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20 results about "Beam diameter" patented technology

The beam diameter or beam width of an electromagnetic beam is the diameter along any specified line that is perpendicular to the beam axis and intersects it. Since beams typically do not have sharp edges, the diameter can be defined in many different ways. Five definitions of the beam width are in common use: D4σ, 10/90 or 20/80 knife-edge, 1/e², FWHM, and D86. The beam width can be measured in units of length at a particular plane perpendicular to the beam axis, but it can also refer to the angular width, which is the angle subtended by the beam at the source. The angular width is also called the beam divergence.

Atmospheric turbulence simulator

The application discloses an atmospheric turbulence simulator, which comprises a light source, a target, a first lens unit, a light splitting unit, a spatial light modulator, a first diaphragm unit, a second lens unit and a detector. The light beam generated by the light source passes through the target, becomes a parallel light beam through the first lens unit, is transmitted through the light splitting unit again, is reflected by the spatial light modulator and the light splitting unit again, enters the first diaphragm unit to be limited in diameter, is changed into an image square telecentric light beam through the second lens unit, is focused on the detector to form an image, and the detection of the target in different atmospheric turbulence environments is realized. The atmospheric turbulence simulator provided by the application has robustness, can realize the change of atmospheric conditions and the change of propagation distance, and thus makes the system device more flexible and practical.
Owner:CHINA JILIANG UNIV

Control device, ultrasound inspection device, and ultrasound inspection method

PendingJP2026105214ABeam diameterReflected waves
The invention provides a control device capable of improving the accuracy of defect detection. [Solution] The control device 7 controls an ultrasonic inspection device 100 that ultrasonically inspects an object to be inspected 5 by irradiating it with ultrasonic waves and receiving reflected waves, and includes an acquisition unit 71 that acquires a first reflected signal received from a first ultrasonic irradiation position on the object to be inspected 5 and a second reflected signal received from a second ultrasonic irradiation position on the object to be inspected, the distance between the second irradiation position and the first irradiation position being shorter than the beam diameter of the ultrasonic waves on the surface of the object to be inspected 5, and an integration unit 72 that integrates the first reflected signal and the second reflected signal to generate an integrated reflected signal.
Owner:HIATACHI POWER SOLUTIONS CO LTD

Method for the layer-by-layer manufacturing of a three-dimensional object, with targeted illumination of grain edges

ActiveDE112021000242B4Additive manufacturing apparatusIncreasing energy efficiencyBeam diameterFull width at half maximum
Method for manufacturing a three-dimensional object layer by layer (102), comprising the following steps: Step a) a new layer (105) of grains (201) of a metallic material (109) is applied to a substrate (104), wherein the grains (201) have a mean particle size d50=DM, where the mean particle size is determined as a volume-equivalent sphere diameter, with 50 µm ≥ DM ≥ 1 µm, and a mean layer thickness SD of the newly applied layer (105) is at most 1.5*DM, in particular wherein the new layer (105) of grains (201) is applied to a previously produced layer of grains (200) of the substrate (104); Step b) the topography of the substrate (104) is measured, including the position and shape of the individual grains (201) of the new layer (105); In step c) a lighting plan for the new layer (105) is determined from the topography measured in step b) and the desired shape of the three-dimensional object (102); Step d) according to the illumination plan, at least a part of the new layer (105) of grains (201) is locally illuminated with an electron beam (115), wherein the electron beam (115) has a beam diameter ED on the surface of the substrate (104) with ED≤0.3*DM, where the beam diameter is determined via FWHM (=full width at half maximum); wherein the electron beam (115) selectively illuminates one or more parts (202) of an edge (401) of a respective grain (201), thereby fixing the grain (201) on the substrate (104), in particular on grains (200) of a previously produced layer and / or on other grains (201) of the new layer (105), and wherein the respective illuminated grain (201) remains at a temperature below the melting point of the metallic material (109); wherein the preceding steps a) to d) are repeated several times until the three-dimensional object (102) is complete.
Owner:NESS STEPHANIE

Light-emitting device and display device

PendingCN122284202ABeam diameterDisplay device
The light-emitting device includes: a light source that emits laser light; a lens that collimates the laser light; and a light-reflecting part that is spaced apart in the direction of travel of the collimated light transmitted through the lens, having a plurality of reflecting surfaces that reflect the collimated light in a direction intersecting the direction of travel, wherein the beam diameter of the reflected light reflected by the plurality of reflecting surfaces is larger than the beam diameter of the collimated light.
Owner:NICHIA CORP

Light-emitting device and display device

PendingUS20260177227A1ReflectorsBeam diameterLight reflection
A light-emitting device includes: a light source configured to emit laser light; a lens configured to collimate the laser light; and a light-reflecting part having a plurality of reflecting surfaces disposed at intervals in a traveling direction of collimated light transmitted through the lens, the plurality of reflecting surfaces being configured to reflect the collimated light in an intersecting direction to the traveling direction, such that a beam diameter of reflected light reflected off the plurality of reflecting surfaces is greater than a beam diameter of the collimated light.
Owner:NICHIA CORP

Control device, ultrasonic inspection device, and ultrasonic inspection method

PCT designated stageWO2026133828A1Response signal detectionProcessing detected response signalBeam diameterReflected waves
A control device (7) controls an ultrasonic inspection device (100) that ultrasonically inspects an object (5) to be inspected by irradiation with ultrasonic waves and reception of reflected waves. The control device (7) comprises: an acquisition unit (71) that acquires a first reflected signal received from a first irradiation position of the ultrasonic waves on the object (5) to be inspected and a second reflected signal received from a second irradiation position of the ultrasonic waves on the object to be inspected, the distance between the second irradiation position and the first irradiation position being shorter than the beam diameter of the ultrasonic waves on a surface of interest of the object (5) to be inspected; and an integration unit (72) that integrates the first reflected signal and the second reflected signal to generate an integrated reflected signal.
Owner:HIATACHI POWER SOLUTIONS CO LTD

Method for adjusting the focus position of a laser beam

UndeterminedDE112024003250T5Beam diameterProtective glasses
This method for setting the focus position of a laser beam comprises a first step of inserting a first holder for holding a protective glass and an aperture for limiting a beam diameter of a guide laser beam into an insertion opening provided in a lower part of a laser head; a second step of emitting the guide laser beam; and a third step of determining whether the focus position of the laser beam is within a predetermined range, which includes a reference position, based on a comparison between a test piece provided at the reference position according to the focus position of the guide laser beam and the beam diameter of the guide laser beam indicated on the test piece during the execution of the second step.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Hair removal device and hair removal method

ActiveJP7867719B1Hair-singeingSurgical instrument detailsSkin treatmentsMedicine
This invention relates to a hair removal device and method that can suppress pain associated with hair removal treatment, regardless of the density of hair follicles. [Solution] A hair removal device that performs hair removal using a beam of light emitted from a light source, comprising a light source, a beam diameter control unit capable of changing the beam diameter of the beam light emitted onto a treatment area of ​​the skin, and an irradiation position identification unit that identifies the irradiation position of the beam light in the treatment area using the beam diameter of the beam light set by the beam diameter control unit, wherein the beam diameter control unit is configured to selectively set the beam diameter of the beam light emitted onto the treatment area to at least a first beam diameter and a second beam diameter smaller than the first beam diameter, and the irradiation position identification unit has a first irradiation position identification unit that identifies the irradiation position of the beam light at the first beam diameter and a second irradiation position identification unit that identifies the irradiation position of the beam light at the second beam diameter.
Owner:EIDEA INC

Epilation device and epilation method

PCT designated stageWO2026134019A1Hair-singeingSurgical instrument detailsMedicineBeam diameter
Provided is an epilation device for performing epilation by beam light emitted from a light source, the device comprising: a light source; a beam diameter control unit capable of changing the beam diameter of beam light irradiating a target region of skin; and an irradiation position specifying unit for specifying the irradiation position of the beam light in the target region by using the beam diameter of the beam light set by the beam diameter control unit. The beam diameter control unit is configured to be capable of selectively setting the beam diameter of the beam light irradiating the target region to at least a first beam diameter and a second beam diameter smaller than the first beam diameter. The irradiation position specifying unit includes: a first irradiation position specifying unit for specifying the irradiation position of the beam light in the case of the first beam diameter; and a second irradiation position specifying unit for specifying the irradiation position of the beam light in the case of the second beam diameter.
Owner:EIDEA INC

A micro-lens array based fiber core diameter parabolic transformation structure

PendingCN122131444ACoupling light guidesCoatingsFiberBeam diameter
This invention belongs to the field of optical technology, specifically relating to a fiber core diameter-preserving focal ratio conversion structure based on a microlens array, comprising a large-core-diameter fiber, a microlens array, and several small-core-diameter fibers. The large-core-diameter fiber, the microlens array, and the several small-core-diameter fibers are connected sequentially from left to right. The light emitted from the large-core-diameter fiber is refracted by the microlens array and enters each small-core-diameter fiber. The microlens array is composed of several microlens units, the number of which corresponds to the number of small-core-diameter fibers. Each microlens unit has an equilateral hexagonal cross-sectional shape. The circumcircle diameter of each microlens unit is... d 3 is smaller than the output beam diameter of a large-core fiber. d 1. The diameter of the inscribed circle of the microlens array d 2 is greater than the output beam diameter of a large-core fiber. d 1. This invention enables a method for optical field transformation using microlens arrays, achieving low-loss, focus-preserving coupling transmission between large and small core diameter optical fibers.
Owner:HARBIN ENG UNIV

A highway pavement rut depth nondestructive testing and data analysis device

ActiveCN121632007BMoving averageLaser array
The application discloses a kind of highway pavement rut depth nondestructive testing and data analysis device, comprising: basic detection module: using multiple laser array non-contact measurement road surface vertical distance, through cubic spline interpolation to generate deformation track and solve rut depth, output original data;Dynamic environment adaptive acquisition module: integrated illumination and dust sensor, dynamically adjust laser power, pulse interval and beam diameter, ensure that signal-to-noise ratio is greater than 30dB, output optimized measurement value;Mobile multi-dimensional scanning module: carry double-shaft platform and SLAM algorithm to realize autonomous navigation, receive optimized data and output rut depth, transverse and longitudinal slope and other multi-dimensional topographic data;Field data grading processing module: through dynamic threshold rejection, moving average filtering and spatial verification to realize data cleaning;Data analysis and prediction module: based on LSTM model, rut development trend is predicted in combination with historical data, to support preventive maintenance decision.
Owner:SHANDONG TRANSPORTATION INST

Faraday rotator, its preparation method and isolator

PendingCN122085547Afast dissipationavoid accumulationCoatingsNon-linear opticsBeam diameterFaraday rotator
This application relates to the field of optical device technology, and discloses a Faraday rotator, its fabrication method, and an isolator. The Faraday rotator comprises multiple magneto-optical crystals and multiple heat-dissipating crystals, which are alternately stacked along the optical path. Embodiments of this application can overcome the thermal focus shift defect of the isolator without increasing the output beam diameter of the collimator.
Owner:GUANGYUE TECH (SHENZHEN) CO LTD

Electron beam curing method, materials and equipment for complex ceramic components

ActiveCN117445131Blong storage timefast formingUltra-high-temperature ceramicsBeam diameter
An electron beam curing method, materials, and equipment for complex ceramic components are disclosed. This method employs a focused electron beam with a variable beam diameter to selectively cure and form ceramic materials containing photosensitive resin, layer by layer, to create complex components. These components are then sintered to obtain the final complex ceramic component. Due to the high penetration of the electron beam and the real-time control of the beam diameter, this method can not only form complex, irregularly shaped, high-density components such as ultrafine carbides, nitrides, and ultra-high temperature ceramics, but also reduce the difficulty of sintering. Simultaneously, the real-time adjustment of the beam diameter allows for efficient filling of large areas within complex components and precise shaping of fine contours. Furthermore, the high vacuum requirement during electron beam curing significantly reduces defects such as pores within the material. Since electron beam curing can reduce or eliminate the need for initiators, the storage stability of the prepared ceramic materials is also greatly improved. This represents a novel additive manufacturing process for high-performance complex ceramic components.
Owner:XI AN JIAOTONG UNIV

A method of additive manufacturing by separate melting of coarse and fine powders, a manufactured part, a system and applications

This invention discloses an additive manufacturing method, part, system, and application of partitioned melting of coarse and fine powders. The method divides the forming area of ​​each layer of the three-dimensional model of the part to be formed into a first and a second region. Coarse powder is laid throughout the powder bed. After removing the coarse powder from the second region, fine powder is laid in the second region. The second region is melted layer by layer using a small-sized laser beam, while the first region is melted by a large-sized laser beam. The layer thickness of the formed layer in the first region is k times that of the formed layer in the second region. A control system is also constructed based on powder particle size, beam diameter, forming region, layer thickness, and forming sequence. Furthermore, an additive manufacturing system suitable for partitioned powder laying of coarse and fine powders and partitioned laser melting is provided. This invention can effectively utilize coarse powder to achieve cost reduction and efficiency improvement, significantly reducing forming time while ensuring the forming accuracy of fine structures, and further meeting the forming requirements of fine internal channels, fine lightweight cellular structures, and fine microporous structures.
Owner:TAIHANG NATIONAL LABORATORY

Light-emitting device and display device

PendingJP2026112307ALaser detailsSemiconductor lasersBeam diameterDisplay device
This invention provides a technology for a light-emitting device equipped with a light source that emits laser light, which enables the output of laser light with an expanded beam diameter. [Solution] The light-emitting device comprises a light source that emits laser light, a lens that collimates the laser light, and a plurality of reflective surfaces arranged at intervals in the direction of propagation of the collimated light that has passed through the lens, which reflect the collimated light in a direction intersecting the direction of propagation, and in which the beam diameter of the reflected light reflected by the plurality of reflective surfaces is larger than the beam diameter of the collimated light.
Owner:NICHIA CORP

A rapid photo-current imaging test device and system thereof

The utility model discloses a kind of fast photoelectric current imaging test device and system, the device includes beam expander (2), galvanometer (3), field lens (4), data collector (6) and synchronous signal generator (7) and controller (8);Wherein: beam expander (2), for the laser beam diameter of laser light source (1) emission is enlarged, the laser beam is focused by field lens (4) and obtains smaller diameter light spot;Synchronous signal generator (7) is used to receive the control signal of controller (8) and generate the synchronous signal of the movement of control galvanometer (3) and data acquisition;Galvanometer (3) is used to control mirror rotation angle according to synchronous signal, adjust the exit direction of the laser beam;Field lens (4) is used to focus the laser beam, and coupling obtains smaller laser spot of focal point diameter;Data collector (6) is used to collect photoelectric current / optical voltage signal to the sample to be measured according to the synchronous signal.Using the utility model, the problem that slow moving speed, long time required and the floor area of test device and system are greatly reduced when moving the sample to be measured by using electric control moving station can be solved.
Owner:ZOLIX INSTRUMENTS CO LTD +1

Treatment method

PCT designated stageWO2026140203A1Beam diameterLight beam
According to the present invention, in a first step S101, a treatment region to be treated is divided into a plurality of divided regions. Next, in a second step S102, in the divided region, a laser beam is scanned and irradiated such that the entirety of the divided region is irradiated with the laser beam. For example, a spot beam of the laser beam focused to a desired beam diameter is raster-scanned and irradiated on a plane of the target divided region.
Owner:NT T INC

Manufacturing method for semiconductor devices

PendingJP2026112165ABeam expanderDevice material
To provide a method for manufacturing semiconductor devices that can improve yield. [Solution] A method for manufacturing a semiconductor device comprises the steps of: preparing an intermediate structure including a first support substrate including a first surface and a second surface, a semiconductor element disposed on the first surface side of the first support substrate, and a delamination layer disposed between the first surface and the semiconductor element; and irradiating the delamination layer with laser light to remove the delamination layer and detach the semiconductor element from the first support substrate. The laser light is such that a first beam of light emitted from a laser light source is expanded in diameter by a first expander to become a second beam of light, the outer periphery of the second beam of light is removed by an aperture to become a third beam of light, the beam shape and intensity distribution of the third beam of light are changed by a diffractive optical element to become a fourth beam of light, and the fourth beam of light reaches the delamination layer. The first expander makes the beam diameter of the second beam of light larger than the design incident diameter of the diffractive optical element.
Owner:NICHIA CORP +1