3428results about "Mechanical roughness/irregularity measurements" patented technology

A method for monitoring the health of a system comprises performing at each of a plurality of times the steps of:

constructing a condition signature from a plurality of condition indicators including (a) a plurality of vibration measurements acquired from the system or (b) one or more vibration measurements and one or more performance parameter measurements acquired from the system;

predicting a normal signature from a model defining one or more inter-dependencies between said condition indicators, the normal signature corresponding to the condition signature for a healthy system;

comparing the condition signature with the normal signature; and

registering an event if the condition signature differs from the normal signature by more than a predetermined threshold.

A method for protecting an item of software, wherein at least one first challenge means is associated with said protected item of software, and at least one first response means accesses one private keying material. At least a third means (either challenge or response also exists). The first challenge means has no access to the said private keying material. The first response means proves to the first challenge means that the first response means has access to the private keying material. The first challenge means validates this proof using the public keying material that corresponds to the first response means' private keying material.

A method and associated apparatus (5) for the standardized grading of gemstones is provided. The system gauges the spectral response of a gemstone subject to a plurality of incident light sources (77, 64, 90, 92, 102) within an imaging apparatus. The operation of the imaging apparatus is controlled by an instruction set of a local station control data processor (12). Light energy data is captured in the form of pixel data sets via a charge coupled device of the imaging apparatus of the local station (8). The control data processor data of the local station is operably linked to analysis station (14). Gemstones qualities are analyzed by the plurality of light sources (92, 90, 102) of the imaging apparatus (5) and quantified relative to model pixel data sets of the database and recorded for future reference therein.

A method of monitoring integrity of a pump. The method may include recording timing information of the pump during operation while simultaneously sampling acoustic data with a high speed equidistant acquisition mechanism or at a rate based on the speed of the pump in operation. The acquisition of acoustic data is followed by evaluation thereof. Such techniques may improve resolution of acquired data while substantially increasing processor capacity for evaluation. A pump integrity monitor for carrying out such techniques is also described.

Various probe systems and probes are provided. In one aspect, a probe is provided that includes a base and a first member coupled to the base. The first member has a first tip for probing a circuit device. A first actuator is coupled to the first member for moving the first member relative to the base. Electrical and/or topographical probing is possible.

The invention relates to an apparatus and a method for a scanning probe microscope, comprising a measuring assembly which includes a lateral shifting unit to displace a probe in a plane, a vertical shifting unit to displace the probe in a direction perpendicular to the plane, and a specimen support to receive a specimen. A condenser light path is formed through the measuring assembly so that the specimen support is located in the area of an end of the condenser light path.

A system for empirically diagnosing a condition of a monitored system. Estimates of monitored parameters from a model of the system provide residual values that can be analyzed for failure mode signature recognition. Residual values can also be tested for alert (non-zero) conditions, and patterns of alerts thus generated are analyzed for failure mode signature patterns. The system employs a similarity operator for signature recognition and also for parameter estimation. Failure modes are empirically determined, and precursor data is automatically analyzed to determine differentiable signatures for failure modes.

A method for characterizing semiconductor device performance variations includes processing a wafer in a processing line to form a feature on the wafer; measuring a physical critical dimension of the feature in a first metrology tool to generate a first critical dimension measurement; measuring the physical critical dimension of the feature in a second metrology tool to generate a second critical dimension measurement independent of the first critical dimension measurement; determining an effective critical dimension of the feature in a third metrology tool to generate a third critical dimension measurement; and comparing the first, second, and third critical dimension measurements to identify a metrology drift in one of the first and second metrology tools. A system for characterizing semiconductor device performance variations includes a processing line, first, second, and third metrology tools, and a process controller. The processing line is adapted to process a wafer to form a feature on the wafer. The first metrology tool is adapted to measure a physical critical dimension of the feature to generate a first critical dimension measurement. The second metrology tool is adapted to measure the physical critical dimension of the feature to generate a second critical dimension measurement independent of the first critical dimension measurement. The third metrology tool adapted to determine an effective critical dimension of the feature to generate a third critical dimension measurement. The process controller is adapted to compare the first, second, and third critical dimension measurements to identify a metrology drift in one of the first and second metrology tools.

An objective is to identify the health state of mechanical equipment and provide information usable for determining maintenance work timing or the like. A health management system includes a time-series data acquisition unit configured to acquire multi-dimensional sensor data and environmental data from mechanical equipment; a first discrimination unit configured to quantify the equipment state of the mechanical equipment by a statistical method using normal data as learning data; a second discrimination unit configured to quantify the health state indicating the performance or quality of the mechanical equipment by a statistical method using normal data; and an output unit configured to display and/or output to the outside the quantified equipment state and health state.

Inspection guided overlay metrology may include performing a pattern search in order to identify a predetermined pattern on a semiconductor wafer, generating a care area for all instances of the predetermined pattern on the semiconductor wafer, identifying defects within generated care areas by performing an inspection scan of each of the generated care areas, wherein the inspection scan includes a low-threshold or a high sensitivity inspection scan, identifying overlay sites of the predetermined pattern of the semiconductor wafer having a measured overlay error larger than a selected overlay specification utilizing a defect inspection technique, comparing location data of the identified defects of a generated care area to location data of the identified overlay sites within the generated care area in order to identify one or more locations wherein the defects are proximate to the identified overlay sites, and generating a metrology sampling plan based on the identified locations.

Computation environments are protected from bogus or rogue load modules, executables, and other data elements through use of digital signatures, seals, and certificates issued by a verifying authority. A verifying authority—which may be a trusted independent third party—tests the load modules and/or other items to verify that their corresponding specifications are accurate and complete, and then digitally signs them based on a tamper resistance work factor classification. Secure computation environments with different tamper resistance work factors use different digital signature authentication techniques (e.g., different signature algorithms and/or signature verification keys), allowing one tamper resistance work factor environment to protect itself against load modules from another tamper resistance work factor environment. The verifying authority can provide an application intended for insecure environments with a credential having multiple elements covering different parts of the application. To verify the application, a trusted element can issue challenges based on different parts of the authenticated credential that the trusted element selects in an unpredictable (e.g., random) way, and deny service (or take other appropriate action) if the responses do not match the authenticated credential.

The present invention relates to a finger-motion detecting apparatus and method and includes a sensing unit to be disposed on a wrist of a subject person, said sensing unit being configured to output a measurement signal into the wrist of the subject person and to receive a reflected signal of the measurement signal according to the motion of tendons in the wrist of the subject person, a signal control unit configured to control whether the measurement signal is outputted and to adjust the measurement signal on the basis of the reflected signal, and a finger-motion recognizing unit configured to detect finger motion of the subject person from the reflected signal. According to the present invention, since a sensor capable of detecting finger motion is worn on a wrist, the problem of inconvenience in existing methods is resolved.

Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of a field in the reticle design pattern. The images illustrate how the field will be printed on a wafer at different values of one or more parameters of a wafer printing process. The field includes a first die and a second die. The method also includes detecting defects in the field based on a comparison of two or more of the images corresponding to two or more of the different values. In addition, the method includes determining if individual defects located in the first die have substantially the same within die position as individual defects located in the second die.

A method for detecting an anomaly, such as a crack, in a rotor includes measuring the rotational speed and vibration of the rotor. A vibration signal synchronous with the frequency of rotation is filtered from the vibration measurement. A background vibration vector is then subtracted from the synchronous vibration signal to produce a vibration difference signal. The phase and amplitude of the vibration difference signal are measured and evaluated to determine whether an anomaly has developed. An apparatus for performing this method includes vibration and speed sensors coupled to a filter for extracting a signal from the vibration measurement having a frequency synchronous with the rotation of the rotor. A processor is coupled to the filter and the speed sensor and is programmed to perform the processing steps, described above.