The invention discloses a
copper surface micro-
etching coarsening solution for a fine circuit as well as a preparation method and application of the
copper surface micro-
etching coarsening solution, and relates to the technical field of
printed circuit board manufacturing. The
copper surface micro-
etching coarsening solution for the fine circuit is prepared from, by
mass concentration, 60 g / L to 100 g / L of
sulfuric acid, 40 g / L to 60 g / L of
hydrogen peroxide, 0.5 g / L to 2 g / L of
zinc sulfate, 10 g / L to 30 g / L of copper ions, 0.5 g / L to 1 g / L of
pyridine heterocycle-containing
Schiff base, 10 g / L to 100 g / L of ethyl
alcohol, 1 g / L to 3 g / L of 2-
mercaptobenzothiazole, 1 g / L to 5 g / L of
methionine and 1 g / L to 5 g / L of
polyacrylamide. According to the copper surface micro-etching coarsening solution, the 2-
mercaptobenzothiazole and the
methionine in the copper surface micro-etching coarsening solution can enable the copper surface to form a
honeycomb structure under the low micro-etching amount, the
zinc sulfate and the
pyridine heterocyclic ring-containing
Schiff base can form a
composite film layer with copper ions on the surface of the
honeycomb structure, and the interlayer
binding force is improved.