Thick copper sandwiched aluminum substrate manufacturing method
A sandwich aluminum substrate and a manufacturing method are used in printed circuit manufacturing, metal core circuit manufacturing, electrical components, etc., and can solve problems such as short circuits and scrap aluminum substrates, so as to avoid short circuits, reduce product defect rates, and achieve good economic benefits. Effect
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[0021] Such as figure 2 As shown, it shows a thick copper sandwich aluminum substrate, the structure is: L2-3 layer (upper sub-board) and L6-7 layer (lower sub-board) are FR4 sheet material, Tg180, thickness 0.25±0.038mm (no Contains copper), copper thickness H / Hoz; L4-5 layer (aluminum substrate) is a double-sided aluminum-based core board, aluminum base 1.00mm, insulating dielectric layer thickness 0.08-0.10mm, copper thickness 5 / 5oz; between layers The bonding sheet medium is FR4 prepreg.
[0022] According to the characteristics of the sheet material and related process requirements and the production experience of the original printed circuit board, we have formulated a production process for the test board: daughter board L4-5 layer process: cutting material → etching isolation ring film → etching isolation ring → Drill target holes → Pre-drill holes → Resin plug holes → Grinding plate → Copper covering production → L4-5 layer circuit production → Line etching → Inspec...
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