The invention discloses an automatic
chip packaging defect identification method based on
computer vision, which comprises the following steps of: generating multi-scale features and candidate regions, and establishing a detection head containing array parameter
estimation and RepPoints
point set regression and classification; the
pitch, the rotation angle, the original point and the relaxation threshold value are regressed, and a
pitch locking grid model is constructed; outputting a
point set containing coordinates, scales, kernel weights and gating probabilities, and screening effective points; projecting according to the grid model and applying bounded offset to obtain a
pitch locking point; constructing an implicit distance
field based on the locking point and extracting a defect contour; calculating a minimum enclosing rectangle, a length, a width, an area and a minimum gap; fusing the classification
score, the gating
retention rate and the curvature stability to generate an instance confidence coefficient, and performing non-maximum suppression; and outputting defect types, position frames, contours and measurement results. According to the invention,
integrated processing of array prior, contour reconstruction and metering is realized.