2498 results about "Ceramic capacitor" patented technology

A multilayer ceramic capacitor includes dielectric layers and internal electrode layers. Internal electrode layers adjacent to a first main surface define first main surface-side internal electrode layers, and internal electrode layers adjacent to the second main surface define second main surface-side internal electrode layers, first solid solution layers including a second metal as a solid solution is provided at interfaces between the first main surface-side internal electrode layers and the dielectric layers, the interfaces being in the first main surface-side internal electrode layers, and second solid solution layers including the second metal as a solid solution is provided at interfaces between the second main surface-side internal electrode layers and the dielectric layers, the interfaces being in the second main surface-side internal electrode layers. A concentration of the second metal in the second solid solution layer is higher than that of the second metal in the first solid solution layer.

A multilayer ceramic capacitor includes first, second, third, and fourth regions each adjacent to a corresponding one of end surfaces, a first middle region between the first and second regions, located closer to an outside of a multilayer body, and having higher coverage, a second middle region between the third and fourth regions, located closer to the outside of the multilayer body, and having higher coverage, a first sloped portion coupling the first region and the first middle region, a second sloped portion coupling the second region and the first middle region, a third sloped portion coupling the third region and the second middle region, and a fourth sloped portion coupling the fourth region and the second middle region.

A multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers including Ni laminated in a thickness direction. In the internal electrode layers, a width of an opposing portion is larger than a width of a lead-out portion. The element body portion includes first, second, and third regions in order from an inside to an outside in the width direction in each of a region from an end portion on one side of the lead-out portion in the width direction to the first side surface and a region from an end portion on another side of the lead-out portion to the second side surface. When grain sizes of dielectrics included in the first, second, and third regions are respectively defined as gr1, gr2, and gr3, a relationship of gr1<gr2<gr3 is satisfied.

The invention discloses a temperature and pressure sensor and a manufacturing method thereof, the temperature and pressure sensor comprises a support assembly formed by an inner support and a thermistor through an injection molding process, two pin copper wires of the thermistor are welded to an insertion piece of the inner support, and a plastic supporting structure wrapping the thermistor and the inner support is formed through injection molding; one end of a PIN needle of the terminal button is connected with an external plugging port; one end of a conductive circuit of the flexible wire board is respectively welded with the PIN of the ceramic capacitor and the insertion piece of the inner bracket, and the other end of the conductive circuit of the flexible wire board is welded with the other end of the PIN of the terminal button; a through hole is formed between the support assembly and the shell, a medium makes contact with the ceramic capacitor through the through hole, the ceramic capacitor transmits a pressure signal to the outside through the flexible wire board and the end button, the thermistor senses the temperature of the medium through the plastic supporting structure, and a temperature signal is transmitted to the outside through the inserting piece, the flexible wire board and the end button. The thermistor is effectively prevented from losing efficacy due to medium impact, and meanwhile, the structural process is relatively simple and easy to assemble.

The utility model discloses a temperature and pressure sensor for a new refrigerant, which comprises a shell with a built-in pressure sensing component, the shell is externally connected with an electric appliance connector connected with the pressure sensing component, and the shell is internally provided with an NTC (Negative Temperature Coefficient) thermistor connected with the pressure sensing component; the pressure sensing component is a five-pin ceramic capacitor, two pins of the five-pin ceramic capacitor are temperature measuring pin bodies which penetrate through a ceramic capacitor body and are connected with the NTC thermistor, and a pressure-resistant protective ring which surrounds the temperature measuring pin bodies is arranged between the pressure sensing component and the shell in an extruding manner. According to the utility model, the five-pin ceramic capacitor is used as a pressure sensing component, two pins for temperature measurement are designed to be of a straight-through type structure, and the withstand voltage protection ring with a double-ring-layer withstand voltage protection structure is arranged, so that the withstand voltage capability of the temperature and pressure sensor is improved.

Technologies for components embedded in a substrate core are disclosed. In one embodiment, power components such as deep trench capacitors and multi-layer ceramic capacitors (MLCCs) are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. The power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. Configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.

A multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers laminated in a thickness direction, and external electrodes respectively on first and second end surfaces and electrically connected to the internal electrode layers. Each of the internal electrode layers includes an opposing portion opposed to another internal electrode layer, and a lead-out portion connected to the opposing portion and extending to the first or second end surface, a width of the opposing portion is larger than a width of the lead-out portion in the width direction, and a relationship of C1>C2 is satisfied when a continuity of an end portion of the opposing portion in the width direction is defined as C1 and a continuity of an end portion of the lead-out portion in the width direction is defined as C2.

The invention discloses a high-voltage multi-core ceramic capacitor and a preparation method thereof, and the multi-core ceramic capacitor comprises a pedestal, two connection frames which are oppositely disposed on the pedestal, and a plurality of capacitor modules which are sequentially arranged in the length direction of the connection frames. The capacitor module comprises a plurality of capacitors which are sequentially connected in series between two connecting frames and a plurality of series connecting sheets which are respectively arranged between two adjacent capacitors, and the connecting frames are connected with the opposite capacitors; the capacitor comprises a capacitor body, two parallel frames oppositely arranged on the two sides of the capacitor body, a potting shell used for installing the capacitor body and a potting layer arranged in the potting shell and wrapping the capacitor body. The specific structure of the capacitor module is limited to be matched with the connecting frame, so that parallel capacity increasing and series voltage dividing of the multiple capacitor chips are achieved, other capacitor modules are not affected after a certain capacitor module fails, and the market requirement of higher-voltage products is met.

A multilayer ceramic capacitor includes first and second counter portions. The first counter portion includes a first middle region and first and second regions. The second counter portion includes a second middle region, third and fourth regions. The first middle region has coverage higher than coverage of the first and second regions. The second middle region has coverage higher than coverage of the third and fourth regions. A dimension of each of the first and second middle regions is shorter than a distance between first and second external electrodes. A dimension at a center of an exposed portion in the length direction is longer that a maximum distance in a lamination direction between first and second covered portions, and shorter than a maximum distance in the lamination direction between both sides of the first and second external electrodes.

A multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers including Ni, and external electrodes. In each internal electrode layer, a width of an opposing portion is larger than a width of a lead-out portion. The element body portion includes side margin portions extending from both end portions of the opposing portion to first and second side surfaces, through a central portion in a length direction, and parallel or substantially parallel to a thickness direction and a width direction. A dielectric layer between adjacent internal electrode layers in the thickness direction includes grains including pores. Each of the side margin portions includes a dielectric including grains that do not include pores.

A ceramic capacitor with double L-shaped pins comprises two supports arranged oppositely, one or more ceramic chips arranged between the two supports and two first solder layers respectively arranged between the end portions of the one or more ceramic chips and the opposite supports, and each support comprises two frames arranged symmetrically and a second solder layer arranged between the two frames. According to the invention, the structure of the ceramic capacitor is limited, and the two symmetrically arranged frames are mutually welded through the welding flux to serve as the support, so that the welding area of the prepared support and the PCB is doubled, the welding strength of the prepared ceramic capacitor is improved, the bonding strength of the ceramic capacitor and the PCB is better, and the service life of the ceramic capacitor is prolonged. Compared with a single-frame ceramic capacitor, the ceramic capacitor can resist higher-strength vibration, improves the reliability of a product, and can be applied to high-reliability occasions such as space flight and aviation.

The invention relates to a multi-core-group ceramic capacitor and a preparation method thereof, and the capacitor comprises a first welding piece and a second welding piece which are oppositely arranged, a capacitor body arranged between the first welding piece and the second welding piece, and a mold pressing housing wrapping the periphery of the capacitor body. Comprising two connecting frames arranged oppositely, a supporting frame arranged between the two connecting frames and two capacitor chip sets arranged between the connecting frames and the supporting frame respectively, each capacitor chip set comprises a plurality of capacitor chips arranged in sequence, a first welding piece is connected with the tops of the two connecting frames, and a second welding piece is connected with the bottom of the supporting frame; the structure of the multi-core group ceramic capacitor is limited, the internal structure of the multi-core group ceramic capacitor is improved, the ends of the capacitor chips are welded with the connecting frame and the supporting frame and then are welded with the welding sheets, and the connecting frame and the supporting frame can be locally deformed when bearing stress, so that the impact of the stress on the capacitor chips is released, and meanwhile, the strain resistance is improved.

Provided is a multi-layered ceramic capacitor in which a penetration-type electrode unit, which is manufactured in a cone shape, passes through a plurality of internal electrodes in a collective stack of the internal electrodes and the dielectric layers, so that the capacitor is miniaturized and the electrical reliability thereof is improved.

In a multilayer ceramic capacitor, a segregation amount of silicon and magnesium on an outer layer side of an outermost internal electrode layer is larger than a segregation amount of silicon and magnesium on an inner layer side of the outermost internal electrode layer, and when a region defined by an existence region of the outermost internal electrode layer and a segregation region of silicon and magnesium in contact with the outermost internal electrode layer is defined as a first region, a line edge roughness of an outer layer side of the first region is larger than a line edge roughness of an inner layer side of the first region.

Provided is a multilayer ceramic capacitor capable of improving adhering strength between a laminate and an external electrode.　A multilayer ceramic capacitor according to the present invention is provided with: a laminate including a plurality of laminated dielectric layers and a plurality of internal electrode layers laminated on the dielectric layers, and having a first main surface and a second main surface facing each other in the lamination direction of the plurality of dielectric layers, a first side surface and a second side surface facing each other in the width direction which is orthogonal to the lamination direction, and a first end surface and a second surface facing each other in the length direction which is orthogonal to the lamination direction and the width direction; a first external electrode disposed on the first main surface and the first end surface of the laminate; and a second external electrode disposed on the first main surface and the second end surface of the laminate. The internal electrode layers are exposed from the first end surface and the second end surface. The first end surface and the second end surface, from which the internal electrode layers are exposed, are inclined to be widened from the first main surface toward the second main surface. To the first end surface and the second end surface, first protrusions which are formed of the dielectric layers and the internal electrode layers are disposed.

The present invention provides a multilayer ceramic capacitor which has further improved reliability. Disclosed is a multilayer ceramic capacitor 1 wherein: an external electrode 25 contains copper and, as glass, at least one of barium-boron-silicon-based glass, strontium-boron-silicon-based glass and barium-strontium-boron-silicon-based glass; the glass and the copper are exposed in a surface 58 of the external electrode 25; a layer 56, which contains sulfur, is formed on at least a part of the surface of the glass exposed in the surface 58 of the external electrode 25; and a tin layer 54 is formed on at least a part of the surface of the copper exposed in the surface 58 of the external electrode 25.

The invention provides a high-voltage low-loss dielectric material and a preparation method thereof, and relates to the technical field of high-voltage ceramic capacitors, and the high-voltage low-loss dielectric material comprises the following raw materials in parts by mass: 35-38 parts of barium titanate, 20-29.5 parts of strontium titanate, 15-17.5 parts of titanium dioxide, 9-12 parts of bismuth oxide, 3-4 parts of zirconium oxide, 0.8-1.0 part of X, 1.2-1.4 parts of antimony oxide, 1-1.2 parts of calcium carbonate and the like. The preparation method of the dielectric material comprises the following steps: 1, preparing the dielectric material; melting calcium carbonate, magnesium oxide, zinc oxide and the like, performing water quenching, and performing ball-milling granulation to obtain zinc borosilicate glass powder; uniformly mixing the zinc borosilicate glass powder with barium titanate, strontium titanate, titanium dioxide and the like, and granulating to obtain oxide powder; and tabletting and sintering the oxide powder to obtain the high-pressure low-loss dielectric material. The high-voltage low-loss dielectric material is high in dielectric constant, small in dielectric loss, high in compression strength and good in high-temperature stability, and the preparation method is simple.

An external electrode includes a base electrode layer, a Ni plating layer, and a Sn plating layer. The base electrode layer is provided on an element body portion. The Ni plating layer is provided above the base electrode layer. The Sn plating layer is provided on the Ni plating layer. The base electrode layer includes Ni as a primary component and a dielectric material.

The invention belongs to the field of electronic component manufacturing, and particularly discloses a sintering method of a multilayer ceramic capacitor, which comprises the following steps of: carrying out trial sintering on a laminated green body after glue removal according to a sintering curve to obtain an oxygen consumption-temperature curve, and taking the oxygen consumption as a reference oxygen consumption at a corresponding temperature; formal sintering is carried out on the stacked green bodies after glue discharging according to a sintering curve, and the sintering atmosphere is adjusted according to the variable quantity of the real-time oxygen consumption and the standard oxygen consumption; the sintering atmosphere contains inert gas, hydrogen and water vapor. According to the sintering method, the sintering atmosphere composition and the gas flow in the formal sintering step can be regulated and controlled in real time, so that the stability of fluidity, oxidability and the like of the sintering atmosphere in the formal sintering process is ensured, the oxidized amount of the Ni element in the MLCC product is controlled, the electrical performance and the reliability of the prepared MLCC product are improved, and the production cost is reduced. Meanwhile, the equipment utilization rate is increased, the productivity is increased, and the cost is reduced.

A multilayer ceramic capacitor includes an element body portion including internal electrode layers, and first and second external electrodes. In the internal electrode layers, a width of an opposing portion is larger than a width of a lead-out portion, each of the first and second external electrodes includes a Cu layer on the element body portion including first and second layer portions. The first layer portion has a higher Cu content than the second layer portion, the second layer portion has a higher glass content than the first layer portion. The Cu in the first layer portion is continuous to connect lead-out portions adjacent to each other. In a cross section of the second layer portion extending through a central portion in the width direction and parallel to the thickness and length directions, the glass occupies about 25% or more of an area of the second layer portion.

A multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers, and external electrodes. In a cross section of the element body portion extending through a central portion in a length direction, a deviation amount in a width direction between internal electrode layers adjacent to each other in a thickness direction is smaller than about 3 μm, each of the internal electrode layers includes an opposing portion opposed to the internal electrode layer, and a lead-out portion, a width of the opposing portion is greater than a width of the lead-out portion, a region of the element body portion where the lead-out portions overlap in the thickness direction includes a thick portion thicker than the central portion in the length direction, and end portions of the lead-out portions in the thickness direction deviate by about 3 μm or more in the width direction.

The invention provides a capacitive performance reliability analysis method and system for an operational amplifier, and relates to the technical field of reliability analysis of electronic components, and the method comprises the steps: carrying out an accelerated degradation test on a ceramic capacitor of the operational amplifier, and obtaining degradation information of electrical parameters and non-electrical parameters of the capacitor; selecting N parameters with an obvious degradation trend from the numerous parameters as key degradation parameters, and carrying out a reliability evaluation process of the capacitor on the basis of the key degradation parameters; analyzing the degradation information of the electrical parameters and the non-electrical parameters of the capacitor to obtain the reliability value of the capacitor under the single performance of the N key parameters; and according to different single-performance degradation amount reliability functions, selecting an appropriate Copula function as a connection function, and calculating a reliability function value under multiple performances according to the connection function. The problem that the capacitance performance of the operational amplifier is difficult to accurately analyze is solved.

Dielectric layers include outer dielectric layers and inner dielectric layers. The outer dielectric layers are located between a first principal surface and an internal electrode layer located closest to the first principal surface in a thickness direction and between a second principal surface and an internal electrode layer located closest to the second principal surface in the thickness direction. The inner dielectric layers are located between internal electrode layers adjacent to each other in the thickness direction. In an element body portion, side margin portions, which are located in a width direction between a first side surface and a plurality of internal electrode layers and between a second side surface and a plurality of internal electrode layers, have a higher Mn content than the inner dielectric layers.

The invention relates to the technical field of capacitors, and discloses a multi-layer ceramic capacitor preparation method and a multi-layer ceramic capacitor. According to the scheme, a clamp is arranged, and the two side faces, in the Z direction, of a laminated body mother board are clamped and covered by the clamp, when external electrodes are prepared, the external electrodes are only distributed on two first cut-off faces; therefore, the width dimension and the thickness dimension of the multilayer ceramic capacitor can be saved, the number of the inner electrodes and the width of the inner electrodes can be increased, and the capacitance of the multilayer ceramic capacitor can be improved. In addition, when any side surface except the two first cut surfaces is used as the mounting surface of the multilayer ceramic capacitor, soldering tin can be prevented from being filled between the multilayer ceramic capacitor and the bonding pad, so that the mounting height of the multilayer ceramic capacitor can be prevented from being increased.

A multilayer ceramic capacitor includes a multilayer body and outer electrodes on two surfaces of the multilayer body. The multilayer body includes an inner-layer portion and two outer-layer portions. The inner-layer portion includes first dielectric layers laminated in the lamination direction and a first inner electrode between the first dielectric layers. Each outer-layer portion includes at least one second dielectric layer and a second inner electrode in contact with the at least one second dielectric layer. A length of the second inner electrode is less than a length of the first inner electrode, or a width of the second inner electrode is less than a width of the first inner electrode. When each outer-layer portion is divided into two equal regions, a porosity of a region near the inner-layer portion is less than a porosity of a region farther from the inner-layer portion.

The utility model belongs to the field of automation equipment, and particularly relates to a feeding device and ceramic capacitor processing equipment. The feeding device comprises a first material taking structure, a material moving structure and a conveying structure, a first station and a second station are arranged on the two sides of the conveying structure, the first station is used for storing first materials, the conveying structure is used for driving the material moving structure to move back and forth between the first station and the second station, and the material moving structure is used for grabbing the first materials. The second station is used for storing second materials and receiving first materials grabbed by the material moving structure, the first material taking structure is arranged on the second station and located above the second materials, the first material taking structure is used for grabbing the second materials and driving the second materials to ascend and descend, and the material moving structure is further used for bearing the second materials at the first material taking structure. And the second material is driven to move to the first station. The feeding device can solve the problem of how to improve the feeding efficiency and the production efficiency.

A multilayer ceramic capacitor includes: a capacitor body comprising a dielectric layer and an internal electrode layer; and an external electrode disposed on an outside surface of the capacitor body, wherein the capacitor body includes an active portion where the dielectric layer and the internal electrode layer are alternately disposed, side margin portions disposed at both side end portions of the active portion facing each other, and bonding portions disposed between the active portion and the side margin portions, and at least one of the active portion or the side margin portions includes a barium titanate-based main ingredient including barium (Ba) and titanium (Ti), and gallium (Ga).

A multilayer ceramic capacitor includes a multilayer body having a dimensional relationship of the dimension in the width direction is greater than the dimension in the length direction which is greater than the dimension in the height direction. The dimension in the width direction of a third surface portion of a first external electrode is smaller than the dimension in the width direction of a first surface portion. The dimension in the width direction of an eighth surface portion of a second external electrode is smaller than the dimension in the width direction of a sixth surface portion. The dimensions in the height direction of a fourth surface portion and a fifth surface portion of the first external electrode are smaller than the dimension in the height direction of the first surface portion.

The present invention provides a multilayer ceramic electronic component, such as a multilayer ceramic capacitor, that is highly reliable. In a multilayer ceramic electronic component (1): a plurality of internal electrode layers have a first internal electrode layer (6a) exposed from a first end surface (E1) and a second internal electrode layer (6b) exposed from a second end surface (E2); a laminate (2) has an inner layer part in which the first internal electrode layer (6a) and the second internal electrode layer (6b) face each other in the lamination direction (T); the particle diameter of ceramic contained on a first lateral surface (S1) side and a second lateral surface (S2) side of the laminate (2) is smaller than the particle diameter of the ceramic contained in the center part of the laminate (2) in the width direction (W); and the particle diameter of the ceramic contained in the end parts of the inner layer part on the first end surface (E1) side and the second end surface (E2) side is the same as or larger than the particle diameter of the ceramic contained in the center part of the inner layer part.

The invention discloses glass powder and conductive copper paste for an MLCC (multilayer ceramic capacitor) and a preparation method of the glass powder and the conductive copper paste. The formula of the glass powder comprises 18.0% to 28.0% of SiO2, 25.0% to 35.0% of B2O3, 30.0% to 45.0% of BaO, 0% to 10% of CaO, 0% to 5% of Na2O, 0% to 8.0% of TiO2, 0% to 6% of CuO, 0% to 5.0% of Sb2O3 and 0% to 5.0% of NaF. Basic components of the glass powder do not contain Bi and Zn, a system is SiO2-B2O3-Na2O-BaO, TiO2, CuO, Sb2O3, NaF and the like are added into the basic glass components, Sb2O3 can reduce the surface tension of the glass and improve the wettability between the glass and the copper powder and ceramic, and TiO2 and CuO enhance the acid resistance of the glass and increase the compactness of an interface. NaF is used as a glass liquid clarifying agent, so that the clarifying speed of the glass liquid can be increased, the high-temperature viscosity of the glass powder can be reduced, the flowability of the glass powder is enhanced, and the interface densification speed is increased. The average particle size of the glass powder is 1.8-2.5 microns, and the thermal expansion coefficient of the glass is 6.5-9.5 ppm / DEG C. The glass powder has an obvious sintering assisting effect on the copper paste, after the copper paste is applied to an MLCC ceramic substrate to be sintered, the copper paste and the ceramic substrate have firm physical and chemical bonding, and the MLCC shows excellent electrical properties, adhesive force and good electroplating liquid resistance.