54results about How to "Poor precision" patented technology

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

An exemplary embodiment of portable electronic device with guide function includes a housing, a processing unit, a command unit, and a guiding unit. The processing unit and the guiding unit are positioned inside the housing, and the command unit is positioned at least partially outside of the housing. The processing unit is electrically connected to the command unit and the guiding unit. Operating the command unit, the portable electronic device with guide function is actuated into guiding mode controlled by the processing unit. The guiding unit sends detection signals to detect obstacles, receives feedback signals from the obstacles, the processing unit receives the feedback signal from the guiding unit to generate corresponding obstacle types and distance according to the feedback signal.

The present invention corrects the insufficient peripheral light amount due to the lens shading and correcting the non-uniformity of light amount at the periphery due to a distortion resulting from a precision of the lens or a poor mounting precision of the lens. A peripheral light amount correction circuit is structured by an image synchronization signal generation circuit, a coordinate conversion circuit and a luminance value correction computing circuit. An integrated value of luminance values is calculated at the coordinate conversion circuit to extract light amount information. Coordinate values to be input to the luminance value correction computing circuit are generated based on an integrated / averaged value of the light amount information. In the luminance value correction computing circuit, peripheral light amount correction functions are converted based on the input coordinate values from the coordinate conversion circuit to perform appropriate correction on the input image.

A method and apparatus for resetting a valve lift for use in an engine brake. A brake piston (160), and a hydraulic fluid passage (214) are arranged within a rocker arm (210) or a valve bridge (400) of an engine. A resetting valve arranged between the rocker arm (210) and the valve bridge (400) is driven by a change in the distance between the rocker arm (210) and the valve bridge (400). When the valve lift of an engine exhaust valve (300) reaches a maximum, a reset fluid passage (219) is opened, the hydraulic pressure within the hydraulic fluid passage is released, the brake piston (160) is reversed by one interval, the motion transmission between a cam (230) and the engine exhaust valve (300) is partially disengaged, and the valve lift of the engine exhaust valve (300) is reduced. Also, during a returning process of the valve lift of the engine exhaust valve (300) after reaching the maximum position, repositioning of the reset valve is used to maintain a supply of pressure within the hydraulic fluid passage, the brake piston (160) is allowed to be positioned at an extended position, and the motion transmission between the cam (230) and the engine exhaust valve (300) is resumed. The apparatus for resetting the valve lift can be integrated within an engine exhaust valve brake, and is structurally simple, convenient to install and to adjust, thereby improving safety and reliability.

The present invention relates to a method for analysing the amount of free gas within a pharmaceutical sample. According to the invention the method comprises the following steps: providing a sample before an irradiating source; irradiating the sample with at least one beam of electromagnetic radiation; detecting radiation emitted through the sample and generating signals corresponding to the amount of free gas in the sample, and correlating the generated signals to at least one solid state parameter of the sample.

A target value that serves as a control value with feed forward control is optimized. A TL performs a feed forward and a feedback control of a PM. A storage unit stores a plurality of recipes indicating different processing sequences, and a target value that serves as a control value when performing an etching process. A communication unit causes an IMM to measure a processing state of the wafer and receives measurement information. A computation unit computes a feedback value for the current wafer processed in the current cycle, based on pre-processing and post-processing measurement information for the wafer. An update unit updates the target value using the feedback value. A recipe adjustment unit changes the recipe to change the process performed in the same PM. When the process is performed after changing, the updated target value is used to perform feed forward control of the wafer in the same PM.