The invention discloses a thick
copper sandwiched
aluminum substrate manufacturing method, which comprises the following steps: (1) making an
aluminum substrate: opening a material, pre-drilling, dry or wet film sticking, exposing, developing,
etching, hole drilling, AOI testing,
browning, and
pairing; (2) making an upper board and a lower board: opening the material, dry or wet film sticking, exposing, developing,
etching, film removing, hole drilling, AOI testing,
browning, and
pairing; (3) and performing outer layer
processing: pressing and fitting, drilling a target position hole, gonging plate edge, drilling a through hole,
copper sinking / full plate
copper plating, thickening copper, outer line wiring,
etching lines,
soldering, surface treating, secondary drilling,
CNC milling, and process-post normal processes. The method pre-drills a hole on an
aluminum substrate to prevent the
short circuit between the copper clad layer and the aluminum base during drilling, thereby reducing the
product defect rate and possessing good
economic benefits.