239 results about "Optical microscope" patented technology

A deep learning-based super-resolution fluorescence lifetime imaging microscopy (SR-FLIM) method includes the steps of: S1, performing fluorescence microscopic imaging on a sample to obtain confocal intensity images and stimulated emission depletion (STED) intensity images at a same location; S2, co-registering the acquired confocal and STED intensity images; S3, pairing the co-registered confocal and STED intensity images as input (Input) and ground truth (GT) to assemble a dataset; S4, partitioning the dataset into training and validation sets following a predefined ratio; and S5, constructing a network, and selecting hyperparameters and an optimizer. This method may achieve SR-FLIM within a conventional confocal FLIM system, surpassing spatial resolution limitations of FLIM, breaking through resolution barriers of conventional optical microscopy, while preserving normal fluorescence lifetime characteristics of fluorescent probes.

The invention relates to the technical field of material analysis, in particular to a light microscope-field emission electron microscope combined shale rock slice analysis and identification method, which comprises the following steps of: firstly, combining a brightness distribution condition represented by a bright field image of a shale rock slice and a birefringence deviation condition represented by a cross polarization image from an optical angle; determining a mineral discrimination index representing an atomic number agent; applying offsets of different sizes based on the distribution condition of mineral discrimination indexes and the surface fluctuation condition of shale rock slices, and determining a position offset vector by combining gray scale gradient distribution on the basis; and finally, determining the cross-scale positioning and more accurate electron microscope objective table coordinates corresponding to each pixel point in combination with a position offset vector in a pixel coordinate conversion process based on an image physical distance scale and rotation translation processing, so that the cross-scale positioning accuracy of the optical microscope and the field emission scanning electron microscope is higher. The reliability of analyzing and identifying the shale rock slice is obviously improved.

This invention provides a PAM staining method that enables staining suitable for magnified observation of various samples using a range of microscopes, from optical microscopes to electron microscopes. [Solution] A PAM staining method comprising the steps of: silvering a biological sample; coloring the biological sample; and fixing the color of the biological sample, wherein the biological sample is a biologically derived sample that has been oxidized; the silvering step involves immersing the biological sample in a methenamine silver aqueous solution at room temperature, raising the methenamine silver aqueous solution from room temperature to 62°C or higher and 68°C or lower, and carrying out the silvering reaction for 30 to 40 minutes from the start of the reaction at room temperature; the coloring step involves immersing the silvered biological sample in a 0.2% gold chloride aqueous solution at room temperature for 8 to 12 hours; and the fixing step involves immersing the sample in a hard film fixing solution containing 11% to 13% sodium thiosulfate and aluminum potassium sulfate dodecahydrate for 3 minutes or more at room temperature.

A light irradiation apparatus focuses light on a surface or an inside of an object to observe or process the object, and includes a laser light source, a lens, a lens, a mask, a wave plate, and a lens. The mask is a multi-ring mask for spatially intensity-modulating input light in a beam cross-section and outputting modulated light, and includes a plurality of ring-shaped light-shielding areas provided around a center position, and a transmitting area provided between two adjacent light-shielding areas out of the plurality of light-shielding areas. A radial width of each of the two adjacent light-shielding areas out of the plurality of light-shielding areas is larger than a radial width of the transmitting area provided between the two light-shielding areas.

The invention relates to an all-solid-state battery thin-layer electrode device for multi-mode in-situ interface research. The all-solid-state battery thin-layer electrode device comprises the following components: a solid electrolyte substrate; the functional thin layer is arranged on the surface of the solid electrolyte substrate; the functional thin layer has conductivity; the functionalized thin layer allows a detection signal of an in-situ characterization technology to effectively penetrate or be reflected from the surface of the functionalized thin layer; the in-situ characterization techniques include atomic force microscopes, optical microscopes, and Raman spectroscopy, X-ray photoelectron spectroscopy, infrared spectroscopy, or X-ray diffraction. The invention provides a universal thin-layer electrode design and system and a thin-layer electrode in-situ imaging and spectroscopic characterization method for all-solid-state battery interface reaction. The objective of the invention is to expose a solid electrolyte-electrode interface reaction process which is difficult to observe in an effective detection range of various characterization technologies so as to realize real-time and in-situ visualization and accurate analysis of a dynamic evolution process of an internal interface of an all-solid-state battery.

A large-field-of-view, high-throughput and high-resolution pathological section analyzer includes an image collector for collecting a set of computing microscopic images of a pathological section sample; a data preprocessing circuit for iteratively updating the set of computing microscopic images by a multi-height phase recovery algorithm to obtain a low-resolution reconstructed image; an image super-resolution circuit for super-resolving the low-resolution reconstructed image according to a pre-trained super-resolution model to obtain a high-resolution reconstructed image; and an image analysis circuit for automatically analyzing the high-resolution reconstructed image according to different tasks, and specifically selecting different analysis models according to the different tasks to obtain corresponding auxiliary diagnosis results. Imaging visual field of the pathological section analyzer is hundreds of times that of the traditional optical microscope, a deep learning network is adopted to analyze pathological conditions of unstained pathological sections, so that the analysis process of pathological sections is simplified.

In various aspects, microscope systems are described, comprising or corresponding to optical microscopes, such as for example a transillumination microscope or a fluorescence microscope. The microscope systems may be used independently or configured with or integrated into another device or system, such as an imaging mass spectrometer or imaging mass cytometer. In various embodiments of this aspect, the microscope system is used to obtain one or more images of a sample, such as at a variety of different light collection wavelengths and / or for a variety of different illumination conditions. The microscope systems can employ various optical components and configurations allowing for high throughput imaging, such as components for imaging the sample at suitable resolutions with a wide field of view and / or for spatially separating different detection channel wavelengths from light output (e.g., transmitted or emitted light) from the sample.

The invention discloses a multi-mode nanometer measurement system and method based on terahertz scattering type scanning near-field optical microscopy and multi-frequency electrostatic force microscopy, and belongs to the technical field of near-field imaging, the measurement system comprises an AFM main body, a terahertz source, an optical path system, a terahertz detector, a multi-frequency signal generator and two phase-locked amplifiers; terahertz waves emitted by the terahertz source reach the terahertz detector through the optical path system, and near-field optical signals are obtained. The AFM comprises a metal coating probe; the multi-frequency signal generator generates sinusoidal signals with frequencies of omega1 and omega2; a sample is placed on the scanner, and the cantilever beam is controlled to vibrate at the frequency omega 1; an alternating voltage with the frequency of omega 2 is applied to a metal coating probe arranged at the top end of the cantilever beam; laser emitted by the laser is reflected to the light spot position detector through the cantilever beam, and morphology and electrostatic force signals are obtained through the two lock-in amplifiers respectively. According to the invention, a morphology signal, an optical signal and an electrostatic force signal can be synchronously obtained through single scanning.

The invention discloses a preparation method of a hydrogen-responsive composite multilayer magnesium-based film surface self-wrinkle pattern. The preparation method comprises the following steps: A, preparing a polymer elastic layer on the surface of a supporting substrate; b, depositing a plurality of layers of metal-based films on the polymer elastic layer by adopting a magnetron sputtering method; and C, exposing the prepared sample in a hydrogen-containing atmosphere, and forming a wrinkle pattern of which the recognizable size is in a range of 10nm-1000mu m on the surface through hydrogenation reaction at normal temperature. According to the method, the surface of the thin film can be deformed by exposing the thin film to the hydrogen-containing atmosphere environment, so that the three-dimensional wrinkle texture can be quickly realized, and the three-dimensional wrinkle morphology can be accurately regulated and controlled by adjusting the element components, sputtering time, sputtering power, working gas flow and hydrogen treatment parameters of the magnesium or magnesium alloy hydrogen-sensitive reaction film layer. The pattern features of the prepared wrinkle pattern can be recognized through characterization means such as an optical microscope, a scanning electron microscope, an atomic force microscope or a diffraction light-variable device.

The application discloses a three-degree-of-freedom microscopic visual precision motion platform, which comprises a linear slide, a worm reducer, a workbench and an optical microscope system. The linear slide is connected with an air floating vibration isolation platform through an aluminum profile stand. The worm reducer is fixed on the upper surface of an aluminum alloy platform carried by the linear slide. One workbench is fixed on each end of the output shaft of the worm reducer. A microstructure workpiece is installed on the lower end workbench, and a machining workpiece is installed on the upper end workbench. The optical microscope is installed on the upper end of an industrial camera from bottom to top. The industrial camera is fixed on the air floating vibration isolation platform through a supporting rod gear clamp, a rack supporting rod and a differential lifting platform. The three-degree-of-freedom microscopic visual precision motion platform can place the optical microscope system below the microstructure workpiece, thereby providing machining space for the machining workpiece, and providing a new scheme for applying microscopic visual technology to the field of precision machining.

The utility model discloses an optical lens polishing detection device which comprises a mounting seat, the lower end of the inner side of the mounting seat is fixedly connected with a placing seat, the upper surface of the placing seat is provided with a setting groove, the inner side of the setting groove is fixedly connected with tempered glass, a reflecting lens is arranged below the setting groove, and the reflecting lens is fixedly connected with the placing seat. And the reflecting lens is fixedly connected with the lower surface of the inner side of the mounting base, the upper surface of the setting groove is fixedly connected with a clamping mechanism, and the top surface of the setting groove is provided with a clamping block. According to the above structure, the clamping mechanism, the clamping blocks and the optical microscope are matched with each other, so that the clamping mechanism drives the clamping blocks to move synchronously and oppositely, an optical lens is clamped at multiple angles, the optical lens is clamped through the clamping blocks, and the clamping efficiency of the optical lens is improved. Therefore, the problem that the optical lens is separated and damaged when the optical lens is detected by the optical microscope is greatly reduced.

This invention belongs to the field of materials testing technology and discloses a deep learning-based method and system for identifying the interface of SiC modified asphalt. It acquires multi-dimensional interface images through a layered time-series acquisition method using four devices: optical microscope, SEM, EDS-Mapping, and Raman spectrometer. Adaptive algorithms are used for targeted denoising, normalization, and registration, while attention mechanisms and weighted fusion strategies are combined to enhance interface features. Simultaneously, a multi-condition dataset containing a high proportion of minor defects is constructed to achieve deep fusion and accurate identification of multi-modal features, eliminating subjective errors from manual judgment and improving the fine-grained accuracy and detection efficiency of SiC modified asphalt interface identification. The U-Net model is improved for specific scenarios and designed to be lightweight. By optimizing the encoder-decoder structure, introducing a dual-channel attention mechanism and a condition-adaptive branch, and combining a loss function, the feature extraction capability of interface boundaries and minor defects is enhanced.

The invention relates to the technical field of quantum sensing and optical instruments, and discloses integrated equipment for representing nitrogen vacancy color center quantum characteristics and sensing sensitivity, which comprises a laser module, an inverted optical microscope module, an electronic control and data acquisition module and a system software control module, the laser module realizes continuous laser beam output or pulse laser beam output through light path selection; the inverted optical microscope module receives the laser beam and collects the nitrogen vacancy color center of the sample, and selectively guides fluorescence to the confocal single photon counting branch or the analog signal detection branch through the light path selection mechanism; the electronic control and data acquisition module is responsible for driving each device and processing signals from different detection branches; and the system software control module cooperates with each module to execute quantum characteristic characterization and sensing sensitivity evaluation tasks. Through deep integration of software and hardware, dual-mode measurement is realized on a single platform, and the device has the advantages of high function integration level, compact structure, convenience in operation and high measurement efficiency.

The present invention relates to an optical or Raman micro-spectrometry apparatus (100) comprising an optical microscope objective (10) and an optical spectrometer (20). According to the invention, the micro-spectrometry apparatus comprises an astigmatic optical system (30, 31, 32) arranged outside the optical spectrometer (20, 21), between the microscope objective (10) and the optical spectrometer, the astigmatic optical system (30, 31, 32) being arranged and configured to form an astigmatic image of a light beam transmitted through the microscope objective (10) on the input slit of the optical spectrometer (20, 21), the astigmatic image being elongated by astigmatism in the height direction of the input slit, the optical spectrometer being able to spectrally disperse the astigmatic image and form a spectrally dispersed image of the field of view on the detector, the astigmatic optical system being configured to reduce an optical aberration of astigmatism of the optical spectrometer in the spectrally dispersed image.

A method for localizing individual emitters in a sample with a first localization step and a second localization step with an increased accuracy including illuminating the emitter with an intensity distribution of the illumination light having a local minimum at illumination positions arranged around the location of the emitter determined in the first localization step, detecting the light emissions of the emitter for the illumination positions, and determining the location of the emitter from the light emissions detected for the illumination positions, wherein a location correction compensating for the systematic deviation is applied to determine the illumination positions in the second localization step, as well as a light microscope and a computer program for carrying out the method.

The invention relates to the technical field of micro-nano electronic devices, in particular to a nanofluid memristor prepared by puncturing a PDMS film and a mechanical-electric coupling regulation and control system and method of the nanofluid memristor. The memristor is composed of a silicon substrate with a window and a PDMS thin film covering the silicon substrate, a three-degree-of-freedom probe station is used for driving a tungsten probe to conduct nanoscale puncture on the PDMS thin film under an optical microscope, and a pore channel with the self-constriction / reversible closing characteristic is formed; after the needle is removed, the hole channel is in a near-closed or sub-nanometer equivalent hole diameter state, by applying controllable pressure to the closed liquid chamber and superposing bias voltage, sudden change / gradual change dual-mode regulation and control of the hole diameter and non-volatile hysteresis conductance switching are achieved, and the switch ratio of the device can reach 108. According to the method, FIB is not needed in hole forming, the process is simple and convenient, the cost is low, high-contrast and programmable nanofluid memristive behaviors are achieved through the structural design of the window orientation and the clamping direction, pressure rate programming and a pressure removal maintaining / negative pressure reset strategy, and the method is suitable for the fields of single molecule detection, ion circuit storage and the like.

The invention provides a nanoimprint master template, a master negative template, a preparation method of the master negative template and a nanoimprint alignment system. The preparation method of the master template comprises the following steps: spin-coating photoresist on a silicon wafer; the method comprises the following steps: placing a mask on a silicon wafer coated with photoresist, exposing and developing by utilizing a photoetching technology, showing a first main body pattern and a first alignment pattern area on the mask on the photoresist, then baking and hardening, and transferring the pattern on the photoresist to the silicon wafer by dry etching; removing the residual photoresist to form a female template; then preparing a female negative template based on the female template, and adjusting the position of the female negative template under an optical microscope, so that the Moire fringe grating and the annular grating are aligned between the female template and the female negative template; according to the invention, the blank in the technical field of nanoimprint alignment in China is realized, high-precision alignment imprint is realized by adopting the existing common photoetching equipment and combining with an optical structure to assist alignment, and the original photoetching overlay precision is multiple times higher than the original precision.

The invention relates to the technical field of steel detection, in particular to a method for detecting the austenite grain size of low-carbon steel through an oxidation method. The method comprises the following steps: S1, cutting a metallographic specimen from low-carbon steel, and grinding and polishing the metallographic specimen; s2, the metallographic specimen ground and polished in the step S1 is subjected to segmented heat treatment; s3, removing an oxide layer on the detection surface of the metallographic sample subjected to segmented heat treatment in the step S2, and then polishing the detection surface; s4, corroding, washing and blow-drying the polished detection surface of the metallographic specimen in the step S3 by using 2-6% nitric acid alcohol; s5, the metallographic sample treated in the step S4 is observed under an optical microscope, and the austenite grain size grade of the low-carbon steel is determined, photographed and preserved; wherein in the step S2, the condition of the segmented heat treatment comprises the following steps: preserving heat for 40-60 minutes at the temperature of 850-920 DEG C, and then preserving heat for 20-30 minutes at the temperature of 720-800 DEG C. According to the method, the austenite grain size of the low-carbon steel is accurately and efficiently detected by optimizing a heat treatment process and a sample preparation process.

The invention relates to a method for time-resolved single-photon measurement, wherein light pulses (L) are generated by a light source (3), wherein photons (P) emitted from a sample (2) on the basis of the light pulses (L) are detected by a detector (4) and registered by an evaluation device (5) coupled to the detector (4), wherein the evaluation device (5) determines detection times (t P ) of the photons (P) are determined, wherein the evaluation device (5) periodically determines pulse times (t) by evaluating a signal from the light source (3) or a sensor (11). L ) of a portion of the light pulses (L) are determined, whereby the pulse times (t L ) are determined at a lower rate than a repetition rate of the light pulses (L), based on the determined pulse times (t L ) Pulse times (t L ') further light pulses (L) are estimated, and where the pulse times (t L , t L') as reference times for the recording times (t P ) of the photons (P) as well as a device (1) for single photon measurement, a light microscope (10) with the device (1) and a computer program.

The detection system of an x-ray or charged particle imaging system utilizes a high bandgap, direct conversion x-ray detection material. The signal of the x-ray / charged particle projection is recorded in a spatial light modulator, for example a liquid crystal (LC) light valve. The light valve is then read out by a polarized light optical microscope and a high speed camera. The camera is used to track the halo in the light valve to resolve its intensity and correlate it to the intensity of the incoming x-ray photons or charged particles. This allows for a spatially resolved imaging with an x-ray and / or charged particle spectrometer.

The application relates to an optical deviation identification method and device, a chromosome scanning device and a storage medium. The deviation identification method comprises the following steps: identifying a first field of view image to obtain a first reference position; identifying a second field of view image to obtain a second reference position; determining a target position of the second reference position in the second field of view image according to the first reference position; and calculating a deviation value of the second reference position and the target position. Comparing the first reference position with the target position is beneficial to determining the deviation value after the objective lens conversion, adapting to the manufacturing error of each optical microscope; is beneficial to providing an accurate deviation value, accurately matching the position of the sample stage to move the sample, thereby being beneficial to controlling the observation field coincidence degree after the objective lens conversion; is beneficial to simplifying the adjustment of the position of the to-be-tested sample after the conversion of the objective lens, improving the conversion precision, and thereby being beneficial to realizing the automatic optical detection; and is beneficial to simplifying the deviation identification, the stage device does not move in the process, and is also beneficial to the factory debugging.

The embodiment of the application provides a preparation method of a fluid inclusion microthermometric ore slice, comprising the following steps: providing a fluid inclusion slice which has been observed and circled under an optical microscope in detail for microthermometric target fluid inclusion position; putting the whole fluid inclusion slice into a glass culture dish, injecting a slice adhesive dissolving solution into the culture dish, and immersing the whole fluid inclusion slice in the slice adhesive dissolving solution to dissolve the slice adhesive and separate the fluid inclusion ore slice from the bonding surface of the glass slide; after the separation, placing the fluid inclusion ore slice with the adhesive surface upward on the surface of the glass slide and immersing it in the slice adhesive dissolving solution; after the slice adhesive on the surface of the fluid inclusion ore slice is completely dissolved, cutting the fluid inclusion ore slice according to the position of the target inclusion to be measured and thermometric, and preparing a rock and mineral fragment containing the target fluid inclusion which is suitable in size to be placed in a cold and hot stage quartz crucible.

Provided is a photosensitive element capable of forming a resist pattern having a thin photosensitive resin composition layer and high resolution, and capable of improving the manufacturing yield of a conductor pattern by suppressing resist pattern defects caused by a support film. In one embodiment, provided is a photosensitive element comprising a support film and a photosensitive resin composition layer, wherein: (1) the thickness of the photosensitive resin composition layer is 30 μm or less; (2) a hole pattern having a diameter of 10 μm or less can be resolved; and (3) the number of foreign substances having a long diameter of 5-30 μm, which are present inside the support film is 0.0004 / mm2 or less; and (4) the ratio of the number of foreign substances having no voids observable by an optical microscope having an objective lens with a numerical aperture of 0.6 to the number of the foreign substances having a major axis of 5-30 μm is 50% or less.

The invention relates to the technical field of high-voltage and insulating metal lightning stroke damage and X-ray imaging, and particularly discloses an X-ray-based lightning current metal damage real-time observation system which comprises a combined wave generator, an observation cavity, an X-ray imaging system, a lead protection system, an oscilloscope and a computer. The method has the beneficial effects that the complete dynamic process, including transient phenomena such as microcrack initiation, propagation, molten pool formation and solidification, of internal damage of the metal sample under the action of lightning current can be captured at microsecond-level time resolution, and the limitation that a traditional optical microscope or electron microscope can only provide a static result is overcome; the method can effectively treat the situation that key details such as the root of an electric arc and a tiny molten pool on the surface of an electrode are submerged by white light and cannot be clearly distinguished, so that accurate judgment on the damage process is enhanced, and analysis on lightning stroke metal damage in the high-voltage and insulation research direction is facilitated.

The application discloses a kind of electron beam wafer defect re-inspection equipment re-inspection preparation method and re-inspection method, re-inspection preparation method includes: after wafer is on piece and obtains initial inspection information and completes wafer alignment under optical microscope system, scanning electron microscope image gray optimization is carried out;In the implementation of the multi-stage wafer alignment under the scanning electron microscope, it is judged whether to carry out automatic focusing of scanning electron microscope, according to the judgment result, complete the wafer alignment of this level or the automatic focusing, complete the wafer alignment of this level and the wafer alignment of the rest higher level;Determine the reference point of wafer coordinate system.The method optimizes the re-inspection preparation process of EBR equipment, the content of judging whether to execute fast automatic focusing is organically inserted into WA, removes the step disorder and redundancy in the prior art, reduces the risk of damaging wafer caused by unnecessary SEM image acquisition, improves the efficiency and accuracy of the re-inspection preparation work, and also improves the throughput of the equipment.

This invention relates to the field of materials analysis technology, specifically to a method for analyzing and identifying shale thin sections using a combination of optical microscopy and field emission scanning electron microscopy. First, from an optical perspective, the method combines the brightness distribution of bright-field images of shale thin sections with the birefringence deviation of cross-polarized images to determine mineral discrimination indices representing atomic number proxies. Then, based on the distribution of the mineral discrimination indices and the surface undulations of the shale thin sections, different biases are applied, and the positional bias vector is determined by combining this with the gray-level gradient distribution. Finally, based on the physical distance scale of the image and the pixel coordinate transformation process involving rotation and translation, the positional bias vector is used to determine the electron microscope stage coordinates corresponding to each pixel point for more accurate cross-scale positioning. This improves the accuracy of cross-scale positioning using optical microscopy and field emission scanning electron microscopy, significantly enhancing the reliability of shale thin section analysis and identification.

A multi-point milling path design method for the full surface feature structure of thin-walled spherical shell micro-components is disclosed, relating to the field of micro-component processing technology. This invention can meet the requirements of high-precision, stable, and controllable removal of full surface feature structures of thin-walled spherical shell micro-components under micro-scale constraints. Key technical points: The method includes spatially uniform distribution of feature structures, micro-structure processing sequence planning, and multi-point milling path generation. The thin-walled spherical shell micro-component to be processed is observed offline using an optical microscope to obtain the coordinates of feature points on the contour edge of the micro-component, and the diameter of the micro-component is obtained by fitting. Based on the secondary development platform of UG software, a micro-structure processing sequence planning method driven by the shortest processing path is established to complete the above-mentioned full surface micro-structure processing sequence planning of the micro-component. Based on the point set coordinates optimized by the spherical point set uniform distribution iterative algorithm and the processing sequence driven by the "shortest processing path," combined with the configuration characteristics of ultra-precision shape control machining equipment and the micro-structure processing requirements, the coordinates of several uniformly distributed point sets with the center of the micro-component as the origin are transformed into a machining coordinate system with the tool setting point as the origin, obtaining the original coordinates of the micro-structure point sets and the corresponding feature angles. This invention is used for full-surface milling of thin-walled spherical shell micro-components.

The utility model relates to the technical field of optical microscopes, in particular to a high-stability optical microscope, which solves the problem that the optical microscope in the prior art is easily influenced by external environmental factors, so that the observation effect and the imaging quality are poor. A high-stability optical microscope comprises a body, the bottom of the body is provided with a stabilizing plate, the surface of the stabilizing plate is in threaded connection with four screws, the bottom of each screw is fixedly connected with an anti-tilt column, the top of the stabilizing plate is provided with three adjusting grooves, the inside of each adjusting groove is provided with an L-shaped stabilizing block through an adjusting mechanism, and the surface of each stabilizing block is provided with a sliding groove. An H-shaped lifting block is slidably connected into the sliding groove, and the surface of the lifting block is in threaded connection with an anti-moving rod. According to the utility model, the body is not easy to vibrate, touch by an operator and the like which affect the observation effect and the imaging quality in the use process, and the observation effect and the imaging quality of the optical microscope are ensured.

The invention discloses a deep silicon dry etching end point detection method and device, and the method comprises the steps: S1, setting the brightness of a light source of an optical microscope to be maximum, and S2, setting an aperture of the optical microscope to be minimum; s3, setting the magnification factor of the optical microscope to be greater than a preset multiple; s4, setting the focal length of the optical microscope until the light source spot edge is clear; s5, for each observation point of the wafer, moving the wafer, enabling the light source spots to fall on the adjacent side area of the area to be observed of the observation point, and obtaining the light transmission state of the observation area; the observation area is an etching area with the maximum length-width ratio; when the light transmission state of the observation area is not carved open, entering S6; entering S7 when the light transmission state of the observation area is a carved state; s6, the wafer is placed into the dry etching equipment again, the preset etching duration is prolonged, and after the preset etching duration, the step S5 is executed again; and S7, determining that the etching end point is reached, and ending the etching. The processing end point judgment effect of the method is good.

The invention discloses a photoresist defect detection method and system, and the method comprises the steps: coating a silicon wafer with photoresist, and exposing and developing the photoresist under ultraviolet light to form a pattern so as to obtain a developed image; and processing the developed image by using an optical microscope to obtain a detection result that whether the photoresist has defects or not. Therefore, the quality and the precision of the photoresist pattern can be improved, and the preparation quality of a semiconductor is ensured.