107 results about "Laser beam machining" patented technology

The present application discloses an optical fiber laser device (1), a laser beam machining system, and a laser welding method. The optical fiber laser device (1) comprises a plurality of laser modules (101-10n), a laser output head (20), and a control device (30); output optical fibers of the plurality of laser modules (101-10n) are symmetrically bundled to form an array of optical fibers (2032); the array of optical fibers (2032) is coupled and connected to the laser output head (20); output laser of the plurality of laser modules (101-10n) is emitted by means of the laser output head (20) to form preset light spots; the control device (30) is separately connected to the plurality of laser modules (101-10n) and provides an editing interface; and the control device (30) is used for controlling light emission and the output power of the laser modules (101-10n) to modulate the shape and energy distribution of the preset light spots.

Embodiments of this application provide a laser beam machining method targeted at chalcogenide materials and an integrated photonic device, relating to the technical fields of integrated photonic chip machining. The laser beam machining method targeted at chalcogenide materials includes: acquiring a dielectric substrate with a preset size, and cleaning the dielectric substrate; preparing a uniform and dense sulfide film on a surface of the dielectric substrate; obtaining a laser spot with a preset energy distribution pattern according to a preset machining pattern; generating laser spot scanning parameters according to the preset machining pattern; and carrying out etching-free laser oxidation machining on the sulfide film through the laser spot according to the spot scanning parameters to obtain a chalcogenide integrated photonic device. The laser beam machining method targeted at chalcogenide materials can significantly simplify the machining flow of integrated photonic chips and improve the machining efficiency of photonic chips.

The utility model discloses an automatic feeding mechanism of a laser marking machine, and relates to the technical field of laser beam processing. An automatic feeding mechanism of a laser marking machine comprises a feeding conveying table, one side of the feeding conveying table is fixedly connected with an automatic feeding table and a limiting structure, and the limiting structure is located on the feeding conveying table and comprises a transmission box, a gear, a rotating motor, a first rack, two connecting frames and a second rack. The transmission box is fixedly connected to the bottom of the feeding conveying table, through cooperation of limiting frames, limiting columns, connecting frames, first racks, second racks, gears and guide arc plates, the two connecting frames can drive the two limiting frames to get close to each other, and then the multiple limiting columns on the two limiting frames make contact with the two sides of a plate conveniently; and therefore, the multiple limiting columns can sort the plates conveniently, the situation that the plates are prone to deviation after entering the feeding conveying table is avoided, workers do not need to place and adjust the plates, and the marking efficiency of the plates is further improved.

A laser beam machining method includes placing a plate material on a support, irradiating the plate material placed on the support with a laser beam to machine the plate material, detaching the plate material that has been machined from the support, and bringing a tool in a rotating state into contact with dross that adheres to the support resulting from irradiating the plate material with the laser beam such that the dross is removed from the support.

The application provides a method for rapidly improving the surface structure and roughness of a cast aluminum alloy part, and relates to the technical field of laser beam processing, and comprises the following steps: fixing the cast aluminum alloy part on a multi-axis movable object platform; using a continuous laser beam to scan the initial surface layer of the cast aluminum alloy part, and controlling the laser power and scanning speed to make adjacent molten pools continuously overlap to form a uniform molten layer; when the thickness of the uniform molten layer reaches a first preset thickness required for surface structure reconstruction, stopping the laser scanning; the uniform molten layer is self-cooled and solidified in a room temperature environment to form a solidified surface layer; wherein the solidified surface layer forms a submicron equiaxed crystal structure, and the roughness of the solidified surface layer is smaller than that of the initial surface layer. The method directly generates a submicron equiaxed crystal structure under the condition of room temperature self-solidification by accurately controlling the molten pool overlap and the cooling rate, and achieves the purpose of rapidly modifying the surface layer of the cast aluminum alloy part.

The invention discloses an ultrasonic-assisted ultrafast laser glass trepanning device and method, and relates to the field of laser beam machining.The ultrasonic-assisted ultrafast laser glass trepanning device comprises a main box body, an operation cavity is formed in the main box body, a laser generating device is arranged on one side in the operation cavity, and a material conveying line is arranged at the position, located in the middle of the operation cavity, of the main box body; a fixing assembly is arranged at the top of the material conveying line, and a jacking assembly is arranged between the fixing assembly and the material conveying line. A discharging table top is arranged in the middle of the material conveying line, a feeding sensor is arranged at the front end of the discharging table top, an ultrasonic assembly is arranged on the side, located on the discharging table top, in the operation cavity, a lifting assembly is arranged on the side, away from the discharging table top, of the ultrasonic assembly, and a width adjusting assembly is arranged on the side, away from the ultrasonic assembly, of the lifting assembly. An auxiliary adjusting wheel is arranged on one side of the bottom of the width adjusting assembly. According to the glass cutting device, assembly line operation is adopted for production, labor dependence is reduced, the glass cutting speed is ultra-high, meanwhile, the higher machining precision is achieved, and the cutting quality is improved.

This invention provides a heat spreader manufacturing process, relating to the field of laser beam processing technology, including: Step S1: After positioning the copper mesh and the lower cover of the heat spreader, place them into the fixture of the laser machine; Step S2: Determine the laser path of the laser machine, perform laser engraving, and use the laser beam to bond the copper mesh and the lower cover of the heat spreader together; The high temperature emitted by the laser beam changes the roughness of the copper mesh, achieving an oxidation effect. The laser beam firmly bonds the copper mesh and the lower cover of the heat spreader together, preventing them from falling off, thus providing a fixing effect, equivalent to the sintering effect of the original technology; The laser beam sweeps across the capillary mesh, and the emitted high temperature instantly changes the roughness of the capillary mesh, achieving the oxidation effect of the original technology; The laser beam is very fast, with a single product expected to be completed within 1 minute, improving efficiency and reducing production costs; It solves the temperature challenge between oxidation and reduction, reducing the difficulty of reduction.

The present invention discloses an ultrasonic-assisted ultrafast laser glass hole-making device and method, which relates to the field of laser beam processing. The device comprises a main housing, an operating chamber is provided inside the main housing, a laser generating device is provided on one side of the operating chamber, a material transport line is provided in the middle of the main housing, a fixed component is provided on the top of the material transport line, and a lifting component is provided between the fixed component and the material transport line; a material discharge table is provided in the middle of the material transport line, a material arrival sensor is provided at the front end of the material discharge table, an ultrasonic component is provided on one side of the operating chamber at the discharge table, a lifting component is provided on the side of the ultrasonic component away from the discharge table, a width adjustment component is provided on the side of the lifting component away from the ultrasonic component, and an auxiliary adjustment wheel is provided on the bottom side of the width adjustment component. The present invention adopts assembly line production to reduce reliance on manpower, and has ultra-fast glass cutting speed while achieving more precise processing accuracy and improving cutting quality.

The invention discloses a stainless steel gas-insulated switchgear welding machine adjusted through an optical assembly, and relates to the field of intelligent welding based on laser beam machining, the stainless steel gas-insulated switchgear welding machine comprises a welding machine body and an optical fiber laser welding head assembly, and the optical fiber laser welding head assembly is arranged on the outer side of the welding machine body; a reserved butt joint handle is arranged on the outer side of the optical fiber laser welding head assembly. An optical lens assembly is arranged on the outer side of the reserved butt joint handle, and a reserved external part is fixedly connected to the upper end of the optical fiber laser welding head assembly in a butt joint mode. According to the stainless steel gas-insulated switchgear welding machine adjusted through the optical assembly, the laser mode is changed through the optical element, penetration welding of a stainless steel gas-insulated switchgear is achieved, and the welding quality is improved; the laser mode output by the whole fiber laser is Gaussian light, the light beam characteristic is sharp, the fiber laser can be used for metal cutting and welding, the optical characteristic is changed through the optical assembly in the stainless steel gas-insulated switchgear penetration welding process application, and welding damage is avoided even if welding deviation occurs.

The invention relates to a machining device (10) and a method for machining a workpiece (20), in particular a workpiece equipped with cutting edges, by means of a high-energy machining beam (30) comprising: a machining device (40), a holder (50) and a base (60), wherein the holder (50) is arranged on the base (60) and the machining device (40) is mounted on the holder (50) so as to be pivotable and / or rotatable about a pivot axis (70);the processing device (40) comprising: a processing beam source (80) for generating and / or coupling the processing beam (30) into the processing device (10), a deflection device (90) by means of which the processing beam (30) can be deflected at different angles, and a beam path (100) of the processing beam (30) which runs between the processing beam source (80) and the deflection device (90), wherein the entire beam path (100) between the processing beam source (80) and the deflection device (90) is designed such that it moves with the processing device (10) when the processing device (10) is pivoted and / or rotated, and the distance and orientation of the entire beam path (100) between the processing beam source (80) and the deflection device (90) with respect to the pivot axis (70) remains constant.

Device (1) for machining an elongated workpiece (2) such as pipes or other metal semi-finished products by means of a laser beam (3) circulating around the workpiece (2), comprising a machine body (4), a holding element (5) rotatably mounted relative to the machine body (4), an opening (6) enclosed by the holding element (5) through which the workpiece (2) to be machined passes during machining of the workpiece (2), wherein the holding element (5) describes an enveloping surface (7) at least partially enclosing the workpiece (2) during its rotational movement, a laser beam source (8) for generating the laser beam (3), wherein the laser beam source (8) is held by the holding element (5), characterized by that the laser beam source (8) is arranged on the side of the holding element (5) facing away from the workpiece (2) during machining, i.e. on the outside of the described enveloping surface (7), and that the holding element (5) is rotatably mounted by the machine body (4) at at least two bearing points (20, 20a, 20b, 20c), the largest part of the holding element (5) running between the two bearing points (20, 20a, 20b, 20c) and a smaller part of the holding element (5) running beyond at least one of the two bearing points (20, 20a, 20b, 20c).

The invention relates to a method for processing a hairpin (12) by means of a pulsed laser beam (18), wherein the method comprises: processing the hairpin (12) by means of the pulsed laser beam (18); detecting a sound emission from the hairpin (12) during the processing of the hairpin (12); and determining information about the processing of the hairpin (12) by analysing the detected sound emission.

Laser beam processing method for a wafer (W) having a device (D) in each of the regions which are subdivided by a plurality of provided division lines (R) formed in a grid, the method comprising: a first groove processing training step for emitting a pulsed laser beam (L) along the intended division line (R) in such a way that the overlap rate of the concentrated beam spots (C1, C2) of the pulsed laser beam, which is concentrated onto the wafer (W), is identical or less than 95%, in order to form a first laser beam processing groove (S1); and a second groove processing training step after the execution of the first groove processing training step for emitting the pulsed laser beam (L) along the first laser beam processing groove (S1) in such a way that the overlap rate of the concentrated beam spots (C1, C2) of the pulsed laser beam, which is concentrated on the wafer (W), is identical or more than 97%, in order to form a second laser beam processing groove (S2) on a bottom region of the first laser beam processing groove (S1), wherein the depth of the second laser beam processing groove (S2) is greater than the depth of the first laser beam processing groove (S1), and debris generated in the second groove processing step is deposited within the first laser beam processing groove (S1) so that it does not protrude to a surface of the wafer (W).

The invention relates to a laser machining system (100) for machining a workpiece (42) by means of an output laser beam (3), comprising a laser radiation source (50), an optical device (10), a feed device (60) and a control device (70).

The utility model relates to the field of laser beam machining equipment, in particular to ultrasonic vibration auxiliary laser welding equipment. The equipment comprises a workbench and a laser welding assembly, a welding position used for fixing a tool is arranged on the workbench, an ultrasonic vibration auxiliary device corresponding to the welding position is fixedly connected to the workbench, and the auxiliary device comprises an ultrasonic vibration mechanism. The ultrasonic vibration mechanism comprises a transducer and an amplitude-change pole arranged at the output end of the transducer, the welding equipment further comprises a supporting base, a pushing assembly used for driving the ultrasonic vibration mechanism to do reciprocating motion is arranged on the supporting base, and a vibration die head used for making contact with a tool is arranged at the end, away from the transducer, of the amplitude-change pole. And the jacking force of the vibration die head to the contact of the tool can be controlled through the reciprocating motion of the jacking assembly. According to the utility model, the amplitude of the workpiece to be welded can be adjusted by adjusting the reciprocating motion of the air cylinder so as to meet the requirements on different amplitudes during welding.

A control unit for use in a laser system for working a workpiece by a laser beam is configured to capture, based on at least one translation axis position, a translational position of a working head which can be changed by a movement unit, capture, based on at least one rotation axis position, a rotational orientation of the working head which can be changed by the movement unit, and issue or revoke a laser beam release for an application of the laser beam to the workpiece. The laser beam release depends on a serial test of the translational position and the rotational orientation of the working head.

To provide a laser beam machining apparatus and a laser beam machining method capable of machining a workpiece by accurately irradiating a target position with a laser beam even when adjusting an irradiation position of the laser beam using a machining mark formed by irradiation of the laser beam.SOLUTION: In the laser processing device 100, the control unit 60 controls the camera 20 to image the transmitted illumination light 51, which is the illumination light that has passed through the through-hole 43 of the processing mark 41, in a state in which the processing mark 41 is irradiated with the visible ray as the illumination light from the transmission layer 40b side by the illumination unit 50.SELECTED DRAWING: Figure 6

The application discloses a cylindrical rotation multi-path laser beam processing method and relates to the technical field of cylindrical surface processing. The processing method comprises the following steps: S1, adjusting the light path of a laser; S2, marking points or lines on the surface of a polyurethane cylinder through laser light emission, and driving the laser to offset through a marking control system; S3, moving the laser to the focal point position of the polyurethane cylinder, marking and slotting through laser light emission, and rotating the polyurethane cylinder simultaneously for one circle, wherein the adjustment of the laser light path position is completed when the line width of laser marking and slotting is the same as the line width of polyurethane cylinder rotation; and S4, adjusting the parameters of the marking control system, and reaching the processing slotting position of the laser, and processing the polyurethane cylinder through laser light emission. The application provides a cylindrical rotation multi-path laser beam processing method, laser processing polyurethane cylinders, limited production cost change, significantly improving production efficiency, and reducing production cost.

This invention discloses a laser-processed honeycomb-type energy-saving electrothermal anti-icing surface and its preparation method, belonging to the field of metal surface laser beam processing technology. The honeycomb-type energy-saving electrothermal anti-icing surface is prepared by bonding an HMPC microstructure surface, after low surface energy treatment, to an electrothermal layer. The HMPC microstructure layer has a hexagonal hollow micropillar structure array processed by femtosecond laser; the electrothermal layer is prepared by bonding insulating polyimide layers to both sides of the MWCNTs / AgNWs electrothermal film. The honeycomb-type energy-saving electrothermal anti-icing surface prepared by this invention has excellent anti-icing / de-icing capabilities. The structural layer forms a stable heat insulation layer by increasing the specific surface area, which, together with the electrothermal layer, achieves efficient heat storage and slow release. Under an applied voltage of 1V, ice melting is achieved within 64s. The surface ice adhesion strength is tested to be 0.96kPa, which is only 0.0138 times that of pure aluminum surface, avoiding the defects of intermittent ice melting and interrupted heating in mainstream reverse circulation defrosting technology.

To provide a laser beam machining device and a laser beam machining method capable of performing machining by accurately irradiating a target position with a laser beam.SOLUTION: A laser beam machining device 100 includes a laser beam emitting unit 10 that emits a laser beam L toward a wiring pattern 2 that is a target object, a visible-light imaging unit 20 that acquires a visible-light image 50v by imaging a visualization member 50 that generates a position specification visible-light Lv at a position where the laser beam L is emitted, and a control unit 60 that performs laser machining of the wiring pattern 2 by adjusting a relative position between an emitted position of the laser beam L and the wiring pattern 2 such that the laser beam L is emitted to the wiring pattern 2 on the basis of a position of the position specification visible-light Lv captured in the visible-light image 50v.SELECTED DRAWING: Figure 1

Provided is a laser beam machining method for forming a modified region by irradiating the interior of a wafer with a laser beam, the laser beam machining method including a first irradiation step for irradiating a first street of the wafer with the laser beam, and a second irradiation step for irradiating a second street that crosses the first street with the laser beam after the first irradiation step, where, in the second irradiation step, the total output of the laser beam at the intersection of the first street and the second street is changed.

To provide a spatter adhesion suppressing device of a laser beam machine, a laser beam machine, and a laser beam machining method, capable of effectively suppressing adhesion of spatter to an inner surface of a pipe while suppressing deposition of spatter on a spatter guard when performing laser beam machining of a pipe-shaped workpiece.SOLUTION: A spatter adhesion suppressing device of a laser beam machine includes a spatter guard inserted into a pipe and having a distal end portion that receives spatters generated due to irradiation of the pipe with a laser beam, an injection unit that injects a fluid to the distal end portion of the spatter guard, and a discharge device that discharges a spatter adhesion inhibitor to the distal end portion of the spatter guard and an inner surface of the pipe.SELECTED DRAWING: Figure 1

The invention relates to a laser device (10) for processing, in particular laser welding, at least one workpiece (12) by means of at least one laser beam (14), having features of claim 1, and to a method for processing, in particular laser welding, at least one workpiece (12) by means of at least one laser beam (14), having features of the additional independent claim.

This invention relates to a method for calibrating at least one optical sensor (200, 300, 400) of a laser processing head (800) for machining workpieces by means of a processing laser beam (L). The laser processing head (800) includes a first optical sensor (200, 300, 400), a deflection device (500), and a focusing device (600). The beam path of the first optical sensor (200, 300, 400) passes through the deflection device (500) and the focusing device (600). The method includes the following steps: deflecting the beam path of a first optical sensor (200, 300, 400) to a first position on a first reference (R, R1, R2, R3, R4) by a deflection device (500); generating a first optical measurement signal based on the measurement light (210, 410) received by the first optical sensor (200, 300, 400) from the first position on the first reference (R, R1, R2, R3, R4); and determining a correction value for calibrating the first optical sensor (200, 300, 400) based on the first optical measurement signal and according to the deviation between the first position on the first reference (R, R1, R2, R3, R4) and a first nominal position, wherein the position of the first nominal position relative to the processing laser beam (L) is predetermined.

The invention relates to a laser device (10) for processing, in particular laser welding, at least one workpiece (12) by means of at least one laser beam (14), having features of claim 1, and to a method for processing, in particular laser welding, at least one workpiece (12) by means of at least one laser beam (14), having features of the additional independent claim.

The invention relates to the technical field of laser beam processing, in particular to laser degumming and stripping equipment for flexible screen production. According to the technical scheme, the device comprises a second frame shell fixedly connected to the front side of a first frame shell; the feeding bin is arranged on the frame shell II; the two groups of material moving frames are connected into the frame shell II in a sliding manner; the two groups of guide rails are fixedly connected to the left and right sides of the mounting cavity of the frame shell II respectively; the mounting frame is slidably connected between the two groups of guide rails; the at least two groups of electric push frames are fixedly connected to the mounting frame; the material suction device is fixedly connected to the bottom of the control end of each group of electric push frames; and the supporting seat is connected into the feeding bin in a sliding manner. By integrating the controllable moving material moving frame, the material sucking device, the conveying piece and the supporting base, full-automatic feeding and discharging and continuous operation in the flexible screen laser glue stripping process can be achieved, the operation efficiency and process consistency of the stripping procedure are improved, and the defects that in the prior art, the efficiency is low, the yield fluctuates, and automatic production line connection is not smooth are overcome.

The invention provides a vapor chamber manufacturing process, and relates to the technical field of laser beam processing, and the vapor chamber manufacturing process comprises the following steps: S1, positioning a copper mesh and a lower cover of a vapor chamber, and putting the copper mesh and the lower cover of the vapor chamber into a jig of a laser machine; s2, a laser route of a laser machine is determined, laser etching is carried out, and the copper net and the lower cover of the uniform-temperature plate are bonded together through laser beams; the high temperature emitted by the laser beam changes the roughness of the copper net, and the oxidation effect is achieved. The copper mesh and the lower cover of the vapor chamber are firmly bonded together through laser beams without falling off, and a fixing effect is achieved, so that the copper mesh and the lower cover of the vapor chamber are equivalent to a sintering effect in the prior art; the laser beam is swept on the capillary net, and the emitted high temperature instantaneously changes the roughness of the capillary net, so that the oxidation effect of the original technology is achieved; the time of the laser beam is short, and a single product is expected to be finished within one minute, so that the efficiency is improved, and the production cost is reduced; the temperature difficulty between oxidation and reduction is solved, and the reduction difficulty is reduced.

A method for identifying splatters or weld seam defects during laser processing of a workpiece includes processing the workpiece using a processing laser beam of a laser processing machine, compiling at least one recording of radiation emerging during the processing of the workpiece using an optical sensor that has a plurality of pixels for recording the radiation, and inputting the at least one recording into an evaluation unit. The evaluation unit has a machine learning algorithm configured as a convolutional neural network in a U-Net architecture. The machine learning algorithm has been trained with verified recordings of splatters or weld seam defects. The method further includes identifying one or more splatters or weld seam defects in the processing of the workpiece by running the machine learning algorithm using the at least one recording as input, and outputting an output indicating the identified one or more splatters or weld seam defects.

To provide a work table and a laser beam machining method capable of improving working efficiency.SOLUTION: A work table 10 used for a laser beam machine includes a mounting part 20 attached to the laser beam machine, and a body part 30 detachably attached to the mounting part 20 to machine a workpiece. The main body part 30 includes a base part 31 to which a support member 45 for supporting the workpiece can be attached, and a frame body 40 for surrounding an outer edge of the base part 31 by its inner surface, and the frame body 40 has a height higher than an upper end of the support member 45 attached to the base part 31 and allowing the workpiece to abut thereon. With this configuration, it is possible to replace only the main body portion 30 in a state where the mounting portion 20 is fixed to the laser processing machine 1, so that the work efficiency is improved.SELECTED DRAWING: Figure 1