The invention discloses a thick 
copper sandwiched 
aluminum substrate manufacturing method, which comprises the following steps: (1) making an 
aluminum substrate: opening a material, pre-drilling, dry or wet film sticking, exposing, developing, 
etching, hole drilling, AOI testing, 
browning, and 
pairing; (2) making an upper board and a lower board: opening the material, dry or wet film sticking, exposing, developing, 
etching, film removing, hole drilling, AOI testing, 
browning, and 
pairing; (3) and performing outer layer 
processing: pressing and fitting, drilling a target position hole, gonging plate edge, drilling a through hole, 
copper sinking / full plate 
copper plating, thickening copper, outer line wiring, 
etching lines, 
soldering, surface treating, secondary drilling, 
CNC milling, and process-post normal processes. The method pre-drills a hole on an 
aluminum substrate to prevent the 
short circuit between the copper clad layer and the aluminum base during drilling, thereby reducing the 
product defect rate and possessing good 
economic benefits.