386 results about "Laser beam machining" patented technology

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, wherein the machine further comprises a protective film forming means for forming a protective film on the to-be-processed surface of the workpiece before laser beam processing.

In a laser beam machining method, a liquid, through which a laser beam can be transmitted, is supplied to the target surface of an object to be processed. A laser beam is guided to the target surface through the liquid. The laser beam processes the target surface under the application of ultrasonic vibration.

A nylon powdery material used for laser sintering to quickly shape the products is prepared through chemical synthesis, surface treatment and modification. Its advantage is high sintering performance. Its products feature high strength and toughness, and low cost.

A laser beam machining apparatus forms blind holes at predetermined intervals in a workpiece by intermittently irradiating a laser beam from a laser nozzle to the workpiece while the laser nozzle and the workpiece being moved relatively. During the time the workpiece is subjected to machining, the electrostatic capacity between the support member and the laser nozzle is detected by an electrostatic capacity sensor while the workpiece made of conductive material is supported on the support member. The irradiation output power is controlled by a control unit which operates to vary the number of output pulses from the laser nozzle each time one hole is formed according to the result detected in response to variation in the thickness of the workpiece.

A semiconductor is cut by directing a green laser beam of high power, and subsequently directing a UV beam along the cut line. The first beam performs cutting with relatively rough edges and a high material removal rate, and the second beam completes the cut at the edges for the required finish, with a lower material quantity removal.

A laser beam machining apparatus including a chuck table for holding a wafer, and a laser beam irradiation unit for irradiating the wafer held on the chuck table with a pulsed laser beam. The laser beam machining apparatus further includes a plasma detecting part which includes a plasma receiving part for receiving a plasma generated by irradiation of the work with the laser beam radiated from the laser beam irradiation unit, and a spectrum analyzing part for analyzing the spectrum of the plasma received by the plasma receiving part; and a controller for determining the material of the work on the basis of a spectrum analysis signal from the spectrum analyzing part of the plasma detecting part and for controlling the laser beam irradiation unit.

A method for laser beam machining of a workpiece in which a laser beam is focused by an objective, into or onto the workpiece having a boundary surface, to produce a machining effect by a two-photon process, and the position of the focal point with respect to the workpiece is shifted. To obtain a reference for the position of the focal point, an image of a luminating modulation object is projected through the objective onto the workpiece into the focal plane or so as to intersect it. Reflections of the image occurring at the boundary surface are imaged into an autofocus image plane, and are detected by a camera. The camera image plane either intersects the autofocus image plane when the image of the illuminating modulation object lies in the focal plane, or lies in the autofocus image plane when the image of the modulation object intersects the focal plane.

A laser material processing apparatus for processing a workpiece (22) in such a way as to separate one laser light (26) into two laser beams (26a, 26b) via first polarizer (25), one laser beam being passed via the mirrors (24), the other laser beam being scanned biaxially by a first galvano scanner (29), and conduct two laser beams (26a, 26b) to a second polarizer (27) for scanning via a second galvano scanner (30), wherein an optical path is constituted such that the laser beam (26b) transmitted through the first polarizer (25) is reflected by the second polarizer (27), and the laser beam (26a) reflected by the first polarizer (25) is transmitted through the second polarizer (27).

A method of manufacturing a device includes: a laser beam-machined groove forming step of irradiating a wafer with a laser beam from the back side of the wafer along planned dividing lines so as to form laser beam-machined grooves along the planned dividing lines; an etching step of etching a back-side surface of the wafer having been subjected to the laser beam-machined groove forming step, so as to remove denatured layers formed at processed surfaces of the laser beam-machined grooves; an adhesive film attaching step of attaching an adhesive film to the back-side surface of the wafer having been subjected to the etching step, and adhering the adhesive film side of the wafer to a surface of a dicing tape; and an adhesive film rupturing step of expanding the dicing tape so as to rupture the adhesive film along individual devices.

A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to 200 μs and with energy density of about 20 J/cm² or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape. The laser beam operates at a frequency of more than 67 Hz, and the spot of the laser beam is sequentially moved to different drilling positions for each pulse. After all of many drilling positions in the range of a scan vision are irradiated with the laser beam pulse by pulse, or after the elapse of a time of 15 ms or more from irradiation of the first drilling position, the laser spot is returned to the first drilling position. The spot is sequentially moved once again, and the movement is repeated several times. A pause of 15 ms or more is required between pulses directed to the same drilling position to avoid formation of a thick char layer and projection of glass cloth into the hole.

An optical waveguide having means for performing optical coupling with high efficiency at a predetermined position in an optical circuit substrate and which optionally includes an optical-electrical circuit board. Also provided are an optical waveguide, an optical path thereof being changed in an optical circuit at a steep angle and the optical waveguide for performing coupling and splitting of light being decreased in size in the optical circuit. The optical waveguide has a core and a cladding layer, and a wall surface, which is formed by cutting out at least a part of the core in a thickness direction of the core through irradiation of a laser beam and crosses at least a part of the core, which is a specular surface.

A laser beam processing machine comprising a laser beam application means having a condenser for applying a laser beam to a workpiece held on a chuck table to process it, and a dust discharge means for collecting and discharging dust produced by the application of a laser beam to the workpiece, wherein the dust discharge means comprises a first cover member which is mounted to the lower end of the condenser and has a first opening for letting a laser beam applied from the condenser pass therethrough in the bottom wall, a second cover member which is arranged to surround the first cover member and has a second opening for allowing a laser beam applied from the condenser pass therethrough and sucking in dust in the bottom wall, an air introduction chamber which is formed between the first cover member and the condenser and communicates with the first opening, a dust collection chamber which is formed between the first cover member and the second cover member and communicates with the second opening, a first air supply means for supplying air to the air introduction chamber, and a swirling flow generating means for generating a swirling flow in the dust collection chamber.

A laser beam machining apparatus includes a laser oscillator, a machining head which that machines a workpiece using the laser beam. An optical duct has an optical system to guide the laser beam form the laser oscillator to the machining head. Purge gas is supplied into the optical duct from a purge gas supply port, and the purge gas is output from a purge gas exhaust port. A detector detects presence of undesired gas in the optical duct.

A laser beam machining method for a wafer, wherein an operation of irradiating the inside of a wafer with a laser beam L along each of planned dividing lines is repeated a plural number of times from a position proximate to a back-side surface of the wafer toward a face-side surface of the wafer so that a plurality of composite layers each including a denatured layer and a cracked layer extending from the denatured layer toward the face-side surface are formed stepwise at intervals (first laser beam irradiation step). Subsequently, each of some of non-cracked layers between the composite layers is irradiated with the laser beam L so as to extend the cracked layer of a given one of the composite layers and to cause the cracked layer to reach the denatured layer of the composite layer which is adjacent to the given one composite layer. The denatured layers and the cracked layers which are sufficient for enabling the wafer to be split are formed by a reduced number of laser beam irradiation operations.

An alignment method of a laser beam processing machine comprising a chuck table, a laser beam application means having a condenser for applying a laser beam to the workpiece held on the chuck table, an image pick-up means for picking up an image of the workpiece held on the chuck table and a control means having a memory for storing the specifications of the workpiece, the method comprising the steps of storing the design coordinates of a processing position set based on the mark indicating the crystal orientation of a wafer and alignment marks; picking up an image of the periphery of the wafer with the image pick-up means and locating the mark indicating the crystal orientation of the wafer at a predetermined position; positioning the design coordinate position of each of the alignment marks set based on the mark indicating the crystal orientation of the wafer right below the condenser and applying a laser beam from the condenser so as to remove the insulating film in the alignment mark areas; and picking up an image of the alignment marks with the image pick-up means and adjusting the coordinates of the processing position of the wafer on the chuck table based on the image of the alignment marks.