The utility model discloses a release film for a
chip multilayer
ceramic capacitor, which comprises a base material layer provided with a
bearing surface and an inner surface opposite to each other along the
layer thickness, core parts arranged along the transverse direction, and folding side edges respectively arranged at two sides of the core parts; the core ultra-light release layer is arranged corresponding to the core parts of the
bearing surface and the inner surface; the side edge
coating is arranged corresponding to the folded side edge of the
bearing surface and is provided with first high-
viscosity glue strips arranged in the transverse direction and ultra-light release strips clamped between the first high-
viscosity glue strips; the second high-
viscosity adhesive tape is arranged corresponding to the folding side edge of the inner surface and is opposite to the ultra-light release strip along the
layer thickness direction; the side ultra-light release strips are adjacent to the second high-viscosity glue strip and are respectively arranged on two sides of the second high-viscosity glue strip; the first high-viscosity
adhesive tape and the core ultra-light release layer on the bearing surface are in a coplanar state or the first high-viscosity
adhesive tape and the second high-viscosity adhesive tape are in a fit state. By folding the edge of the
ceramic dielectric green film wrapped by the side edge and folding the edge outwards, the two surfaces of the falling broken film chips are effectively prevented from being fixed, and the
coating on the side edge adsorbs finer dust.