The invention belongs to the technical field of
copper-clad plate materials, and relates to a high-speed high-frequency low-CTE
copper-clad plate glue solution as well as a preparation method and application thereof, the
copper-clad plate glue solution comprises 55-135 parts of a resin composition, 2.5-21 parts of a cross-linking agent, 0.05-1.5 parts of a cross-linking
accelerant, 11-54 parts of filler and 38-95 parts of a
solvent; the resin composition is prepared from 25 to 45 parts of polyerylene resin, 15 to 35 parts of
styrene-butadiene
polymer, 15 to 30 parts of bismaleimide and 10 to 25 parts of allyl-terminated
polyphenyl ether resin. According to the invention, Dk and Df meet the requirement of ultra-low loss and are greatly improved compared with the traditional PPO
system, and meanwhile, the Z-axis CTE is reduced by more than 40%; the
halogen-free
flame-retardant design meets the environment-friendly requirement, and the high-frequency performance is not influenced; and a standard PCB
processing technology is compatible, and the copper-clad plate suitable for 5G
millimeter wave communication, automatic driving
radar and
satellite high-frequency circuits is prepared.