8460results about "Coils manufacture" patented technology

Improved method steps for terminating multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrode and dielectric layers are provided in an interleaved arrangement and selected portions of the electrode layers are exposed. Electrically isolated anchor tabs may optionally be provided and exposed in some embodiments. Termination material is then plated to the exposed portions of the electrode layers until exposed portions of selected such portions thereof are connected. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

A first insulator is formed on a base layer. A first conductor is formed on the first insulator. The first conductor is patterned. A second insulator is formed over the first insulator. A via hole is formed in the second insulator and is electrically coupled to the first conductor through the via hole. A second conductor is formed on the second insulator, and is electrically coupled to the first conductor by the via hole. The second conductor is patterned. A cavity is formed under the second conductor, and in the first and second insulators.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

A magnetic induction device (MID) is disclosed. The MID includes a core, and at least one first winding including at least one conductive strip deposited on the core and including at least two turns which are substantially simultaneously shaped. Related apparatus and methods are also disclosed.

An inductive device (105) is formed above a substrate (225) having a conductive coil formed around a core (109). The coil comprises segments formed from a first plurality of bond wires (113) and a second plurality of bond wires (111). The first plurality of bond wires (113) extends between the core (109) and the substrate (225). Each of the first plurality of bond wires is coupled to two of a plurality of wire bond pads (117, 116). The second plurality of bond wires (111) extends over the core (109) and is coupled between two of the plurality of wire bond pads (117, 119). A shield (141) includes a portion that is positioned between the core (109) and the substrate (225).

An on-chip inductor device for Integrated Circuits utilizes coils on a plurality of metal layers of the IC with electrical connectors between the coils and a magnetic core for the inductor of stacked vias running between the coils. The magnetic core is made from a series of stacked vias which are deposited between each metal layer of the IC having a coil. The magnetic core desirably includes an array of magnetic bars comprising the magnetic core. The via material of the magnetic core may be both magnetic and electrically conductive. The magnetic and electrically conductive via material may also be used for the planar coil electrical connectors or other electrically conductive parts of the IC, or both, thereby lessening fabrication steps. Films of magnetic material may be formed at the ends of the inductor to provide a closed magnetic circuit for the inductor. A high Q factor inductor of small (e.g., transistor) size is thus obtained. The materials and processes which enable the on-chip inductor device are compatible with ordinary IC fabrication methods.

A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater.

A method (200) for coiling an earphone set (10) comprising at least one earphone (11), at least one cable (12), one for each earphone (11), and a connector (14), the method comprising: coiling the at least one cable (12) around a cable strap (21) having at least one end (22); passing a first (22) of the at least one end of the cable strap (21) over a first (11) of the earphones by inserting the first earphone (11) through a first slot (23) in the first end (22) for attaching the first earphone (11) to the cable strap (21); and passing a second (22) of the at least one end of the cable strap (21) over a second (11) of the earphones by inserting the second earphone (11) through a second slot (23) in the second end (22) for releasably attaching the second earphone (11) to the cable strap (21).

A spiral reverse osmosis membrane element that improves impregnation property of a sealing resin at edges of a membrane leaf and can effectively prevent micro-leaks, by using, for example, a porous support having a structure capable of sufficiently impregnating therein a sealing resin, a method for manufacturing the same, and a use method of the same are disclosed. The spiral reverse osmosis membrane element comprises a cylindrically wound body comprising a perforated core tube and, spirally wound therearound, a separation membrane, a feed-side passage material and a permeation-side passage material in a laminated state, and a sealing portion for preventing a feed-side liquid and a permeation-side liquid from being mixed together, wherein the separation membrane facing through the permeation-side passage material has a structure that a porous support and a skin layer are successively laminated on a non-woven fabric layer, and the sealing portion sealed with a sealing resin is provided at the edges of the separation membrane, wherein the separation membrane is impregnated with the sealing resin at least up to the vicinity of the skin layer through the porous support.