The invention relates to the technical field of
electronic materials, in particular to a preparation method of low-
halogen alkali-soluble photosensitive resin and solder
resist ink. Comprising the following steps: adding amino resin,
alcohol olefin and a catalyst A into a
solvent, mixing, and carrying out an
ether exchange reaction to obtain an initial etherified product; adding
peroxide into the initial etherification product, and carrying out epoxidation reaction to obtain an
epoxy resin intermediate; adding an olefine acid compound, a catalyst B and a
polymerization inhibitor into the
epoxy resin intermediate, and carrying out ring-opening
esterification reaction to obtain an
epoxy acrylate intermediate; and adding
acid anhydride into the
epoxy acrylate intermediate, and carrying out
carboxylation reaction to obtain the low-
halogen alkali-soluble photosensitive resin. The problem of high
halogen content of the existing alkali-soluble photosensitive resin is solved, and the solder
resist ink prepared from the alkali-soluble photosensitive resin has high sensitivity,
high resolution,
high heat resistance, high acid and alkali resistance and high electrical insulation property.