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Monolithic capacitor

a technology of monolithic capacitors and capacitors, applied in the field of monolithic capacitors, can solve problems such as the reduction of electrostatic capacity

Inactive Publication Date: 2001-07-12
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012] In the monolithic capacitor of preferred embodiments of the present invention, since the solder layers are disposed on the entire surfaces of the external electrodes of the monolithic ceramic capacitors, thermal stress is dispersed by the solder layers, and cracks are prevented from occurring in the joints of the monolithic ceramic capacitor elements and the monolithic ceramic capacitor elements. Therefore, the thermal shock resistance is greatly improved in the monolithic capacitor of preferred embodiments of the present invention.

Problems solved by technology

However, with respect to the monolithic ceramic capacitor in which the external electrodes of the monolithic ceramic capacitor elements are partially joined to each other by the conductive resin or the solder paste, thermal stress is concentrated at the joints, and cracks may occur in the joints and the monolithic ceramic capacitor elements, resulting in a decrease in electrostatic capacity.

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

(FIG. 1) 2.5 Fe--Cr 0 / 36 0 / 36 Example 2 (FIG. 3) 7.0 Fe--Cr 0 / 36 0 / 36 Comparative 2.5 Fe--Cr 2 / 36 16 / 36 Example 1 (FIG. 4) Comparative 7.0 Fe--Cr 2 / 36 10 / 36 Example 2 (FIG. 6)

[0035] As is clear from Table 1, in Examples 1 and 2 constructed according to the first and second preferred embodiments of the present invention, in which solder layers were disposed on the entire surfaces of the external electrodes of the monolithic ceramic capacitor elements, the number of defects caused by thermal shock was zero. In contrast, in Comparative Examples 1 and 2 in which solder layers were partially formed on the surfaces of the external electrodes of the monolithic ceramic capacitor elements, defects occurred due to thermal shock.

[0036] This result occurred because when the external electrodes of the monolithic ceramic capacitor elements are partially connected by the solder layers, in the thermal shock cycle test, thermal stress is concentrated at the joints and cracks occur in the joints and ...

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Abstract

A monolithic capacitor includes a plurality of monolithic ceramic capacitor elements provided with external electrodes at both ends thereof, solder layers arranged on the entire surfaces of the external electrodes of the monolithic ceramic capacitor elements, and metal terminals electrically connected to the external electrodes of the monolithic ceramic capacitor elements. The monolithic ceramic capacitor elements are joined to each other by the solder layers and are stacked on each other. The external electrodes of the monolithic ceramic capacitor elements are electrically connected to each other by the solder layers.

Description

[0001] 1. Field of the Invention[0002] The present invention relates to a monolithic capacitor, and more particularly, the present invention relates to a monolithic capacitor having high capacitance and which includes a plurality of monolithic ceramic capacitor elements and metal terminals, and used, for example, as a substitute for a tantalum electrolytic capacitor for smoothing a power circuit in a DC-DC converter, or other suitable uses.[0003] 2. Description of the Related Art[0004] A monolithic capacitor provided with metal terminals is used in order to improve thermal shock resistance by ensuring bending strength and by relieving thermal stress. In such a monolithic capacitor, monolithic ceramic capacitor elements are supported by metal terminals so as not to contact a substrate. Furthermore, as disclosed in Japanese Unexamined Utility Model Publication No. 1-112032, metal terminals are bent. By using the techniques described above, it is also possible to decrease the differenc...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01G4/12H01G4/228H01G4/30H01G4/38H05K3/34
CPCH01F2027/295H01G4/38H05K3/3426Y02P70/50
Inventor NAKAGAWA, TAKUJITAKAGI, YOSHIKAZUYONEDA, YASUNOBU
Owner MURATA MFG CO LTD
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