356 results about "Faraday cage" patented technology

A portable computing device is disclosed. The portable computing device can take many forms such as a laptop computer, a tablet computer, and so on. The portable computing device can include a single piece housing formed from a radio opaque material with a cover formed from a radio transparent material. To implement a wireless interface, an antenna stack-up can be provided that allows an antenna to be mounted to a bottom of the cover. Methods and apparatus are provided for improving wireless performance. For instance, in one embodiment, a metal housing can be thinned to improve antenna performance. As another example, a faraday cage can be formed around speaker drivers to improve antenna performance.

Improved electromagnetic compatibility for integrated motherboard or device board designs is provided by magnetic shielding, electric shielding, or both integrated into the chip packaging materials. Motherboard emissions may be reduced by use of the shielding. A nonconductive primary and tertiary layer sandwich a high-conductivity metal secondary layer forming a Faraday cage for electric field shielding. A nonconductive primary layer is covered by a tertiary layer formed of a composite having permeable material for magnetic shielding. The tertiary layer formed of a composite could include a high permeability particulate ferrous material. Both the secondary layer and the tertiary layer formed of a composite could be used for both electric and magnetic shielding of chips.

A surgical instrument includes a force sensor apparatus that is immune to noise from arcing cautery without relying on fiber optic strain gauges, and that is autoclabable. The surgical instrument includes a housing, a shaft, the force sensor apparatus, a joint, and an end component. The force sensor apparatus includes at least one strain gauge that is enclosed in a Faraday cage. The Faraday cage includes a sensor capsule that includes one or more strain gauges, a cable shield tube connected to the sensor capsule, and an electronics enclosure connected to the cable shield tube. The sensor capsule is positioned between the joint and the shaft. The cable shield tube extends through the shaft to the electronics enclosure that is within the housing.

A branding process provides a networked computing device with initial set up information, including a name, a public/private key pair, and a set of certificates the device will need to inter-operate with other devices in the trust group. A branding device conveys the initial set-up information to the networked computing device via a limited access network interface, or alternatively via a broadcast network media with the device enclosed in a wave guide and/or Faraday cage. The networked computing device can then use the set up information to verify that other devices on the network that seek to interact with the device are also members of the trust group, with which networked computing device can interact.

A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising an undiced semiconductor wafer having a multitude of microchips. The multitude of microchips on the wafer forming a plurality of independently functioning computers, each computer having independent communication capabilities.

A system and method for transmitting wireless energy between two or more components housed within a faraday-like cage structure. In one preferred form a cooling plenum of an equipment rack supporting a plurality of independent components is used for transmitting wireless signals between the components. In another form a wireless backplane is formed in an equipment rack that houses a plurality of LRUs. In another example a card file housing a plurality of components forms a faraday-like cage for enabling transmission of wireless signals, either electromagnetic wave or optical signals, between various circuit boards held within the card file. The various preferred embodiments eliminate the need for expensive, bulky and heavy electrical or optical cabling to be used to intercouple the components supported within the support structure for communication.

A shielded planar capacitor structure (202) is discussed, formed within a Faraday cage (210) in an integrated circuit device (200). The capacitor structure (202) reduces parasitic capacitances within the integrated circuit device (200). The capacitor (202) comprises a capacitor stack (102) formed between a first and second metal layers (230,232) of the integrated circuit. The capacitor stack (102) has a first conductive layer formed from a third metal layer (106) disposed between the first and second metal layers (230,232) of the integrated circuit, a dielectric isolation layer (110) disposed upon the first conductive layer (106); and a second conductive layer (112) disposed upon the dielectric isolation layer (110) and overlying the first conductive layer (106). The structure (202) further has a first and second isolation layers (104,114) disposed upon opposite sides of the capacitor stack (102). The Faraday cage (210) is formed between the first and second metal layers (230,232) of the integrated circuit (200), comprising a first and second shield layers (402,414) each having a plurality of mutually electrically conductive spaced apart traces (404). The first and second isolation layers (404,414) and the capacitor stack (102,434) are sandwiched between the first and second shield layers (402,414). Conductive elements (432) are distributed around the periphery of the capacitor stack (102,434) and the first and second isolation layers (404,412). The conductive traces (424) of the first shield layer (402) are connected to the conductive traces (424) of the second shield layer (414) through the conductive elements (432).

A system for protecting a composite-body aircraft from damage caused by lightning strikes includes a Faraday cage defined on the exterior surface of the aircraft body by a continuous, electrically conductive grid that extends to the outermost lateral periphery of the body. In one possible embodiment in which the aircraft's body includes a plurality of composite panels that are joined at their adjacent edges by splice plates, the conductive grid may advantageously be formed by electrically conductive splice plates, e.g., of titanium, that have their respective, adjacent ends electrically connected to each other, e.g., with conductive straps and fasteners. The conductive grid provides preferential attachment points and conductive paths for lightning strikes on the surface of the aircraft, thereby shielding the interior of the grid from lightning damage. The conductive grid can optionally function as a ground return path for the aircraft's electrical system.

An integrated circuit assembly is formed with an insulating layer, a semiconductor layer, an active device, first, second, and third electrically conductive interconnect layers, and a plurality of electrically conductive vias. The insulating layer has a first surface and a second surface. The second surface is below the first surface. A substrate layer has been removed from the second surface. The semiconductor layer has a first surface and a second surface. The first surface of the semiconductor layer contacts the first surface of the insulating layer. The active device is formed in a region of the semiconductor layer. The first electrically conductive interconnect layer forms an electrically conductive ring. The second electrically conductive interconnect layer forms a first electrically conductive plate above the electrically conductive ring and the region of the semiconductor layer. The third electrically conductive interconnect layer forms a second electrically conductive plate below the electrically conductive ring and the region of the semiconductor layer. The plurality of electrically conductive vias electrically couple the electrically conductive ring to the first electrically conductive plate and to the second electrically conductive plate. The electrically conductive ring, the first electrically conductive plate, the second electrically conductive plate, and the plurality of electrically conductive vias form a Faraday cage around the active device.

A system comprising a personal computer configured to operate with another computer connected to a network of computers. The personal computer includes a microchip having a microprocessor with a control unit and at least two processing units, the control unit being configured to allow a user of the personal computer to control the two processing units, and the microchip including a power management component. The personal computer includes an internal firewall configured to allow and/or deny access to portions of the microchip both to the user of the personal computer and to a user of the microchip from the network of computers during a shared use of the microchip; and the internal firewall is configured to deny access to portions of the microchip from the network of computers.

An integrated semiconducting device comprises a semiconducting substrate, a plurality of grounding strips disposed above the substrate in a lower metal level of the semiconducting device, an inductor positioned in an upper metal level of the semiconducting device, and a plurality of conducting vias connected to and extending away from the grounding strips towards the inductor. The inductor, conducting via, ground strips structure forms a Faraday cage that acts as a shield against electromagnetic radiation. The number and placement of the conductive vias are adjustable and can be optimized based on the relative importance of maximizing the quality factor Q of the inductor or minimizing the capacitance between the inductor and ground.

A stacked multi-chip package with an EMI shielded component has first and second substrates mounted together by a grid array of metallic connecting nodes, such as a solder Ball Grid Array. Each substrate has a conductive plane associated with it. An electronic component is mounted between the first and second substrates and is surrounded by a group of the metallic connecting nodes that are also electrically connected to the conductive planes of both substrates to form a conductive Faraday cage about the component.

The invention relates to an electronic control device (10) having electronic components (160, 162) on a circuit board (110) which are shielded from electrical and/or magnetic interference fields. According to the invention, an electrically conductive sheet metal part (170) is arranged on the circuit board (110) which forms a Faraday cage for the electronic components (160, 162) with the circuit board. The electrically conductive sheet metal part (170) is furthermore in thermal contact to the electronic components (160, 162) and in thermal contact to the housing (100) of the control device (10) and thereby deflects heat from the electronic components (160, 162) into the housing (100).

A frame system for an information handling apparatus is disclosed. In the system, a first frame and an electronic subsystem cooperate to form at least a partial Faraday cage about an electronic component of the electronic subsystem, and a second frame and a different electronic subsystem cooperate to form at least a partial Faraday cage about an electronic component of that electronic subsystem.

A camera includes an electrically conductive housing defined by exterior walls and an interior cavity. The exterior walls of the housing have a lens opening and a connector opening formed therein. An imaging device is disposed within the interior cavity of the housing and communicates with the lens opening. A printed wiring board (PWB) is disposed within the interior cavity of the housing separating the imaging device from the connector opening. The PWB has an electrically conductive chassis plane operatively connected to the exterior walls of the housing so that the chassis plane and the housing form at least a partial Faraday cage around the imaging device.