4185results about "Transformers/reacts mounting/support/suspension" patented technology

The present invention provides a transformer formed from adjacent conducting layers of a multi-layer PCB and at least one additional conducting layer in contact with the PCB. The inventive transformer includes one or more winding turns of a first winding formed by connecting the multiple layers of the multi-layer PCB with conductive vias and one or more winding turns of a second winding formed by connecting one or more other layers of the multi-layer PCB. The additional conducting layer or layers is connected to respective selected one or more of said conducting layers of said PCB. In one embodiment, an additional conducting layer is soldered to a top conducting layer of the PCB, effectively increasing the cross-sectional area of the top winding layer. In another embodiment, an additional conducting layer is separated from a conducting PCB layer formed on the surface thereof by a layer of insulation, permitting the additional conducting layer to form a separate winding turn. The inventive transformer can be surface mounted to a PCB, and can be used in other electromagnetic devices. The windings thus constructed are capable of accepting larger currents with lower resulting temperature increases than windings formed only from PCBs, and are less expensive to manufacture than PCB-only windings.

Back-end-of-line (BEOL) wiring structures that include an on-chip inductor and an on-chip capacitor, as well as design structures for a radiofrequency integrated circuit. The on-chip inductor and an on-chip capacitor, which are fabricated as conductive features in different metallization levels, are vertically aligned with each other. The on-chip capacitor, which is located between the on-chip inductor and the substrate, may serve as a Faraday shield for the on-chip inductor. Optionally, the BEOL wiring structure may include an optional Faraday shield located vertically either between the on-chip capacitor and the on-chip inductor, or between the on-chip capacitor and the top surface of the substrate. The BEOL wiring structure may include at least one floating electrode capable of being selectively coupled with the electrodes of the on-chip capacitor to permit tuning, during circuit operation, of a resonance frequency of an LC resonator that further includes the on-chip inductor.

An electrical rough-in box for a low voltage transformer is provided. The box has a removable cover with a low voltage transformer mounted there through. The removable cover contains a recessed portion for accommodating low voltage wiring. A sidewall of the box contains a channel for low voltage wiring, thus permitting flush mounting of the box against a wall stud.

An inductor assembly is disclosed for protecting electronic circuitry in a downhole equipment string. The inductor assembly includes a plurality of modular inductors coupled to one another in series to provide the desired inductance. The modular inductors are supported by a support structure in a protective housing, such as in a common housing with the electronic circuitry. The inductor assembly is electrically isolated from the housing. The support structure may include insulative end members and rail members extending between the end members to which the inductors are secured. One or more insulative covers are provided around the inductors to further isolate the inductors from the housing. The inductor assembly dissipates energy in the event of certain failure modes of power supply circuitry or lines extending from the earth's surface. The inductor may be secured electrically between a neutral node in a Y-wound motor to prevent high voltage ac waveforms from damaging the electronic circuitry. Insulation of the inductors inhibits arcing with the housing, thereby inhibiting damage to the inductors or the electronic circuitry during such failure modes.

Disclosed herein are various embodiments of means and methods for reducing the pick-up of electromagnetic interference (“EMI”) by coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. In some embodiments, the lengths, heights, and horizontal distances between wires electrically connecting transmitter circuits and receiver circuits to coil transducers are minimized and optimized respecting one another.

A module having a discrete passive element and a semiconductor device, and method of forming the same. In one embodiment, the module includes a patterned leadframe, a discrete passive element mounted on an upper surface of the leadframe, and a thermally conductive, electrically insulating material formed on an upper surface of the discrete passive element. The module also includes a semiconductor device bonded to an upper surface of the thermally conductive, electrically insulating material.

A transformer is provided with a coil portion containing primary windings and a secondary winding. Cores sandwich the coil portion. Each of these windings includes a toroidal-shaped portion that is formed by winding flat type wires in a toroidal shape and by overlapping these flat type wires. Edge portions of this flat type wire are derived from the toroidal-shaped portion respectively. A plurality of windings and the cores are arranged along an overlapping direction of the flat type wires. employed, By this structure, a copper loss caused by the skin effect can be reduced and the electromagnetic coupling conditions between the windings can be improved.

An integrated semiconducting device comprises a semiconducting substrate, a plurality of grounding strips disposed above the substrate in a lower metal level of the semiconducting device, an inductor positioned in an upper metal level of the semiconducting device, and a plurality of conducting vias connected to and extending away from the grounding strips towards the inductor. The inductor, conducting via, ground strips structure forms a Faraday cage that acts as a shield against electromagnetic radiation. The number and placement of the conductive vias are adjustable and can be optimized based on the relative importance of maximizing the quality factor Q of the inductor or minimizing the capacitance between the inductor and ground.

The bobbin for the bar antenna includes a core supporting portion into which a bar shaped ferromagnetic core is inserted and supported. The core supporting portion is attached to at least one end of the bar antenna formed by the core around which a conductive wire material is wound. The bobbin further includes a conductive wire material fixing portion for fixing the conductive wire material and a core holding portion for sandwiching the core inserted into the core supporting portion from both sides opposing to each other and firmly pressing by a tension force of the conductive wire material wound thereon.

A coil component that can be mounted on a printed circuit board, with a part in an aperture of the printed circuit board. The coil component includes a first flange on an upper side and a second flange. Terminal boards are on respective opposite sides of the first flange. Terminals respectively project in a direction perpendicular to an axial direction of a winding drum, from the terminal boards and bend and are inserted into through-holes of the printed circuit board. First and second touching surfaces, which are parts of a downside surface of the second flange, touch an upside surface of the printed circuit board.

A distribution transformer adapted for mounting to a utility pole. The distribution transformer includes a plurality of coil assemblies mounted to a ferromagnetic core. Each of the coil assemblies includes a low voltage coil and a high voltage coil. The low voltage coils are connected together and the high voltage coils are connected together. An encasement comprised of an insulating resin encapsulates the core and the coil assemblies. The encasement includes a substantially annular body and a pair of high voltage bushings extending outwardly from the body. Terminals extend from the high voltage bushings and are connected to the high voltage coils.

An improved field emission system and method is provided that involves field emission structures having electric or magnetic field sources. The magnitudes, polarities, and positions of the magnetic or electric field sources are configured to have desirable correlation properties, which may be in accordance with a code. The correlation properties correspond to a desired spatial force function where spatial forces between field emission structures correspond to relative alignment, separation distance, and the spatial force function.

A symmetrical stacked inductor comprising a plurality of conductive layers using at least one conductive line formed out of a symmetrical and geometric conductive layer and having at least one inter-metal dielectric layer for isolating each conductive layer, and wherein the conductive line does not intersect; and a plurality of vias placed between the inter-metal dielectric layers for electrical conduction.

An inductive device (105) is formed above a substrate (225) having a conductive coil formed around a core (109). The coil comprises segments formed from a first plurality of bond wires (113) and a second plurality of bond wires (111). The first plurality of bond wires (113) extends between the core (109) and the substrate (225). Each of the first plurality of bond wires is coupled to two of a plurality of wire bond pads (117, 116). The second plurality of bond wires (111) extends over the core (109) and is coupled between two of the plurality of wire bond pads (117, 119). A shield (141) includes a portion that is positioned between the core (109) and the substrate (225).

A magnetic component provides both electrical interconnectivity and mechanical support between stacked circuit boards. The magnetic component includes a bobbin structure and a magnetically permeable core. The bobbin structure includes an upper bobbin pin rail and a lower bobbin pin rail. The upper bobbin pin rail includes one or more upper bobbin pins extending from the upper bobbin pin rail. Each upper bobbin pin may be adapted for soldering onto a first circuit board. At least one lower bobbin pin extends from the lower bobbin pin rail. Each lower bobbin pin may also be adapted for soldering onto a second circuit board, forming a circuit board assembly. Each soldered connection between a bobbin pin and a circuit board may provide an electrical connection between the circuit board and the magnetic component. Each soldered connection may also provide a mechanical attachment between a printed circuit board and the magnetic component. A conductive coil is positioned on the bobbin structure and may be connected to an upper or lower bobbin pin. The core is positioned near the conductive coil for providing an electrical connection between the circuit boards through magnetic coupling.

The invention discloses a transformer with functions of shock absorption, water resistance and heat dissipation. Connection, internal thread sleeve, connecting rod, slider, side plate, glass cooling pipe, second motor, fan blade and mounting plate, the present invention is provided with a shock absorption device, which can avoid the problem of damage to internal components caused by long-term operation of the transformer , To better protect the transformer, it is equipped with a first motor, a first pulley, a second pulley, a two-way screw, an internal thread sleeve and a connecting rod, so as to adjust the height of the transformer box and the ground to avoid rainwater entering the transformer box and The ground rain erodes or submerges the bottom of the transformer box, and a second motor and fan blades are provided to uniformly dissipate the electrical components in the transformer box, speed up the air circulation rate, and improve the heat dissipation effect.

A coil unit includes a planar coil, a printed circuit board that includes a planar coil placement section that receives the planar coil, a protective sheet that is provided on a transmission side of the planar coil and protects the planar coil, and a magnetic sheet that is provided on a non-transmission side of the planar coil. The planar coil is placed in the planar coil placement section and is electrically connected to the printed circuit board. The planar coil placement section has a shape that corresponds to an external shape of the planar coil.

A method for forming a spiral inductor (11) or component of a transformer, compatible with very large scale integrated processing, that achieves a higher Q value without occupying more space by splitting at least one turn (13 51) as two or more crisscrossing or interwoven smaller-width turns (13a 13b 52 53 54 55). The at least one turn (51) may, for example, be split into four turns paired up to provide two pairs of two turns, and the turns of each pair may then be interwoven or crisscrossed, and then the two pairs may also be interwoven or crisscrossed. The splitting of a turn into two or more smaller-width turns results in the current being divided among the smaller-width turns.

A means for fabrication of solenoidal inductors integrated in a semiconductor chip is provided. The solenoidal coil is partially embedded in a deep well etched into the chip substrate. The non-embedded part of the coil is fabricated as part of the BEOL metallization layers. This allows for a large cross-sectional area of the solenoid turns, thus reducing the turn-to-turn capacitive coupling. Because the solenoidal coils of this invention have a large diameter cross-section, the coil can be made with a large inductance value and yet occupy a small area of the chip. The fabrication process includes etching of a deep cavity in the substrate after all the FEOL steps are completed; lining said cavity with a dielectric followed by fabrication of the part of the coil that will be embedded by deposition of a conductive material metal through a mask; deposition of dielectric and planarization of same by CMP. After planarization the fabrication of the remaining part of the solenoidal coil is fabricated as part of the metallization in the BEOL (i.e. as line/vias of the BEOL). To further increase the cross section of the solenoidal coil part of it may be built by electrodeposition through a mask on top of the BEOL layers.