183 results about "Pulsed laser beam" patented technology

The invention relates to the technical field of laser radars, in particular to a laser radar near-field saturation suppression method and device based on signal splicing. The method comprises the following steps: transmitting a pulse laser beam and receiving a scattering echo signal, dividing the echo signal into a transmission light signal and a reflection light signal through an intensity beam splitter prism, and respectively obtaining a far-field channel photon profile and a near-field channel photon profile through the transmission light signal and the reflection light signal; fusing and splicing the far-field channel photon profile and the near-field channel photon profile to obtain a corrected distance square signal profile; and performing atmospheric detection by using a laser radar system, and inverting atmospheric parameters by correcting a distance square signal profile. Meanwhile, the invention discloses a device for executing the method, by adopting the laser radar near-field saturation suppression method and device based on signal splicing, the problem of near-field signal saturation of a high-power laser radar can be effectively solved, and the overall performance index of the laser radar is greatly improved while the detection precision is guaranteed.

A fractional handpiece and systems thereof for skin treatment include a passively Q-switched laser assembly operatively connected to a pump laser source to receive a pump laser beam having a first wavelength and a beam-splitting assembly operable to scan a solid beam emitted by the passively Q-switched laser assembly and form an array of micro-beams across a segment of skin. The passively Q-switched laser assembly generates a sub-nanosecond pulsed laser beam having a second wavelength. The fractional handpiece may also incorporate a wavelength switching assembly, enabling selective delivery of both the second and third wavelengths, while providing control over the energy output at each wavelength, all within a single handpiece. The passively Q-switched laser assembly has an unstable cavity operation.

A fractional handpiece and systems thereof for skin treatment include a passively Q-switched laser assembly operatively connected to a pump laser source to receive a pump laser beam having a first wavelength and a beam-splitting assembly operable to scan a solid beam emitted by the passively Q-switched laser assembly and form an array of micro-beams across a segment of skin. The passively Q-switched laser assembly generates a sub-nanosecond pulsed laser beam having a second wavelength. The fractional handpiece may also incorporate a wavelength switching assembly, enabling selective delivery of both the second and third wavelengths, while providing control over the energy output at each wavelength, all within a single handpiece. The passively Q-switched laser assembly has an unstable cavity operation.

A method for processing glass elements is provided. The method includes introducing a perforation line for parting a glass element introduced into the glass element during or after a hot processing process at an elevated temperature of at least 100° C. Spaced-apart filamentary flaws are introduced into the glass element along the predetermined course of the perforation line by a pulsed laser beam of an ultrashort pulse laser, and, during or after the introduction of the filamentary flaws, the glass element is cooled down so as to produce a temperature gradient, which induces a mechanical stress at the filamentary flaws, whereby the breaking force required for parting the glass element along the perforation line is reduced.

A spectral linewidth adjusting method includes: adjusting a timing of a first trigger signal for amplifying and converting a portion of a first pulse laser beam to a second pulse laser beam and / or a timing of a second trigger signal for amplifying and converting a portion of second continuous light to a third pulse laser beam and adjusting a spectrum of a fourth pulse laser beam obtained by performing sum-frequency mixing of the second and third pulse laser beams to a first spectrum in a non-Gaussian shape; and modulating a wavelength of the second continuous light within time corresponding to one pulse of the third pulse laser beam and adjusting the spectrum of the fourth pulse laser beam to a second spectrum having a spectral linewidth wider than the first spectrum through generation of a modulation signal for supplying the modulation signal to an optical phase modulator.

The invention provides a wafer composite scribing process. The wafer composite scribing process comprises the following steps that S1, a modified layer is formed in a wafer cutting channel through focusing of a pulse laser beam; s2, a blade is used for conducting scribing, scribing is conducted on the cutting channel laser marks generated in the step S1, and the newest surface cutting channel is formed under the condition that the modified layer is not cut through; s3, splitting is conducted in sequence along the newest surface cutting channel; a modified layer is formed in a wafer cutting channel through focusing of a pulse laser beam, then a blade is used for cutting into the interior of the cutting channel from the surface of the wafer, and the newest surface cutting channel is formed under the condition that the cutting channel is not cut through. And finally, sequentially carrying out chip splitting along the newest surface cutting channel to obtain a chip with a vertical cutting channel, a complete split chip, a standard size and no edge breakage.

Provided is a pulse width expansion device for expanding the pulse width of a pulsed laser beam, the pulse width expansion device including a first optical pulse stretcher, a second optical pulse stretcher, a third optical pulse stretcher, and a fourth optical pulse stretcher disposed on the optical path of the pulsed laser beam, the first optical pulse stretcher, the second optical pulse stretcher, the third optical pulse stretcher, and the fourth optical pulse stretcher being disposed on the optical path of the pulsed laser beam. The optical path length of the delay optical path of the first optical pulse stretcher is L1, the optical path length of the delay optical path of the second optical pulse stretcher is L2, the optical path length of the delay optical path of the third optical pulse stretcher is L3, and the optical path length of the delay optical path of the fourth optical pulse stretcher is L4. When n is an integer of 2 or more, L2 is an integer multiple of 2 or more of L1, L3 satisfies (n-0. 75) * L1 < = L3 < = (n-0.25) * L1, and L4 satisfies (n-0.25) * L1 < = L4 < = (n + 0.25) * L1.

The invention relates to a method and a device for regulating and controlling the structure performance of a nickel-based high-temperature alloy in pulse laser-assisted additive manufacturing, and belongs to the technical field of additive manufacturing. The method comprises the following steps: controlling the oxygen content in a sealed forming cabin of an LPBF forming device, and paving nickel-based high-temperature alloy powder on a substrate of the sealed forming cabin; and the pulse laser and the continuous laser are controlled to output laser beams, the pulse laser beams and the continuous laser beams are coupled in a polarization beam combination or wavelength beam combination mode, and after the focal length of the coupled laser beams is adjusted, the nickel-based superalloy powder on the substrate is subjected to fusion forming. According to the method, the pulse laser and the continuous laser are coupled into the coaxial light spots, in-situ synchronous disturbance on the molten pool in the LPBF additive manufacturing process is achieved, the solidification behavior of the nickel-based high-temperature alloy can be accurately regulated and controlled, epitaxial growth of columnar crystals is effectively broken, formation of fine isometric crystals is promoted, and the yield of the nickel-based high-temperature alloy is improved. And the anisotropy and cracking risk of the material can be reduced.

The invention relates to the technical field of resin material processing, in particular to a method for preparing a laser cladding metal coating on the surface of a resin-based material, which comprises the following steps of: pulse laser cladding: synchronously sending a metal cladding material to a position right below a pulse laser beam, so that the metal cladding material forms high-speed molten drops and is sprayed to the surface of the resin-based material; a metal cladding layer is formed after cooling; wherein the pulse width of the pulse laser beam ranges from 0.2 ms to 1000 ms, the power of the pulse laser beam ranges from 50 W to 200 W, and the feeding rate of the metal cladding material ranges from 3 particles per second to 8 particles per second. The problem that the resin-based material is easily damaged when a traditional laser cladding technology is applied to the metallization modification process of the surface of the resin-based material can be solved.

An autocorrelator and a pulse amplifying device including the same are provided. The autocorrelator includes a parabolic mirror configured to transmit and reflect pulse laser beam, a prism on one side of the parabolic mirror and configured to split the pulse laser beam, a first lower retro-reflector under the prism and provided at a first distance from the prism to reflect a portion of the pulse laser beam, a first upper retro-reflector on the prism, provided at a second distance different from the first distance from the prism, and configured to reflect another portion of the pulse laser beam to generate a first time difference between pulses of the pulse laser beam upper retro-reflector, and a first sensor under the parabolic mirror and configured to receive the pulse laser beam to detect a pulse width of the pulse laser beam.

A pulse width extension system, a laser apparatus, and a method of manufacturing an electronic device are provided. A pulse width expansion system according to one aspect of the present disclosure expands the pulse width of an incident pulse laser beam and emits the pulse laser beam, the pulse width expansion system comprising: a pulse width expansion optical system configured to include a beam splitter and a plurality of mirrors; a housing that houses the pulse width expansion optical system; at least one target configured so as to be able to discriminate a portion irradiated with the pulsed laser light; and a target movement mechanism capable of disposing the at least one target on an optical path of the pulse laser light including the pulse width expansion optical system and retracting the at least one target from the optical path.

The invention relates to the technical field of quantum sensing and optical instruments, and discloses integrated equipment for representing nitrogen vacancy color center quantum characteristics and sensing sensitivity, which comprises a laser module, an inverted optical microscope module, an electronic control and data acquisition module and a system software control module, the laser module realizes continuous laser beam output or pulse laser beam output through light path selection; the inverted optical microscope module receives the laser beam and collects the nitrogen vacancy color center of the sample, and selectively guides fluorescence to the confocal single photon counting branch or the analog signal detection branch through the light path selection mechanism; the electronic control and data acquisition module is responsible for driving each device and processing signals from different detection branches; and the system software control module cooperates with each module to execute quantum characteristic characterization and sensing sensitivity evaluation tasks. Through deep integration of software and hardware, dual-mode measurement is realized on a single platform, and the device has the advantages of high function integration level, compact structure, convenience in operation and high measurement efficiency.

The invention discloses a metal fatigue damage detection method based on double-grating laser ultrasonic multi-parameter measurement, and relates to the technical field of metal fatigue damage detection. According to the invention, a double-cycle transient grating is formed on the surface of a to-be-detected metal material by using a pulse laser beam modulated by a double-spacing slit mask, so that double-frequency high-strength resonant ultrasonic surface wave non-contact excitation is realized, and an ultrasonic surface wave signal is acquired through a laser interferometer based on the non-contact excitation. And performing fast Fourier transform on the measurement signal to obtain frequency spectrum information of the measurement signal, and detecting the metal fatigue damage according to multiple laser ultrasonic characteristic parameters extracted from the frequency spectrum information. Ultrasonic detection on the surface of the metal material to be detected is achieved through an all-optical means, the effects of no damage, complete non-contact and high accessibility are achieved, and the detection precision and resolution of local fatigue damage are improved.

A biological information detection device is disclosed that includes a first laser oscillator that oscillates a first pulsed laser beam adapted for detection of a lactic acid or lactic acid salt; a second laser oscillator that oscillates a second pulsed laser beam adapted for detection of a pyruvic acid; an irradiation mechanism that emits the first pulsed laser beam and the second pulsed laser beam to blood; a light receiving sensor that receives a detected laser beam output from the blood; and a control unit. The control unit outputs oscillation instructions for oscillating the first pulsed laser beam and the second pulsed laser beam, cuts out detected signals provided from the light receiving sensor as time segment data for time periods, and calculates respective quantities of the lactic acid or lactic acid salt and the pyruvic acid in the blood based on the time segment data.

The invention relates to a hard light resisting method of a laser radar and related equipment. The method comprises the following steps: controlling a laser receiving module to acquire an optical signal within the exposure time after a laser transmitting module transmits a pulse laser beam according to the current exposure time, and converting the optical signal into an electric signal; extracting a bottom noise value according to the electric signal; if the current exposure time is the ith-gear exposure time and the bottom noise value is greater than or equal to an upshift threshold value from the ith gear to the (i + 1) th gear, taking the (i + 1) th-gear exposure time as the target exposure time; if the current exposure time is the jth-gear exposure time and the bottom noise value is smaller than or equal to a downshift threshold value from the jth gear to the (j-1) th gear, taking the (j-1) th-gear exposure time as target exposure time; wherein the upshift threshold value corresponding to the smaller-gear exposure time is higher than the downshift threshold value corresponding to the adjacent larger-gear exposure time. According to the invention, the complex environment adaptability of the sweeping robot is improved.

Laser processing device (40) comprising: a clamping table (54) which holds a wafer (10) having a front side (10a) and a back side (10b); a laser beam application means (44) that applies a laser beam to the wafer (10) which is held by the clamping table (54); and a processing feed means (43) that performs a relative processing feed of the clamping table (54) and the application means (44) for a laser beam, wherein the application means for a laser beam comprises a laser oscillator (44b) which oscillates a pulsed laser beam, and a focusing device (44a) which focuses the pulsed laser beam oscillated by the laser oscillator (44b) in order to apply the pulsed laser beam to the wafer (10) which is held by the clamping table (54), and The pulsed laser beam, oscillated by the laser oscillator (44b), includes burst pulses (BP), each of which has several subpulses that are gradually amplified stepwise from a lower energy to a high energy, and the burst pulses (BP) are applied to the wafer (10) to form shielding tunnels (100), each containing a small hole (102) and an amorphous phase (104) surrounding the small hole, wherein the application means (44) is configured for a laser beam to form a circular small hole (102) and a circular amorphous phase (104), each extending from the front side (10a) to the rear side (10b) of the wafer (10), wherein the focusing device (44a) is movable in the direction of the optical axis and configured such that the focal point is positioned at a predetermined position in the wafer (10). is.

The present invention provides an inspection device that inspects the internal condition of an object being measured from its back surface. [Solution] The inspection device comprises a holding means, an ultrasonic vibration generating means 40, an ultrasonic vibration capturing means 70, and an image generating means 110. The ultrasonic vibration generating means comprises an oscillator 41 that emits a pulsed laser beam LB1, and a fiber bundle 43 composed of multiple rings in which multiple optical fibers are arranged in multiple rings of different diameters that form concentric circles. The length of the optical fibers constituting the fiber bundle is formed to increase from the configuration of a large ring with a large diameter that forms the concentric circles to the configuration of a small ring with a small diameter that forms the concentric circles. The pulsed laser beam is first irradiated onto the upper surface of the object to be measured from the optical fibers constituting the large ring, and then the pulsed laser beam is gradually irradiated onto the upper surface of the object to be measured from the optical fibers constituting the small ring with a time difference, thereby focusing the ultrasonic vibration at a desired internal position of the object to be measured.

The invention relates to laser processing, and provides a laser melting and strengthening combined processing system which comprises a continuous laser device, a laser processing device, a laser processing device, a laser processing device and a laser processing device, and is characterized in that the continuous laser device is used for generating continuous laser beams and melting powder materials through a melting light path; the ultrafast laser is used for generating an ultrafast pulse laser beam and carrying out strengthening processing on the surface of the product subjected to melting processing through a strengthening light path; and the galvanometer assembly is used for receiving the continuous laser beam guided out by the melting light path and the ultrafast pulse laser beam guided out by the strengthening light path. The invention further provides a laser melting and strengthening combined machining method. According to the combined machining system, the continuous laser is firstly adopted for 3D printing, then the ultrafast laser is adopted for strengthening the printing surface, the mechanical strength of a printed piece can be effectively improved, the ultrafast laser and the continuous laser share the galvanometer assembly, and space arrangement of a printing cavity is facilitated.

A fluid nanoparticle measuring device according to an exemplary embodiment of the present invention may include: a flow cell configured to allow flow of a liquid sample containing nanoparticles; a laser generating unit that irradiates the flow cell with a pulsed laser beam; a flow control unit that controls the flow of the liquid sample within the flow cell; and a signal detection unit that detects a signal from a plasma generated in the flow cell by the pulsed laser beam, wherein the signal detection unit includes a spectrometer that performs spectral analysis of the light signal from the plasma to obtain information about the nanoparticles.

The invention relates to a method for producing a polymorphic or pseudo-polymorphic crystalline phase from a plurality of compounds (C, D, S1, S2), the method comprising steps of preparing (I) a supersaturated solution from the compounds, homogenizing (II) the supersaturated solution in an ultrasonic bath, transferring (III) the supersaturated solution into a plurality of heated tubes (54), aging (V) the solutions transferred into the tubes for a predetermined period of time, exposing the tubes (54) to a polarized pulsed laser beam before and / or during exposure, followed in situ by nucleation and then growing cocrystals inside the tubes (54), and filtering the exposed solutions in order to recover cocrystals having a size greater than a predetermined minimum size. This method is carried out in order to obtain cocrystallization from at least one active substance (D) and a coformer (C) in at least a first solvent (S1) and a second solvent (S2).

The invention provides an isotope quantitative analysis method and system based on laser-induced breakdown spectroscopy, and relates to the technical field of laser spectrums.The method comprises the steps that a liquid analysis environment is constructed according to the form of a sample to be detected; focusing a pulse laser beam in the liquid analysis environment to ablate a sample to be detected so as to generate plasma; collecting an emission spectrum signal generated in the plasma cooling process; and extracting an isotope characteristic spectral line of a target element from the emission spectrum signal, and carrying out isotope quantitative analysis based on spectral line information of the isotope characteristic spectral line. According to the device and the method, spectral line broadening and self-absorption can be effectively inhibited in mechanism, the resolution ratio of the isotope spectral line is remarkably improved, the device is simple, the cost is low, and a reliable and economical solution is provided for realizing high-performance isotope in-situ and rapid quantitative analysis in the fields of nuclear industry and the like by a laser-induced breakdown spectroscopy technology.

A laser component according to one embodiment of the present invention is provided with: a first optical output unit that outputs first pulsed laser light, and has a first optical resonator and a first laser medium which is disposed in the first optical resonator and to which excitation light is inputted in the optical axis direction; a second optical output unit that outputs second light different from the first pulsed laser light, and has a second laser medium to which the excitation light is inputted; and a laser medium that has a first medium region disposed in the first optical resonator and a second medium region disposed in the second optical output unit. The first laser medium and the second laser medium are a common laser medium, the wavelength regions of the first pulsed laser light and the second light are the same, and the second optical output unit is adjacent to the first optical output unit when viewed in the optical axis direction of the first optical output unit.

A laser beam irradiating unit of a laser processing apparatus includes a laser oscillating mechanism. The laser oscillating mechanism includes a group setting unit configured to, on a condition that a pulsed laser beam is applied at shorter time intervals than a length of time that molten debris is generated, set the number of pulsed laser beams to be applied until a time that the molten debris is solidified and set the number of pulsed laser beams as one group. A time interval setting unit is configured to set a time until heat generated by application of the pulsed laser beams of the one group is cooled, which serves as a time interval between the one group and an adjacent group, and set time intervals of the pulsed laser beams constituting the one group. The laser oscillating mechanism sets a repetition frequency with the one group as one unit.

The invention relates to a method for processing a hairpin (12) by means of a pulsed laser beam (18), wherein the method comprises: processing the hairpin (12) by means of the pulsed laser beam (18); detecting a sound emission from the hairpin (12) during the processing of the hairpin (12); and determining information about the processing of the hairpin (12) by analysing the detected sound emission.

Laser beam processing method for a wafer (W) having a device (D) in each of the regions which are subdivided by a plurality of provided division lines (R) formed in a grid, the method comprising: a first groove processing training step for emitting a pulsed laser beam (L) along the intended division line (R) in such a way that the overlap rate of the concentrated beam spots (C1, C2) of the pulsed laser beam, which is concentrated onto the wafer (W), is identical or less than 95%, in order to form a first laser beam processing groove (S1); and a second groove processing training step after the execution of the first groove processing training step for emitting the pulsed laser beam (L) along the first laser beam processing groove (S1) in such a way that the overlap rate of the concentrated beam spots (C1, C2) of the pulsed laser beam, which is concentrated on the wafer (W), is identical or more than 97%, in order to form a second laser beam processing groove (S2) on a bottom region of the first laser beam processing groove (S1), wherein the depth of the second laser beam processing groove (S2) is greater than the depth of the first laser beam processing groove (S1), and debris generated in the second groove processing step is deposited within the first laser beam processing groove (S1) so that it does not protrude to a surface of the wafer (W).

The invention discloses a rapid and efficient laser fuze signal high repetition frequency and high speed modulation system based on a DMD, and belongs to the field of laser fuze signal modulation. The modulation system is composed of a coupling optical system, a DMD modulation optical system and an emission optical system. The emission optical system is used for receiving the pulse laser beam output by the DMD modulation optical system, shaping the pulse laser beam and then projecting the pulse laser beam to a target area at a preset angle so as to illuminate a fuse; the divergence angle of the emergent laser beam is adjusted through the focusing mechanism, so that the illumination area is changed; the DMD modulation optical system is used for receiving the coupling optical laser beams output by the coupling optical system and outputting the coupling optical laser beams after spatial intensity modulation on the DMD micromirror array; in an echo receiving mode, laser echoes returned by a target are imaged on the surface of the DMD micromirror array; and the coupling optical system is used for coupling the laser beam output by the optical fiber laser source to a free space and adjusting the size and the divergence angle of the laser beam. The device is used for laser fuze signal modulation.

The invention relates to a forming method and system of a crystal single-tip hot-fix rhinestone and the crystal single-tip hot-fix rhinestone. The forming method comprises the following steps that quartz sand raw materials are smelted through an electric melting furnace, pressed and formed to obtain crystal bead blanks; laser cold grinding equipment is adopted for conducting non-contact laser engraving on the crystal bead blank, and a single crystal tip with a plurality of cutting faces is formed; the single crystal tip is adsorbed to the blister sheet and polished, and the bare diamond is obtained; coating and paint spraying are sequentially carried out on the bare diamonds; coating the bottom layer of the bottom of the bare rhinestone with a hot melt adhesive to obtain the crystal single-tip hot-fix rhinestone; wherein in the laser cold grinding process, a pulse laser beam is adopted to denudate the surface of the bead blank layer by layer in a low-temperature environment, the laser power is controlled to be 50-200 W, the pulse frequency is controlled to be 10-100 kHz, and the scanning speed is controlled to be 100-1000 mm / s. The crystal single-tip hot-fix rhinestone is smooth in crystal face and high in surface smoothness, laser cold grinding is adopted to replace traditional mechanical grinding, tool abrasion is avoided, and the crystal single-tip hot-fix rhinestone is suitable for complex polyhedron forming.

The application relates to an acceleration measuring device based on a particle image velocimetry, which comprises at least two CCD cameras, the center points of the mirrors of the two CCD cameras are located on a straight line through a limiting device; a tracer particle generator is used for emitting tracer particles along the direction vertical to the normal of the mirror of the CCD camera; a four-pulse laser is used for sequentially emitting four pulse laser beams along the direction vertical to the direction of the particle flow to illuminate the tracer particles; a control device is connected with the CCD camera and the four-pulse laser respectively, and is used for synchronously controlling the CCD camera and the four-pulse laser, so that the CCD camera acquires the tracer particle images under the irradiation of different pulse lasers in a double-exposure mode, and the speed and acceleration of the particles are acquired based on the tracer particle images. Since the four-pulse laser capable of sending four high-energy pulse lasers at a time is adopted, at least four particle images with a very short time interval are acquired by using two CCD cameras, and then the particle acceleration can be acquired.

A lift-off method includes joining a transfer substrate to a face side of an optical device layer of an optical device wafer with a joining member interposed therebetween, thereby making up a composite substrate, applying a pulsed laser beam having a wavelength transmittable through the epitaxy substrate and absorbable by a buffer layer, from a reverse side of the epitaxy substrate of the optical device wafer, thereby breaking the buffer layer, and an optical device layer transferring step of peeling off the epitaxy substrate from the optical device layer and transferring the optical device layer to the transfer substrate. The optical device layer transferring step includes the step of applying a bending moment to an area of the composite substrate that includes an outer peripheral portion thereof while holding an area of the composite substrate that includes a central portion thereof.