The application discloses a cylindrical rotation multi-path
laser beam
processing method and relates to the technical field of cylindrical
surface processing. The
processing method comprises the following steps: S1, adjusting the light path of a
laser; S2, marking points or lines on the surface of a
polyurethane cylinder through
laser light emission, and driving the laser to offset through a marking
control system; S3, moving the laser to the focal point position of the
polyurethane cylinder, marking and slotting through
laser light emission, and rotating the
polyurethane cylinder simultaneously for one circle, wherein the adjustment of the
laser light path position is completed when the
line width of laser marking and slotting is the same as the
line width of polyurethane cylinder rotation; and S4, adjusting the parameters of the marking
control system, and reaching the
processing slotting position of the laser, and processing the polyurethane cylinder through
laser light emission. The application provides a cylindrical rotation multi-path laser beam processing method,
laser processing polyurethane cylinders, limited production cost change, significantly improving production efficiency, and reducing production cost.