical models of a patient's anatomy, crowns and bridges. An operator of a prosthetic designing system can receive information, such as from a scanner, which provides information on the topology of the patient's dentition. The operator can use this information to design a custom prosthetic to fit the patient. Part of the designing process involves using a finish line defined for a preparation as a segmentation line for a physical die corresponding to the preparation, and using a path of draw line as an insertion axis line for a dental prosthetic.

A wafer processing method for dividing a wafer having function elements in area sectioned by dividing lines formed on the front surface in a lattice pattern into individual chips along the dividing lines, comprising a deteriorated layer forming step for forming a deteriorated layer on the side of the back surface of a position at a distance corresponding to the final thickness of the chip from the front surface of the wafer by applying a laser beam capable of passing through the wafer along the dividing lines from the back surface of the wafer; a dividing step for dividing the wafer into individual chips along the dividing lines by applying external force to the wafer in which the deteriorated layer has been formed along the dividing lines; and a back surface grinding step for grinding the back surface of the wafer divided into individual chips to the final thickness of the chip.

A semiconductor device manufacturing apparatus includes etching equipment, damage forming equipment, dividing equipment and removing equipment. The etching equipment etches a film formed on an element forming surface of a semiconductor wafer, thereby defining a dicing line or a chip-dividing line. The damage forming equipment forms damage layers used as starting points to divide a semiconductor wafer into discrete semiconductor chips on a rear surface side of the semiconductor wafer which is opposite to an element forming surface. The dividing equipment divides the semiconductor wafer into discrete semiconductor chips with the damage layers used as the starting points. The removing equipment removes a rear surface portion of the semiconductor wafer to at least a depth where the damage layers are no more present.

The invention relates to a split line moving platform. A power transmission lead is used as a working path in the platform, various barriers (a vibration damper, a crimping pipe, a spacing bar, a suspension line clamp, an insulator string and the like) are spanned and avoided, the platform is provided with a camera which can observe the condition of the running line and timely discover the defects of the line and hardware tools, and other working mechanical arms can be expanded to finish clearing line barriers and the like. A robot has flexible action and large working range, has the effect of protecting devices during jumping the barriers, and has high safety and reliability. The platform mainly consists of a traveling device, a driving arm device, an anti-tilting device and a power supply control box; and the traveling device is arranged on an electric cable and connected with the driving arm device, and the anti-tilting device is arranged at the tail end of the traveling device.

An embodiment of the invention provides a multiple-picture display control method, a multiple-picture display control device and a multiple-picture display control system. The method comprises the steps of receiving sliding tracks operated by a user, performing multiple-picture split line operation according to the sliding tracks operated by the user and controlling a target screen to perform picture displaying according to a multiple-picture display mode formed by operated multiple-picture split lines. By means of the multiple-picture display control method, the multiple-picture display control device and the multiple-picture display control system, the multiple-picture display mode can be intuitively and flexibly arranged.

The present invention relates to a circular masking-out area rate determination-based adhesive particle image concave point segmentation method. The method comprises the following steps of 1) carrying out the image pre-processing to obtain a binary image of a particle image; 2) carrying out the concave point rough detection to obtain an angular point image of the particle image; 3) carrying out the concave point accurate detection, and utilizing an area rate method to obtain all concave points capable of being used for the particle segmentation in a regional contour; 4) carrying out the concave point pairing, wherein the selected concave point pairs are used as the segmentation points of an adhesive particle image; 5) constructing a segmentation line of the particles, obtaining the contour coordinates of individual particles, and combining the coordinates of two segmentation points to obtain the complete particle contour. According to the present invention, by combining an angular point detection method and a method based on concave point analysis, an operand problem brought by purely utilizing the concave point search based on area is avoided; by setting few parameters, a lot of sample training is not needed; at the same time, the segmentation paths can be replanned, thereby being able to adapt to the different shape and size change of the images.

A wafer dividing method including a step of applying a laser beam to a wafer along division lines with the focal point of the laser beam set inside the wafer, thereby forming modified layers inside the wafer along the division lines; a step of attaching an adhesive tape to the wafer, the adhesive tape having a base sheet and an adhesive layer; a dividing step of applying an external force to the wafer by expanding the adhesive tape, thereby dividing the wafer along the division lines to obtain a plurality of device chips; and a debris catching step of heating the adhesive tape to thereby soften the adhesive layer such that it enters the space between any adjacent ones of the device chips obtained by the dividing step, thereby catching debris generated on the side surface of each device chip in the dividing step to the adhesive layer by adhesion.

The invention provides a method for separating semiconductor light-emitting devices formed on a substrate. In the method, a pulse laser beam having a pulse width less than 10 ps in a substrate is focused on the substrate, to thereby cause multi-photon absorption in the substrate. Through multi-photon absorption, a groove is formed through the pulse laser beam along a split line predetermined on a surface of the substrate, the groove being substantially continuous in the direction of the predetermined split line. In addition, internal structurally changed portions are formed through the pulse laser beam at a predetermined depth of the substrate on a predetermined split face, the structurally changed portions being discontinuous in the direction of the predetermined split line. Subsequently, an external force is applied to thereby form a split face along the continuous groove and the discontinuous internal structurally changed portions, whereby the semiconductor light-emitting devices are separated from one another.

A method of dividing a substrate 10 into individual pieces by setting dividing lines A used to dividing the substrate 10 into individual pieces at a predetermined interval in a vertical direction and a horizontal direction and then dividing the substrate 10 along the dividing lines A, includes a step of forming chamfering patterns 14 to form through holes, which are used to chamfer corner portions of individual pieces of the substrate, in respective intersection points between the dividing lines on the substrate, a step of forming chamfering through holes by etching the substrate 10, and a step of obtaining the individual pieces of the substrate by separating the substrate in the vertical direction and the horizontal direction along the dividing lines A respectively.

A method for manufacturing a semiconductor element of the present invention, has: a laser irradiation step of focusing a pulsed laser beam inside of a substrate constituting a wafer, thereby forming a plurality of isolated processed portions along an intended dividing line inside of the substrate, and creating a fissure that runs from the processed portions at least to the surface of the substrate and links adjacent processed portions; and a wafer division step of dividing the wafer along the intended dividing line.

The invention discloses a method for cutting a portable data file (PDF) 417 standard two-dimensional bar code image based on a projection mode by using image profile information. The method comprises the following steps of: inputting the normal PDF417 standard two-dimensional bar code image, carrying out grey processing, and binarizing a grey image by using a self-adaptive global threshold value to obtain a two-dimensional code binary image; cutting two-dimensional code areas of the processed image to obtain the image which only has the code areas; identifying the obtained two-dimensional code image, detecting coordinates of partition lines of each row, and calculating row height; detecting whether the two-dimensional code image is inversed, cutting each code word image sequentially from top to bottom and from right to left according to the detected coordinates of the partition lines of the row, the row height, the coordinates of the partition lines of a line, and line width; and identifying code words from right to left reversely, and converting the code words into corresponding code word sequences. By the method, each code word can be cut accurately in the situation that the image is partially contaminated, lost or even inclined slightly at an angle of less than 0.1 degree. The method is high in robustness and high in reliability.

The invention discloses a recognition and counting method for cells, comprising nine steps: preprocessing an image in a micron-order microscopic acquisition environment; extracting cell holes from the preprocessed image; performing closed hole filling of cells by using the knowledge of a connected domain; extracting a contour point sequence of cells from the image filled in step 3; filling non-closed holes of cells by adopting a non-closed hole filling method based on circularity determination; performing chamfer distance transformation on the filled image; performing extreme value uniqueness marking on cell hole positions; segmenting the image after extreme value uniqueness by using a marked watershed method; and quantifying and marking the segmented result. The method has the advantages that the influence of image noise can be greatly reduced, the phenomena of over-segmentation and discontinuous segment lines are eliminated, the segmentation effect is improved, and the cell recognition rate is improved.

A laser beam machining method for a wafer, wherein an operation of irradiating the inside of a wafer with a laser beam L along each of planned dividing lines is repeated a plural number of times from a position proximate to a back-side surface of the wafer toward a face-side surface of the wafer so that a plurality of composite layers each including a denatured layer and a cracked layer extending from the denatured layer toward the face-side surface are formed stepwise at intervals (first laser beam irradiation step). Subsequently, each of some of non-cracked layers between the composite layers is irradiated with the laser beam L so as to extend the cracked layer of a given one of the composite layers and to cause the cracked layer to reach the denatured layer of the composite layer which is adjacent to the given one composite layer. The denatured layers and the cracked layers which are sufficient for enabling the wafer to be split are formed by a reduced number of laser beam irradiation operations.

A method of dividing a plate-like workpiece having a layer that is made of a different material from that of a substrate and is formed on the front surface of the substrate along predetermined dividing lines, comprising a laser beam application step for applying a laser beam along the dividing lines formed on the plate-like workpiece to form a plurality of grooves deeper than the layer and a cutting step for cutting the plate-like workpiece with a cutting blade along the plurality of grooves formed in the laser beam application step, wherein a length between the outer sides of grooves on both sides formed in the laser beam application step is set to be larger than the thickness of the cutting blade and the cutting blade cuts the area between the outer sides of the grooves on both sides in the cutting step.