The invention discloses a thick copper sandwiched aluminum substrate manufacturing method, which comprises the following steps: (1) making an aluminum substrate: opening a material, pre-drilling, dry or wet film sticking, exposing, developing, etching, hole drilling, AOI testing, browning, and pairing; (2) making an upper board and a lower board: opening the material, dry or wet film sticking, exposing, developing, etching, film removing, hole drilling, AOI testing, browning, and pairing; (3) and performing outer layer processing: pressing and fitting, drilling a target position hole, gonging plate edge, drilling a through hole, copper sinking/full plate copper plating, thickening copper, outer line wiring, etching lines, soldering, surface treating, secondary drilling, CNC milling, and process-post normal processes. The method pre-drills a hole on an aluminum substrate to prevent the short circuit between the copper clad layer and the aluminum base during drilling, thereby reducing the product defect rate and possessing good economic benefits.