6770results about How to "Reduce defective rate" patented technology

A method of encapsulating an organic electroluminescent (EL) device. The method includes applying a first sealant to a portion of an encapsulation plate facing a substrate to define one selected from a plurality of organic EL devices formed on the substrate, each including a first electrode layer, organic layers, and a second electrode layer. A space produced by the encapsulation plate and the first sealant and having an open face is filled with a second sealant. The substrate and the encapsulation plate are bonded together by applying pressure. The first sealant and the second sealant are then cured. The substrate and the encapsulation plate are cut into a plurality of independent organic EL panels.

A stacked semiconductor device includes a plurality of semiconductor chips and a conductive path extending through at least one of the semiconductor chips. The semiconductor chips are stacked together. The semiconductor chips are electrically connected by the conductive path, and the conductive path has a plurality of through-connections extending through the corresponding semiconductor chip.

An organic light-emitting display device includes a substrate, a plurality of pixel electrodes arranged in a matrix on the substrate, and an organic common layer covering the pixel electrodes. The pixel electrodes include a plurality of first pixel electrodes, a plurality of second pixel electrodes, and a plurality of third pixel electrodes. An n-th pixel column includes the second pixel electrodes and the third pixel electrodes arranged alternately, an (n+1)-th pixel column which is adjacent to the n-th pixel column includes the first pixel electrodes, and an (n+2)-th pixel column which is adjacent to the (n+1)-th pixel column includes the second pixel electrodes and the third pixel electrodes arranged alternately, wherein n is a natural number. One of the second and third pixel electrodes is disposed in the n-th pixel column in a row and the other one of the second and third pixel electrodes is disposed in the (n+2)-th pixel column in the same row.

The invention discloses a pharmaceutical product manufacturing execution system and method. The method includes connecting a manufacturing execution system function server and a manufacturing execution system database server to an upper-level management terminal through an industrial loop network; allowing the manufacturing execution system function server to perform data exchange with a production management terminal through the industrial loop network; allowing the production management terminal to connect to a bottom procedure controller through the industrial loop network; allowing the production management terminal to receive a production planning instruction from the upper-level management terminal, divide the production planning instruction into a production instruction and a material list and transmit the production instruction to the bottom procedure controller, and allowing the bottom procedure controller to control corresponded production procedures and acquire staff producing operation information and corresponded equipment information. The method has the advantages that the corresponded material is encoded correspondingly and respectively, the workshop producing material data management and tracking are implemented, the statistical graph and report support is provided, and the material management is simplified.

The invention provides a high-frequency coil structure which can produce six silica cores and other crystal materials simultaneously, relating to the technical field of high-frequency coils. The high-frequency coil structure comprises a radial shunt trough (14) which is used for diversion of current (15), and six internal holes (8), wherein, one internal hole is arranged at the middle part and other five internal holes are uniformly distributed around the middle internal hole in a petal-shape; an inclined opening (13) at one side of a copper pipe A(11) for conveying current and cooled water and a copper pipe B(12) for conveying current and cooled water is connected and communicated with the middle internal hole; the radial shunt trough extends out from the middle internal hole to a position between every two internal holes except the inclined opening; the inclined opening is connected with the middle internal hole; and the radial shunt trough is radially distributed between every two peripheral internal holes by the middle internal hole, thus leading the current to uniformly run by surrounding the six internal holes under the shunt effect of the shunt trough during the running process and achieving the objects that the current is uniformly distributed around the six internal holes.

An organic electro-luminance display device includes a first substrate including a plurality of sub-pixels, a first electrode on the first substrate, a buffer layer on the first electrode of a region that partitions each of the sub-pixels, a spacer on the buffer layer, the buffer layer and the spacer being integrally formed, an organic light-emitting layer on the first electrode that corresponds to each of the sub-pixels and the spacer, and a second electrode on the organic light-emitting layer.

The invention discloses a high-frequency coil structure capable of simultaneously producing seven silicon cores and other crystalline materials, and relates to the technical field of the high-frequency coils. The high-frequency coil structure comprises a radial splitter box (14) for guiding current (15), and seven inner bores (8) one inner bore of which is arranged at the middle part of the high-frequency coil and six inner bores of which are evenly distributed around the inner bore at the middle part in a petaline shape; an oblique opening (13) arranged on one side of a current delivery and cooling water delivery copper pipe A(11) and a current delivery and cooling water delivery copper pipe B(12) is in through connection with the inner bore at the middle part; and the radial splitter box extends outwards to the position between every two inner bores except for the oblique opening from the inner bore at the middle part. The oblique opening is connected with the inner bore at the middle part, and the radial splitter box is radially distributed at the position between every two peripheral inner bores by the inner bore at the middle part, which causes the current to evenly surround the seven inner bores for running under the current splitting action of the splitter box while the current is running, thus realizing the purpose that the current is evenly distributed around the seven inner bores.

The invention discloses a high-frequency coil structure capable of simultaneously producing eight silicon cores and other crystalline materials, and relates to the technical field of the high-frequency coils. The high-frequency coil structure comprises a radial splitter box (14) for guiding current (15), and eight inner bores (8) one inner bore of which is arranged at the middle part of the high-frequency coil and seven inner bores of which are evenly distributed around the inner bore at the middle part in a petaline shape, an oblique opening (13) arranged on one side of a current delivery and cooling water delivery copper pipe A(11) and a current delivery and cooling water delivery copper pipe B(12) is in through connection with the inner bore at the middle part; and the radial splitter box extends outwards to the position between every two inner bores except for the oblique opening from the inner bore at the middle part. The oblique opening is connected with the inner bore at the middle part, and the radial splitter box is radially distributed at the position between every two peripheral inner bores by the inner bore at the middle part, which causes the current to evenly surround the eight inner bores for running under the current splitting action of the splitter box while the current is running, thus realizing the purpose that the current is evenly distributed around the eight inner bores.

A shower head includes a main body seal seat fixed to a main body. The main body seal seat is fitted in a rotation seat in a rotation way and located above a cover seal seat. The cover seal seat is fixed to a cover unit. The joint of the main body seal seat and the rotation seat has a groove to receive a first seal ring. The main body seal seat has at least one water inlet. The water inlet is provided with a spring and a second seal ring therein. The spring is located between the second seal ring and the water inlet of the main body seal seat. The cover seal seat has at least one through hole corresponding in position to the water inlet. The cover unit has at least one water outlet.

The invention relates to a honeycomb flue gas denitrification catalyst and a preparation method thereof, belonging to the technical field of inorganic new materials. The honeycomb flue gas denitrification catalyst is mainly prepared by carrying out extrusion molding and sintering on the following raw materials in parts by weight: 68-92.8 parts of nano TiO2, 3-10 parts of nano SiO2, 2-10 parts of glass fiber, 0.1-0.5 part of extrusion aid, 0.1-0.2 part of carboxymethyl cellulose, 0.1-0.3 part of polyoxyethylene and 0.1-0.2 part of sesbania powder. The preparation method comprises the following steps: (1) weighing the nano TiO2 and nano SiO2 powder, adding the extrusion aid, adding water while stirring to obtain paste, and adding ammonia water to regulate the pH value to 7-11; (2) adding the rest of raw materials, evenly mixing, and extruding with an extruding machine to obtain a honeycomb blank; (3) drying the blank at 30-70 DEG C under the relative humidity of 20-100% for 7-15 days; and (4) calcining the dried blank at 250-300 DEG C for 8-15 hours, calcining at 380-420 DEG C for 5-10 hours, and calcining at 580-620 DEG C for 8-12 hours to obtain the finished product.

An object of the invention is to provide a preparation process of a semiconductor wafer, in which breakage of the wafer on grinding the back surface of the wafer and on peeling the adhesive tape is prevented, and the operation time can be reduced. The preparation process of a semiconductor wafer comprises the steps of: adhering an adhesive tape on a front surface of a semiconductor wafer; grinding a back surface of the semiconductor wafer by a grinding machine; peeling the adhesive tape; and cleaning the front surface of the semiconductor wafer, wherein an adhesive tape having heat shrinkability is used as the adhesive tape, and after grinding the back surface of the semiconductor wafer, warm water at a temperature of from 50 to 99 DEG C. is poured to peel the adhesive tape in a wafer cleaning machine, and the front surface of the semiconductor wafer is cleaned in the wafer cleaning machine.

An optical sheet includes a base film in which light is incident from a lower side, a plurality of prism patterns and a diffusion member. The prism patterns are protruded to be spaced apart from each other on the base film to enhance the front luminance of light incident from the lower side of the base film. The diffusion member is disposed between prism patterns to have a diffusion surface in parallel with the base film. The diffusion member includes a plurality of diffusion dots capable of enhancing the luminance uniformity of light incident from the lower side of the base film. Thus, front luminance and luminance uniformity may be enhanced due to a juxtaposition of the prism patterns and the diffusion portion, and the viewing angle of the LCD device may be enhanced.

A pressure sensor (30) for sensing a fluid pressure in harsh environments such as the air pressure in a tire, by using a first wafer substrate (32) with a front side and an opposing back side, a chamber (58) partially defined by a flexible membrane (50) formed on the front side and at least one hole (33) etched from the back side to the chamber (58);

• • a second wafer (31) on the back side of the first wafer (32) to seal the at least one hole (33); wherein,
  • the chamber (58) containing a fluid at a reference pressure, such that the flexible membrane (50) deflects due to pressure differentials between the reference pressure and the fluid pressure; and,
  • associated circuitry (34) for converting the deflection of the flexible membrane (50) into an output signal indicative of the fluid pressure; wherein,
  • the second wafer (31) is wafer bonded to the first wafer substrate (32). Wafer bonding offers an effective non-adhesive solution. It provides a hermetic seal with only minor changes to the fabrication procedure. Skilled workers in this field will readily understand that the most prevalent forms of wafer bonding are: direct wafer, or silicon fusion, bonding; anodic, or electrostatic Mallory process bonding; and, intermediate layer bonding.

The invention relates to a structure using graphite alkene as buffer layer epitaxy GaN (gallium nitride) and a preparation method of the structure. The method comprises the following steps of: adopting a graphite alkene layer as a buffer layer between the substrate and a gallium nitride epitaxy layer; and inserting a nitride thin layer between the graphite alkene layer and a GaN layer so as to obtain a gallium nitride epitaxy layer with low stress and high quality. The defective rate of LED (light emitting diode) devices is reduced, the quality of the LED devices is increased, and the life cycle is prolonged. The problem of lattice mismatch and thermal expansion coefficient mismatch between the substrate and the gallium nitride are solved effectively.

An electronic cigarette is provided, and the electronic cigarette comprises an outer sleeve, a battery and a controlling module both mounted inside the outer sleeve; the electronic cigarette further comprises a mounting seat which the controlling module is mounted on, and an electrode terminal mounted on the mounting seat and electrically connected to the controlling module; an end of the electrode terminal, aloof from the controlling module, is connected to a conductive wire by soldering. By implementing the electronic cigarette in the present application, the following advantages can be achieved. The electronic cigarette adopts that the conductive wire is soldered on the first electrode terminal, the second electrode terminal or the third electrode terminal, so that the conductive wire is electrically connected to the controlling module, and soldering operation can be easily achieved, which can improve production efficiency of the electronic cigarettes and decrease product defective rate.

Provided is a cutting equipment for automatically cutting off workpieces from a material tape. The cutting equipment includes an electrical control box, a base board, a material-feeding mechanism, a material-transferring mechanism, a material-pulling mechanism and a cutting mechanism. The material-feeding mechanism includes a supporting bracket, a material disc and a disc-driving device. The material-transferring mechanism mounted on the base board includes a pad board, a first supporting board and a second supporting board. The material-pulling mechanism disposed above the material-transferring mechanism includes a driving component and a material-pulling component. The cutting mechanism mounted on the base board includes a lower supporting plate, an upper cutting plate and a transferring cylinder. The upper cutting plate disposes at least one cutting blade. The cutting equipment can enhance the working efficiency, reduce the defective rate and the manufacture cost, lighten the labor intensity of operators, and be suitable for mass production.

The invention relates to a package machine of a cylindrical battery roll core, comprising a stander, a work table, a driving system and an electric control system. The work table is provided with a roil core inputting device, a shell inputting device and a roil core package machine which are driven by the driving system and controlled by the electric control system; and the roil core package machine comprises a shell positioning mechanism, a shell conveying mechanism and a roil core conveying mechanism. The roil core package machine is controlled by the electric control system to be capable for conveying the shell conveyed by the shell input device into the shell positioning mechanism, is fixed by the shell positioning mechanism, and conveys the roil core conveyed by the roil core input device into the fixed shell, so as to realize the work procedure of automatic package, and greatly improve the work efficiency of package. The invention further discloses a roil core shaping device, a circumference positioning device, a cathode ear bending device, a lower insulating sheet conveying device and an upper insulating sheet conveying device, which are corresponding to the work proceduressuch as roil core shaping, circumference positioning, cathode ear bending, lower insulating sheet inputting, upper insulating sheet inputting, etc.

The invention relates to a metal material high-energy-beam additive/subtractive material and on-line laser ultrasonic detection composite processing method and belongs to the field of metal material additive/subtractive composite manufacturing (3D printing). The processing method includes the following steps: S1) additive moulding: performing layer-by-layer fusion/solidification stacking with a high-energy-beam fused metal material according to a predetermined route; S2) subtractive processing: performing subtractive processing to the deposited and shaped material to prepare a detection plane having high size-precision and surface quality; S3) laser ultrasonic detection: carrying out laser ultrasonic nondestructive detection on the surface to determine whether defects exist on the surface of or in interior of the material and determine the positions of the defects; and S4) detection determination and treatment: removing excessive surface or subsurface defects through subtractive processing, and adjusting an additive process to perform additive deposition until the whole metal component is completed, and if no defect exists, directly completing the on-line detection and performing high-quality work piece shaping circularly and repeatedly. The method solves a problem that a process of single additive manufacturing of components cannot achieve on-line detection and repair, and can reduce defection rate of products and save cost.