144 results about "Low dissipation" patented technology

A halogen-free resin composition includes (A) 100 parts per hundred resin of epoxy resin; (B) 1 to 100 parts per hundred resin of benzoxazine resin; (C) 1 to 100 parts per hundred resin of styrene-maleic anhydride; (D) 0.5 to 30 parts per hundred resin of amine curing agent; and (E) 5 to 150 parts per hundred resin of halogen-free flame retardant. The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Multilayer ceramic chip capacitors which satisfy COG requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as copper and copper alloys thereof may be used for internal and external electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a composite oxide formed by calcining rare earth titanates, barium titanate, together with other metal oxides such as MgO, CaO, ZnO, MnO₂, ZrO₂, SiO₂, Ga₂O₃, Nd₂O₃, Nb₂O₅, and Y₂O₃.

An infrared camera with lower dissipation power, a wide range of operating environment temperature, and a shorter warmup is provided. The infrared camera includes a plurality of device operating-temperature setting circuits setting respective device operating temperatures different from one another, a device operating-temperature setting switch for selecting one of the output of the device operating-temperature setting circuits, and a temperature sensor, and performs imaging by switching the connection target of the device operating-temperature setting switch according to a measurement by the temperature sensor, that is to say, according to the temperature inside an enclosure and selecting an operating temperature for an imaging device among a plurality of device operating-temperature settings.

Curable functionalized imide-linked polyimides compounds have been synthesized that have been found to possess very low dielectric constant and extremely low dissipation factor. These compounds also have a range of high to low modulus, extremely low moisture uptake and are very thermally stable. The combination of these materials in formulation along with functionalized polyethylene, polypropylene, polybutadiens have been found to be ideal for forming films and coatings for the microelectronic applications, multiplayer capacitors and interconnects, and high power cables and wire coatings. The addition of perfluorinated hydrocarbons, and POSS nanoparticles to the formulations have decreased the dielectric constant and dielectric dissipation factor further, and have also improved the flammability of the compositions.

A method of using nickeliferous laterite to reduce ferronickel directly in tunnel kiln relates to a method of reducing ferronickel. Comparing with high furnace smelting ferronickel and electric furnace smelting ferronickel having problems such as great invest, high manufacturing cost and produced ferronickel with high carbon content, the method of the invention is finished as: selecting nickeliferous laterite as material, the nickeliferous laterite contains 0.75-2.60% by weight of nickel, 8.00-55.0% by weght of iron; adding weight ratio of nickeliferous laterite and reductant as 1.00:0.25-0.55 into reducing pot, then putting the reducing pot in tunnel kiln, through preheating and stoving, heating reducing, cooling, taking off to get qualified reduced directly nickeliferous laterite. The invention selects natural nickeliferous laterite as material to reduce nickeliferous laterite, having advantages such as technology which easy to control, simple operation, low dissipation of energy, environment protection without pollution, low manufacturing cost, low installion cost and produced ferronickel with low carbon content.

The invention discloses a gas flow meter actual flow cycling detecting device and a detecting method thereof. A pipeline loop of the actual flow cycling detecting device is provided with a plurality of uniform voltage container sealing pots; a blower is arranged in the sealing pot; the air inlet of the blower penetrates out of the sealing pot to be connected with the upstream side of the pipeline loop; the air outlet of the blower is arranged in the sealing pot and the outlet of the sealing pot is connected with the downstream side of the pipeline loop; the sealing pot, a temperature controlling device, a testing system and a standard meter system are arranged in series. The invention effectively resolves the problem that the detecting condition is not consistent with the working condition to lead measurement error existing in the prior gas flow meter, breaks through the prior method which depends on a pipeline gas source or adopts compressor, has the advantages of small volume, low dissipation energy, high accuracy, and also has the characteristics of small investment, low noise, exchangeable gas and easy operation, is applicable to the testing of fuel gas and most industry gas and can be promoted and used in large range.

Laminates have at least one resin-system layer, a low dielectric, low dissipation factor bond core having at least one surface that is treated for adhesion, such as by etching, plasma or Corona discharge or mechanical roughing to facilitate bonding to the at least one resin system layer and a conductive metal cladding on the at least one resin system layer. The bond core can be a fluoropolymer film or a fluoropolymer prepreg, having at least one etched or Corona discharge treated surface. Alternately, the bond core can be a polyetherimide film or a polyetherimide prepreg, having at least one etched or Corona discharge treated surface. The laminates are used, for example, high performance, low loss printed circuit boards. The laminates have the desired dielectric properties inherent to fluoropolymer materials and can be produced using conventional printed circuit board manufacturing processes, materials, and equipment. Methods of producing laminates are disclosed.

This invention relates to a low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); or the mixture of (B) and (C), and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Because all of component (A) DCPD-PN, component (B) DCPD-PNE and component (C) DCPD-BX in this resin varnish composition contain a saturated multi-cyclic structure of dicyclopentadiene, the resin varnish shows lower dipole, dielectric constant (Dk), dissipation factor (Df) and moisture absorption; and via adding a brominated or phosphorus flame retardant, the composition exhibits high thermal stability characteristic. The copper clad laminates obtained in accordance with the invention meet not only the demand of low dielectric constant (Dk<4.0 @ 1 GHz) and low dissipation factor (Df<0.009 @ 1 GHz), but also possesses high heat stability and low moisture absorption characteristics, thus are widely applied to high-performance electronic materials.

The invention belongs to the technical field of a constructional material, in particular relates to building used mortar used for masonry and plastering of buildings and ground, and a preparation method thereof. The building mortar is characterized in that the building motor is prepared with a dry material and water though mixing according to the ratio of 1 to 0.03 to 0.35 by weight; the dry material is prepared with 60 to 80 percent of quartz sand, 7 to 30 percent of ground limestone, 1 to 20 percent of powdered industrial residue, 0.1 to 4 percent of land plaster, 0.1 to 8 percent of mineral admixture, and 0 to 0.1 percent of chemical additives by weight. The additive is any of or the mixture of a plasticizer and a gelatinizer at a discretionary ratio. The building mortar has the characteristics of low cost, high strength, and low dissipation of energy. The preparation method is operated easily.

A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

The present invention is a capacitor of a triphenyl phosphine oxide film as a base dielectric. More specifically, the base dielectric film is selected from the group consisting of Bisphenol-A (Bis-A PEPO). 4',4'-biphenol (BP-PEPO), and Hydroquinone (HQ-PEPO). TPPO based polymers have a very high breakdown strength, dielectric constant, low dissipation factor and high energy density. An ultra-thin coating can leverage the capabilities of this new dielectric, and potentially other commercial polymer films, to make possible energy storage in excess of 1 J/cc. The triphenyl phosphine oxide film can be fabricated containing a conducting PolyANiline (PAN) polymer layer located between the electrode and core polymer, or by being dip coated with PAN.

A resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 25 parts by weight of nitrogen and oxygen containing heterocyclic compound; (C) 5 to 75 parts by weight of polyphenylene oxide resin; and (D) 5 to 100 parts by weight of oligomer of phenylmethane maleimide. By using specific components at specific proportions, the resin composition of the invention offers the features of low dielectric constant and low dissipation factor and can be made into prepreg that may be used in printed circuit board.

Perfluoropolymer made without ionic species, initiator and without halocarbon solvent polymerization medium and dispersing agent is beneficially useful in liquid contact or food contact applications, for high-speed melt extrusion wire coating, and to produce insulated wire exhibiting low dissipation factor at high signal frequencies.

A resin composition, including (A) a polyimide resin; (B) a pre-polymerised maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerised maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

An ethylene-based polymer, e.g., LDPE, with a low dissipation factor is made by a process comprising the step of contacting at polymerization conditions ethylene and, optionally, one or more comonomers, e.g., an alpha-olefin, with at least one carbon-carbon (C—C) hydrocarbyl, free-radical initiator of Structure 1: wherein R₁, R₂, R₃, R₄, R₅ and R₆, are each, independently, hydrogen or a hydrocarbyl group and wherein, optionally, two or more R groups (R₁, R₂, R₃, R₄, R₅ and R₆) form a ring structure, with the provisos that at least one of R₂ and R₅, and at least one of R₃ and R₆ is a hydrocarbyl group of at least two carbon atoms, e.g., an alkaryl of at least seven carbon atoms.

The invention discloses a cymbal-shaped driver based on tangential deformation, which comprises a piezoelectric element, an upper metal elastomer and a lower metal elastomer. The piezoelectric element is in double-deck toroidal structure. The metal elastomer is in semi-cymbal shape. The upside of the piezoelectric element is connected with the bottom of the upper metal elastomer. The underside of the piezoelectric element is connected with the bottom of the lower metal elastomer. Signal input lines are connected between the double rings of the piezoelectric element. An earth wire is connected between the piezoelectric element and the upper metal elastomer; another earth wire is connected between the piezoelectric element and the lower metal elastomer. The invention also discloses a drive method of the cymbal-shaped driver. Regarding the driver, the traditional displacement driving power section and actuator are manufactured into one piece. The utility model has the advantages of large displacement, high rigidity, working safely, simple structure, compactness, minitype and thinness, light weight, low dissipation of energy, no noise, no electromagnetic interference, high precision and high resolution and so on, and is applicable for mechanical systems of optics and electronics and so on requiring precise displacement.

The invention belongs to the integrated circuit technical field, in particular to a mixed type double-layer folding circuit analog-to-digital converter. The invention consists of a single sample-hold circuit, a reference resistance string, premagnification, resistance offset averaging and twice interpolating circuit, a rough analog-to-digital converter, a folding circuit, an resistance eight-time interpolating circuit, a comparator and a code circuit, etc.; wherein, the folding circuit consists of an amplifying circuit and an outputting circuit and makes improvement of high-speed and low-dissipation to the amplifying circuit which comprises double-layer amplifying units which are same with the number being M and leads 3 multiplied by M pairs of differential input voltage to be amplified. In the invention, the consumption of the circuit is reduced greatly and the speed is raised greatly.

The present invention aims to provide a film having a high dielectric constant and a low dissipation factor. The high dielectric film of the present invention includes a vinylidene fluoride/tetrafluoroethylene copolymer (A) with a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 95/5 to 80/20. The film includes an β-crystal structure and a β-crystal structure. The ratio of the β-crystal structure is 50% or more.