252 results about "Ultrashort pulse laser" patented technology

Various implementations of implants and implant surfaces for clinical rehabilitation or enhancement of a patient, related systems, and computer programs and methods for the design and manufacturing of implants are disclosed. A macroscale shape, a microscale surface texture, and a nanoscale surface topography are overlaid to increase, condition, and thereby functionalize an implant surface. A thin-film coating and / or laser interferometry is utilized to overlay on a machined implant substrate a nanoscale surface topography. Manufacturing the macroscale shape and the microscale texture may be performed with an ultrashort pulsed laser system in separate process steps. The design of a dental implant may be assisted by a self-learning computer program product, based on trained coupled shape models including, for example, mesh-based statistical shape and orientation models.

The present invention provides a method and apparatus for laser stripping a silicon carbide ingot. The method first transmits an ultrashort pulse laser beam through the first end face of the silicon carbide ingot and focuses it on a set depth layer of the ingot. A cavity-modified region and a crack-modified region are generated above the set depth layer, respectively, and scanned to form the cavity-modified layer and the crack-modified layer. A short pulse laser beam then transmits the second end face of the silicon carbide ingot and focuses it on the cavity-modified region. The beam scatters and propagates within the cavity-modified region, causing the heat from the short pulse laser beam to act on the cavity-modified region, causing cracks within the crack-modified region to grow laterally outward. Scanning is then performed to connect cracks within adjacent cavity-modified regions within the cavity-modified layer through lateral growth. This reduces the amount and length of cracks in the modified layer extending longitudinally along the silicon carbide ingot, increases the number and length of lateral crack growth, reduces cutting loss, and reduces waste.

Various implementations of implants and implant surfaces for clinical rehabilitation or enhancement of a patient, related systems, and computer programs and methods for the design and manufacturing of implants are disclosed. A macroscale shape, a microscale surface texture, and a nanoscale surface topography are overlaid to increase, condition, and thereby functionalize an implant surface. A thin-film coating and / or laser interferometry is utilized to overlay on a machined implant substrate a nanoscale surface topography. Manufacturing the macroscale shape and the microscale texture may be performed with an ultrashort pulsed laser system in separate process steps. The design of a dental implant may be assisted by a self-learning computer program product, based on trained coupled shape models including, for example, mesh-based statistical shape and orientation models.

Various implementations of implants and implant surfaces for clinical rehabilitation or enhancement of a patient, related systems, and computer programs and methods for the design and manufacturing of implants are disclosed. A macroscale shape, a microscale surface texture, and a nanoscale surface topography are overlaid to increase, condition, and thereby functionalize an implant surface. A thin-film coating and / or laser interferometry is utilized to overlay on a machined implant substrate a nanoscale surface topography. Manufacturing the macroscale shape and the microscale texture may be performed with an ultrashort pulsed laser system in separate process steps. The design of a dental implant may be assisted by a self-learning computer program product, based on trained coupled shape models including, for example, mesh-based statistical shape and orientation models.

Various implementations of implants and implant surfaces for clinical rehabilitation or enhancement of a patient, related systems, and computer programs and methods for the design and manufacturing of implants are disclosed. A macroscale shape, a microscale surface texture, and a nanoscale surface topography are overlaid to increase, condition, and thereby functionalize an implant surface. A thin-film coating and / or laser interferometry is utilized to overlay on a machined implant substrate a nanoscale surface topography. Manufacturing the macroscale shape and the microscale texture may be performed with an ultrashort pulsed laser system in separate process steps. The design of a dental implant may be assisted by a self-learning computer program product, based on trained coupled shape models including, for example, mesh-based statistical shape and orientation models.

The invention relates to the technical field of laser processing, particularly discloses an ultrathin prepreg single-emitting laser hole forming system, and aims to solve the contradiction among precision, thermal damage and efficiency in ultrathin prepreg laser processing. According to the system, through cooperation of an ultrashort pulse laser source, precise light beam shaping and transmission, material processing and positioning, real-time monitoring and feedback and an intelligent control and optimization module, laser and material interaction is finely regulated and controlled. In a single laser event or an equivalent single laser event, high-precision and low-damage microstructure processing of the ultrathin prepreg is realized, the defects of a heat affected zone, carbonization, layering and the like are effectively reduced, and the processing quality and efficiency are improved.

The invention discloses a non-consistency multi-focus unit modification system for laser slicing of transparent materials. The non-consistency multi-focus unit modification system comprises an ultra-short pulse laser, a light beam regulation and control system, a light beam shaping system, a focusing objective lens, a visual positioning system and a high-precision three-dimensional motion platform, a transparent material sample wafer to be sliced is placed on the high-precision three-dimensional motion platform; the ultrashort pulse laser provides picosecond laser beams for the whole system, the laser beams generated by the ultrashort pulse laser are transmitted to the light beam shaping system through the light beam regulation and control system to generate multiple inconsistent laser beams, and the multiple inconsistent laser beams are focused and shrunk through the focusing objective lens to obtain multiple inconsistent focuses. The focus is focused in a transparent material sample wafer on a high-precision three-dimensional motion platform for slicing; wherein the high-precision three-dimensional motion platform realizes the movement of a transparent material sample wafer in x, y and z directions; and the visual positioning system is used for identifying and positioning the transparent material sample. On the premise that the slicing quality is guaranteed, the processing efficiency is remarkably improved.

The invention provides an ultrafast scanning measurement system for optical element absorption loss spatial domain and frequency domain distribution based on dispersion Fourier transform. Comprising an ultra-short pulse laser, a spatial light focusing and collecting module, a laser average spectrum measurement module, a single-pulse real-time spectrum measurement module based on dispersion Fourier transform, a time lens module, a high-speed photoelectric detector and a high-frequency oscilloscope. According to the invention, based on the dispersion Fourier transform principle, the real-time spectrum of a single pulse can be demodulated, and the scanning detection module can be used to take the light pulse repetition period as the scanning frame rate of the optical element, so that the spatial domain two-dimensional distribution of the absorptivity of the optical element can be subjected to ultrafast scanning detection. And a means is provided for high-efficiency comprehensive detection of heat absorption of the large-aperture optical element.

The invention relates to the technical field of laser processing, and discloses a laser processing method of a ceramic substrate, which adopts an ultrashort pulse laser and nanosecond laser dual-laser system process, integrates the advantages of precise surface modification of ultrashort pulse laser and efficient processing of nanosecond laser, and forms a micron-sized porous sacrificial layer on the surface of a ceramic material. Micropores and microcracks on the micron-sized porous sacrificial layer destroy the continuous heat conduction path of the original compact ceramic, and heat is gathered on the micron-sized porous sacrificial layer formed on the surface, so that when subsequent nanosecond laser acts, compared with the original smooth ceramic substrate, the generated cracks are easy to block, two-dimensional cracks are not easy to generate on the surface of the ceramic substrate, and the surface of the ceramic substrate is not easy to crack. And low-power and high-efficiency processing can be carried out on the ceramic material without coating an auxiliary material, and high-absorption and low-heat-influence processing is realized.

The invention discloses a femtosecond laser three-dimensional pumping detection imaging method, which belongs to the technical field of ultrafast laser observation, and particularly comprises the following steps of: generating a laser pulse by using an ultrashort pulse laser, splitting the laser pulse by using a beam splitter to generate two beams of pulse light, namely pumping light and detection light, ablating a material by using the pumping light as an excitation source, reflection or transmission imaging is realized at different moments after the probe light passes through the time delay table; a detection angle is freely adjusted in space around a sample to be detected by rotating the light path propagation system, and a detection mode is switched between a reflection mode and a detection mode by rotating the imaging system; a multi-angle two-dimensional transient image is fused into a three-dimensional graph, plasma and a double-temperature model are expanded, the electronic dynamic characteristics of three-dimensional space distribution and the plasma eruption process can be calculated in an ultrafast scale, and three-dimensional information of a femtosecond laser ablation material is reduced. The problem that an existing imaging method cannot achieve three-dimensional imaging of the femtosecond laser processing ultrafast process at any angle in the space is solved.

According to the mask defect in-situ repairing method, the femtosecond laser is adopted for defect repairing, and all the advantages of the femtosecond laser are absorbed. Femtosecond laser is ultrashort pulse laser with'femtosecond 'as a time unit, the pulse duration time of the femtosecond laser is extremely short (femtosecond magnitude), and the peak power of the femtosecond laser is extremely high (the maximum can reach pat watt). Therefore, according to the repairing method, the repairing precision can be reduced to 15 nm, the heat affected zone is smaller than 1 micron, the repairing time can be shortened to 100 ms for the defect of 100 nm, the roughness of the repaired surface is smaller than or equal to 0.5 nm, meanwhile, the good effects of high repairing precision, low heat affected zone, high repairing speed, low equipment cost and simple operation are achieved, and the rejection rate of the mask is reduced. The method is especially suitable for repairing advanced process masks, such as EUV and ArF, and display panel masks, such as OLED and FMM, and MEMS device masks.

The invention relates to a method for manufacturing an elastic sheet microneedle for a crimping test, which is characterized by comprising the following steps: S1, designing a processing pattern according to an outline pattern and a micro bridge contact of the elastic sheet microneedle, the outline pattern comprises a connecting part, a bending elastic part and a test needle body part, the bending elastic part comprises a straight line part and an arc line part, and the test needle body part comprises a connecting part, a bending elastic part and a test needle body part; micro-bridge contacts are formed at two ends of the bent elastic part, and the end parts of the micro-bridge contacts extend into the outline pattern of the elastic sheet micro-needle; s2, a cutting track path of laser cutting equipment is formed according to the machining pattern; s3, the metal sheet with the thickness ranging from 10 micrometers to 500 micrometers is cut through picosecond or femtosecond ultrashort pulse laser according to the cutting track path; s4, redundant metal scraps on the product obtained after laser cutting are removed, and an elastic piece microneedle and a frame are formed; s5, plating a nickel layer and a gold layer on the upper surface of the elastic sheet microneedle in a chemical plating manner; and S6, separating the micro-bridge contacts to obtain a single elastic sheet micro-needle. According to the elastic sheet micro-needle, the micro-bridge connection points extending inwards are arranged at the two ends of the bending elastic part, sheet cutting is carried out in combination with picosecond or femtosecond ultrashort pulses, the produced elastic sheet micro-needle has good consistency, and it is detected that the elastic sheet micro-needle can still keep good consistency after being tested for 300,000 times, and the test requirement is still met.

The invention provides an ultrafast laser radar system based on ultrashort pulse laser two-dimensional frequency-space mapping, and the system comprises an ultrafast laser which is connected with a first coupler and is used for transmitting detection light, first reference light and second reference light; the two-dimensional frequency-space mapping module is used for converting the detection light into two-dimensional dispersion light, and the two-dimensional dispersion light detects a detected object and returns the detected object; the coherent detection light path module is used for performing interference on the first reference light and the returned two-dimensional dispersion light to obtain an interference spectrum; the dispersion Fourier transform-based measurement module is used for performing dispersion Fourier transform on the interference spectrum to obtain phase information of the measured object; and the distance measuring module is used for coupling the returned two-dimensional dispersion light with the second reference light to obtain the distance between the measured object and the ultrafast laser and the moving speed of the measured object. According to the invention, the detection refresh frame rate and the scanning rate are higher than those of a traditional laser radar, and the morphology information of the measured object is measured at the micron-dimension longitudinal resolution.

Provided are a spectacle lens 1 and related features, wherein the spectacle lens 1 is provided with a lens base material with an optical surface and an anti-reflective film coating the optical surface of the lens base material, the anti-reflective film has a multilayer structure including a low refractive index layer and a high refractive index layer layered on each other, the anti-reflective film is provided with a reactive layer that has relatively higher reactivity to ultrashort pulse laser irradiation than the other layers included in the anti-reflective film, and a marking 2M is applied in a cut lens-like shape in a material removal area formed by at least partially removing one or more specific layers including a topmost layer of the multilayer structure, wherein in the marking, the material removal area is visible due to visible light as a result of exposure of the high refractive index layer below the reactive layer or exposure of the reactive layer having partially remained.

The invention belongs to the technical field of laser, and discloses a method and system for generating mid-infrared laser based on soliton self-frequency shift, and the method comprises the steps: obtaining a 2 [mu] m ultrashort pulse laser pumping source, a forward pumping source and a reverse pumping source; coupling the obtained 2-micron ultrashort pulse laser pumping source and the forward pumping source to a first end of a gain fiber, and coupling the obtained reverse pumping source to a second end of the gain fiber; adjusting the ratio of the pumping power of the forward pumping source in the first end of the gain optical fiber to the pumping power of the reverse pumping source in the second end of the gain optical fiber, and exciting the 2-micron ultra-short pulse laser pumping source in the gain optical fiber to generate soliton self-frequency shift to obtain wide-spectrum ultra-short pulse laser; and inputting the broad-spectrum ultrashort pulse laser into a filter for wavelength filtering treatment to obtain 2.8 [mu] m intermediate infrared laser. By adjusting the pumping power of the pumping sources at the two ends of the gain fiber, various different soliton self-frequency shift effects can be obtained.

A method for processing glass elements is provided. The method includes introducing a perforation line for parting a glass element introduced into the glass element during or after a hot processing process at an elevated temperature of at least 100° C. Spaced-apart filamentary flaws are introduced into the glass element along the predetermined course of the perforation line by a pulsed laser beam of an ultrashort pulse laser, and, during or after the introduction of the filamentary flaws, the glass element is cooled down so as to produce a temperature gradient, which induces a mechanical stress at the filamentary flaws, whereby the breaking force required for parting the glass element along the perforation line is reduced.

The invention provides a controllable processing method for a photoetching single crystal optical fiber multi-ring cladding based on femtosecond laser and a multi-ring mask plate. The technical bottlenecks that in the prior art, the processing efficiency is low, the processing length is limited, and the structural precision is insufficient are effectively solved. The core of the method is that high-energy ultrashort pulse laser generated by a femtosecond laser is combined with a spatial light modulation technology of a programmable multi-ring mask plate to generate multi-layer femtosecond laser spots in specific annular distribution. Micron-scale focusing of multi-ring femtosecond laser beams can be achieved through a precisely-designed optical system, and precise spatial selective refractive index modulation is achieved on the cross section of the single-crystal optical fiber. Compared with a single-crystal optical fiber with a single-multi-ring annular cladding structure, the multi-ring annular cladding structure can further enhance the suppression capability of the multi-ring annular cladding structure on a high-order mode, realizes flexible regulation and control of a light wave transmission mode field, effectively reduces the influence of a multi-mode interference problem in the single-crystal optical fiber on the signal quality, and improves the signal quality. The stability of signal transmission and the quality of sensing signals are improved, and the application requirements of different scenes are met.

The invention relates to the technical field of wafer laser cutting, and provides a dual-laser synchronous coaxial modified stripping device and a dual-laser synchronous coaxial modified stripping method.The dual-laser synchronous coaxial modified stripping device comprises a mobile platform, a first pulse laser system, a second pulse laser system and a pulse delay regulation and control system; the moving platform can move the to-be-stripped part along a plurality of different directions; the first pulse laser system emits ultrashort pulse laser to the to-be-stripped part through a first light path, so that an initial modified layer is formed in the to-be-stripped part; the second pulse laser system synchronously emits continuous laser to the to-be-stripped part through a second light path, so that the initial modified layer is heated to form a cracked complete modified layer; the pulse delay regulation and control system is arranged in the first light path and used for regulating and controlling the pulse delay of the first pulse laser system. The latter can be suitable for the former, the stripping efficiency of the semiconductor crystal ingot can be improved, and quality stripping is improved.

A method for manufacturing an optical member, and a related technique, the method including: applying desired laser processing to an anti-reflection film formed to coat an optical surface of an optical base material and having a multilayer structure including laminated layers of a low refractive index layer and a high refractive index layer, by irradiating the anti-reflection film with ultrashort pulse laser; and partially removing a predetermined layer including an outermost layer of the multilayer structure, the ultrashort pulse laser having a pulse width of 10 femtoseconds or more and less than 100 picoseconds, the anti-reflection film including a reactive layer that is relatively more reactive to irradiation with the ultrashort pulse laser than other layers included in the multilayer structure, wherein the reactive layer is subjected to the laser processing so as to be visually recognizable by visible light by being at least partially removed.

The invention relates to the technical field of laser splitting, and provides a dual-laser synchronous coaxial modified stripping device which comprises a mobile platform, a first pulse laser system, a second pulse laser system and a pulse delay regulation and control system, the moving platform can move the to-be-stripped part along a plurality of different directions; the first pulse laser system emits ultrashort pulse laser to the to-be-stripped part through a first light path, so that an initial modified layer is formed in the to-be-stripped part; the second pulse laser system synchronously emits continuous laser to the to-be-stripped part through a second light path, so that the initial modified layer is heated to form a cracked complete modified layer; the pulse delay regulation and control system is arranged in the first light path and comprises a plurality of regulation and control parts which are arranged in the first light path at intervals in the same straight line direction; and the plurality of regulation and control parts are used for enabling the ultrashort pulse laser irradiated in the pulse delay regulation and control system to form at least two different optical path differences, and mutually interfere in the pulse delay regulation and control system to form pulse delay.

The invention relates to a device and method for testing a deep ultraviolet laser damage threshold of an element, and the device comprises a first laser module which is set to emit deep ultraviolet laser; the second laser module is set to emit ultrashort pulse laser with the same light spot size as that of the first laser module; the beam combining module is arranged to enable the laser emitted by the first laser module and the laser emitted by the second laser module to be coaxial and emit the modulated laser to a test element; the detection module comprises a first detection unit and a second detection unit which are used for detecting light beam energy, the first detection unit is arranged on a light path of the beam combining module and the test element, and the second detection unit is arranged in a light path penetrating out of the test element; and the control module is respectively connected with the first laser module and the second laser module and is used for controlling laser energy emitted by the first laser module and the second laser module and determining a deep ultraviolet laser damage threshold value of the test element according to information sent by the first detection unit and the second detection unit.

The utility model relates to an acousto-optic mode locker capable of improving working frequency and diffraction efficiency, and belongs to the field of photoelectrons. The acousto-optic mode locker comprises an acousto-optic medium which adopts a quartz crystal, the X axis of the quartz crystal serves as an ultrasonic transmission direction, the Y axis serves as a light transmission direction, and the Z axis serves as an optical axis and is perpendicular to the light transmission direction; two parallel polished surfaces are arranged in the X-axis direction of the quartz crystal, one polished surface serves as a sound transmission surface, a welding layer is arranged on the sound transmission surface, a transducer is mounted on the welding layer, and a surface electrode is arranged on the transducer; and the other polished surface is used as an ultrasonic reflecting surface. Fused quartz is replaced by the high-purity quartz crystal, and the tangential direction of the quartz crystal is optimized, so that the influence of the optical rotation of the quartz crystal on the mode-locked laser is reduced to the minimum. The sound wave attenuation coefficient of the quartz crystal is lower, and the acousto-optic merit figure is higher, so that the working frequency and diffraction efficiency of the acousto-optic mode locker can be greatly improved, and the development requirement of an ultra-short pulse laser towards a smaller size is met.

The present invention provides a design method for a deep-groove ohmic contact with high thermoelectric performance based on micro-jet laser technology, which relates to the technical field of semiconductor power devices. The method comprises: a high-thermoelectric-performance deep-groove ohmic contact structure is obtained by a micro-jet laser etching process using an ultrashort pulse laser; a micro-jet laser etching process based on an ultrashort pulse laser precisely etches a positioning area to achieve a deep-groove flow channel that meets the thermal management performance requirements of the microchannel and is compatible with subsequent device processes and research requirements. The method combines a capacitance-voltage ring diode measurement unit prepared using a hard mask process and a thick photoresist process, a transmission line model measurement unit prepared using a hard mask process or a thick photoresist process, and a time-domain thermal reflection measurement unit prepared using a chemical mechanical polishing process to achieve an optimized iterative study of the thermoelectric characteristics of a high-thermoelectric-performance deep-groove ohmic contact structure, thereby achieving a high-thermoelectric-performance deep-groove ohmic contact.

The invention provides an RB-SiC polished surface pressure stress strengthening device and an implementation method thereof, and the method comprises the following steps: a femtosecond laser generates an ultrashort pulse laser beam, and the ultrashort pulse laser beam passes through an optical shutter, a beam expander, a laser power attenuator, a reflector, a scanning galvanometer and an F-theta mirror and is finally focused on the surface of an RB-SiC sample. The RB-SiC sample is fixed on an XY displacement platform, the XY displacement platform and a Z axis are adjusted, and laser is focused on the to-be-irradiated surface of the RB-SiC sample; introducing high-pressure and high-speed nitrogen to protect the surface of the sample; a laser scanning path, a scanning speed and scanning times are designed, laser pulse frequency and average power of light emitted by a femtosecond laser and an attenuation coefficient of a laser power attenuator are set, so that laser single pulse energy density is slightly lower than an ablation threshold value of the sample under laser and scanning parameter setting, and finally, laser irradiation on the surface of the RB-SiC sample is started. Pressure stress strengthening can be achieved on the RB-SiC polished surface after sub-ablation threshold femtosecond laser irradiation, and the fatigue strength of a workpiece made of the RB-SiC material can be improved.

The invention provides an ultrashort pulse laser ceramic grading method and equipment for realizing the method. The method comprises the following steps: a) adopting an ultrashort pulse laser beam which is generated by a specific SESAM passive mode-locking seed laser and a regenerative amplifier and has the pulse width of 1-15 ps and the monopulse energy of 10 mu J-1 mJ; b) focusing the ultrashort pulse laser beam into a processing light spot with the light spot diameter of 5-50 microns through a light beam shaping transmission module; c) controlling the focused laser beam to perform grain-dividing path processing on the surface of the ceramic workpiece at a scanning speed of 10-1000 mm / s to realize grain-dividing joint cutting with a depth-to-width ratio of more than 10: 1; according to the method, the energy difference between single pulses is smaller than or equal to + / -2%, the difference of peak power between the pulses is smaller than or equal to + / -3%, and the method is stable in working performance, high in consistency, short in action time / low in damage and high in machining precision.

The present invention relates to a method and apparatus for processing a workpiece (4), in particular to a method and apparatus for imprinting an anti-glare function through a laser pulse (100) of a laser (1), wherein the apparatus comprises: a laser (1), in particular a short pulse laser or an ultrashort pulse laser, configured to provide a laser beam (10) including a laser pulse (100); a first diffusion lens (2) and a second diffusion lens (2'), each configured to scatter the laser beam (10) and imprint a locally randomized intensity distribution on the laser beam (10) at a focal plane (12), wherein the first diffusion lens (2) and the second diffusion lens (2') sequentially scatter the laser beam (10); and at least one optical focusing system (3) configured to focus the laser beam (10) onto a focal area (120) within a focal plane (12) on the workpiece (4), wherein the laser beam (10) is applied to the workpiece (4) and consequently the workpiece is processed. The invention includes a progression device (5) configured to move a laser beam (10) and a workpiece (4) by one step (V) relative to each other, wherein the progression device includes a scanner device (50) having a first scanner element (500) and a second scanner element (502), the movement of the scanner elements (500, 502) generates one step, the second scanner element (502) includes a second diffusion lens (2'), and the movement of the scanner elements changes a locally randomized intensity distribution.

The invention discloses an ultra-short pulse laser welding method for a YAG crystal and a metal heat sink, and belongs to the field of ultra-short pulse laser welding. The invention aims to overcome the defect that the existing YAG crystal and metal heat sink connection process cannot integrate effective heat transfer of an interface, low connection stress and high production efficiency at the same time. The method comprises the steps of 1, pretreatment; 2, assembling a to-be-welded part; and thirdly, ultrashort pulse laser welding is conducted. The ultra-short pulse laser welding method is used for ultra-short pulse laser welding of the YAG crystal and the metal heat sink.

The invention belongs to the technical field of acoustic lenses, and discloses a high-frequency vortex sound field lens which comprises a stainless steel sheet substrate, the center area of the substrate is a solid area, and a periodic spiral line hollow structure is formed on the periphery of the solid area through laser processing; the area where the spiral line hollow structure is located allows sound waves to pass without shielding, and the solid area blocks sound wave propagation. The ultra-short pulse laser micromachining technology is adopted, the spiral line hollowed-out structure with the screw pitch, the line width and the spiral angle strictly matched with the high-frequency sound wave wavelength can be accurately etched in the surface of the stainless steel sheet, the spiral phase gradient is accurately constructed through the acoustic impedance difference of hollowed-out area conduction-solid area blocking, and the spiral phase gradient is accurately measured. The problem of phase error amplification under high frequency is effectively suppressed, the orbital angular momentum transfer efficiency is improved to 90% or above, and stable generation of a high-frequency vortex sound field is successfully realized.

This system is directed to an orbital angular momentum generator which can include an AOD; a beam shaping optic assembly; a log-polar optic; a Fourier lens; and, wherein the orbital angular momentum generator is configured to produce pulse shaping according to the application of a quadratic waveform chirp that corresponds to one or more OAM modes. The system can include an ultrashort pulsed laser; a log-spiral transformation assembly; an AOD; an ellipse generator; a λ / 2 plate; and, wherein the optical system is configured to provide for multiple coherent spiral beams with control of amplitude and relative phase. The system can include an ultraviolet orbital angular momentum generator comprising: a femtosecond pulsed laser; a crystal configured to provide a collinear phase-matching; and can provide a UV OAM source for imaging with high resolution and quantum information. The AOD can be replaced with a scanning mirror and configured to add a linear phase gradient.

The application provides a manufacturing method of glass direct copper clad circuit, relates to the technical field of microelectronic circuit manufacturing, and comprises the following steps: S01, copper foil surface planarization: the copper foil is adhered to a UV photosensitive adhesive film, and the surface of the adhered copper foil is ground; after the surface of the copper foil is ground to reach a target roughness, the copper foil is cleaned and dried; S02, laminated static pressure: a glass substrate, the UV photosensitive adhesive film with the adhered copper foil and a carrier plate are sequentially laminated and fixed, vacuum is drawn and sealed, static pressure is applied to the formed sealed body, and a structure to be welded is obtained; and S03, laser selective welding: an ultrashort pulse laser and a short pulse are combined, and multiple compound scans are performed by using an energy gradient, so that the problem that an interface gap cannot be effectively reduced and the interface is easy to be ablated when a laser is used for welding to manufacture a glass copper clad circuit is solved, and the interface fusion capacity between the copper foil and the glass is improved.