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2790results about "Transformers/inductances details" patented technology

Inductive power coupling systems for roadways

An inductive power transfer system (10) for roadways includes at least one drive unit arrangement (50) coupled to at least one drive coil arrangement (40) disposed along a roadway (20) for generating a magnetic field extending upwardly from the roadway (20), and at least one vehicle (30) including a corresponding pickup coil arrangement (60) coupled to a power conditioning circuit arrangement (80, 200) for receiving the extending magnetic field for providing power to operate the at least one vehicle (30). The at least one drive unit arrangement (50) is operable to excite, for example at resonance, the at least one drive coil arrangement (40) at a fundamental frequency (f0) of at least 30 kHz, preferably at least 50 kHz, more preferably at least 100 kHz, and most preferably at least 140 kHz. The at least one drive coil arrangement (40) is implemented to be substantially devoid of ferromagnetic components for providing a path for the extending magnetic field. Optionally, the at least one drive unit arrangement (50) is operable to employ a balanced class-E amplifier arrangement for exciting the at least one drive coil arrangement (40) at the fundamental frequency (f0). Optionally, the at least one drive unit arrangement (50) is operable to employ one or more Silicon Carbide semiconductor devices for switching the currents provided to the corresponding at least one drive coil arrangement (40). Optionally, there is further included a passive and/or active suppression arrangement (100, 110, 120, 130, 140) for suppressing harmonic magnetic field components generated by the system (10) at multiples of the fundamental frequency (f0) when in operation.
Owner:DAMES ANDREW NICHOLAS +2

Thin film surface mount components

Surface mount components and related methods of manufacture involve one or more thin film circuits provided between first and second insulating substrates. The thin film circuits may include one or more passive components, including resistors, capacitors, inductors, arrays of one or more passive components, networks or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads being exposed between the substrates on end and / or side surfaces of the surface mount component. The exposed conductive pads are then electrically connected to external terminations. The external terminations may include a variety of different materials, including at least one layer of conductive polymer and may be formed as termination stripes, end caps or the like. Optional shield layers may also be provided on top and / or bottom device surfaces to protect the surface mount components from signal interference. For embodiments where one or more thin film circuits are provided between insulating base and cover substrates, such thin film circuit(s) can be formed with conductive pads that extend to and are initially exposed along one or more surfaces of the resultant component. The cover substrate is formed with a plurality of conductive elements (e.g., internal active electrodes, internal anchor electrodes and / or external anchor electrodes) that are designed to generally align with the conductive pads formed on the base substrate such that conductive element portions are exposed in groups along one or more peripheral surfaces of a device. External plated terminations are then formed directly to the exposed portions of the conductive elements.
Owner:KYOCERA AVX COMPONENTS CORP
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