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21271results about "Transformers/inductances coils/windings/connections" patented technology

Contact-less power transfer

A system and method for transferring power does not require direct electrical conductive contacts. There is provided a primary unit having a power supply and a substantially laminar surface having at least one conductor that generates an electromagnetic field when a current flows therethrough and having an active area defined within a perimeter of the surface, the at least one conductor being arranged such that electromagnetic field lines generated by the at least one conductor are substantially parallel to the plane of the surface within the active area; and at least one secondary device including at least one conductor that may be wound about a core; wherein the active area has a perimeter large enough to surround the conductor or core of the at least one secondary device in any orientation thereof substantially parallel to the surface of the primary unit in the active area, such that when the at least one secondary device is placed on or in proximity to the active area in a predetermined orientation, the electromagnetic field induces a current in the at least one conductor of the at least one secondary device.
Owner:PHILIPS IP VENTURES BV

Printed circuit board coil

A multilayer printed circuit board (“PCB”) coil that simulates a coil formed from litz wire. The PCB includes a plurality of alternating conductor and insulating layers interconnected to cooperatively form the coil. Each conductor layer includes a trace that follows the desired coil shape and is divided into a plurality of discrete conductor segments. The segments are electrically connected across layers to provide a plurality of current flow paths (or filaments) that undulate between the layers in a regular, repeating pattern. The coil may be configured so that each filament spends a substantially equal amount of time in proximity to the paired coil and therefore contributes substantially equally to the self or mutual inductance of the coil. Each conductor layer may include a plurality of associated traces and intralayer connector that interconnected so that each filament undulates not only upwardly / downwardly, but also inwardly / outwardly in a regular, repeating pattern.
Owner:PHILIPS IP VENTURES BV

Wireless Energy Transfer System

A wireless energy transfer system includes a first energy transfer unit having at least one resonant frequency, a second energy transfer unit having the at least one resonant frequency, and a load. The first wireless energy transfer unit includes a first coil magnetically coupled to a first wireless energy transfer cell, and the second wireless energy transfer unit includes a second coil magnetically coupled to a second wireless energy transfer cell. The first coil receives first energy and through the magnetic coupling between the first coil and the first wireless energy transfer cell, the first wireless energy transfer cell is caused to generate second energy, wherein the second wireless energy transfer cell receives the second energy and through the magnetic coupling between the second wireless energy transfer cell and the second coil, the second coil is caused to provide third electromagnetic wave energy to the load.
Owner:UNIVERSITY OF PITTSBURGH

Planar coil and contactless electric power transmission device using the same

This invention has an object to a planar coil, a contactless electric power transmission device using the same. This planar coil is configured to suppress an eddy current developed between adjacent turns of wire for minimizing adverse effects on ambient electrical appliances resulting from heat generation. The planar coil 1 in the present invention is formed of spiral shaped wire 7 coated with thinned insulative film, in which adjacent turns of the wire 7 are spaced in radial direction at such a predetermined interval to suppress an eddy current. This planar coil 1 is preferably employed as a power transmission coil or power receiving coil.
Owner:PANASONIC CORP

Power supplying module for contactless power supplying device, method for using power supplying module of contactless power supplying device, and method for manufacturing power supplying module of contactless power supplying device

ActiveUS20130175877A1High degree of freedom for designShort timeNear-field transmissionTransformersComputer modulePrinted circuit board
Coil units equipped with primary coils having the same specification are provided in a power feeding module. Coil-unit intermeshing recess sections are formed on a printed circuit board to match each of the coil units. Pads for joining together with electrodes formed on the coil units are formed on the bottom faces of each of the coil-unit intermeshing recess sections. A plurality of coil units can be mounted onto the printed circuit board easily, by fitting each of the coil units into each of the coil-unit intermeshing recess sections and joining them together, which will enable manufacturing efficiency to be improved.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Transformer structure

The present invention describes a planar transformer having a plurality of juxtaposed magnetic cores as well as a two-layer printed circuit board for spiralling a plurality of windings. Each arm of a plurality of juxtaposed magnetic cores respectively goes through a corresponding hole in the middle of these windings, to magnetically couple the current in the main winding to the other windings.
Owner:ENTRUST POWER CO LTD

Plated terminations

InactiveUS6960366B2Improved termination featureEliminate and greatly simplifyResistor terminals/electrodesFinal product manufactureTermination problemEngineering
Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.
Owner:KYOCERA AVX COMPONENTS CORP

Concentric tilted double-helix dipoles and higher-order multipole magnets

Concentric tilted double-helix magnets, which embody a simplified design and construction method for production of magnets with very pure field content, are disclosed. The disclosed embodiment of the concentric tilted double-helix dipole magnet has the field quality required for use in accelerator beam steering applications, i.e., higher-order multipoles are reduced to a negligibly small level. Magnets with higher multipole fields can be obtained by using a simple modification of the coil winding procedure. The double-helix coil design is well-suited for winding with superconducting cable or cable-in-conduit conductors and thus is useful for applications that require fields in excess of 2 T. The coil configuration has significant advantages over conventional racetrack coils for accelerators, electrical machinery, and magneto-hydrodynamic thrusting devices.
Owner:GOODZEIT CARL L +2

Method of forming an electromagnetic sensing coil in a medical instrument

A surgical navigation system for navigating a region of a patient includes a non-invasive dynamic reference frame and / or fiducial marker, sensor tipped instruments, and isolator circuits. The dynamic reference frame may be repeatably placed on the patient in a precise location for guiding the instruments. The instruments may be precisely guided by positioning sensors near moveable portions of the instruments. Electrical sources may be electrically isolated from the patient.
Owner:MEDTRONIC NAVIGATION

Integration of planar transformer and/or planar inductor with power switches in power converter

A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and / or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled to a heat sink via one or more multi-layer switch substrates.
Owner:VITESCO TECH USA LLC

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

The invention provides electronic parts which comprise a composite dielectric layer composed of an organic insulating material and a dielectric ceramic powder having a larger relative dielectric constant than the organic insulating material, and which also comprise conductive element sections forming inductor elements, etc., wherein the organic insulating material comprises a cured resin obtained by curing reaction of an epoxy resin with an active ester compound obtained by reaction between a compound with two or more carboxyl groups and a compound with a phenolic hydroxyl group. The dielectric ceramic powders of the described electronic parts have larger relative dielectric constants than the organic insulating materials, and the organic insulating materials have low dielectric loss tangents. It is possible to adequately reduce time-dependent dielectric constant changes in the high-frequency range of 100 MHz and above even with prolonged use at high temperatures of 100° C. and higher, while it is also possible to satisfactorily prevent deformation and other damage to the electronic parts during their handling.
Owner:TDK CORPARATION

Electronic component and manufacturing method of electronic component

A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.
Owner:TDK CORPARATION

Coil component

A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.
Owner:TDK CORPARATION

Integrated circuits with inductors in multiple conductive layers

Two inductors formed in multiple layers of conductive layers of integrated circuits are disclosed. Symmetric portions of a first inductor and a second inductor are formed in two or more conductive layers. Portions of the first inductor in adjacent conductive layers are connected by vias, and portions of the second inductor in adjacent conductive layers are connected by vias. The first and second inductor portions form a substantially loop-shaped structure in each conductive layer. The first and second inductor vias may be positioned at the same position within the substantially loop-shaped inductor structure by alternating inner and outer radiuses, or the vias for the second inductor may be positioned opposite the vias for the first inductor within the substantially loop-shaped inductor structure, using notches in the first and second inductor portions.
Owner:INFINEON TECH AG

An integrated dual-output grid-to-vehicle (G2V) and vehicle-to-grid (V2G) onboard charger for plug-in electric vehicles

An integrated and isolated onboard charger for plug-in electric vehicles, includes an ac-dc converter and a dual-output dc-dc resonant converter, for both HV traction batteries and LV loads. In addition, the integrated and isolated onboard charger may be configured as unidirectional or bidirectional, and is capable of delivering power from HV traction batteries to the grid for vehicle-to-grid (V2G) applications. To increase the power density of the converter, the dual-output DC-DC resonant converter may combine magnetic components of resonant networks into a single three-winding electromagnetically integrated transformer (EMIT). The resonant converter may be configured as a half-bridge topology with split capacitors as the resonant network components to further reduce the size of converter. The integrated charger may be configured for various operating modes, including grid to vehicle (G2V), vehicle to grid (V2G) and high voltage to low voltage, HV-to-LV (H2L) charging.
Owner:UNIV OF MARYLAND
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